[01.2017]
Mod. 0805 2017-01 Rev.6
HE910
HW User Guide
1VV0300925 Rev. 29 – 2017-01-27
HE910 Hardware User Guide
1VV0300925 Rev. 29 Page 2 of 112 2017-01-27
SPECIFICATIONS ARE SUBJECT TO CHANGE WITHOUT NOTICE
NOTICE
While reasonable efforts have been made to assure the accuracy of this document, Telit
assumes no liability resulting from any inaccuracies or omissions in this document, or from
use of the information obtained herein. The information in this document has been
carefully checked and is believed to be reliable. However, no responsibility is assumed for
inaccuracies or omissions. Telit reserves the right to make changes to any products
described herein and reserves the right to revise this document and to make changes
from time to time in content hereof with no obligation to notify any person of revisions or
changes. Telit does not assume any liability arising out of the application or use of any
product, software, or circuit described herein; neither does it convey license under its
patent rights or the rights of others.
It is possible that this publication may contain references to, or information about Telit
products (machines and programs), programming, or services that are not announced in
your country. Such references or information must not be construed to mean that Telit
intends to announce such Telit products, programming, or services in your country.
COPYRIGHTS
This instruction manual and the Telit products described in this instruction manual may be,
include or describe copyrighted Telit material, such as computer programs stored in
semiconductor memories or other media. Laws in the Italy and other countries preserve
for Telit and its licensors certain exclusive rights for copyrighted material, including the
exclusive right to copy, reproduce in any form, distribute and make derivative works of the
copyrighted material. Accordingly, any copyrighted material of Telit and its licensors
contained herein or in the Telit products described in this instruction manual may not be
copied, reproduced, distributed, merged or modified in any manner without the express
written permission of Telit. Furthermore, the purchase of Telit products shall not be
deemed to grant either directly or by implication, estoppel, or otherwise, any license under
the copyrights, patents or patent applications of Telit, as arises by operation of law in the
sale of a product.
COMPUTER SOFTWARE COPYRIGHTS
The Telit and 3rd Party supplied Software (SW) products described in this instruction
manual may include copyrighted Telit and other 3rd Party supplied computer programs
stored in semiconductor memories or other media. Laws in the Italy and other countries
preserve for Telit and other 3rd Party supplied SW certain exclusive rights for copyrighted
computer programs, including the exclusive right to copy or reproduce in any form the
copyrighted computer program. Accordingly, any copyrighted Telit or other 3rd Party
supplied SW computer programs contained in the Telit products described in this
instruction manual may not be copied (reverse engineered) or reproduced in any manner
without the express written permission of Telit or the 3rd Party SW supplier. Furthermore,
the purchase of Telit products shall not be deemed to grant either directly or by
implication, estoppel, or otherwise, any license under the copyrights, patents or patent
applications of Telit or other 3rd Party supplied SW, except for the normal non-exclusive,
royalty free license to use that arises by operation of law in the sale of a product.
HE910 Hardware User Guide
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USAGE AND DISCLOSURE RESTRICTIONS
I. License Agreements
The software described in this document is the property of Telit and its licensors. It is
furnished by express license agreement only and may be used only in accordance with
the terms of such an agreement.
II. Copyrighted Materials
Software and documentation are copyrighted materials. Making unauthorized copies is
prohibited by law. No part of the software or documentation may be reproduced,
transmitted, transcribed, stored in a retrieval system, or translated into any language or
computer language, in any form or by any means, without prior written permission of Telit
III. High Risk Materials
Components, units, or third-party products used in the product described herein are NOT
fault-tolerant and are NOT designed, manufactured, or intended for use as on-line control
equipment in the following hazardous environments requiring fail-safe controls: the
operation of Nuclear Facilities, Aircraft Navigation or Aircraft Communication Systems, Air
Traffic Control, Life Support, or Weapons Systems (High Risk Activities"). Telit and its
supplier(s) specifically disclaim any expressed or implied warranty of fitness for such High
Risk Activities.
IV. Trademarks
TELIT and the Stylized T Logo are registered in Trademark Office. All other product or
service names are the property of their respective owners.
V. Third Party Rights
The software may include Third Party Right software. In this case you agree to comply
with all terms and conditions imposed on you in respect of such separate software. In
addition to Third Party Terms, the disclaimer of warranty and limitation of liability
provisions in this License shall apply to the Third Party Right software.
TELIT HEREBY DISCLAIMS ANY AND ALL WARRANTIES EXPRESS OR IMPLIED
FROM ANY THIRD PARTIES REGARDING ANY SEPARATE FILES, ANY THIRD
PARTY MATERIALS INCLUDED IN THE SOFTWARE, ANY THIRD PARTY MATERIALS
FROM WHICH THE SOFTWARE IS DERIVED (COLLECTIVELY “OTHER CODE”), AND
THE USE OF ANY OR ALL THE OTHER CODE IN CONNECTION WITH THE
SOFTWARE, INCLUDING (WITHOUT LIMITATION) ANY WARRANTIES OF
SATISFACTORY QUALITY OR FITNESS FOR A PARTICULAR PURPOSE.
NO THIRD PARTY LICENSORS OF OTHER CODE SHALL HAVE ANY LIABILITY FOR
ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR
CONSEQUENTIAL DAMAGES (INCLUDING WITHOUT LIMITATION LOST PROFITS),
HOWEVER CAUSED AND WHETHER MADE UNDER CONTRACT, TORT OR OTHER
LEGAL THEORY, ARISING IN ANY WAY OUT OF THE USE OR DISTRIBUTION OF
THE OTHER CODE OR THE EXERCISE OF ANY RIGHTS GRANTED UNDER EITHER
OR BOTH THIS LICENSE AND THE LEGAL TERMS APPLICABLE TO ANY SEPARATE
FILES, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.
