GW5BDF15L00 - Sharp Microelectronics

SPEC. No. DG-087006

ISSUE Jun-27-08

ELECTRONIC COMPONENTS AND DEVICES GROU

SHARP CORPORATIO

SPECIFICATION

GW5BDF15L00

CUSTOMERS' APPROVAL PRESENTED

Date Date

By By

Y.Inada,

Department General Manage

A1249 Project Team

SHARP CORPORATION

※ This s

ecification is reference.

ELECTRONIC

COMPONENTS

AND DEVICES GROUP

DEVICE SPECIFICATION FOR

LIGHT EMITTING DIODE MODULE

MODEL No.

Ｓｐｅｃｉｆｉｅｄ　ｆｏｒ

Reference

o. DG-087006

PRODUCT NAME Light Emitting Diode Module

MODEL No.

1. These specification sheets include materials protected under the copyright of Sharp Corporation ("Sharp").

Please do not reproduce or cause anyone to reproduce them without Sharp's consent.

2. When using this product, please observe the absolute maximum ratings and the instructions for use outlined

in these specification sheets, as well as the precautions mentioned below. Sharp assumes no responsibility

for any damage resulting from use of the product which does not comply with the absolute maximum ratings

and the instructions included in these specification sheets, and the precautions mentioned below.

(Precautions)

(1) This products is designed for use in the following application areas;

* OA equipment * Audio visual equipment * Home appliance

* Telecommunication equipment (Terminal) * Measuring equipmen

* Tooling machines * Computers

If the use of the product in the above application areas is for equipment listed in paragraphs

(2) or (3), please be sure to observe the precautions given in those respective paragraphs.

(2) Appropriate measures, such as fail-safe design and redundant design considering

the safety design of the overall system and equipment, should be taken to ensure reliability

and safety when this product is used for equipment which demands high reliability and

safety in function and precision, such as ;

* Transportation control and safety equipment (aircraft, train, automobile etc.)

* Traffic signals * Gas leakage sensor breakers * Rescue and security equipment

* Other safety equipment

(3) Please do not use this product for equipment which require extremely high reliability

and safety in function and precision, such as ;

* Space equipment * Telecommunication equipment (for trunk lines)

* Nuclear power control equipment * Medical equipment

(4) Please contact and consult with a Sharp sales representative if there are any questions

regarding interpretation of the above three paragraphs.

3. Manufacturing method or materials of this product which does not influence on its specifications

are subject to change without notice.

4. Please contact and consult with a Sharp sales representative for any questions about this product.

※ This s

ecification is reference.

Jun-27-08

GW5BDF15L00

DG-087006

Page

GW5BDF15L00 2/12

GW5BDF15L00 specificatio

1. Application

This specification applies to the light emitting diode module Model No. GW5BDF15L00

[White (from InGaN Blue LED chip + Phosphor) LED module]

Main use : Illumination

2. Outline dimensions and terminal connections -------------------------- Refer to the attached sheet Page 3.

3. Ratings and characteristics ------------------------------------------------ Refer to the attached sheet Page 4. ～ 6.

3-1. Absolute maximum ratings

3-2. Electro-optical characteristics

3-3. Derating Curve

3-4. Characteristics Diagram

4. Reliability -------------------------------------------------------------------- Refer to the attached sheet Page 7.

4-1. Test items and test conditions

4-2. Failure judgment criteria

5. Quality level ----------------------------------------------------------------- Refer to the attached sheet Page 8.

5-1. Inspection method

5-2. Description of inspection and criteria

6. Supplement------------------------------------------------------------------- Refer to the attached sheet Page 9. ～ 10.

6-1. Chromaticity coordinates

6-2. Packing

6-3. Label

6-4.Indication to the product

7. Precautions for use ---------------------------------------------------------- Refer to the attached sheet Page 11. ～ 12.

※ This specification is reference.

MODEL No.

DG-087006

MODEL Page

3/12

2. Outline dimensions and terminal connections

(Outline dimension)

(Internal circuit diagram)

"3series ×　16parallel=48 pcs of LED"

(3 serially connected LED compose a block.16 blocks are parallelly connected)

※ This s

ecification is reference.

Drawing No.

Substrate: Alumina ceramic 52006022

GW5BDF15L00

unit Material Finish

Connection terminal: Au 　plating

* ( ) is reference.

