3A, Rad Hard, Positive, Ultra Low Dropout Regulator ISL75051SEH Features The ISL75051SEH is a radiation hardened low-voltage, high-current, single-output LDO specified for up to 3.0A of continuous output current. These devices operate over an input voltage range of 2.2V to 6.0V and are capable of providing output voltages of 0.8V to 5.0V adjustable based on resistor divider setting. Dropout voltages as low as 65mV can be realized using the device. * DLA SMD#5962-11212 * Output Current Up to 3.0A at TJ = +150C * Output Accuracy 1.5% over MIL Temp Range * Ultra Low Dropout: - 65mV Typ Dropout at 1.0A - 225mV Typ Dropout at 3.0A The OCP pin allows the short circuit output current limit threshold to be programmed by means of a resistor from the OCP pin to GND. The OCP setting range is from 0.5A minimum to 8.5A maximum. The resistor sets the constant current threshold for the output under fault conditions. The thermal shutdown disables the output if the device temperature exceeds the specified value. It subsequently enters an ON/OFF cycle until the fault is removed. The ENABLE feature allows the part to be placed into a low current shutdown mode that typically draws about 1A. When enabled, the device operates with a typical low ground current of 11mA, which provides for operation with low quiescent power consumption. * Noise of 100VRMS from 300Hz to 300kHz * SET Mitigation with No Added Filtering/Diodes * Input Supply Range: 2.2V to 6.0V * Fast Load Transient Response * Shutdown Current of 1A Typ * Output Adjustable Using External Resistors * PSRR 66dB Typ @ 1kHz * Enable and PGood Feature * Programmable Soft-start/Inrush Current Limiting The device is optimized for fast transient response and single event effects. This reduces the magnitude of SET seen on the output. Additional protection diodes and filters are not needed. The device is stable with tantalum capacitors as low as 47F and provides excellent regulation all the way from no load to full load. Programmable soft-start allows the user to program the inrush current by means of the decoupling capacitor value used on the BYP pin. * Adjustable Overcurrent Limit from 0.5A to 8.5A * Over-temperature Shutdown * Stable with 47F Min Tantalum Capacitor * 18 Ld Ceramic Flatpack Package * Radiation Environment - High Dose Rate (50-300rad(Si)/s) . . . . . . . . . 100krad(Si) - Low Dose Rate (0.01rad(Si)/s). . . . . . . . . . . . 100krad(Si)* *Product capability established by initial characterization. The "EH" version is acceptance tested on a wafer by wafer basis to 50 krad(Si) at low dose rate Applications * LDO Regulator for Space Application * DSP, FPGA and P Core Power Supplies * Post-regulation of Switched Mode Power Supplies * Down-hole Drilling 0.30 EN +150C BYP OCP 0.1F ADJ ISL75051SEH VIN 220F VOUT VIN VOUT PG GND R1 0.1F 0.1F 2.67k VIN 4.7n PG 220F DROPOUT VOLTAGE (V) ROCP EN 0.25 +125C 0.20 0.15 +25C 0.10 0.05 R2 100pF 0.00 0.00 0.50 1.00 1.50 2.00 2.50 3.00 3.50 IOUT (A) FIGURE 1. TYPICAL APPLICATION August 28, 2012 FN8294.0 1 FIGURE 2. DROPOUT vs IOUT CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Copyright Intersil Americas Inc. 2012. All Rights Reserved Intersil (and design) is a trademark owned by Intersil Corporation or one of its subsidiaries. All other trademarks mentioned are the property of their respective owners. ISL75051SEH Block Diagram VIN CURRENT LIMIT ADJ OCP 520MV POWER PMOS REFERENCE BIAS BYPASS VOUT CURRENT LIMIT THERMAL SHUTDOWN LEVEL SHIFT ENABLE ADJ VADJ PGOOD DELAY 450mV GND Typical Applications EN EN 10 9 BYP OCP 11 8 ADJ VIN 12 7 VOUT VIN 13 6 VOUT VIN 14 5 ISL75051SEH VOUT VIN 15 4 VOUT VIN 16 3 VOUT VIN 17 2 VOUT PG 18 1 GND 511 0.2F VIN VOUT 220F 0.1F 0.1F 4.32k 220F 2.67k 4.7n VIN 2.26k 5.49k 100pF PG 2 FN8294.0 August 28, 2012 ISL75051SEH Pin Configuration ISL75051SEH (18 LD CDFP) TOP VIEW GND 1 18 PG VOUT 2 17 VIN VOUT 3 16 VIN VOUT 4 15 VIN VOUT 5 14 VIN VOUT 6 13 VIN VOUT 7 12 VIN VADJ 8 11 OCP BYP 9 10 EN GND Pin Descriptions PIN NUMBER PIN NAME DESCRIPTION 12, 13, 14 15, 16, 17 VIN Input supply pins 18 PG VOUT in regulation signal. Logic low defines when VOUT is not in regulation. Must be grounded if not used. 1 GND GND pin 2, 3, 4 5, 6, 7 VOUT Output voltage pins 8 VADJ VADJ pin allows VOUT to be programmed with an external resistor divider. 9 BYP To filter the internal reference, connect a 0.1F capacitor from BYP pin to GND. 10 EN VIN independent chip enable. TTL and CMOS compatible. 11 OCP Allows current limit to be programmed with an external resistor. Top Lid GND The top lid is connected to GND pin of the package. Ordering Information ORDERING NUMBER PART NUMBER (NOTES 1, 2) TEMP RANGE (C) 5962R1121202VXC ISL75051SEHVF -55 to +125 5962R1121202V9A ISL75051SEHVX -55 to +125 ISL75051SRHF/PROTO ISL75051SRHF/PROTO -55 to +125 ISL75051SRHEVAL1Z Evaluation Board PACKAGE PKG DWG. # 18 Ld CDFP K18.D 18 Ld CDFP K18.D NOTES: 1. These Intersil Pb-free Hermetic packaged products employ 100% Au plate - e4 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations. 2. For Moisture Sensitivity Level (MSL), please see device information page for ISL75051SEH. For more information on MSL please see Tech Brief TB363. 