GaAs-IR-Lumineszenzdioden-Zeilen GaAs Infrared Emitter Arrays Lead (Pb) Free Product - RoHS Compliant LD 260 LD 262 ... LD 269 Wesentliche Merkmale Features * GaAs-IR-Lumineszenzdiode * Zeilenbauform, lieferbar von 2 bis 10 Emitter pro Zeile * Farbe: transparent * Hohe Zuverlassigkeit * Gruppiert lieferbar * Gehausegleich mit BPX 80-Serie * Miniatur-Gehause * GaAs infrared emitting diode * Leadframe arrays, available from 2 to 10 Emitters per array * Colour: transparent * High reliability * Available in bins * Same package as BPX 80 series * Miniature package Anwendungen Applications * Miniaturlichtschranken fur Gleich- und Wechsellichtbetrieb * Barcodeleser * Industrieelektronik * Messen/Steuern/Regeln" * Sensorik * Drehzahlsteuerung * Miniature photointerrupters 2011-05-27 * * * * * 1 Barcode readers Industrial electronics For control and drive circuits Sensor technology Speed controller LD 260, LD 262 ... LD 269 Typ Bestellnummer Type IRED pro Zeile per Row LD 262 2 Q62703Q0070 LD 263 3 Q62703Q0071 LD 264 4 Q62703Q0072 LD 265 5 Q62703Q0073 LD 266 6 Q62703Q0074 LD 267 7 Q62703Q0075 LD 268 8 Q62703Q0076 LD 269 9 Q62703Q0077 LD 260 10 Q62703Q0078 1) Ordering Code Strahlstarkegruppierung 1) (IF = 50 mA, tp = 20 ms) Radiant intensity grouping 1) Ie (mW/sr) > 2.5 (typ. 5) gemessen bei einem Raumwinkel = 0.01 sr / measured at a solid angle of = 0.01 sr 2011-05-27 2 LD 260, LD 262 ... LD 269 Grenzwerte (TA = 25 C) Maximum Ratings Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Betriebs- und Lagertemperatur Operating and storage temperature range Top; Tstg - 40 ... + 80 C Sperrschichttemperatur Junction temperature Tj 80 C Sperrspannung Reverse voltage VR 5 V Durchlassstrom Forward current IF 50 mA Stostrom, 10 s, D = 0 Surge current IFSM 1.6 A Verlustleistung Power dissipation Ptot 70 mW Warmewiderstand Thermal resistance RthJA RthJL 750 650 K/W K/W Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Wellenlange der Strahlung Wavelength at peak emission IF = 50 mA, tp = 20 ms peak 950 nm Spektrale Bandbreite bei 50% von Imax Spectral bandwidth at 50% of Imax IF = 50 mA, tp = 20 ms 55 nm Abstrahlwinkel Half angle 15 Grad deg. Aktive Chipflache Active chip area A 0.25 mm2 Abmessungen der aktiven Chipflache Dimension of the active chip area LxB LxW 0.5 x 0.5 mm Abstand Chipoberflache bis Linsenscheitel Distance chip surface to lens top H 1.3 ... 1.9 mm Kennwerte (TA = 25 C) Characteristics 2011-05-27 3 LD 260, LD 262 ... LD 269 Kennwerte (TA = 25 C) Characteristics (cont'd) Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Schaltzeiten, Ie von 10% auf 90% und von 90% auf 10%, bei IF = 50 mA, RL = 50 Switching times, Ie from 10% to 90% and from 90% to 10%, IF = 50 mA, RL = 50 tr , tf 1 s Kapazitat, VR = 0 V Capacitance Co 40 pF Durchlassspannung, IF = 50 mA, tp = 20 s Forward voltage VF 1.25 ( 1.4) V Sperrstrom, VR = 5 V Reverse current IR 0.01 ( 1) A Gesamtstrahlungsfluss, IF = 50 mA, tp = 20 ms Total radiant flux e 9 mW Temperaturkoeffizient von Ie bzw. e, IF = 50 mA Temperature coefficient of Ie or e, IF = 50 mA TCI - 0.55 %/K Temperaturkoeffizient von VF, IF = 50 mA Temperature coefficient of VF, IF = 50 mA TCV - 1.5 mV/K Temperaturkoeffizient von peak, IF = 50 mA Temperature coefficient of peak, IF = 50 mA TC 0.3 nm/K Strahlstarke, IF = 50 mA, tp = 20 ms Radiant intensity e typ. 5 ( 2) mW/sr 2011-05-27 4 LD 260, LD 262 ... LD 269 Relative Spectral Emission Irel = f () Radiant Intensity Single pulse, tp = 20 s OHRD1938 100 OHR01039 10 2 e % rel e = f (IF) e 100 mA e (100 mA) Max. Permissible Forward Current IF = f (TA) OHR01124 80 F mA 70 80 60 10 1 50 60 40 R thJL = 650 K/W 40 30 10 0 R thJA = 750 K/W 20 20 10 0 880 920 960 1000 nm 10 -1 10 -2 1060 Forward Current IF = f (VE), single pulse, tp = 20 s F OHR01042 10 1 A F OHR02182 10 4 F mA 10 0 10 0 Permissible Pulse Handling Capability IF = f (), TC = 25 C, duty cycle D = parameter 10 1 A typ. 0 10 -1 max. D= T D=0 0,005 0,01 0,02 F T 10 3 0,05 0,1 0,2 10 -1 10 2 0,5 DC 10 -2 1 1.5 2 2.5 3 3.5 10 1 -5 10 4 V 4.5 VF 10 -4 10 -3 10 -2 10 -1 s 10 0 Radiation Characteristics Irel = f () 40 30 20 10 0 OHR01878 1.0 50 0.8 60 0.6 70 0.4 0.2 80 0 90 100 1.0 2011-05-27 0.8 0.6 0.4 0 20 40 60 80 5 100 120 0 20 40 60 80 C 100 TA , TL LD 260, LD 262 ... LD 269 Mazeichnung Package Outlines Mae in mm / Dimensions in mm. . Typ IRED pro Zeile Ma B" Type IRED per Row Dimension "B" LD 262 2 4.5 ... 4.9 LD 263 3 7.0 ... 7.4 LD 264 4 9.6 ... 10.0 LD 265 5 12.1 ... 12.5 LD 266 6 14.6 ... 16.0 LD 267 7 17.2 ... 17.6 LD 268 8 19.7 ... 20.1 LD 269 9 22.3 ... 22.7 LD 270 10 24.8 ... 25.2 2011-05-27 6 LD 260, LD 262 ... LD 269 Lotbedingungen Soldering Conditions Wellenloten (TTW) TTW Soldering (nach CECC 00802) (acc. to CECC 00802) OHLY0598 300 C T 10 s 250 Normalkurve standard curve 235 C ... 260 C Grenzkurven limit curves 2. Welle 2. wave 200 1. Welle 1. wave 150 ca 200 K/s 2 K/s 5 K/s 100 C ... 130 C 100 2 K/s 50 Zwangskuhlung forced cooling 0 0 50 100 150 200 s 250 t Published by OSRAM Opto Semiconductors GmbH Leibnizstrae 4, D-93055 Regensburg www.osram-os.com (c) All Rights Reserved. The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. Packing Please use the recycling operators known to you. We can also help you - get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS. 1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. 2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered. 2011-05-27 7