DG-087006

Page

4/12

3. Ratings and characteristics

3-1. Absolute maximum ratings

Symbol Rating Uni

P 8.0 W

IＦ700 ｍＡ

-15 V

Topr -30～+90 ℃

Tstg -40～+100℃℃

*1 Power dissipation and forward current are the value when the module temperature

is set lower than the rating by using an adequate heat sink.

*2 Operating temperature is fixed to the temperature of module's external part.

(Not an ambient temperature)

The derating curve in the next page is applied to the operating current.

3-2．Electro-optical characteristics

Tc＝25 ℃

Item Symbol Condition Min. Typ. Max. Unit

Forward voltage VF IF=640mA 8.5 (10.2) 11.5 V

Luminous Flux φ IF=640mA 300 (400) - lm

Chromaticity ｘ IF=640mA - 0.452 -

*4 ｙ- 0.409 -

Tc (2550) 2800 (3050) K

* ( ) is reference.

(*3) Monitored by 8 inch integrating sphere of Sharp Standards.

(After 20 ms drive) (Tolerance: ±15%)

(*4) Monitored by 8 inch integrating sphere of Sharp Standards

Measured by Otsuka electronics MODEL LE-3400

(After 20 ms drive) （Tolerance：x, y: ±0.02）

※ This specification is reference.

Storage temperature

Reverse Voltage

Forward current *1

Operating temperature *2

MODEL No.

GW5BDF15L00

Item

Power dissipation *1

DG-087006

Page

5/12

3-3. Derating Curve

（Measuring point for case temperature）

（Example of heat sink attachment）

（Thermal resistance）

①Thermal resistance： 4.5℃/W ＜Reference value＞

（Junction-Case)

②

Thermal resistance ：Depends on performance of attached heat sink.

（Case-Atmosphere）

※ This specification is reference.

GW5BDF15L00

MODEL No.

*To keep case temperature lower than the rating, enough heat-radiation

performance needs to be secured by using an adequate heat sink.

To secure long-term life,use it by the current equal to or less than 640mA .

measuring point

Forward current derating curve

100

200

300

400

500

600

700

800

-40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100

Case temperature　Ｔｃ [℃]

Forward current　IF [mA]

DG-087006

Page

6/12

3-4. Characteristics Diagram

3-4-① Lamp "BD"type.　(*1)

(*1)Above characteristics data are typical data and not a guaranteed data.

※ This specification is reference.

MODEL No.

GW5BDF15L00

Case temperature - Forward Voltage

6.0

7.0

8.0

9.0

10.0

11.0

12.0

13.0

-40 -20 0 20 40 60 80 100

Case temperature [°C]

Forward Voltage VF [V

]

Case temperature - Color temperature

2700

2750

2800

2850

2900

-40 -20 0 20 40 60 80 100

Case temperature [°C]

Color temperature [K]

Case tenperature - Chromaticity coordinate

0.412

0.413

0.414

0.415

0.416

0.445 0.450 0.455 0.460

90°C

60°C

25°C

0°C

-30°

Case temperature - Relative luminous flux

50%

60%

70%

80%

90%

100%

110%

120%

-40 -20 0 20 40 60 80 100

Case temperature [°C]

Relative luminous flux

Forward current - Relative luminous flux

20%

40%

60%

80%

100%

120%

0 200 400 600 800

Forward current IF [mA]

Relative luminous flux

Tc=25 ° C

Forward current - Forward Voltage

8.0

9.0

10.0

11.0

12.0

0 200 400 600 800

Forward current IF [mA]

Forward Voltage VF [V

]

Tc=25 ° C

DG-087006

MODEL No. Page

7/12

4. Reliability

　　The reliability of products shall be satisfied with items listed below.

4-1. Test items and test conditions Confidence level: 90%

No. Test items Samples Defective LTPD

ｎＣ（％）

１Temperature -40 ℃(30 min)～+100 ℃(30 min), 30 times

cycle 11 0 20

２High temp and high Ta*=+60℃, RH=90％, t=1,000h

humidity storage 11 0 20

３High temperature Ta*= +100℃, t=1,000h

storage 11 0 20

４Low temperature Ta*= -40 ℃, t=1000h

storage 11 0 20

５Operating test Tc=60 ℃，IF=640mA, t=1,000h

　　 11 0 20

６Mechanical shock 15,000 m/s2, 0.5 ms

test ±X･±Y･±Z direction, 3 times 5050

７Variable frequency 200 m/s2, 100～2,000～100 Hz / sweep for 4 min.

vibration X･Y･Z direction, 4 times 5050

4-2. Failure judgment criteria

No. Parameter Symbol

１Forward voltage VF

２Luminous flux Φ

※ This specification is reference.