3 FN8294.0 August 28, 2012 ISL75051SEH Absolute Maximum Ratings Thermal Information VIN Relative to GND (Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to +6.7V VOUT Relative to GND (Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to +6.7V PG, EN, OCP/ADJ Relative to GND (Note 3). . . . . . . . . . . . . -0.3 to +6.7VDC Junction Temperature (TJ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +175C Thermal Resistance (Typical) JA (C/W) JC (C/W) 18 Ld CDFP Package (Notes 7, 8) . . . . . . . 28 4 Storage Temperature Range. . . . . . . . . . . . . . . . . . . . . . . .-65C to +150C Recommended Operating Conditions (Note 4) Ambient Temperature Range (TA) . . . . . . . . . . . . . . . . . . .-55C to +125C Junction Temperature (TJ) (Note 3). . . . . . . . . . . . . . . . . . . . . . . . . . .+150C VIN Relative to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.2V to 6.0V VOUT Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .0.8V to 5.0V PG, EN, OCP/ADJ relative to GND . . . . . . . . . . . . . . . . . . . . . . . 0V to +6.0V Radiation Information Maximum Total Dose Dose Rate = 50-300rad(Si)/s . . . . . . . . . . . . . . . . . . . . . . . 100krad (Si) Dose Rate = 0.01rad(Si)/s (Note 5). . . . . . . . . . . . . . . . . . . . . 100krad (Si) SEE Performance SET (VOUT < 5% During Events) (Note 6) . . . . . . . . . . .86MeV*cm2/mg SEL/SEB (No Latchup/Burnout. . . . . . . . . . . . . . . . . . . .86MeV*cm2/mg CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and result in failures not covered by warranty. NOTES: 3. Extended operation at these conditions may compromise reliability. Exceeding these limits will result in damage. Recommended operating conditions define limits where specifications are guaranteed. 4. Refer to "Thermal Guidelines" on page 15. 5. Product capability established by initial characterization. The "EH" version is acceptance tested on a wafer by wafer basis to 50 krad(Si) at low dose rate. 6. Specify EVAL test conditions for SET/SEB/SEL here. 7. JA is measured in free air with the component mounted on a high effective thermal conductivity test board with "direct attach" features. See Tech Brief TB379 8. For JC, the "case temp" location is the center of the package underside. 9. The device can work down to VOUT = 0.8V; however, the SET performance of < 5% at LET = 86MeV.cm2/mg is guaranteed at VOUT = >1.5V only. SET tests performed with 220F 10V 25m and 0.1F CDR04 capacitor on the input and output. Electrical Specifications Unless otherwise noted, all parameters are guaranteed over the following specified conditions: VIN = VOUT + 0.4V, VOUT = 1.8V, CIN = COUT = 220F 25m and 0.1F X7R, TJ = +25C, IL = 0A. Applications must follow thermal guidelines of the package to determine worst-case junction temperature (see Note 13). Boldface limits apply over the operating temperature range, -55C to +125C. Pulse load techniques used by ATE to ensure TJ = TA defines guaranteed limits. PARAMETER SYMBOL TEST CONDITIONS MIN (Note 10) TYP MAX (Note 10) UNITS -1.5 0.2 1.5 % -1.5 0.2 1.5 % 514.8 520 525.2 mV DC CHARACTERISTICS DC Output Voltage Accuracy VOUT VOUT Resistor adjust to 0.52V, 1.5V and 1.8V 2.2V < VIN < 3.6V; 0A < ILOAD < 3.0A VOUT Resistor adjust to 5.0V VOUT + 0.4V < VIN < 6.0V; 0A < ILOAD < 3.0A VADJ Pin Voltage VADJ 2.2V < VIN < 6.0V; ILOAD = 0A BYP Pin VBYP 2.2V < VIN < 6.0V; ILOAD = 0A 520 DC Input Line Regulation 2.2V < VIN < 3.6V, VOUT = 1.5V, +25C and -55C (Note 11) 1.13 3.5 mV DC Input Line Regulation 2.2V < VIN < 3.6V, VOUT = 1.5V, +125C (Note 11) 1.13 8.0 mV DC Input Line Regulation 2.2V < VIN < 3.6V, VOUT = 1.8V, +25C and -55C (Note 11) 1.62 3.5 mV DC Input Line Regulation 2.2V < VIN < 3.6V, VOUT = 1.8V, +125C (Note 11) 1.62 10.5 mV DC Input Line Regulation VOUT + 0.4V < VIN < 6.0V, VOUT = 5.0V (Note 11) 12.50 20.0 mV DC Output Load Regulation VOUT = 1.5V; 0A < ILOAD < 3.0A, VIN = VOUT + 0.4V (Note 11) -4.0 -0.8 -0.1 mV DC Output Load Regulation VOUT = 1.8V; 0A < ILOAD < 3.0A, VIN = VOUT + 0.4V (Note 11) -4.0 -1.2 -0.05 mV 4 mV FN8294.0 August 28, 2012 ISL75051SEH Electrical Specifications Unless otherwise noted, all parameters are guaranteed over the following specified conditions: VIN = VOUT + 0.4V, VOUT = 1.8V, CIN = COUT = 220F 25m and 0.1F X7R, TJ = +25C, IL = 0A. Applications must follow thermal guidelines of the package to determine worst-case junction temperature (see Note 13). Boldface limits apply over the operating temperature range, -55C to +125C. Pulse load techniques used by ATE to ensure TJ = TA defines guaranteed limits. (Continued) PARAMETER SYMBOL TEST CONDITIONS DC Output Load Regulation VOUT = 5.0V; 0A < ILOAD < 3.0A, VIN = VOUT + 0.4V (Note 11) VADJ Input Current VADJ = 0.5V MIN (Note 10) TYP MAX (Note 10) UNITS -15.0 -6.0 -0.05 mV 1 A Ground Pin Current IQ VOUT = 1.5V; ILOAD = 0A, VIN = 2.2V 11 12 mA Ground Pin Current IQ VOUT = 5.0V; ILOAD = 0A, VIN = 6.0V 16 18 mA Ground Pin Current IQ VOUT = 1.5V; ILOAD = 3.0A, VIN = 2.2V 11 13 mA Ground Pin Current IQ VOUT = 5.0V; ILOAD = 3.0A, VIN = 6.0V 16 18 mA Ground Pin Current in Shutdown ISHDN ENABLE Pin = 0V, VIN = 6.0V 1 10 A Dropout Voltage VDO ILOAD = 1.0A, VOUT = 2.5V (Note 12) 65 100 mV Dropout Voltage VDO ILOAD = 2.0A, VOUT = 2.5V (Note 12) 140 200 mV Dropout Voltage VDO ILOAD = 3.0A, VOUT = 2.5V (Note 12) 225 300 mV Output Short Circuit Current ISCL VOUT = 0V, VIN = 2.2V, RSET = 5.11k 1.1 A Output Short Circuit Current ISCL VOUT = 0V, VIN = 6.0V, RSET = 5.11k 1.2 A Output Short Circuit Current ISCH VOUT = 0V, VIN = 2.2V, RSET = 511 5.7 A Output Short Circuit Current ISCH VOUT = 0V, VIN = 6.0V, RSET = 511 6.2 A Thermal Shutdown Temperature TSD VOUT + 0.4V < VIN < 6.0V 175 C Thermal Shutdown Hysteresis (Rising Threshold) TSDn VOUT + 0.4V < VIN < 6.0V 25 C Input Supply Ripple Rejection PSRR VP-P = 300mV, f = 1kHz, ILOAD = 3A; VIN = 2.5V, VOUT = 1.8V 66 dB Input Supply Ripple Rejection PSRR VP-P = 300mV, f = 100kHz, ILOAD = 3A; VIN = 2.5V, VOUT = 1.8V 30 dB 70 dB AC CHARACTERISTICS 42 Phase Margin PM VOUT = 1.8V, CL = 220F Tantalum Gain Margin GM VOUT = 1.8V, CL = 220F Tantalum 16 dB ILOAD = 10mA, BW = 300Hz < f < 300kHz, BYPASS to GND capacitor = 0.2F 100 VRMS Output Noise Voltage DEVICE START-UP CHARACTERISTICS: ENABLE PIN Rising Threshold 2.2V < VIN < 6.0V 0.6 0.9 1.2 V Falling Threshold 2.2V < VIN < 6.0V 0.47 0.7 0.9 V 1 A 225 300 450 s Enable Pin Leakage Current VIN = 6.0V, EN = 6.0V Enable Pin Propagation Delay VIN = 2.2V, EN rise to IOUT rise Enable Pin Turn-on Delay VIN = 2.2V, VOUT = 1.8V, ILOAD = 1A, COUT = 220F, CBYP = 0.2F 6 ms Enable Pin Turn-on Delay VIN = 2.2V, VOUT = 1.8V, ILOAD = 1A, COUT = 47F, CBYP = 0.2F 50 s Hysteresis Must be independent of VIN; 2.2V < VIN < 6.0V 5 90 200 318 mV FN8294.0 August 28, 2012 ISL75051SEH Electrical Specifications Unless otherwise noted, all parameters are guaranteed over the following specified conditions: VIN = VOUT + 0.4V, VOUT = 1.8V, CIN = COUT = 220F 25m and 0.1F X7R, TJ = +25C, IL = 0A. Applications must follow thermal guidelines of the package to determine worst-case junction temperature (see Note 13). Boldface limits apply over the operating temperature range, -55C to +125C. Pulse load techniques used by ATE to ensure TJ = TA defines guaranteed limits. (Continued) PARAMETER SYMBOL TEST CONDITIONS MIN (Note 10) TYP MAX (Note 10) UNITS DEVICE START-UP CHARACTERISTICS: PG PIN PG Rising Threshold 2.2V < VIN < 6.0V 85 90 96 % PG Falling Threshold 2.2V < VIN < 6.0V 82 88 93 % 2.5 PG Hysteresis 2.2V < VIN < 6.0V 3.2 4.0 %VOUT PG Low Voltage ISINK = 1mA 35 100 mV PG Low Voltage ISINK = 6mA 185 400 mV PG Leakage Current VIN = 6.0V, PG = 6.0V 0.01 1 A NOTES: 10. Parameters with MIN and/or MAX limits are 100% tested at -55C, +25C and +125C, unless otherwise specified. Temperature limits established by characterization and are not production tested. 11. Line and Load Regulation done under pulsed condition for T<10ms. 12. Dropout is defined as the difference between the supply VIN and VOUT, when the supply produces a 2% drop in VOUT from its nominal value. Data measured within a 3ms period. 13. Please refer to "Applications Information" on page 14 of the datasheet and Tech Brief TB379. High Dose Rate Post Radiation Characteristics TA = +25C, unless otherwise noted. This data is typical test data post radiation exposure at a rate of 50 to 300rad(Si)/s. This data is intended to show typical parameter shifts due to high dose rate radiation. (see Note 14). These are not limits nor are they guaranteed. ITEM # DESCRIPTION CONDITION 0k RAD 100k RAD UNITS 1 DC Output Voltage Accuracy VOUT = 0.52V; VIN = 2.2V; IOUT = 0A 0.520575 0.520975 V 2 DC Output Voltage Accuracy VOUT = 0.52V; VIN = 2.2V; IOUT = 3A 0.520000 0.520300 V 3 DC Output Voltage Accuracy VOUT = 0.52V; VIN = 3.6V; IOUT = 0A 0.520650 0.520813 V 4 DC Output Voltage Accuracy VOUT = 0.52V; VIN = 3.6V; IOUT = 3A 0.519963 0.520113 V 5 DC Output Voltage Accuracy VOUT = 1.5V; VIN = 2.2V; IOUT = 0A 1.500813 1.501325 V 6 DC Output Voltage Accuracy VOUT = 1.5V; VIN = 2.2V; IOUT = 3A 1.499250 1.499800 V 7 DC Output Voltage Accuracy VOUT = 1.5V; VIN = 3.6V; IOUT = 0A 1.500550 1.500938 V 8 DC Output Voltage Accuracy VOUT = 1.5V; VIN = 3.6V; IOUT = 3A 1.499075 1.499388 V 9 DC Output Voltage Accuracy VOUT = 1.8V; VIN = 2.2V; IOUT = 0A 1.802288 1.803613 V 10 DC Output Voltage Accuracy VOUT = 1.8V; VIN = 2.2V; IOUT = 3A 1.800900 1.801825 V 11 DC Output Voltage Accuracy VOUT = 1.8V; VIN = 3.6V; IOUT = 0A 1.802900 1.803338 V 12 DC Output Voltage Accuracy VOUT = 1.8V; VIN = 3.6V; IOUT = 3A 1.801175 1.801550 V 13 DC Output Voltage Accuracy VOUT = 5.0V; VIN = 5.4V; IOUT = 0A 5.018250 5.018850 V 14 DC Output Voltage Accuracy VOUT = 5.0V; VIN = 5.4V; IOUT = 3A 5.013050 5.013450 V 15 DC Output Voltage Accuracy VOUT = 5.0V; VIN = 6.0V; IOUT = 0A 5.023838 5.024188 V 16 DC Output Voltage Accuracy VOUT = 5.0V; VIN = 6.0V; IOUT = 3A 5.016550 5.016763 V 17 VADJ Pin Voltage VOUT = 0.52V; VIN = 2.2V 0.520625 0.521000 V 18 VADJ Pin Voltage VOUT = 0.52V; VIN = 3.6V 0.520700 0.520863 V 19 VADJ Pin Voltage VOUT = 0.52V; VIN = 5.5V 0.521125 0.521200 V 20 VADJ Pin Voltage VOUT = 1.5V; VIN = 2.2V 0.520800 0.521013 V 21 VADJ Pin Voltage VOUT = 1.5V; VIN = 3.6V 0.520688 0.520838 V 6 FN8294.0 August 28, 2012 ISL75051SEH High Dose Rate Post Radiation Characteristics TA = +25C, unless otherwise noted. This data is typical test data post radiation exposure at a rate of 50 to 300rad(Si)/s. This