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BAR66...
Silicon PIN Diode Array
• Surge protection device
• Designed for surge overvoltage clamping
in antiparallel connection
• Pb-free (RoHS compliant) package
BAR66
!
,
,
Type Package Configuration LS(nH) Marking
BAR66 SOT23 series 1.8 PMs
Maximum Ratings at T
A
= 25°C, unless otherwise specified
Parameter Symbol Value Unit
Diode reverse voltage VR150 V
Forward current IF200 mA
Total power dissipation
Ts ≤ 25 °C
Ptot 250 mW
ESD contact discharge1) VESD 25 kV
Peak pulse current (t
p
= 8 / 20 µs)2) I
pp
12 A
Junction temperature T
j
150 °C
Operating temperature range To
p
-55 ... 125
Storage temperature Tst
g
-55 ... 150
Thermal Resistance
Parameter Symbol Value Unit
Junction - soldering point3), BAR 66 RthJS ≤ 290 K/W
1VESD according to IEC61000-4-2, only valid if pin 1 and pin 2 are connected
2Ipp according to IEC61000-4-5, only valid if pin 1 and pin 2 are connected
3For calculation of RthJA please refer to Application Note Thermal Resistance
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BAR66...
Electrical Characteristics at T
A
= 25°C, unless otherwise specified
Parameter Symbol Values Unit
min. typ. max.
DC Characteristics
Breakdown voltage
I(BR) = 5 µA
V(BR) 150 - - V
Reverse current
VR = 100 V
IR- - 20 nA
Forward voltage
IF = 50 mA
VF- 0.95 1.2 V
Clamping voltage
VESD = ± 15 kV (contact)1)
IPP = 12 A, tp = 8/20 µs2)
VCL
-
-
tbd
7
-
-
AC Characteristics
Diode capacitance
VR = 35 V, f = 1 MHz
VR = 0 V, f = 100 MHz
CT
-
-
0.4
0.35
0.6
0.9
pF
Zero bias conductance
VR = 0 V, f = 1 GHz
gP- 220 - µS
Forward resistance
IF = 5 mA, f = 100 MHz
rf- 1.5 1.8 Ω
Charge carrier life time
IF = 10 mA, IR = 6 mA, measured at IR = 3 mA,
RL = 100 Ω
τ rr - 0.7 - µs
1VESD according to IEC61000-4-2, only valid if pin 1 and pin 2 are connected
2Ipp according to IEC61000-4-5, only valid if pin 1 and pin 2 are connected
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BAR66...
Diode capacitance CT = ƒ (VR)
f = Parameter
0 5 10 15 20 25 V35
VR
0
0.1
0.2
0.3
0.4
0.5
0.6
pF
0.8
CT
100MHz
1MHz
Forward resistance rf = ƒ (IF)
f = 100MHz
10 -2 10 -1 10 0 10 1 10 2
mA
IF
-1
10
0
10
1
10
2
10
3
10
Ohm
rf
Forward current IF = ƒ (VF)
TA = Parameter
0 0.2 0.4 0.6 0.8 V1.2
VF
-6
10
-5
10
-4
10
-3
10
-2
10
-1
10
0
10
A
IF
-40 °C
25 °C
85 °C
125 °C
Forward current IF = ƒ (TS)
BAR66
0 20 40 60 80 100 120 °C 150
TS
0
20
40
60
80
100
120
140
160
180
mA
220
IF
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BAR66...
Permissible Puls Load RthJS = ƒ (tp)
BAR66
10 -6 10 -5 10 -4 10 -3 10 -2 10 0
s
tP
-1
10
0
10
1
10
2
10
3
10
K/W
RthJS
0.5
0.2
0.1
0.05
0.02
0.01
0.005
D = 0
Permissible Pulse Load
IFmax/ IFDC = ƒ (tp)
BAR66
10 -6 10 -5 10 -4 10 -3 10 -2 10 0
s
tP
0
10
1
10
2
10
-
IFmax/IFDC
D = 0
0.005
0.01
0.02
0.05
0.1
0.2
0.5
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BAR66...
Package SOT23
Package Outline
Foot Print
Marking Layout (Example)
Standard Packing
Reel ø180 mm = 3.000 Pieces/Reel
Reel ø330 mm = 10.000 Pieces/Reel
EH
s
BCW66
Type code
Pin 1
0.8
0.9 0.91.3
0.8 1.2
0.25
M
BC
1.9
-0.05
+0.1
0.4
±0.1
2.9
0.95
C
B
0...8˚
0.2 A
0.1 MAX.
10˚ MAX.
0.08...0.15
1.3
±0.1
10˚ MAX.
M
2.4
±0.15
±0.1
1
A
0.15 MIN.
1)
1) Lead width can be 0.6 max. in dambar area
12
3
3.15
4
2.65
2.13
0.9
8
0.2
1.15
Pin 1
Manufacturer
2005, June
Date code (YM)
2011-06-27
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BAR66...
Edition 2009-11-16
Published by
Infineon Technologies AG
81726 Munich, Germany
2009 Infineon Technologies AG
All Rights Reserved.
Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee
of conditions or characteristics. With respect to any examples or hints given herein,
any typical values stated herein and/or any information regarding the application of
the device, Infineon Technologies hereby disclaims any and all warranties and
liabilities of any kind, including without limitation, warranties of non-infringement of
intellectual property rights of any third party.
Information
For further information on technology, delivery terms and conditions and prices,
please contact the nearest Infineon Technologies Office (<www.infineon.com>).
Warnings
Due to technical requirements, components may contain dangerous substances.
For information on the types in question, please contact the nearest Infineon
Technologies Office.
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only with the express written approval of Infineon Technologies, if a failure of such
components can reasonably be expected to cause the failure of that life-support
device or system or to affect the safety or effectiveness of that device or system.
Life support devices or systems are intended to be implanted in the human body or
to support and/or maintain and sustain and/or protect human life. If they fail, it is
reasonable to assume that the health of the user or other persons may be
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