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APPLICABILITY TABLE
PRODUCTS
HE910 (*)
HE910-D
HE910-GL
HE910-EUR
HE910-EUD
HE910-EUG
HE910-NAR
HE910-NAD
HE910-NAG
(*)HE910 IS THE “TYPE NAME” OF THE PRODUCTS MARKETED AS HE910-G
& HE910-DG
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Contents
NOTICE ……………………………………………………………………………2
COPYRIGHTS ................................................................................................ 2
COMPUTER SOFTWARE COPYRIGHTS ...................................................... 2
USAGE AND DISCLOSURE RESTRICTIONS ............................................... 3
I. License Agreements ..................................................................... 3
II. Copyrighted Materials ................................................................... 3
III. High Risk Materials ....................................................................... 3
IV. Trademarks .................................................................................. 3
V. Third Party Rights ......................................................................... 3
APPLICABILITY TABLE ................................................................................ 4
CONTENTS .................................................................................................... 5
1. INTRODUCTION .......................................................................... 9
Scope ........................................................................................... 9
Audience....................................................................................... 9
Contact info and Support .............................................................. 9
Text Conventions ........................................................................ 10
Related Documents .................................................................... 11
2. OVERVIEW ................................................................................ 12
3. HE910 MODULE CONNECTIONS ............................................ 13
Pin-Out ....................................................................................... 13
3.1.1. LGA Pads Layout (HE910) ......................................................... 26
3.1.2. LGA Pads Layout (HE910-D) ...................................................... 27
3.1.3. LGA Pads Layout (HE910-EUD/EUR, HE910-NAD/NAR and
HE910-GL) ................................................................................. 28
3.1.4. LGA Pads Layout (HE910-EUG and HE910-NAG) ..................... 29
4. HARDWARE COMMANDS ........................................................ 30
Turning ON the HE910 ............................................................... 30
Turning OFF the HE910 .............................................................. 35
HE910 Unconditional Shutdown ................................................. 37
5. POWER SUPPLY ....................................................................... 40
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Power Supply Requirements ....................................................... 40
Power Consumption ................................................................... 41
General Design Rules ................................................................. 43
5.3.1. Electrical Design Guidelines ....................................................... 43
5.3.1.1. + 5V input Source Power Supply Design Guidelines ................... 43
5.3.1.2. + 12V input Source Power Supply Design Guidelines ................. 44
5.3.1.3. Battery Source Power Supply Design Guidelines ........................ 45
5.3.2. Thermal Design Guidelines ......................................................... 46
5.3.3. Power Supply PCB layout Guidelines ......................................... 47
6. GSM/WCDMA RADIO SECTION ............................................... 49
HE910 Product Variants ............................................................. 49
TX Output Power ........................................................................ 50
Sensitivity ................................................................................... 50
GSM/WCDMA Antenna Requirements ....................................... 51
GSM/WCDMA - PCB line Guidelines .......................................... 52
PCB Guidelines in case of FCC certification ............................... 54
6.6.1. Transmission line design ............................................................ 54
6.6.2. Transmission line measurements ............................................... 55
GSM/WCDMA Antenna - Installation Guidelines ......................... 57
Antenna Diversity Requirements ................................................. 57
7. GPS RECEIVER ......................................................................... 59
GPS Performances ..................................................................... 59
GPS Signals Pinout .................................................................... 60
RF Front End Design .................................................................. 61
7.3.1. RF Signal Requirements ............................................................. 61
7.3.2. GPS Antenna Polarization .......................................................... 62
7.3.3. GPS Antenna Gain ..................................................................... 63
7.3.4. Active versus Passive Antenna ................................................... 63
7.3.5. GPS Antenna - PCB Line Guidelines .......................................... 64
7.3.6. RF Trace Losses ........................................................................ 64
7.3.7. Implications of the Pre-select SAW Filter .................................... 64
7.3.8. External LNA Gain and Noise Figure .......................................... 65
7.3.9. Powering the External LNA (active antenna) ............................... 65
7.3.10. External LNA Enable .................................................................. 65
7.3.11. Shielding ..................................................................................... 66
7.3.12. GPS Antenna – Installation ......................................................... 66
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8. LOGIC LEVEL SPECIFICATIONS ............................................. 67
Unconditional Shutdown ............................................................. 69
9. USB PORT ................................................................................. 70
USB 2.0 HS Description .............................................................. 70
10. SPI PORT ................................................................................... 71
SPI Connections ......................................................................... 72
11. USB HSIC .................................................................................. 73
12. SERIAL PORTS ......................................................................... 75
MODEM SERIAL PORT 1 (USIF0) ............................................. 76
MODEM SERIAL PORT 2 (USIF1) ............................................. 79
RS232 level translation ............................................................... 80
13. AUDIO SECTION OVERVIEW ................................................... 82
Electrical Characteristics ............................................................. 82
13.1.1. CODEC Examples ...................................................................... 82
14. GENERAL PURPOSE I/O .......................................................... 83
GPIO Logic levels ....................................................................... 84
Using a GPIO Pad as INPUT ...................................................... 85
Using a GPIO Pad as OUTPUT .................................................. 85
Indication of network service availability ..................................... 86
RTC Bypass out .......................................................................... 87
External SIM Holder Implementation ........................................... 87
VAUX Power Output ................................................................... 87
ADC Converter ........................................................................... 88
14.8.1. Description .................................................................................. 88
14.8.2. Using ADC Converter ................................................................. 88
15. MOUNTING THE HE910 ON THE APPLICATION ..................... 89
General ....................................................................................... 89
Module finishing & dimensions .................................................... 89
Recommended foot print for the application ................................ 91
Stencil ......................................................................................... 92
PCB pad design .......................................................................... 92
PCB pad dimensions .................................................................. 93
Solder paste ............................................................................... 95
15.7.1. HE910 Solder reflow ................................................................... 95
Packing system (Tray) ................................................................ 97
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Packing System (Reel) ............................................................... 99
15.9.1. Carrier Tape Detail ..................................................................... 99
15.9.2. Reel Detail ................................................................................ 100
15.9.3. Packaging Detail ....................................................................... 101
Moisture sensitivity ................................................................... 101
16. SAFETY RECOMMANDATIONS ............................................. 102
17. CONFORMITY ASSESSMENT ISSUES .................................. 103
1999/5/EC Directive .................................................................. 103
FCC/IC Regulatory notices ....................................................... 108
18. DOCUMENT HISTORY ............................................................ 110
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1. INTRODUCTION
Scope
The aim of this document is the description of some hardware solutions useful for
developing a product with the Telit HE910 module.
Audience
This document is intended for Telit customers, who are integrators, about to implement
their applications using our HE910 modules.
Contact info and Support
For general contact, technical support services, technical questions and report
documentation errors contact Telit Technical Support at:
TS-EMEA@telit.com
TS-AMERICAS@telit.com
TS-APAC@telit.com
TS-SRD@telit.com
Alternatively, use:
http://www.telit.com/support
For detailed information about where you can buy the Telit modules or for
recommendations on accessories and components visit:
http://www.telit.com
Our aim is to make this guide as helpful as possible. Keep us informed of your comments
and suggestions for improvements.
Telit appreciates feedback from the users of our information.
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Text Conventions
Danger – This information MUST be followed or catastrophic
equipment failure or bodily injury may occur.
Caution or Warning – Alerts the user to important points about
integrating the module, if these points are not followed, the module and
end user equipment may fail or malfunction.
Tip or Information – Provides advice and suggestions that may be
useful when integrating the module.
All dates are in ISO 8601 format, i.e. YYYY-MM-DD.
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Related Documents
Digital Voice Interface Application Note, 80000NT10050A
SPI Port Application Note, 80000NT10053A
Product description, 80378ST10085A
SIM Holder Design Guides, 80000NT10001A
USB HSIC Port Application Note, 80000NT10071A
AT Commands Reference Guide, 80378ST10091A
Telit EVK2 User Guide, 1vv0300704
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2. OVERVIEW
The aim of this document is the description of some hardware solutions useful for
developing a product with the Telit HE910 module. In this document all the basic functions
of a mobile phone will be taken into account; for each one of them a proper hardware
solution will be suggested and eventually the wrong solutions and common errors to be
avoided will be evidenced. Obviously this document cannot embrace the whole hardware
solutions and products that may be designed. The wrong solutions to be avoided shall be
considered as mandatory, while the suggested hardware configurations shall not be
considered mandatory, instead the information given shall be used as a guide and a
starting point for properly developing your product with the Telit HE910 module. For
further hardware details that may not be explained in this document refer to the Telit
HE910 Product Description document where all the hardware information is reported.
The information presented in this document is believed to be accurate and reliable.
However, no responsibility is assumed by Telit Communications S.p.A. for its use, nor any
infringement of patents or other rights of third parties which may result from its use. No
license is granted by implication or otherwise under any patent rights of Telit
Communications S.p.A. other than for circuitry embodied in Telit products. This document
is subject to change without notice.
NOTE:
(EN) The integration of the GSM/GPRS/WCDMA HE910 cellular
module within user application shall be done according to the design
rules described in this manual.
(IT) L’integrazione del modulo cellulare GSM/GPRS/WCDMA HE910
all’interno dell’applicazione dell’utente dovrà rispettare le indicazioni
progettuali descritte in questo manuale.
(DE) Die Integration des HE910 GSM/GPRS/WCDMA Mobilfunk-
Moduls in ein Gerät muß gemäß der in diesem Dokument
beschriebenen Kunstruktionsregeln erfolgen.
(SL) Integracija GSM/GPRS/WCDMA HE910 modula v uporabniški
aplikaciji bo morala upoštevati projektna navodila, opisana v tem
priročniku.
(SP) La utilización del modulo GSM/GPRS/WCDMA HE910 debe ser
conforme a los usos para los cuales ha sido deseñado descritos en
este manual del usuario.
(FR) L’intégration du module cellulaire GSM/GPRS/WCDMA HE910
dans l’application de l’utilisateur sera faite selon les règles de
conception décrites dans ce manuel.