data is intended to show typical parameter shifts due to high dose rate radiation. (see Note 14). These are not limits nor are they guaranteed. (Continued) ITEM # DESCRIPTION CONDITION 0k RAD 100k RAD UNITS 22 VADJ Pin Voltage VOUT = 1.5V; VIN = 5.5V 0.521025 0.521113 V 23 VADJ Pin Voltage VOUT = 1.8V; VIN = 2.2V 0.520563 0.520925 V 24 VADJ Pin Voltage VOUT = 1.8V; VIN = 3.6V 0.520688 0.520838 V 25 VADJ Pin Voltage VOUT = 1.8V; VIN = 5.5V 0.521038 0.521100 V 26 VADJ Pin Voltage VOUT = 5.0V; VIN = 5.4V 0.521000 0.521088 V 27 VADJ Pin Voltage VOUT = 5.0V; VIN = 6.0V 0.521575 0.521625 V 28 DC Input Line Regulation 2.2V < VIN < 3.6V, VOUT = 1.5V -0.257100 -0.408960 mV 29 DC Input Line Regulation 2.2V < VIN < 3.6V, VOUT = 1.8V 0.611613 -0.281990 mV 30 DC Input Line Regulation VOUT + 0.4V < VIN < 6.0V, VOUT = 5.0V 5.600700 5.313688 mV 31 DC Output Load Regulation VOUT = 1.5V; 0A < ILOAD < 3.0A, VIN = VOUT + 0.4V -1.559875 -1.549760 mV 32 DC Output Load Regulation VOUT = 1.8V; 0A < ILOAD < 3.0A, VIN = VOUT + 0.4V -1.390263 -1.784640 mV 33 DC Output Load Regulation VOUT = 5.0V; 0A < ILOAD < 3.0A, VIN = VOUT + 0.4V -5.201513 -5.418710 mV 34 Feedback Input Current VADJ = 0.5V -0.036650 -0.040980 A 35 Ground Pin Current VOUT = 1.5V; ILOAD = 0A, VIN = 2.2V 10.715763 10.758810 mA 36 Ground Pin Current VOUT = 1.5V; ILOAD = 3.0A, VIN = 2.2V 12.016163 12.067510 mA 37 Ground Pin Current VOUT = 5.0V; ILOAD = 0A, VIN = 6.0V 15.796488 15.781190 mA 38 Ground Pin Current VOUT = 5.0V; ILOAD = 3.0A, VIN = 6.0V 17.178913 17.166440 mA 39 Ground Pin Current in Shutdown ENABLE Pin = 0V, VIN = 6.0V 0.811625 0.752100 A 40 Dropout Voltage ILOAD = 1.0A, VOUT = 2.5V 62.588600 63.660340 mV 41 Dropout Voltage ILOAD = 2.0A, VOUT = 2.5V 134.520040 135.703500 mV 42 Dropout Voltage ILOAD = 3.0A, VOUT = 2.5V 215.603360 216.651900 mV 43 Output Short Circuit Current VOUT = 0V, VIN = 2.2V, RSET = 5.11k 1.204063 1.323238 A 44 Output Short Circuit Current VOUT = 0V, VIN = 2.2V, RSET = 511 5.903613 6.058613 A 45 Output Short Circuit Current VOUT = 0V, VIN = 6.0V, RSET = 5.11k 1.333325 1.439638 A 46 Output Short Circuit Current VOUT = 0V, VIN = 6.0V, RSET = 511 6.389913 6.635563 A 47 PSRR VP-P = 300mV, f = 1kHz, ILOAD = 3A; VIN = 2.5V, VOUT = 1.8V 65.428638 66.410750 db 48 Enable Rising Threshold VIN = 2.2V 0.863700 0.824150 V 49 Enable Rising Threshold VIN = 6.0V 0.911300 0.875263 V 50 Enable Falling Threshold VIN = 2.2V 0.678400 0.636800 V 51 Enable Falling Threshold VIN = 6.0V 0.724475 0.684400 V 52 Enable Pin Leakage Current VIN = 6.0V, EN = 0V -0.028513 -0.029950 A 53 Enable Pin Leakage Current VIN = 6.0V, EN = 6.0V -0.030638 -0.038110 A 54 Enable Hysterisis VIN = 2.2V 185.370000 187.374000 mV 55 Enable Hysterisis VIN = 6.0V 186.874000 190.881600 mV 56 Enable Pin Propagation Delay VIN = 2.2V, EN rise to IOUT rise 305.015280 290.839200 s 57 PG Rising Threshold VIN = 2.2V 89.542938 88.811230 % 58 PG Rising Threshold VIN = 6.0V 91.083838 90.396230 % 59 PG Falling Threshold VIN = 2.2V 86.793125 86.074360 % 7 FN8294.0 August 28, 2012 ISL75051SEH High Dose Rate Post Radiation Characteristics TA = +25C, unless otherwise noted. This data is typical test data post radiation exposure at a rate of 50 to 300rad(Si)/s. This data is intended to show typical parameter shifts due to high dose rate radiation. (see Note 14). These are not limits nor are they guaranteed. (Continued) ITEM # DESCRIPTION CONDITION 0k RAD 100k RAD UNITS 60 PG Falling Threshold VIN = 6.0V 87.840925 87.165790 % 61 PG Hysteresis VIN = 2.2V 2.749825 2.736875 % 62 PG Hysteresis VIN = 6.0V 3.242925 3.230450 % 63 PG Low Voltage ISINK = 1mA 31.426938 31.570940 mV 64 PG Low Voltage ISINK = 6mA 177.107950 178.578800 mV 65 PG Leakage Current VIN = 6.0V, PG = 6.0V -0.001550 -0.001560 A Low Dose Rate Post Radiation Characteristics TA = +25C, unless otherwise noted. This data is typical test data post radiation exposure at a rate of 10mrad(Si)/s. This data is intended to show typical parameter shifts due to low dose rate radiation. (see Note 14). These are not limits nor are they guaranteed. ITEM # DESCRIPTION CONDITION 0k RAD 50k RAD 100k RAD UNITS 1 DC Output Voltage Accuracy VOUT = 0.52V; VIN = 2.2V; IOUT = 0A 0.521050 0.521150 0.521600 V 2 DC Output Voltage Accuracy VOUT = 0.52V; VIN = 2.2V; IOUT = 3A 0.520500 0.520600 0.520950 V 3 DC Output Voltage Accuracy VOUT = 0.52V; VIN = 3.6V; IOUT = 0A 0.521050 0.521350 0.521750 V 4 DC Output Voltage Accuracy VOUT = 0.52V; VIN = 3.6V; IOUT = 3A 0.520450 0.520600 0.521000 V 5 DC Output Voltage Accuracy VOUT = 1.5V; VIN = 2.2V; IOUT = 0A 1.502450 1.503050 1.503200 V 6 DC Output Voltage Accuracy VOUT = 1.5V; VIN = 2.2V; IOUT = 3A 1.500950 1.501400 1.502100 V 7 DC Output Voltage Accuracy VOUT = 1.5V; VIN = 3.6V; IOUT = 0A 1.501950 1.502900 1.503650 V 8 DC Output Voltage Accuracy VOUT = 1.5V; VIN = 3.6V; IOUT = 3A 1.500500 1.501400 1.502150 V 9 DC Output Voltage Accuracy VOUT = 1.8V; VIN = 2.2V; IOUT = 0A 1.804150 1.805050 1.806100 V 10 DC Output Voltage Accuracy VOUT = 1.8V; VIN = 2.2V; IOUT = 3A 1.802850 1.803650 1.804800 V 11 DC Output Voltage Accuracy VOUT = 1.8V; VIN = 3.6V; IOUT = 0A 1.804450 1.805850 1.806600 V 12 DC Output Voltage Accuracy VOUT = 1.8V; VIN = 3.6V; IOUT = 3A 1.802850 1.804100 1.804900 V 13 DC Output Voltage Accuracy VOUT = 5.0V; VIN = 5.4V; IOUT = 0A 5.022600 5.027250 5.028500 V 14 DC Output Voltage Accuracy VOUT = 5.0V; VIN = 5.4V; IOUT = 3A 5.017200 5.022200 5.023350 V 15 DC Output Voltage Accuracy VOUT = 5.0V; VIN = 6.0V; IOUT = 0A 5.028050 5.032500 5.034350 V 16 DC Output Voltage Accuracy VOUT = 5.0V; VIN = 6.0V; IOUT = 3A 5.020950 5.025500 5.027050 V 17 VADJ Pin Voltage VOUT = 0.52V; VIN = 2.2V 0.521150 0.521300 0.521600 V 18 VADJ Pin Voltage VOUT = 0.52V; VIN = 3.6V 0.521150 0.521400 0.521700 V 19 VADJ Pin Voltage VOUT = 0.52V; VIN = 5.5V 0.521550 0.521800 0.522150 V 20 VADJ Pin Voltage VOUT = 1.5V; VIN = 2.2V 0.521400 0.521500 0.521550 V 21 VADJ Pin Voltage VOUT = 1.5V; VIN = 3.6V 0.521150 0.521400 0.521700 V 22 VADJ Pin Voltage VOUT = 1.5V; VIN = 5.5V 0.521450 0.521800 0.522050 V 23 VADJ Pin Voltage VOUT = 1.8V; VIN = 2.2V 0.521050 0.521200 0.521550 V 24 VADJ Pin Voltage VOUT = 1.8V; VIN = 3.6V 0.521150 0.521400 0.521750 V 25 VADJ Pin Voltage VOUT = 1.8V; VIN = 5.5V 0.521450 0.521800 0.522000 V 26 VADJ Pin Voltage VOUT = 5.0V; VIN = 5.4V 0.521400 0.521800 0.521950 V 27 VADJ Pin Voltage VOUT = 5.0V; VIN = 6.0V 0.522000 0.522250 0.522600 V 28 DC Input Line Regulation 2.2V < VIN < 3.6V, VOUT = 1.5V -0.284500 -0.176150 0.158400 mV 29 DC Input Line Regulation 2.2V < VIN < 3.6V, VOUT = 1.8V 0.520000 0.551100 0.356200 mV 8 FN8294.0 August 28, 2012 ISL75051SEH Low Dose Rate Post Radiation Characteristics TA = +25C, unless otherwise noted. This data is typical test data post radiation exposure at a rate of 10mrad(Si)/s. This data is intended to show typical parameter shifts due to low dose rate radiation. (see Note 14). These are not limits nor are they guaranteed. (Continued) ITEM # DESCRIPTION CONDITION 0k RAD 50k RAD 100k RAD UNITS 30 DC Input Line Regulation VOUT + 0.4V < VIN < 6.0V, VOUT = 5.0V 5.792850 5.296750 5.315300 mV 31 DC Output Load Regulation VOUT = 1.5V; 0A < ILOAD < 3.0A, VIN = VOUT + 0.4V -1.525700 -1.571300 -1.219950 mV 32 DC Output Load Regulation VOUT = 1.8V; 0A < ILOAD < 3.0A, VIN = VOUT + 0.4V -1.314200 -1.447200 -1.372050 mV 33 DC Output Load Regulation VOUT = 5.0V; 0A < ILOAD < 3.0A, VIN = VOUT + 0.4V -5.026850 -5.007050 -4.816750 mV 34 Feedback Input Current VADJ = 0.5V -0.011650 -0.030300 -0.036550 A 35 Ground Pin Current VOUT = 1.5V; ILOAD = 0A, VIN = 2.2V 10.665000 10.658900 10.621750 mA 36 Ground Pin Current VOUT = 1.5V; ILOAD = 3.0A, VIN = 2.2V 11.977100 12.015600 11.948450 mA 37 Ground Pin Current VOUT = 5.0V; ILOAD = 0A, VIN = 6.0V 15.814550 15.840150 15.771750 mA 38 Ground Pin Current VOUT = 5.0V; ILOAD = 3.0A, VIN = 6.0V 17.223200 17.224650 17.189200 mA 39 Ground Pin Current in Shutdown ENABLE Pin = 0V, VIN = 6.0V 0.430300 0.601500 0.707900 A 40 Dropout Voltage ILOAD = 1.0A, VOUT = 2.5V 62.801250 62.431600 65.466000 mV 41 Dropout Voltage ILOAD = 2.0A, VOUT = 2.5V 132.799650 133.294300 138.742500 mV 42 Dropout Voltage ILOAD = 3.0A, VOUT = 2.5V 214.477050 mV 213.033000 221.517950 43 Output Short Circuit Current VOUT = 0V, VIN = 2.2V, RSET = 5.11k 1.178050 1.199850 1.224300 A 44 Output Short Circuit Current VOUT = 0V, VIN = 2.2V, RSET = 511 5.838350 5.898050 5.750950 A 45 Output Short Circuit Current VOUT = 0V, VIN = 6.0V, RSET = 5.11k 1.317450 1.338450 1.361150 A 46 Output Short Circuit Current VOUT = 0V, VIN = 6.0V, RSET = 511 6.375650 6.464150 6.539300 A 47 PSRR VP-P = 300mV, f = 1kHz, ILOAD = 3A; VIN = 2.5V, VOUT = 1.8V 64.103100 67.373400 65.407000 db 48 Enable Rising Threshold VIN = 2.2V 0.867700 0.835700 0.827700 V 49 Enable Rising Threshold VIN = 6.0V 0.915800 0.905800 0.893800 V 50 Enable Falling Threshold VIN = 2.2V 0.681400 0.671300 0.661300 V 51 Enable Falling Threshold VIN = 6.0V 0.727500 0.715400 0.707400 V 52 Enable Pin Leakage Current VIN = 6.0V, EN = 0V -0.004900 -0.025200 -0.030100 A 53 Enable Pin Leakage Current VIN = 6.0V, EN = 6.0V -0.009750 -0.024850 -0.029650 A 54 Enable Hysterisis VIN = 2.2V 184.368000 166.332000 168.336000 mV 55 Enable Hysterisis VIN = 6.0V 188.377000 190.381000 188.377000 mV 56 Enable Pin Propagation Delay VIN = 2.2V, EN rise to IOUT rise 304.015700 299.771700 296.604250 s 57 PG Rising Threshold VIN = 2.2V 88.455750 88.057850 88.741300 % 58 PG Rising Threshold VIN = 6.0V 89.994350 89.499600 90.142250 % 59 PG Falling Threshold VIN = 2.2V 85.755650 85.356800 85.996150 % 60 PG Falling Threshold VIN = 6.0V 86.812350 86.316300 86.870500 % 61 PG Hysteresis VIN = 2.2V 2.701500 2.699650 2.745150 % 62 PG Hysteresis VIN = 6.0V 3.182050 3.183350 3.271700 % 63 PG Low Voltage ISINK = 1mA 31.560800 31.295600 31.212750 mV 64 PG Low Voltage ISINK = 6mA 177.500500 177.572900 175.997050 mV 65 PG Leakage Current VIN = 6.0V, PG = 6.0V 0.017550 -0.000750 -0.002400 A NOTE: 14. See the Radiation report. 9 FN8294.0 August 28, 2012 ISL75051SEH Post Radiation Characteristics for High Dose and Low Dose TA = +25C, unless otherwise noted. This data is typical test data post radiation exposure at a rate of 10mrad(Si)/s for low dose rate and 50-300rad(Si)/s for high dose rate. This data is intended to show typical parameter shifts due to HDR (High Dose Rate) or LDR (Low Dose Rate) radiation. These are not limits nor are they guaranteed. 