FEATURES:
1310nm FP laser
Very low power dissipation
SC and LC optical receptacles
10Gbps direct modulation
Impedance matching inside the
laser package
Differential electrical interface
Compatible with all 10GBE MSAs
(XFP, X2, XPAK, XENPAK)
1310NM FP LASER
FOR 10GBASE-LRM
SC AND LC TOSA
HFE6X62-561
DATA
SHEET
The HFE6x62-561 is specifically designed for applications based on the IEEE
10GBASE-LRM optical standard. The TOSA is designed to meet the fiber launch
conditions specified for the multimode and single mode optical fiber options.
Excellent optical performance is achieved by matching the electrical character-
istics of the TOSA and laser to the external circuitry. Separate, differential laser
bias and modulation pins significantly reduce the amount of electrical power
required at the module level, and help to reduce the overall electro-magnetic
emissions. The TOSA is designed to be paired with the linear ROSA HFD6x40-
417 available at www.finisar.com/aoc.php.
Part Number Description
HFE6362-561 1310nm SC TOSA with FP laser
HFE6162-561 1310nm LC TOSA with FP laser
HFE6X62-561 1310NM FP LASER FOR 10GBASE-LRM
NOTICE: Stresses greater than those listed under “Absolute
Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation
of the device at these or any other conditions above those
indicated in the operations section for extended periods of
time may affect reliability.
NOTICE: The inherent design of this component causes it
to be sensitive to electrostatic discharge (ESD). To prevent
ESD-induced damage and/or degradation to equipment,
take normal ESD precautions when handling this product.
ABSOLUTE MAXIMUM RATINGS
Parameter Rating
Storage temperature -40oC to +90oC
Case Operating temperature -5 to +85oC
Lead solder temperature 260oC, 10 seconds
Continuous Optical Power 20 mW
Laser Diode Reverse Voltage 2V
Laser Diode Continuous Forward Current 130 mA
Monitor Photodiode Reverse Current 2 mA
Monitor Photodiode Reverse Voltage 10V
LASER RADIATION
AVOID EXPOSURE TO BEAM
CLASS 1M LASER PRODUCT
INVISIBLE LASER RADIATION
DO NOT VIEW DIRECTLY WITH
OPTICAL INSTRUMENTS
10mW at 820 - 860nm
CLASS 1M LASER PRODUCT
COMPLIES WITH IEC/EN 60825-1
Ed1.2:2001
COMPLIES WITH 21 CFR 1040.10
AND 1040-10.11 EXCEPT FOR
DEVIATION PURSUANT TO
LASER NOTICE NO.50
DATED 26 JULY 2001
Advanced Optical Components
600 Millennium Drive,
Allen, TX 75013
HFE6X62-561
Parameter Test Condition Symbol Min Typ Max Units Notes
Threshold Current T = 25°C
T = TRANGE ITH 10
25 mA
Operating Current T = 25 °C
T = T RANGE IOP 45
70 mA Note 1
Modulation Current T = 25 °C
T = T RANGE IMOD 25
60 mA ER ~ 4.5 dB
ER ~ 6.5 dB
Output Power I
F = I OP LOP -3 0.5 dBm Note 2
Slope Eciency T = 25 °C, SMF η 0.018 mW/mA
E ncircled Flux r < 5 µm
r < 11 µm
EF 5
EF 10
30
86
% Note 3
Extinction Ratio T=range 3.5 6.0 dB Note 4
LA (wiggle) LA 1.5 dB Note 5
Wavelength T = T RANGE
T = 25 °C λ 1265
1295
1355
1315 nm
Spectral Width
T = T RANGE
T = 25 °C ∆λ
1.4
3.0 Nm, rms Note 6
Relative Intensity Noise I=Iop, 20dB
ORL RIN 20 -136
dB /
Hz
Note 7
Modulation Bandwidth I=I OP, T= T RANGE
I=I OP, T=25 °C S21,3dB 8
9.5
GHz
Rise/fall time T
r
Tf
35
35
50
50 ps Note 8
Transmittter Waveform
Dispersion Penalty
TWDP
4.7 dB Note 9
Forward Voltage T= T RANGE ,I=I OP Vf 1 1.6 V
Laser Resistance T= T RANGE ,I=I OP RL 6 8 12 Ohms Note 10
Monitor Current T=25°C, I=I OP,
VB=-2.5V IMON 200 2000 uA
Tracking Error
T=T MAX
T=T MIN
TE -1.25
-1.25
1.25
1.25 dB Note 11
Monitor Dark Current Vb=-2.5V,
T=T RANGE
ID 100 nA
Monitor Diode
Capacitance VB=-2.5V CMON 10 pF
Optical Return Loss
Tolerance
ORLT 12 dB
Input Impedance (Di) R DIFF 44 50 56 Ω
Di. Return Loss
0.1< f <7.5 GHz
7.5 <f< 12.5
GHz
SDD11
-10
-6 dB
Case to Signal Isolation R ISO 10 kΩ
ELECTRO-OPTICAL CHARACTERISTICS (TCASE=25 oC, TRANGE, CASE = -5 to 80oC, 10.3125Gbps, PRBS 231-1)
ELECTRICAL-OPTICAL CHARACTERISTICS
HFE6X62-561 1310NM FP LASER FOR 10GBASE-LRM
NOTES
1. Operating current is the average bias current required to
meet the ER, rise/fall, and bandwidth specifications. The
target operating condition is 35 mA over threshold at
high temperature, 30mA over threshold at RT.