(HE)
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3. HE910 MODULE CONNECTIONS
Pin-Out
Pad
Signal
I/O
Function
Type
Comment
USB HS 2.0 COMMUNICATION PORT
B15
USB_D+
I/O
USB differential Data (+)
C15
USB_D-
I/O
USB differential Data (-)
A13
VUSB
I
Power sense for the
internal USB transceiver.
Asynchronous Serial Port (USIF0) - Prog. / Data + HW Flow Control
N15
C103/TXD
I
Serial data input from
DTE
CMOS 1.8V
M15
C104/RXD
O
Serial data output to
DTE
CMOS 1.8V
M14
C108/DTR
I
Input for (DTR) from
DTE
CMOS 1.8V
L14
C105/RTS
I
Input for Request to
send signal (RTS) from
DTE
CMOS 1.8V
P15
C106/CTS
O
Output for Clear to Send
signal (CTS) to DTE
CMOS 1.8V
N14
C109/DCD
O
Output for (DCD) to
DTE
CMOS 1.8V
P14
C107/DSR
O
Output for (DSR) to
DTE
CMOS 1.8V
R14
C125/RING
O
Output for Ring (RI) to
DTE
CMOS 1.8V
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Asynchronous Auxiliary Serial Port (USIF1)
D15
TX_AUX
O
Auxiliary UART (TX Data
to DTE)
CMOS 1.8V
E15
RX_AUX
I
Auxiliary UART (RX
Data from DTE)
CMOS 1.8V
USB HSIC
A12
HSIC_USB_DA
TA
I/O
USB HSIC data signal
CMOS 1.2V
A11
HSIC_USB_ST
RB
I/O
USB HSIC strobe signal
CMOS 1.2V
H15
HSIC_SLAVE_
WAKEUP
I
Slave Wake Up
CMOS 1.8V
Shared with
SPI_MRDY
F15
HSIC_HOST_W
AKEUP
O
Host Wake Up
CMOS 1.8V
Shared with
SPI CLK
K15
HSIC_SUSPEN
D_REQUEST
O
Slave Suspend Request
CMOS 1.8V
Shared with
GPIO08
J15
HSIC_HOST_A
CTIVE
I
Active Host Indication
CMOS 1.8V
Shared with
SPI_SRDY
D13
VDD_IO1
I
VDD_IO1 Input
To be
connected to
E13
E13
1V8_SEL
O
1V8 SEL for VDD_IO1
To be
connected to
D13
SIM card interface
A6
SIMCLK
O
External SIM signal –
Clock
1.8 / 3V
A7
SIMRST
O
External SIM signal –
Reset
1.8 / 3V
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A5
SIMIO
I/O
External SIM signal –
Data I/O
1.8 / 3V
A4
SIMIN
I
External SIM signal –
Presence (active low)
CMOS 1.8
A3
SIMVCC
-
External SIM signal –
Power supply for the
SIM
1.8 / 3V
Digital Voice Interface (DVI)
B9
DVI_WA0
I/O
Digital Audio Interface
(WA0)
1.8V
16K pull down
(typical at
1.8V) when in
Input
B6
DVI_RX
I
Digital Audio Interface
(RX)
1.8V
Input with 16K
pull down
(typical at
1.8V)
B7
DVI_TX
I/O
Digital Audio Interface
(TX)
1.8V
16K pull down
(typical at
1.8V) when in
Input
B8
DVI_CLK
I/O
Digital Audio Interface
(CLK)
1.8V
Input with 16K
pull down
(typical at
1.8V)
SPI
D15
SPI_MOSI
I
SPI MOSI
CMOS 1.8V
Shared with
TX_AUX
E15
SPI_MISO
O
SPI_MISO
CMOS 1.8V
Shared with
RX_AUX
F15
SPI_CLK
I
SPI Clock
CMOS 1.8V
Shared with
H15
SPI_MRDY
I
SPI_MRDY
CMOS 1.8V
HSIC_HOST_
WAKEUP
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J15
SPI_SRDY
O
SPI_SRDY
CMOS 1.8V
Shared with
HSIC_SLAVE_
WAKEUP
DIGITAL IO
C8
GPIO_01
I/O
GPIO_01 /STAT
LED
CMOS 1.8V
Alternate
Function STAT
LED
C9
GPIO_02
I/O
GPIO_02
CMOS 1.8V
C10
GPIO_03
I/O
GPIO_03
CMOS 1.8V
C11
GPIO_04
I/O
GPIO_04
CMOS 1.8V
B14
GPIO_05
I/O
GPIO_05
CMOS 1.8V
C12
GPIO_06
I/O
GPIO_06
CMOS 1.8V
C13
GPIO_07
I/O
GPIO_07
CMOS 1.8V
K15
GPIO_08
I/O
GPIO_08
CMOS 1.8V
Shared with
HSIC_SUSPE
ND_REQUEST
L15
GPIO_09
I/O
GPIO_09
CMOS 1.8V
G15
GPIO_10
I/O
GPIO_10
CMOS 1.8V
ADC
B1
ADC_IN1
AI
Analog / Digital
converter input
A/D
Accepted
values 0 to
1.2V DC
RF SECTION
K1
ANTENNA
I/O
GSM/EDGE/UMTS
Antenna (50 ohm)
RF
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F1
ANT_DIV
I
Antenna Diversity Input
(50 ohm)
RF
See NOTE 1
GPS SECTION (see NOTE1)
R9
ANT_GPS
I
GPS Antenna (50 ohm)
RF
R7
GPS_LNA_EN
O
Output enable for
External LNA supply
CMOS 1.8V
Miscellaneous Functions
R13
HW_SHUTDOW
N*
I
HW Unconditional
Shutdown
1.8V
Active low
R12
ON_OFF*
I
Input command for
power ON
1.8V
Active low
C14
VRTC
I
VRTC Backup capacitor
Power
backup for the
embedded
RTC supply
(1.8V)
R11
VAUX/PWRMO
N
O
Supply Output for
external accessories /
Power ON Monitor
1.8V
Power Supply
M1
VBATT
-
Main power supply
(Baseband)
Power
M2
VBATT
-
Main power supply
(Baseband)
Power
N1
VBATT_PA
-
Main power supply
(Radio PA)
Power
N2
VBATT_PA
-
Main power supply
(Radio PA)
Power
P1
VBATT_PA
-
Main power supply
(Radio PA)
Power
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P2
VBATT_PA
-
Main power supply
(Radio PA)
Power
E1
GND
-
Ground
Power
G1
GND
-
Ground
Power
H1
GND
-
Ground
Power
J1
GND
-
Ground
Power
L1
GND
-
Ground
Power
A2
GND
-
Ground
Power
E2
GND
-
Ground
Power
F2
GND
-
Ground
Power
G2
GND
-
Ground
Power
H2
GND
-
Ground
Power
J2
GND
-
Ground
Power
K2
GND
-
Ground
Power
L2
GND
-
Ground
Power
R2
GND
-
Ground
Power
M3
GND
-
Ground
Power
N3
GND
-
Ground
Power
P3
GND
-
Ground
Power
R3
GND
-
Ground
Power
D4
GND
-
Ground
Power
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M4
GND
-
Ground
Power
N4
GND
-
Ground
Power
P4
GND
-
Ground
Power
R4
GND
-
Ground
Power
N5
GND
-
Ground
Power
P5
GND
-
Ground
Power
R5
GND
-
Ground
Power
N6
GND
-
Ground
Power
P6
GND
-
Ground
Power
R6
GND
-
Ground
Power
P8
GND
-
Ground
Power
R8
GND
-
Ground
Power
P9
GND
-
Ground
Power
P10
GND
-
Ground
Power
R10
GND
-
Ground
Power
M12
GND
-
Ground
Power
B13
GND
-
Ground
Power
P13
GND
-
Ground
Power
E14
GND
-
Ground
Power
RESERVED
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C1
RESERVED
-
RESERVED
D1
RESERVED
-
RESERVED
B2
RESERVED
-
RESERVED
C2
RESERVED
-
RESERVED
D2
RESERVED
-
RESERVED
B3
RESERVED
-
RESERVED
C3
RESERVED
-
RESERVED
D3
RESERVED
-
RESERVED
E3
RESERVED
-
RESERVED
F3
RESERVED
-
RESERVED
G3
RESERVED
-
RESERVED
H3
RESERVED
-
RESERVED
J3
RESERVED
-
RESERVED
K3
RESERVED
-
RESERVED
L3
RESERVED
-
RESERVED
B4
RESERVED
-
RESERVED
C4
RESERVED
-
RESERVED
B5
RESERVED
-
RESERVED
C5
RESERVED
-
RESERVED
C6
RESERVED
-
RESERVED
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C7
RESERVED
-
RESERVED
N7
RESERVED
-
RESERVED
P7
RESERVED
-
RESERVED
N8
RESERVED
-
RESERVED
N9
RESERVED
-
RESERVED
A10
RESERVED
-
RESERVED
N10
RESERVED
-
RESERVED
N11
RESERVED
-
RESERVED
P11
RESERVED
-
RESERVED
B12
RESERVED
-
RESERVED
D12
RESERVED
-
RESERVED
N12
RESERVED
-
RESERVED
P12
RESERVED
-
RESERVED
F14
RESERVED
-
RESERVED
G14
RESERVED
-
RESERVED
H14
RESERVED
-
RESERVED
J14
RESERVED
-
RESERVED
K14
RESERVED
-
RESERVED
N13
RESERVED
-
RESERVED
L13
RESERVED
-
RESERVED
HE910 Hardware User Guide
1VV0300925 Rev. 29 Page 22 of 112 2017-01-27
Warning – Reserved pins must not be connected.