1.525 1.525 1.515 1.510 HDR BIAS LDR BIAS 1.505 1.500 1.495 HDR GROUND LDR GROUND 1.490 1.485 1.480 1.475 SPEC LIMIT 50 0 100 150 TOTAL DOSE, krad(Si) 1.500 1.495 HDR GROUND LDR GROUND 1.490 1.485 1.480 SPEC LIMIT 0 50 100 POST ANNEAL 150 FIGURE 4. DC OUTPUT VOLTAGE, 1.5VOUT, 3.6VIN, 3A LOAD 18 LDR BIAS HDR BIAS 16 14 HDR GROUND LDR GROUND 12 10 8 SPEC LIMIT 0 50 100 150 DROPOUT VOLTAGE, 3A (mV) GROUND PIN CURRENT 5.0VOUT, 5.5VIN, NL (mA) HDR BIAS LDR BIAS 1.505 350 SPEC LIMIT CONTROL TOTAL DOSE, krad(Si) SPEC LIMIT 300 200 100 SPEC LIMIT 50 0 50 100 150 TOTAL DOSE, krad(Si) 1.8 SPEC LIMIT LDR BIAS 6 CONTROL LDR GROUND 5 HDR GROUND SPEC LIMIT 0 50 100 150 TOTAL DOSE, krad(Si) POST ANNEAL FIGURE 7. OUTPUT SHORT CIRCUIT CURRENT, RSET = 511, 2.2VIN 10 POST ANNEAL SPEC LIMIT 1.6 SC CURRENT RSET = 5.11k, 5.5VIN (A) HDR BIAS HDR BIAS LDR GROUND 150 FIGURE 6. DROPOUT VOLTAGE, 2.5VOUT, 3A LOAD CURRENT 8 7 HDR GROUND CONTROL LDR BIAS 250 0 POST ANNEAL FIGURE 5. GROUND PIN CURRENT, 1.5VOUT, 6.0VIN, NO LOAD SC CURRENT RSET = 511, 2.2VIN (A) 1.510 TOTAL DOSE, krad(Si) 20 4 1.515 1.475 POST ANNEAL FIGURE 3. DC OUTPUT VOLTAGE, 1.5VOUT, 3.6VIN NO LOAD 6 SPEC LIMIT 1.520 SPEC LIMIT DC OUTPUT VOLTAGE 3.6V IN, 1.5VOUT, 3.0A (V) DC OUTPUT VOLTAGE 3.6VIN, 1.5VOUT, NL (V) 1.520 LDR BIAS CONTROL HDR BIAS 1.4 1.2 LDR GROUND 1.0 HDR GROUND 0.8 0.6 0.4 0 50 SPEC LIMIT 100 TOTAL DOSE, krad(Si) 150 POST ANNEAL FIGURE 8. OUTPUT SHORT CIRCUIT CURRENT, RSET = 5.11k, 6.0VIN FN8294.0 August 28, 2012 ISL75051SEH Typical Operating Performance 1.528 +25C, VADJ 0.521 1.524 -58C, VOUT 0.520 VADJ (V) 1.522 VOUT (V) 0.522 +25C, VOUT 1.526 1.520 1.518 +128C, VOUT 1.516 -58C, VADJ 0.519 0.518 +128C, VADJ 0.517 1.514 1.512 VIN = 2.5V = 1.5V V 1.510 OUT 0.0 0.5 1.0 1.5 2.0 2.5 3.0 0.516 V = 2.5V IN V = 1.5V 0.515 OUT 0.0 0.5 1.0 3.5 1.5 IOUT (A) FIGURE 9. LOAD REGULATION, VOUT vs IOUT 0.5210 -58C, VOUT 2.515 3.5 +25C, VADJ 0.5205 -58C, VADJ 0.5200 +25C, VOUT 2.510 VADJ (V) VOUT (V) 3.0 0.5215 2.520 2.505 2.500 +128C, VOUT 2.490 VIN = 3.3V V = 2.5V 2.485 OUT 0.0 0.5 1.0 0.5195 0.5190 0.5185 0.5180 0.5170 0.5165 1.5 2.0 2.5 +128C, VADJ 0.5175 2.495 3.0 VIN = 3.3V VOUT = 2.5V 0.5160 0.0 3.5 0.5 1.0 IOUT (A) 0.5215 0.5210 0.5200 VADJ (V) 4.080 +25C, VOUT 4.075 4.070 1.5 2.0 2.5 3.0 IOUT (A) FIGURE 13. LOAD REGULATION, VOUT vs IOUT 11 3.5 +25C, VADJ -58C, VADJ 0.5195 0.5190 0.5185 +128C, VADJ 0.5180 0.5170 VIN = 5V VOUT = 4V 1.0 3.0 0.5175 -58C, VOUT 0.5 2.5 0.5205 +128C, VOUT 4.060 0.0 2.0 FIGURE 12. LOAD REGULATION, VADJ vs IOUT 4.090 4.085 1.5 IOUT (A) FIGURE 11. LOAD REGULATION, VOUT vs IOUT VOUT (V) 2.5 FIGURE 10. LOAD REGULATION, VADJ vs IOUT 2.525 4.065 2.0 IOUT (A) 3.5 0.5165 VIN = 5V V = 4V 0.5160 OUT 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 IOUT (A) FIGURE 14. LOAD REGULATION, VADJ vs IOUT FN8294.0 August 28, 2012 ISL75051SEH Typical Operating Performance (Continued) 8 0.525 ROCP = 0.511k 7 6 +25C, VADJ 0.521 0.519 OCP (A) VADJ (V) 0.523 -58C, VADJ +128C, VADJ ROCP = 0.681k 5 ROCP = 0.75k 4 ROCP = 1.47k 3 ROCP = 1.00k ROCP = 2.00k 2 0.517 1 0.515 2.0 ROCP = 2.61k 0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 2.0 2.5 3.0 3.5 ROCP = 3.83 4.0 VIN (V) 4 3 8 ROCP = 0.511k 6 ROCP = 0.681k ROCP = 0.75k ROCP = 1.00k ROCP = 1.47k ROCP = 2.00k 2 6.5 7.0 ROCP = 0.681k 5 ROCP = 1.00k ROCP = 0.75k 4 ROCP = 2.00k ROCP = 1.47k 3 2 1 0 2.0 6.0 ROCP = 0.511k 7 OCP (A) OCP (A) 5 5.5 FIGURE 16. ROCP vs OCP AT +25C, VOUT = 1.5V 8 6 ROCP = 5.11k 5.0 VIN (V) FIGURE 15. VIN vs VADJ OVER TEMPERATURE 7 4.5 1 ROCP = 3.83 ROCP = 2.61k 2.5 3.0 3.5 4.0 4.5 5.0 VIN (V) 5.5 ROCP = 5.11k 6.0 6.5 7.0 FIGURE 17. ROCP vs OCP AT +128C, VOUT = 1.5V FIGURE 19. TRANSIENT LOAD RESPONSE, VIN = 3.3V, VOUT = 2.5V, COUT = 47F, 35m 12 0 2.0 ROCP = 3.83 ROCP = 2.61k 2.5 3.0 3.5 4.0 4.5 5.0 VIN (V) 5.5 ROCP = 5.11k 6.0 6.5 7.0 FIGURE 18. ROCP vs OCP AT -58C, VOUT = 1.5V FIGURE 20. TRANSIENT LOAD RESPONSE, VIN = 3.3V, VOUT = 2.5V, COUT = 220F, 25m FN8294.0 August 28, 2012 ISL75051SEH Typical Operating Performance (Continued) FIGURE 21. POWER-ON AND POWER-OFF, EN = 0 TO 1, +25C, VIN = 6V, VOUT = 0.8V, IOUT = 0.5A, PGOOD TURN-ON FIGURE 22. POWER-ON AND POWER-OFF, EN = 0 TO 1, +25C, VIN = 2.2V, VOUT = 0.8V, IOUT = 0.5A, PGOOD TURN-ON FIGURE 23. POWER-ON AND POWER-OFF, EN = 1 TO 0, +25C, VIN = 6V, VOUT = 0.8V, IOUT = 0.5A, PGOOD TURN-OFF FIGURE 24. POWER-ON AND POWER-OFF, EN = 1 TO 0, +25C, VIN = 2.2V, VOUT = 0.8V, IOUT = 0.5A, PGOOD TURN-OFF 80 1000 10 1 0.1 300 64.96dB PSRR dB AT -58C 60 100 GAIN (dB) NOISE (V/Hz) 70 3k 30k FREQUENCY (Hz) FIGURE 25. NOISE (V/Hz) 13 300k 50 40 30 PSRR dB AT +25C PSRR dB AT +128C 20 VIN = 2.5V, VOUT = 1.8V, IOUT = 3A, SIGNAL = 300mVP-P, 10 CIN = 220F TANT, COUT = 220F TANT, CBYP = 0.2F 0 10 100 1k 10k FREQUENCY (Hz) 27.61dB 100k FIGURE 26. PSRR FN8294.0 August 28, 2012 ISL75051SEH Applications Information Input Voltage Requirements This RH LDO will work from a VIN in the range of 2.2V to 6.0V. The input supply can have a tolerance of as much as 10% for conditions noted in the "Electrical Specifications" table starting on page 4. Minimum guaranteed input voltage is 2.2V. However, due to the nature of an LDO, VIN must be some