GW5BDF15L00

Test conditions

Failure judgment criteria (*2)

VF ＞ U.S.L × 1.1

Φ＜Initial value × 0.5,Φ＞Initial value × 2.0

DG-087006

MODEL No. Page

8/12

5. Incoming inspection

　5-1. Inspection method

A single sampling plan, normal inspection S-4 based on ISO 2859-1 shall be adopted.

　5-2. Description of inspection and criteria

No. Inspection items Criteria Defect AQL

2Electro-optical

characteristics

Not conforming to the specification (Forward voltage,

Luminous flux and Chromaticity)

3Outline

dimensions

Not conforming to the specification

（Outline dimensions of ①、②　in page3）

4 Appearance

Nonconformity observed in product appearance is

determined as good product except that electro-optical

characteristics is affected by.

*Products with removable foreign material attached on is not determined to be defective.

※ This specification is reference.

GW5BDF15L00

Major

defect

Minor

defect 0.4%

1 Emission No emission 0.1%

DG-087006

MODEL No. Page

GW5BDF15L0

9/12

6．Supplement

6-1　Chromaticity coordinates

（Chromaticity table）

（IF=640mA　Tc=25℃）

Lank Point Color temperature　*⊿uv　*

1234 (K)

d1 x 0.447 0.438 0.449 0.459 2900～3050 0.003～0.009

y0.431 0.412 0.416 0.435

d2 x 0.438 0.429 0.440 0.449 2900～3050 　-0.003～0.003

y 0.412 0.394 0.397 0.416

d3 x 0.429 0.421 0.431 0.440 2900～3050 -0.009～-0.003

y 0.394 0.377 0.380 0.397

d4 x 0.459 0.449 0.465 0.476 2700～2900 0.003～0.009

y 0.435 0.416 0.420 0.440

d5 x 0.449 0.440 0.455 0.465 2700～2900 　-0.003～0.003

y 0.416 0.397 0.401 0.420

d6 x 0.440 0.431 0.445 0.455 2700～2900 -0.009～-0.003

y 0.397 0.380 0.384 0.401

d7 x 0.476 0.465 0.478 0.490 2550～2700 0.003～0.009

y 0.440 0.420 0.423 0.442

d8 x 0.465 0.455 0.467 0.478 2550～2700 　-0.003～0.003

y 0.420 0.401 0.404 0.423

d9 x 0.455 0.445 0.457 0.467 2550～2700 -0.009～-0.003

y 0.401 0.384 0.386 0.404

* Color temperature and ⊿uv　is reference.

(Note1)　Quantity of each rank is decided by Sharp.　（Tolerance：x, y: ±0.02）

（Chromaticity coordinates）

※ This specification is reference.

0.37

0.38

0.39

0.40

0.41

0.42

0.43

0.44

0.45

0.41 0.42 0.43 0.44 0.45 0.46 0.47 0.48 0.49 0.50

DG-087006

Page

GW5BDF15L00 10/12

6-2　Packing

・Amount in one box ：　400 (2　bags)

・Amount in one bag ：　200 (5 trays)

・Amount in one tray ：　40

・Putting 5 pieces of tray in a damp proofing packing bag and 2 bags in a box.

・Dimensions of the box: 235×220×90mm

(Packing form: Box）(Packing form: bag）(Packing form: Tray）

200×2bags=　400 40×5trays= 200 5×8=　40

*The packing dimensions are reference.

There is a case to become another packing specifications.

6-3．Label

The following label is put on the packing box.

SHARP CORPORATION １）About Lot number

PART No. GW5BDF15L00 ← Model number ＫＡ　０８１　Ａ

QUANTIT

500 ← Quantity of products ①　　 ② 　③ ④

← EIAJ C-3 Bar code ① Production plant code (to be indicated alphabetically)

← EIAJ C-3 Bar code ② Year of production (the last two figures of the year)

LOT No.KA081A ← Lot number ③ Month of production

<EIAJ C-3>MADE IN JAPAN ← Production country (to be indicated alphabetically with January

　corresponding to A)

④ Date of production (01～31)

6-4．Indication to the product

Model No. and Control NO. are indicated on the substrate surface.

Indication contents are to be announced.

①Model No.

Abbreviated Model No. "5BDF15L00" is indicated.

②Control No.