J13
RESERVED
-
RESERVED
M13
RESERVED
-
RESERVED
K13
RESERVED
-
RESERVED
H13
RESERVED
-
RESERVED
G13
RESERVED
-
RESERVED
F13
RESERVED
-
RESERVED
B11
RESERVED
-
RESERVED
B10
RESERVED
-
RESERVED
A9
RESERVED
-
RESERVED
A8
RESERVED
-
RESERVED
D14
RESERVED
-
RESERVED
A14
RESERVED
-
RESERVED
HE910 Hardware User Guide
1VV0300925 Rev. 29 Page 23 of 112 2017-01-27
NOTE 1:
The following table is listing the main Pinout differences between the
HE910 variants
Product
GPS
Antenna
Diversity
Notes
HE910 (*)
YES
YES
HE910-D
NO
YES
Reserved Pads: R7, R9
HE910-GL
NO
NO
Reserved Pads:,F1, R7, R9
HE910-EUR
NO
NO
Reserved Pads:,F1, R7, R9
HE910-EUD
NO
NO
Reserved Pads:,F1, R7, R9
HE910-EUG
YES
NO
Reserved Pads: F1
HE910-NAR
NO
NO
Reserved Pads: F1, R7, R9
HE910-NAD
NO
NO
Reserved Pads: F1, R7, R9
HE910-NAG
YES
NO
Reserved Pads: F1
(*) HE910 is the “type name” of the products marketed as HE910-G &
HE910-DG
HE910 Hardware User Guide
1VV0300925 Rev. 29 Page 24 of 112 2017-01-27
NOTE:
If not used, almost all pins should be left disconnected. The only
exceptions are the following pins:
PAD
Signal
Notes
M1,M2,N1,N2,P1,P2
VBATT &
VBATT_PA
E1,G1,H1,J1,L1,A2,E2,
F2,G2,H2,J2,K2,L2,R2,
M3,N3,P3,R3,D4,M4,
N4,P4,R4,N5,P5,R5,N6
,P6,R6,P8,R8,P9,P10,
R10,M12,B13,P13,E14
GND
R12
ON/OFF*
R13
HW_
SHUTDOWN*
B15
USB_D+
If not used should be
connected to a Test
Point or an USB
connector
C15
USB_D-
If not used should be
connected to a Test
Point or an USB
connector
D15
TXD_AUX
If not used should be
connected to a Test
Point
E15
RXD_AUX
If not used should be
connected to a Test
Point
D13
VDD_IO1
It has always to be
connected to 1V8_SEL
HE910 Hardware User Guide
1VV0300925 Rev. 29 Page 25 of 112 2017-01-27
E13
1V8_SEL
It has always to be
connected to VDD_IO1
K1
MAIN
ANTENNA
F1
ANT_DIV (if
supported by
the product)
If not used it could left
unconnected but has to
be disabled by the
related AT Command
(AT#RXDIV); please
refer to the At User
guide for the related
syntax
R9
ANT_GPS (if
supported by
the product)
If the GPS is not used it
could be left
unconnected
RTS pin should be connected to the GND (on the module side) if flow
control is not used.
The above pins are also necessary to debug the application when the
module is assembled on it so we recommend connecting them also to
dedicated test point.
HE910 Hardware User Guide
1VV0300925 Rev. 29 Page 26 of 112 2017-01-27
3.1.1. LGA Pads Layout (HE910)
TOP VIEW
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
1
ADC_IN1
RES
RES
GND
ANT_DIV
GND
GND
GND
ANT
GND
VBATT
VBATT_P
A
VBATT_P
A
2
GND
RES
RES
RES
GND
GND
GND
GND
GND
GND
GND
VBATT
VBATT_P
A
VBATT_P
A
GND
3
SIMVC
C
RES
RES
RES
RES
RES
RES
RES
RES
RES
RES
GND
GND
GND
GND
4
SIMIN
RES
RES
GND
GND
GND
GND
GND
5
SIMIO
RES
RES
GND
GND
GND
6
SIMCLK
DVI_RX
RES
GND
GND
GND
7
SIMRST
DVI_TX
RES
RES
RES
GPS_LN
A_EN
8
RES
DVI_CLK
GPIO_01
RES
GND
GND
9
RES
DVI_WA0
GPIO_02
RES
GND
ANT_GP
S
10
RES
RES
GPIO_03
RES
GND
GND
11
HSIC_U
SB_ST
RB
RES
GPIO_04
RES
RES
VAUX/P
WRMON
12
HSIC_U
SB_DA
TA
RES
GPIO_06
RES
GND
RES
RES
ON_OFF*
13
VUSB
GND
GPIO_07
VDD_IO1
1V8_SEL
RES
RES
RES
RES
RES
RES
RES
RES
GND
HW_SHU
TDOWN*
14
RES
GPIO_05
VRTC
RES
GND
RES
RES
RES
RES
RES
C105/RT
S
C108/DT
R
C109/DC
D
C107/DS
R
C125/RIN
G
15
USB_D+
USB_D-
TX AUX
RX AUX
SPI_CLK
GPIO_10
SPI_MRD
Y
SPI_SRD
Y
GPIO_08
GPIO_09
C104/RX
D
C103/TX
D
C106/CT
S
NOTE:
The pin defined as RES has to be considered RESERVED and not
connected on any pin in the application.
HE910 is the “type name” of the products marketed as HE910-G &
HE910-DG.