margin higher than the output voltage, plus dropout at the maximum rated current of the application, if active filtering (PSRR) is expected from VIN to VOUT. The dropout spec of this family of LDOs has been generously specified to allow applications to design for efficient operation. TABLE 2. TYPICAL GM/PM WITH VARIOUS CAPACITORS CAPACITANCE (F) ESR (m) GAIN MARGIN (dB) PHASE MARGIN () 47 35 14 55 100 25 16 57 220 6 19 51 220 25 16 69 100 100 10 62 Type numbers of KEMET capacitors used in the device are shown in Table 3. Adjustable Output Voltage TABLE 3. KEMET CAPACITORS USED IN DEVICE The output voltage of the RH LDO can be set to any user programmable level between 0.8V to 5.0V. This is achieved with a resistor divider connected between the OUT, ADJ and GND pins. With the internal reference at 0.52V, the divider ratio should be fixed such that when the desired VOUT level is reached, the voltage presented to the ADJ pin is 0.52V. Resistor values for typical voltages are shown in Table 1. TABLE 1. RESISTOR VALUES FOR TYPICAL VOLTAGES RTOP 0.8V 7.87k 4.32k 1.5V 2.26k 4.32k 1.8V 1.74k 4.32k 2.5V 1.13k 4.32k 4.0V 634 4.32k 5.0V 499 4.32k Input and Output Capacitor Selection RH operation requires the use of a combination of tantalum and ceramic capacitors to achieve a good volume-to-capacitance ratio. The recommended combination is a 220F, 25m 10V DSSC 04051-032 rated tantalum capacitor in parallel with a 0.1F MIL-PRF-49470 CDR04 ceramic capacitor, to be connected between VIN to GND pins and VOUT to GND pins of the LDO, with PCB traces no longer than 0.5cm. The stability of the device depends on the capacitance and ESR of the output capacitor. The usable ESR range for the device is 6m to 100m. At the lower limit of ESR = 6m, the phase margin is about 51C. On the high side, an ESR of 100m is found to limit the gain margin at around 10dB. The typical GM/PM seen with capacitors are shown in Table 2. T525D476M016ATE035 47F, 10V, 35m T525D107M010ATE025 100F, 10V, 25m T530D227M010ATE006 220F, 10V, 6m T525D227M010ATE025 220F, 10V, 25m T495X107K016ATE100 100F, 16V, 100m A typical gain phase plot measured on the ISL75051SRHEVAL1Z evaluation board for VIN = 3.3V, VOUT = 1.8V and IOUT = 3A with a 220F, 10V, 25m capacitor is shown in Figure 27 and is measured at GM = 16.3dB and PM = 69.16. GAIN (dB) RBOTTOM CAPACITOR DETAILS 60 50 40 30 20 10 0 -10 3.3V -20 1.8V -30 3.0A -40 1x220F -50 T525D -60 500 180 150 120 90 60 30 0 -30 -60 -90 -120 -150 -180 PHASE GAIN 5k 50k 500k PHASE () VOUT KEMET TYPE NUMBER 5M FREQUENCY (Hz) FIGURE 27. TYPICAL GAIN PHASE PLOT Enable The device can be enabled by applying a logic high on the EN pin. The enable threshold is typically 0.9V. A soft-start cycle is initiated when the device is enabled using this pin. Taking this pin to logic low disables the device. EN can be driven from either an open drain or a totem pole logic drive between EN pin and GND. Assuming an open drain configuration, M1 will actively pull down the EN line, as shown in Figure 28, and thereby discharge the input capacitance, shutting off the device immediately. 14 FN8294.0 August 28, 2012 ISL75051SEH Current Limit Protection VIN R1 10k INT EN GATE EN PIN INT EN BUS M1 EN The RH LDO incorporates protection against overcurrent due to any short or overload condition applied to the output pin. The current limit circuit becomes a constant current source when the output current exceeds the current limit threshold, which can be adjusted by means of a resistor connected between the OCP pin and GND. If the short or overload condition is removed from VOUT, then the output returns to normal voltage mode regulation. OCP can be calculated with Equation 2: (EQ. 2) OCP = 9.5 * EXP ( - 0.6 * ( ROCP ( 1 + 0.1ROCP ) ) ) 0 where OCP = Overcurrent Threshold in amps, and ROCP = OCP resistor in k. FIGURE 28. ENABLE Power-Good The Power-Good pin is asserted high when the voltage on the ADJ pin crosses the rising threshold of 0.9 x VADJ typ. On the falling threshold, Power-Good is asserted low when the voltage on the ADJ pin crosses the falling threshold of 0.88 x VADJ. The power-good output is an open-drain output rated for a continuous sink current of 1mA. In the event of an overload condition based on the set OCP limit, the die temperature may exceed the internal over-temperature limit, and the LDO begins to cycle on and off due to the fault condition (Figure 30). However, thermal cycling may never occur if the heatsink used for the package can keep the die temperature below the limits specified for thermal shutdown. 