2. Output power specification must be met into both single-
mode fiber and 62/125 multi-mode fiber.
3. Encircled flux is measured at the end of a 10m patchcord
through a fiber shaker per IEC 61280-1-4.
4. TOSA would be capable of meeting other specifications
when modulated over this ER range.
5. Maximum change in power as fiber is rotated by 360º.
6. See Figure 1 below for the present 10GBASE-LRM spectral
width vs. wavelength specification, and TOSA requirement
curve that is further restricted to 3 nm for margin, but is
limited by the IEEE curve below 1275nm.
7. Corresponds to 10GBASE-LRM specification of RIN20OMA
–128 dB/√Hz which is equivalent to –136 dB/√Hz with ER
= 3.5 dB. RIN averaged up to 15 GHz. RIN to be measured
with -20 dB back reflection at worst case polarization with
a single mode fiber.
8. Measured with an optical receiver with a 10.3125 Gb/s
filter (4th order Bessel-Thomson filter with 3 dB
bandwidth = 0.75*bitrate).
9. TWDP is measured as defined in IEEE 802.3aq.
10. Laser slope resistance is measured between “Bias+” and
“Bias-“ pins.
11. Tracking error is defined as the coupled power difference
at Tmax or Tmin (relative to 25ºC) where the back monitor
current, Imon, is held constant at the value found at 25ºC
at I=Iop.
Maximum Spectral Width vs Wavelength
0
1
2
3
4
5
1250 1270 1290 1310 1330 1350 1370
Wavelength (nm)
Max. R.M.S. Spectral Width (nm)
PINOUT
HFE6X62-561
PIN Function
1Laser BIAS +
2MPD Cathode
3Ground
4Laser MOD +
5Laser MOD -
6Ground
7MPD Anode
8Laser BIAS -
TYPICAL PERFORMANCE CHARACTERISTICS
20oC80oC
10.7Gbps, SONET Mask
Pin 1
INTERNAL CONFIGURATION
HFE6X62-561 1310NM FP LASER FOR 10GBASE-LRM
PIN Function
1Bias +
2MPD-C
3Mod +
4Mod -
5MPD-A
6Bias -
FLEX MOUNTING DIMENSIONS – DIMENSIONS IN INCHES
HFE6X62-561
HFE6362-562 SC MOUNTING DIMENSIONS – DIMENSIONS IN MM [INCHES]
HFE6162-562 LC MOUNTING DIMENSIONS – DIMENSIONS IN MM [INCHES]
©2007 Finisar Corporation. All rights reserved. Finisar is a registered trademark of Finisar Corporation. Features and specifications are subject to change without notice. 6/07 Rev B.
Phone:1-866-MY-VCSEL USA (toll free)
1-214-509-2700 USA (Direct dial)
44 (0) 174 336 5533 Europe
886-935-409898 China & Taiwan
81-90-4437-1130 Japan
82-11-220-6153 Asia Pacific & Korea
Fax: 1-214-509-3709 USA
Email: support@adopco.com
WEB: www.finisar.com/aoc.php
ADVANCED OPTICAL COMPONENTS
Finisar’s ADVANCED OPTICAL COMPONENTS division was
formed through strategic acquisition of key optical compon-
ent suppliers. The company has led the industry in high
volume Vertical Cavity Surface Emitting Laser (VCSEL) and
associated detector technology since 1996. VCSELs have
become the primary laser source for optical data communi-
cation, and are rapidly expanding into a wide variety of sensor
applications. VCSELs’ superior reliability, low drive current,
high coupled power, narrow and circularly symmetric beam
and versatile packaging options (including arrays) are enabling
solutions not possible with other optical technologies.
ADVANCED OPTICAL COMPONENTS is also a key supplier of
Fabrey-Perot (FP) and Distributed Feedback (DFB) Lasers, and
Optical Isolators (OI) for use in single mode fiber data and
telecommunications networks
LOCATION
Allen, TX - Business unit headquarters, VCSEL wafer
growth, wafer fabrication and TO package assembly.
Fremont, CA – Wafer growth and fabrication of 1310 to
1550nm FP and DFB lasers.
Shanghai, PRC – Optical passives assembly, including
optical isolators and splitters.
SALES AND SERVICE
Finisar’s ADVANCED OPTICAL COMPONENTS division serves its
customers through a worldwide network of sales offices and
distributors. For application assistance, current specifications,
pricing or name of the nearest Authorized Distributor, contact
a nearby sales office or call the number listed below.
AOC CAPABILITIES
ADVANCED OPTICAL COMPONENTS’ advanced capabilities
include:
1, 2, 4, 8, and 10Gbps serial VCSEL solutions
1, 2, 4, 8, and 10Gbps serial SW DETECTOR solutions
VCSEL and detector arrays
1, 2, 4, 8, and 10Gbps FP and DFB solutions at 1310 and
1550nm
1, 2, 4, 8, and 10Gbps serial LW DETECTOR solutions
Optical Isolators from 1260 to 1600nm range
Laser packaging in TO46, TO56, and Optical
subassemblies with SC, LC, and MU interfaces for
communication networks
VCSELs operating at 670nm, 780nm, 980nm, and 1310nm
in development
Sensor packages include surface mount, various plastics,
chip on board, chipscale packages, etc.
Custom packaging options
HFE6X62-561 1310NM FP LASER FOR 10GBASE-LRM