HE910 Hardware User Guide
1VV0300925 Rev. 29 Page 27 of 112 2017-01-27
3.1.2. LGA Pads Layout (HE910-D)
TOP VIEW
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
1
ADC_IN1
RES
RES
GND
ANT_DIV
GND
GND
GND
ANT
GND
VBATT
VBATT_P
A
VBATT_P
A
2
GND
RES
RES
RES
GND
GND
GND
GND
GND
GND
GND
VBATT
VBATT_P
A
VBATT_P
A
GND
3
SIMVC
C
RES
RES
RES
RES
RES
RES
RES
RES
RES
RES
GND
GND
GND
GND
4
SIMIN
RES
RES
GND
GND
GND
GND
GND
5
SIMIO
RES
RES
GND
GND
GND
6
SIMCLK
DVI_RX
RES
GND
GND
GND
7
SIMRST
DVI_TX
RES
RES
RES
RES
8
RES
DVI_CLK
GPIO_01
RES
GND
GND
9
RES
DVI_WA0
GPIO_02
RES
GND
RES
10
RES
RES
GPIO_03
RES
GND
GND
11
HSIC_U
SB_ST
RB
RES
GPIO_04
RES
RES
VAUX/P
WRMON
12
HSIC_U
SB_DA
TA
RES
GPIO_06
RES
GND
RES
RES
ON_OFF*
13
VUSB
GND
GPIO_07
VDD_IO1
1V8_SEL
RES
RES
RES
RES
RES
RES
RES
RES
GND
HW_SHU
TDOWN*
14
RES
GPIO_05
VRTC
RES
GND
RES
RES
RES
RES
RES
C105/RT
S
C108/DT
R
C109/DC
D
C107/DS
R
C125/RIN
G
15
USB_D+
USB_D-
TX AUX
RX AUX
SPI_CLK
GPIO_10
SPI_MRD
Y
SPI_SRD
Y
GPIO_08
GPIO_09
C104/RX
D
C103/TX
D
C106/CT
S
NOTE:
The pin defined as RES has to be considered RESERVED and not
connected on any pin in the application.
HE910 Hardware User Guide
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3.1.3. LGA Pads Layout (HE910-EUD/EUR, HE910-NAD/NAR and HE910-GL)
TOP VIEW
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
1
ADC_IN1
RES
RES
GND
RES
GND
GND
GND
ANT
GND
VBATT
VBATT_P
A
VBATT_P
A
2
GND
RES
RES
RES
GND
GND
GND
GND
GND
GND
GND
VBATT
VBATT_P
A
VBATT_P
A
GND
3
SIMVC
C
RES
RES
RES
RES
RES
RES
RES
RES
RES
RES
GND
GND
GND
GND
4
SIMIN
RES
RES
GND
GND
GND
GND
GND
5
SIMIO
RES
RES
GND
GND
GND
6
SIMCLK
DVI_RX
RES
GND
GND
GND
7
SIMRST
DVI_TX
RES
RES
RES
RES
8
RES
DVI_CLK
GPIO_01
RES
GND
GND
9
RES
DVI_WA0
GPIO_02
RES
GND
RES
10
RES
RES
GPIO_03
RES
GND
GND
11
HSIC_U
SB_ST
RB
RES
GPIO_04
RES
RES
VAUX/P
WRMON
12
HSIC_U
SB_DA
TA
RES
GPIO_06
RES
GND
RES
RES
ON_OFF*
13
VUSB
GND
GPIO_07
VDD_IO1
1V8_SEL
RES
RES
RES
RES
RES
RES
RES
RES
GND
HW_SHU
TDOWN*
14
RES
GPIO_05
VRTC
RES
GND
RES
RES
RES
RES
RES
C105/RT
S
C108/DT
R
C109/DC
D
C107/DS
R
C125/RIN
G
15
USB_D+
USB_D-
TX AUX
RX AUX
SPI_CLK
GPIO_10
SPI_MRD
Y
SPI_SRD
Y
GPIO_08
GPIO_09
C104/RX
D
C103/TX
D
C106/CT
S
NOTE:
The pin defined as RES has to be considered RESERVED and not
connected on any pin in the application.
HE910 Hardware User Guide
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3.1.4. LGA Pads Layout (HE910-EUG and HE910-NAG)
TOP VIEW
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
1
ADC_IN1
RES
RES
GND
RES
GND
GND
GND
ANT
GND
VBATT
VBATT_P
A
VBATT_P
A
2
GND
RES
RES
RES
GND
GND
GND
GND
GND
GND
GND
VBATT
VBATT_P
A
VBATT_P
A
GND
3
SIMVC
C
RES
RES
RES
RES
RES
RES
RES
RES
RES
RES
GND
GND
GND
GND
4
SIMIN
RES
RES
GND
GND
GND
GND
GND
5
SIMIO
RES
RES
GND
GND
GND
6
SIMCLK
DVI_RX
RES
GND
GND
GND
7
SIMRST
DVI_TX
RES
RES
RES
GPS_LN
A_EN
8
RES
DVI_CLK
GPIO_01
RES
GND
GND
9
RES
DVI_WA0
GPIO_02
RES
GND
ANT_GP
S
10
RES
RES
GPIO_03
RES
GND
GND
11
HSIC_U
SB_ST
RB
RES
GPIO_04
RES
RES
VAUX/P
WRMON
12
HSIC_U
SB_DA
TA
RES
GPIO_06
RES
GND
RES
RES
ON_OFF*
13
VUSB
GND
GPIO_07
VDD_IO1
1V8_SEL
RES
RES
RES
RES
RES
RES
RES
RES
GND
HW_SHU
TDOWN*
14
RES
GPIO_05
VRTC
RES
GND
RES
RES
RES
RES
RES
C105/RT
S
C108/DT
R
C109/DC
D
C107/DS
R
C125/RIN
G
15
USB_D+
USB_D-
TX AUX
RX AUX
SPI_CLK
GPIO_10
SPI_MRD
Y
SPI_SRD
Y
GPIO_08
GPIO_09
C104/RX
D
C103/TX
D
C106/CT
S
NOTE:
The pin defined as RES has to be considered RESERVED and not
connected on any pin in the application.
HE910 Hardware User Guide
1VV0300925 Rev. 29 Page 30 of 112 2017-01-27
4. HARDWARE COMMANDS
Turning ON the HE910
To turn on the HE910 the pad ON_OFF* must be tied low for at least 5 seconds and then
released.
The maximum current that can be drained from the ON_OFF* pad is 0,1 mA.
A simple circuit to do it is:
Figure 4-1 – Turning ON the HE910 1
NOTE:
Don't use any pull up resistor on the ON_OFF* line, it is internally
pulled up. Using pull up resistor may bring to latch up problems on the
HE910 power regulator and improper power on/off of the module. The
line ON_OFF* must be connected only in open collector or open drain
configuration.
NOTE:
In this document all the lines that are inverted, hence have active low
signals are labelled with a name that ends with”#",”*” or with a bar over
the name.
TIP:
To check if the device has powered on, the hardware line PWRMON
should be monitored.
NOTE:
It is mandatory to avoid sending data to the serial ports during the first
200ms of the module start-up.
HE910 Hardware User Guide
1VV0300925 Rev. 29 Page 31 of 112 2017-01-27
A flow chart showing the proper turn on procedure is displayed below:
“Modem ON Proc”
START
Y
Y
GOTO
“HW SHUTDOWN
unconditional”
GOTO
“Start AT CMD.”
N
PWMON = ON ?
PWMON = ON ?
N
Delay 1s
ON_OFF* = LOW
Delay = 5 Sec
ON_OFF* = HIGH
“Modem ON Proc”
END
VBATT > 3.22V ?
Y
N
HE910 Hardware User Guide
1VV0300925 Rev. 29 Page 32 of 112 2017-01-27
A flow chart showing the AT commands managing procedure is displayed below:
NOTE:
In order to avoid a back powering effect it is recommended to avoid
having any HIGH logic level signal applied to the digital pins of the
HE910 when the module is powered off or during an ON/OFF transition
AT answer in
1 sec ?
N
Y
“Start AT CMD.”
START
DELAY 300msec
Enter AT<CR>
“Start AT CMD
.”
END
GOTO
“HW SHUTDOWN
unconditional”
GOTO
“Modem ON Proc.”
HE910 Hardware User Guide
1VV0300925 Rev. 29 Page 33 of 112 2017-01-27
For example:
1- Let's assume you need to drive the ON_OFF* pad with a totem pole output of a
+3/5 V microcontroller (uP_OUT1):
Figure 4-2 Turning ON the HE910 2
2- Let's assume you need to drive the ON_OFF* pad directly with an ON/OFF button:
Figure 4-3 ON the HE910 3
Warning
It is recommended to set the ON_OFF* line LOW to power on the
module only after VBATT is higher than 3.22V.