8 7 Soft-start is achieved by means of the charging time constant of the BYP pin. The capacitor value on the pin determines the time constant and can be calculated using Equation 1: 6 T S = 0.00577xC S (EQ. 1) OCP (A) Soft-start 5 4 OCP = +25C 3 2 where TS = soft-start time in ms, and CS = BYPASS capacitor in nF. The BYPASS capacitor, C1, charges with a 90A source current and provides an EA reference, -IN, with an SS ramp. VOUT, in turn, follows this ramp. The ramp rate can be calculated based on the C1 value. For conditions in which C1 is opened, or for small values of C1, the ramp is provided by C2 = 50pF, with a source of 0.5A. Connecting C1 min = 0.1F to the BYPASS pin is recommended for normal operation. ADJ PIN VIN VIN I1 90Adc BYPASS EXT PIN C1 0.1F 0 I2 0.5Adc U1 VIN +IN INT SS NODE -IN OUT -IN ISL75051SEH EA C2 50pF 0 FIGURE 29. SOFT-START 75051_PMOS M1 VOUT 1 0 0 1 2 3 4 5 6 ROCP (k) FIGURE 30. OCP vs ROCP OVER TEMP Thermal Guidelines If the die temperature exceeds typically +175C, then the LDO output shuts down to zero until the die temperature cools to typically +155C. The level of power combined with the thermal impedance of the package (JC of 4C/W for the 18 Ld CDFP package) determines whether the junction temperature exceeds the thermal shutdown temperature specified in the "Electrical Specifications" table. The device should be mounted on a high effective thermal conductivity PCB with thermal vias, per JESD51-7 and JESD51-5. Place a silpad between package base and PCB copper plane. The VIN and VOUT ratios should be selected to ensure that dissipation for the selected VIN range keeps TJ within the recommended operating level of 150C for normal operation. Weight Characteristics Weight of Packaged Device K18.D: 1.07 Grams typical with leads clipped 15 FN8294.0 August 28, 2012 ISL75051SEH Die Characteristics Die Dimensions 4555m x 4555m (179.3 mils x 179.3 mils) Thickness: 304.8m 25.4m (12.0 mils 1 mil) BACKSIDE FINISH Silicon PROCESS 0.6M BiCMOS Junction Isolated ASSEMBLY RELATED INFORMATION Interface Materials Substrate Potential GLASSIVATION Type: Silicon Oxide and Silicon Nitride Thickness: 0.3m 0.03m to 1.2m 0.12m TOP METALLIZATION Unbiased ADDITIONAL INFORMATION Worst Case Current Density < 2 x 105 A/cm2 Type: AlCu (99.5%/0.5%) Thickness: 2.7m 0.4m Transistor Count BACKSIDE METALLIZATION None 2932 Layout Characteristics SUBSTRATE Step and Repeat Type: Silicon 4555m x 4555m Metallization Mask Layout PAD X Y C O O R D IN ATES PAD N AM E X m Y m 1 GND 0 0 2 GND -393 0 3 VOUT -711 -710 4 VOUT -711 -1858 5 VOUT -711 -2964 6 ADJ -1680 -3070 7 BYP -1621 -3879 8 EN 2164 -3879 9 OCP 2222 -3131 10 VIN 1078 -2965 11 VIN 1078 -1853 12 VIN 1078 -711 13 PG 420 -25 16 FN8294.0 August 28, 2012 ISL75051SEH Revision History The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to web to make sure you have the latest revision. DATE REVISION August 28, 2012 FN8294.0 CHANGE Initial Release. Products Intersil Corporation is a leader in the design and manufacture of high-performance analog semiconductors. The Company's products address some of the industry's fastest growing markets, such as, flat panel displays, cell phones, handheld products, and notebooks. Intersil's product families address power management and analog signal processing functions. Go to www.intersil.com/products for a complete list of Intersil product families. For a complete listing of Applications, Related Documentation and Related Parts, please see the respective product information page. Also, please check the product information page to ensure that you have the most updated datasheet: ISL75051SEH To report errors or suggestions for this datasheet, please go to: www.intersil.com/askourstaff FITs are available from our website at: http://rel.intersil.com/reports/search.php For additional products, see www.intersil.com/product_tree Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems as noted in the quality certifications found at www.intersil.com/design/quality Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com 17 FN8294.0 August 28, 2012 ISL75051SEH Package Outline Drawing K18.D 18 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE Rev 3, 1/12 0.015 (0.381) 0.005 (0.127) PIN NO. 1 ID OPTIONAL 1 2 A A 0.040 (1.016 BSC) 0.476 (12.09) 0.456 (11.58) PIN NO. 1 ID AREA 0.005 (0.127) MIN 4 0.020 (0.508) 0.013 (0.330) 0.122 (3.10) 0.100 (2.54) 0.038 (0.97) 0.026 (0.66) -C- TOP VIEW 6 0.397 (10.084) 0.377 (9.576) 0.283 (7.19) MIN 0.010 (0.25) 0.004 (0.10) -D- 0.350 (8.89) 0.250 (6.35) -H- 0.03 (0.76) MIN SEATING AND BASE PLANE SIDE VIEW NOTES: 0.007 (0.178) 0.004 (0.102) LEAD FINISH BASE METAL 0.010 (0.254) 0.004 (0.102) 0.017 (0.432) 0.013 (0.330) 2. If a pin one identification mark is used in addition to a tab, the limits of the tab dimension do not apply. 3. The maximum limits of lead dimensions (section A-A) shall be measured at the centroid of the finished lead surfaces, when solder dip or tin plate lead finish is applied. 4. Measure dimension at all four corners. 0.0015 (0.04) MAX 5. For bottom-brazed lead packages, no organic or polymeric materials shall be molded to the bottom of the package to cover the leads. 0.020 (0.508) 0.013 (0.330) 3 SECTION A-A 1. Index area: A notch or a pin one identification mark shall be located adjacent to pin one and shall be located within the shaded area shown. The manufacturer's identification shall not be used as a pin one identification mark. Alternately, a tab may be used to identify pin one. 6. Dimension shall be measured at the point of exit (beyond the meniscus) of the lead from the body. Dimension minimum shall be reduced by 0.0015 inch (0.038mm) maximum when solder dip lead finish is applied. 7. Dimensioning and tolerancing per ANSI Y14.5M - 1982. 8. Dimensions = INCH (mm). Controlling dimension: INCH. 18 FN8294.0 August 28, 2012