Control No. is indicated as below;

Ｍ０８Ｇ０１

①　② ③ ④

① Production plant code (to be indicated alphabetically)

② Year of production (the last two figures of the year)

③ Month of production (to be indicated alphabetically with January corresponding to A)

④ Date of production (01 to 31)

※ This specification is reference.

MODEL No.

Model No.

Control No.

DG-087006

Page

GW5BDF15L00 11/12

7. Precautions

①Storage conditions

Please follow the conditions below.

・Before opened： Temperature 5～30℃, humidity less than 60%RH

・After opened： Temperature 5～30℃, humidity less than 60%RH (Please apply soldering within 1 week.)

・Avoid exposing to air with corrosive gas.

If exposed, electrode surface would be damaged, which may affect soldering.

②Usage conditions

The products are not designed for the use under any of the following conditions.

Please confirm their performance and reliability well enough if you use under any of the following conditions;

・ In a place with a lot of moisture, dew condensation, briny air, and corrosive gas

(Cl, H2S, NH3, SO2, NOX, etc.).

・Under the direct sunlight, outdoor exposure, and in a dusty place.

・In water, oil, medical fluid, and organic solvent.

③Heat radiation

If the forward current(IF) is applied to single-state module at 360mA, there is a risk of damaging module

or emitting smoke.

Equip with specified heat radiator, and avoid heat stuffed inside the module.

Applying thermal conductive sheet or grease between module and heat radiator enables heat to radiate effectively.

④Installation

Material of board is alumina ceramic. If installed inappropriately, trouble of no radiation may occur due to

board crack. Please take particular notice of install method.

Further information on installation, refer to the following cautions.

・Apply ether screws or adhesives, or both of them when installed to heat radiator.

In case of applying adhesive only, check the effectiveness before fixing.

In case of screw, apply thread locker in order to prevent loosening.

If LED comes off from the heat radiator, unusual temperature rise entails hazardous phenomena including

device deterioration, coming off of solder at leads, and emitting smoke.

・Refer to recommended dimensions when installing with screws.

・Screw torque: Within 0.2Nｍ

If it is inefficient to tighten screws, apply locker to prevent loosening.

・It is recommended to apply screws which use low corrosive materials such as Stainless steel.

Avoid applying flat-head screws, which cause board crack due to applying stress to screw holes.

・Avoid convexly uneven boards.

Those convex boards are subject to crack when tightening screws.

・It is recommended to apply thermal conductive sheet or grease with adhesiveness and heat radiating-

adhesives, because of thermal and mechanical combination between module and heat radiator.

However, depending on their thickness, board crack may be entailed by warped board, which is

caused when tightening screws. So please check your actual conditions carefully as for the screw torque.

※ This specification is reference.

MODEL No.

DG-087006

Page

GW5BDF15L00 12/12

⑤Module surface strength

Module surface is subject to mechanical stress. Applying stress to surface of modules results in damage on resin,

and inside-failure.

⑥Connecting method

In case of solder connecting method, apply solder to the leads

by soldering iron with thermo controller (tip temperature 380℃), within 10seconds per one place.

Put the board on materials whose conductivity is poor enough not to radiate heat of soldering.

Avoid touching yellow phosphor with soldering iron.

This product is not designed for reflow and flow soldering.

⑦Static electricity

This product is subject to static electricity, so take measures to cope with it.

Install circuit protection device to drive circuit, if necessary.

⑧Drive method

Module is composed of LEDs connected in both series and parallel. Constant voltage power supply

runs off more than specified current amount due to lowered VF caused by temperature rise.

Constant current power supply is recommended to drive.

Any reverse voltage cannot be applied to LEDs when they are in operation or not.

Design a circuit so that any flow of reverse or forward voltage can not be applied to LEDs when they are

out of operation.

⑨Cleaning

Avoid cleaning, since silicone resin is eroded by it.

⑩Color-tone variation

Chromaticity of this product is monitored by integrating sphere right after the operation.

Chromaticity varies depending on measuring method, light spread condition, or ambient temperature.

Please verify your actual conditions before use.

⑪Safety

Looking directly at LEDs for a long time may result in hurt your eyes.

In case that excess current(over ratings) are supplied to the device, hazardous phenomena including abnormal

heat generation, emitting smoke, or catching fire can be caused.

Take appropriate measures to excess current and voltage.

In case of solder connecting method, there is a possibility of fatigue failure by heat.

Please fix the leads in such case to protect from short circuit or leakage of electricity caused by contact.

Please confirm the safety standards or regulations of application devices.

※ This specification is reference.

MODEL No.