HE910 Hardware User Guide
1VV0300925 Rev. 29 Page 34 of 112 2017-01-27
In case this condition it is not satisfied you could use the HW_SHUTDOWN* line to
recover it and then restart the power on activity using the ON_OFF * line.
An example of this is described in the following diagram:
After HW_SHUTSDOWN* is released you could again use the ON_OFF* line to power on
the module
HE910 Hardware User Guide
1VV0300925 Rev. 29 Page 35 of 112 2017-01-27
Turning OFF the HE910
Turning off of the device can be done in two ways:
via AR command (see HE910 Software User Guide, AT#SHDN)
by tying low pin ON_OFF*
Either ways, the device issues a detach request to network informing that the device will
not be reachable any more.
To turn OFF the HE910 the pad ON_OFF* must be tied low for at least 3 seconds and
then released.
TIP:
To check if the device has been powered off, the hardware line
PWRMON must be monitored. The device is powered off when
PWRMON goes low
NOTE:
In order to avoid a back powering effect it is recommended to avoid
having any HIGH logic level signal applied to the digital pins of the
HE910 when the module is powered off or during an ON/OFF
transition.
HE910 Hardware User Guide
1VV0300925 Rev. 29 Page 36 of 112 2017-01-27
The following flow chart shows the proper turn off procedure:
Modem OFF Proc.
START
AT
Y
N
PWMON = ON ?
OFF Mode
ON_OFF* = LOW
Delay >= 3 Sec
ON_OFF* = HIGH
“Modem OFF Proc”
END
PWRMON=ON?
Y
N
Key
AT#SHDN
GOTO
“HW Shutdown
Unconditional”
Looping for more
Y
N
HE910 Hardware User Guide
1VV0300925 Rev. 29 Page 37 of 112 2017-01-27
HE910 Unconditional Shutdown
The Unconditional Shutdown of the module could be activated using the
HW_SHUTDOWN* line (pad R13).
Warning
The hardware unconditional Shutdown must not be used during normal
operation of the device since it does not detach the device from the
network. It shall be kept as an emergency exit procedure
To unconditionally shutdown the HE910, the pad HW_SHUTDOWN* must be tied low for
at least 200 milliseconds and then released.
NOTE:
Do not use any pull up resistor on the HW_SHUTDOWN* line nor any
totem pole digital output. Using pull up resistor may bring to latch up
problems on the HE910 power regulator and improper functioning of
the module. The line HW_SHUTDOWN* must be connected only in
open collector configuration.
The HW_SHUTDOWN* is generating an unconditional shutdown of the
module without an automatic restart.
The module will shutdown, but will NOT perform the detach from the
cellular network.
To proper power on again the module please refer to the related
paragraph (“Powering ON the HE910”)
TIP:
The unconditional hardware shutdown must always be implemented on
the boards and should be used only as an emergency exit procedure.
HE910 Hardware User Guide
1VV0300925 Rev. 29 Page 38 of 112 2017-01-27
A typical circuit is the following:
Figure 4-4 Tipical circuit 1
For example:
Let us assume you need to drive the HW_SHUTDOWN* pad with a totem pole
output of a +3/5 V microcontroller (uP_OUT2):
Figure 4-5 Tipical circuit 2
NOTE:
In order to avoid a back powering effect it is recommended to avoid
having any HIGH logic level signal applied to the digital pins of the
HE910 when the module is powered off or during an ON/OFF transition
HE910 Hardware User Guide
1VV0300925 Rev. 29 Page 39 of 112 2017-01-27
In the following flow chart is detailed the proper restart procedure:
“HW SHUTDOWN
Unconditional”
START
HW_SHDN = LOW
Delay 200ms
HW_SHDN = HIGH
PWRMON = ON
Delay 1s
Y
N
Disconnect
VBATT
“HW SHUTDOWN
Unconditional”
END
HE910 Hardware User Guide
1VV0300925 Rev. 29 Page 40 of 112 2017-01-27
5. POWER SUPPLY
The power supply circuitry and board layout are a very important part in the full product
design and they strongly reflect on the product overall performances, hence read carefully
the requirements and the guidelines that will follow for a proper design.
Power Supply Requirements
The external power supply must be connected to VBATT & VBATT_PA signals and must
fulfil the following requirements:
POWER SUPPLY
Nominal Supply Voltage
3.8 V
Normal Operating Voltage
Range
3.40 V÷ 4.20 V
Extended Operating
Voltage Range
3.10 V÷ 4.50 V
NOTE:
The Operating Voltage Range MUST never be exceeded; care must be
taken when designing the application’s power supply section to avoid
having an excessive voltage drop.
If the voltage drop is exceeding the limits it could cause a Power Off of
the module.
The Power supply must be higher than 3.22 V to power on the module
NOTE:
Overshoot voltage (regarding MAX Extended Operating Voltage) and
drop in voltage (regarding MIN Extended Operating Voltage) MUST
never be exceeded;
The “Extended Operating Voltage Range” can be used only with
completely assumption and application of the HW User guide
suggestions
HE910 Hardware User Guide
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Power Consumption
HE910
Mode
Average (mA)
Mode description
SWITCHED OFF
Module supplied but Switched Off
Switched Off
40uA
IDLE mode (WCDMA)
AT+CFUN=1
12.2
Normal mode: full functionality of the
module
AT+CFUN=5
1.2
Full functionality with power saving;
DRX7;
Module registered on the network can
receive incoming calls and SMS
IDLE mode (GSM/EDGE)
AT+CFUN=1
19
Normal mode: full functionality of the
module
AT+CFUN=4
16.5
Disabled TX and RX;
module is not registered on the network
AT+CFUN=5
0.8
Full functionality with power saving;
DRX9 (1.3mA in case of DRX5).
Operative mode (WCDMA)
WCDMA Voice
152
WCDMA voice call (TX = 10dBm)
WCDMA HSDPA (0dBm)
187
WCDMA data call (Cat 14, TX = 0dBm)
WCDMA HSDPA (22dBm)
494
WCDMA data call
(Cat 14, TX = 22dBm)
HE910 Hardware User Guide
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The GSM system is made in a way that the RF transmission is not continuous, else it is
packed into bursts at a base frequency of about 216 Hz, and the relative current peaks
can be as high as about 2A. Therefore the power supply has to be designed in order to
withstand with these current peaks without big voltage drops; this means that both the
electrical design and the board layout must be designed for this current flow. If the layout
of the PCB is not well designed a strong noise floor is generated on the ground and the
supply; this will reflect on all the audio paths producing an audible annoying noise at 216
Hz; if the voltage drop during the peak current absorption is too much, then the device
may even shutdown as a consequence of the supply voltage drop.
NOTE:
The electrical design for the Power supply should be made ensuring it
will be capable of a peak current output of at least 2 A.
Operative mode (EDGE)
EDGE 4TX+2RX
EDGE Sending data mode
GSM900 PL5
495
DCS1800 PL0
484
Operative mode (GSM)
CSD TX and RX mode
GSM VOICE CALL
GSM900 CSD PL5
220
DCS1800 CSD PL0
167
GPRS 4TX+2RX
GPRS Sending data mode
GSM900 PL5
580
DCS1800 PL0
438
HE910 Hardware User Guide
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General Design Rules
The principal guidelines for the Power Supply Design embrace three different design
steps:
the electrical design
the thermal design
the PCB layout
5.3.1. Electrical Design Guidelines
The electrical design of the power supply depends strongly from the power source where
this power is drained. We will distinguish them into three categories:
+5V input (typically PC internal regulator output)
+12V input (typically automotive)
Battery
5.3.1.1. + 5V input Source Power Supply Design Guidelines
The desired output for the power supply is 3.8V, hence there's not a big difference
between the input source and the desired output and a linear regulator can be
used. A switching power supply will not be suited because of the low drop out
requirements.
When using a linear regulator, a proper heat sink shall be provided in order to
dissipate the power generated.
A Bypass low ESR capacitor of adequate capacity must be provided in order to cut
the current absorption peaks close to the HE910, a 100μF tantalum capacitor is
usually suited.
Make sure the low ESR capacitor on the power supply output (usually a tantalum
one) is rated at least 10V.
A protection diode should be inserted close to the power input, in order to save the
HE910 from power polarity inversion.
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An example of linear regulator with 5V input is:
Figure 5-1 Linear regulator
5.3.1.2. + 12V input Source Power Supply Design Guidelines
The desired output for the power supply is 3.8V, hence due to the big difference
between the input source and the desired output, a linear regulator is not suited
and shall not be used. A switching power supply will be preferable because of its
better efficiency especially with the 2A peak current load represented by the
HE910.
When using a switching regulator, a 500kHz or more switching frequency regulator
is preferable because of its smaller inductor size and its faster transient response.
This allows the regulator to respond quickly to the current peaks absorption.
In any case the frequency and Switching design selection is related to the
application to be developed due to the fact the switching frequency could also
generate EMC interferences.
For car PB battery the input voltage can rise up to 15,8V and this should be kept in
mind when choosing components: all components in the power supply must
withstand this voltage.
A Bypass low ESR capacitor of adequate capacity must be provided in order to cut
the current absorption peaks, a 100μF tantalum capacitor is usually suited.
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An example of switching regulator with 12V input is in the below schematic:
Figure 5-2 switching regulator
5.3.1.3. Battery Source Power Supply Design Guidelines
The desired nominal output for the power supply is 3.8V and the maximum voltage
allowed is 4.2V, hence a single 3.7V Li-Ion cel power to the Telit HE910 module.l battery
type is suited for supplying the power to the Telit HE910 module.
Warning
The three cells Ni/Cd or Ni/MH 3,6 V Nom. battery types or 4V PB
types MUST NOT BE USED DIRECTLY since their maximum voltage
can rise over the absolute maximum voltage for the HE910 and
damage it.
NOTE:
DON'T USE any Ni-Cd, Ni-MH, and Pb battery types directly connected
with HE910. Their use can lead to overvoltage on the HE910 and
damage it. USE ONLY Li-Ion battery types.
A Bypass low ESR capacitor of adequate capacity must be provided in order to cut
the current absorption peaks, a 100μF tantalum capacitor is usually suited.
Make sure the low ESR capacitor (usually a tantalum one) is rated at least 10V.
A protection diode should be inserted close to the power input, in order to save the
HE910 from power polarity inversion. Otherwise the battery connector should be
done in a way to avoid polarity inversions when connecting the battery.
The battery capacity must be at least 500mAh in order to withstand the current
peaks of 2A; the suggested capacity is from 500mAh to 1000mAh.
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5.3.2. Thermal Design Guidelines
The thermal design for the power supply heat sink should be done with the following
specifications:
Average current consumption during HSDPA transmission @PWR level max :
600 mA
Average current during idle:
1.5 mA
NOTE:
The average consumption during transmissions depends on the power
level at which the device is requested to transmit by the network. The
average current consumption hence varies significantly.
Considering the very low current during idle, especially if Power Saving function is
enabled, it is possible to consider from the thermal point of view that the device absorbs
current significantly only during calls.
If we assume that the device stays into transmission for short periods of time (let's say few
minutes) and then remains for a quite long time in idle (let's say one hour), then the power
supply has always the time to cool down between the calls and the heat sink could be
smaller than the calculated one for 600mA maximum RMS current, or even could be the
simple chip package (no heat sink).
Moreover in the average network conditions the device is requested to transmit at a lower
power level than the maximum and hence the current consumption will be less than the
600mA, being usually around 150mA.
For these reasons the thermal design is rarely a concern and the simple ground plane
where the power supply chip is placed can be enough to ensure a good thermal condition
and avoid overheating.
For the heat generated by the HE910, you can consider it to be during transmission 1W
max during CSD/VOICE calls and 2W max during GPRS upload.
This generated heat will be mostly conducted to the ground plane under the HE910; you
must ensure that your application can dissipate it.
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5.3.3. Power Supply PCB layout Guidelines
As seen on the electrical design guidelines the power supply shall have a low ESR
capacitor on the output to cut the current peaks and a protection diode on the input to
protect the supply from spikes and polarity inversion. The placement of these components
is crucial for the correct working of the circuitry. A misplaced component can be useless or
can even decrease the power supply performances.
The Bypass low ESR capacitor must be placed close to the Telit HE910 power
input pads or in the case the power supply is a switching type it can be placed
close to the inductor to cut the ripple provided the PCB trace from the capacitor to
the HE910 is wide enough to ensure a dropless connection even during the 2A
current peaks.
The protection diode must be placed close to the input connector where the power
source is drained.
The PCB traces from the input connector to the power regulator IC must be wide
enough to ensure no voltage drops occur when the 2A current peaks are
absorbed. Note that this is not made in order to save power loss but especially to
avoid the voltage drops on the power line at the current peaks frequency of 216 Hz
that will reflect on all the components connected to that supply, introducing the
noise floor at the burst base frequency. For this reason while a voltage drop of
300-400 mV may be acceptable from the power loss point of view, the same
voltage drop may not be acceptable from the noise point of view. If your
application doesn't have audio interface but only uses the data feature of the Telit
HE910, then this noise is not so disturbing and power supply layout design can be
more forgiving.
The PCB traces to the HE910 and the Bypass capacitor must be wide enough to
ensure no significant voltage drops occur when the 2A current peaks are
absorbed. This is for the same reason as previous point. Try to keep this trace as
short as possible.
The PCB traces connecting the Switching output to the inductor and the switching
diode must be kept as short as possible by placing the inductor and the diode very
close to the power switching IC (only for switching power supply). This is done in
order to reduce the radiated field (noise) at the switching frequency (100-500 kHz
usually).
The use of a good common ground plane is suggested.
The placement of the power supply on the board should be done in such a way to
guarantee that the high current return paths in the ground plane are not
overlapped to any noise sensitive circuitry as the microphone amplifier/buffer or
earphone amplifier.
The power supply input cables should be kept separate from noise sensitive lines
such as microphone/earphone cables.
The insertion of EMI filter on VBATT pins is suggested in those designs where
antenna is placed close to battery or supply lines. A ferrite bead like Murata
BLM18EG101TN1 or Taiyo Yuden P/N FBMH1608HM101 can be used for this
purpose.
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The below figure shows the recommended circuit:
Figure 5-3 Circuit
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6. GSM/WCDMA RADIO SECTION
HE910 Product Variants
The following table is listing the main differences between the HE910 variants:
Product
Supported 2G
Bands
Supported 3G
bands
Antenna Diversity
HE910
GSM 850, GSM
900, DCS1800,
PCS 1900
FDD B1, B2, B4,
B5, B8
FDD B1, B2, B5, B8 GSM
850, GSM 900, PCS 1900
HE910-D
GSM 850, GSM
900, DCS1800,
PCS 1900
FDD B1, B2, B4,
B5, B8
FDD B1, B2, B5, B8 GSM
850, GSM 900, PCS 1900
HE910-GL
GSM 850, GSM
900, DCS1800,
PCS 1900
FDD B1, B2, B4,
B5, B8
NO
HE910-EUR
GSM 850, GSM
900, DCS1800,
PCS 1900
FDD B1, B5, B8
NO
HE910-EUD
GSM 850, GSM
900, DCS1800,
PCS 1900
FDD B1, B5, B8
NO
HE910-EUG
GSM 850, GSM
900, DCS1800,
PCS 1900
FDD B1, B5, B8
NO
HE910-NAR
GSM 850, GSM
900, DCS1800,
PCS 1900
FDD B2, B4, B5
NO
HE910-NAD
GSM 850, GSM
900, DCS1800,
PCS 1900
FDD B2, B4, B5
NO
HE910-NAG
GSM 850, GSM
900, DCS1800,
PCS 1900
FDD B2, B4, B5
NO
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TX Output Power
Band
Power Class
GSM 850 / 900
4 (2W)
DCS1800 / PCS 1900
1 (1W)
EDGE, 850/900 MHz
E2 (0.5W)
EDGE, 1800/1900 MHz
Class E2 (0.4W)
WCDMA FDD B1, B2, B4, B5, B8
Class 3 (0.25W)
Sensitivity
Band
Typical
(without Diversity)
Note
GSM 850
-109.5 dBm
BER Class II <2.44%
GSM 900
-109 dBm
BER Class II <2.44%
DCS1800
-110 dBm
BER Class II <2.44%
PCS 1900
-109.5 dBm
BER Class II <2.44%
WCDMA FDD B1
-111 dBm
BER <0.1%
WCDMA FDD B2
-110 dBm
BER <0.1%
WCDMA FDD B4
-111 dBm
BER <0.1%
WCDMA FDD B5
-111 dBm
BER <0.1%
WCDMA FDD B8
-110 dBm
BER <0.1%
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GSM/WCDMA Antenna Requirements
The antenna connection and board layout design are the most important aspect in the full
product design as they strongly affect the product overall performances, hence read
carefully and follow the requirements and the guidelines for a proper design.
The antenna and antenna transmission line on PCB for a Telit HE910 device shall fulfil the
following requirements:
ANTENNA REQUIREMENTS
Frequency range
Depending by frequency band(s) provided
by the network operator, the customer shall
use the most suitable antenna for that/those
band(s)
Bandwidth (GSM/EDGE)
70 MHz in GSM850, 80 MHz in GSM900,
170 MHz in DCS & 140 MHz PCS band
Bandwidth
(WCDMA)
70 MHz in WCDMA Band V
80 MHz in WCDMA Band VIII
460 MHz in WCDMA Band IV
140 MHz in WCDMA Band II
250 MHz in WCDMA Band I
Impedance
50 ohm
Input power
> 33dBm(2 W) peak power in GSM
> 24dBm Average power in WCDMA
VSWR absolute max
≤ 10:1 (limit to avoid permanent damage)
VSWR recommended
≤ 2:1 (limit to fulfil all regulatory
requirements)
When using the HE910, since there's no antenna connector on the module, the antenna
must be connected to the HE910 antenna pad (K1) by means of a transmission line
implemented on the PCB.
In the case the antenna is not directly connected at the antenna pad of the HE910, then a
PCB line is needed in order to connect with it or with its connector.
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This transmission line shall fulfil the following requirements:
ANTENNA LINE ON PCB REQUIREMENTS
Characteristic Impedance
50 ohm
Max Attenuation
0,3 dB
Coupling with other signals shall be avoided
Cold End (Ground Plane) of antenna shall be equipotential to the HE910 ground
pins
Furthermore if the device is developed for the US market and/or Canada market, it shall
comply with the FCC and/or IC approval requirements:
This device is to be used only for mobile and fixed application. In order to re-use the Telit
FCC/IC approvals the antenna(s) used for this transmitter must be installed to provide a
separation distance of at least 20 cm from all persons and must not be co-located or
operating in conjunction with any other antenna or transmitter. If antenna is installed with
a separation distance of less than 20 cm from all persons or is co-located or operating in
conjunction with any other antenna or transmitter then additional FCC/IC testing may be
required. End-Users must be provided with transmitter operation conditions for satisfying
RF exposure compliance.
Antennas used for this OEM module must not exceed the gains for mobile and fixed
operating configurations as described in “FCC/IC Regulatory notices” chapter.
GSM/WCDMA - PCB line Guidelines
Make sure that the transmission line’s characteristic impedance is 50ohm;
Keep line on the PCB as short as possible, since the antenna line loss shall be
less than around 0,3 dB;
Line geometry should have uniform characteristics, constant cross section, avoid
meanders and abrupt curves;
Any kind of suitable geometry / structure (Microstrip, Stripline, Coplanar, Grounded
Coplanar Waveguide...) can be used for implementing the printed transmission line
afferent the antenna;
If a Ground plane is required in line geometry, that plane has to be continuous and
sufficiently extended, so the geometry can be as similar as possible to the related
canonical model;
Keep, if possible, at least one layer of the PCB used only for the Ground plane; If
possible, use this layer as reference Ground plane for the transmission line;
It is wise to surround (on both sides) the PCB transmission line with Ground, avoid
having other signal tracks facing directly the antenna line track.
Avoid crossing any un-shielded transmission line footprint with other signal tracks
on different layers;
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The ground surrounding the antenna line on PCB has to be strictly connected to
the main Ground Plane by means of via holes (once per 2mm at least), placed
close to the ground edges facing line track;
Place EM noisy devices as far as possible from HE910 antenna line;
Keep the antenna line far away from the HE910 power supply lines;
If EM noisy devices are present on the PCB hosting the HE910, such as fast
switching ICs, take care of the shielding of the antenna line by burying it inside the
layers of PCB and surround it with Ground planes, or shield it with a metal frame
cover.
If EM noisy devices are not present around the line, the use of geometries like
Microstrip or Grounded Coplanar Waveguide has to be preferred, since they
typically ensure less attenuation if compared to a Stripline having same length;
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PCB Guidelines in case of FCC certification
In the case FCC certification is required for an application using HE910, HE910-D,
HE910-NAx, according to FCC KDB 996369 for modular approval requirements, the
transmission line has to be similar to that implemented on module’s interface board and
described in the following chapter.
6.6.1. Transmission line design
During the design of the interface board, the placement of components has been chosen
properly, in order to keep the line length as short as possible, thus leading to lowest power
losses possible. A Grounded Coplanar Waveguide (G-CPW) line has been chosen, since
this kind of transmission line ensures good impedance control and can be implemented in
an outer PCB layer as needed in this case. A SMA female connector has been used to
feed the line.
The interface board is realized on a FR4, 4-layers PCB. Substrate material is
characterized by relative permittivity εr = 4.6 ± 0.4 @ 1 GHz, TanD= 0.019 ÷ 0.026 @ 1
GHz.
A characteristic impedance of nearly 50 Ω is achieved using trace width = 1.1 mm,
clearance from coplanar ground plane = 0.3 mm each side. The line uses reference
ground plane on layer 3, while copper is removed from layer 2 underneath the line. Height
of trace above ground plane is 1.335 mm. Calculated characteristic impedance is 51.6 Ω,
estimated line loss is less than 0.1 dB. The line geometry is shown below:
Figure 6-1 Trasmission line designed
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6.6.2. Transmission line measurements
HP8753E VNA (Full-2-port calibration) has been used in this measurement session. A
calibrated coaxial cable has been soldered at the pad corresponding to RF output; a SMA
connector has been soldered to the board in order to characterize the losses of the
transmission line including the connector itself. During Return Loss / impedance
measurements, the transmission line has been terminated to 50 Ω load.
Return Loss plot of line under test is shown below:
Figure 6-2 Return Loss Plot
Line input impedance (in Smith Chart format, once the line has been terminated to 50 Ω
load) is shown in the following figure:
Figure 6-3 Line input impedence
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Insertion Loss of G-CPW line plus SMA connector is shown below:
Figure 6-4 Loss of G-CPW
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GSM/WCDMA Antenna - Installation Guidelines
Install the antenna in a place covered by the GSM signal.
If the device antenna is located greater then 20cm from the human body and there
are no co-located transmitter then the Telit FCC/IC approvals can be re-used by
the end product
If the device antenna is located less then 20cm from the human body or there are
no co-located transmitter then the additional FCC/IC testing may be required for
the end product (Telit FCC/IC approvals cannot be reused)
Antenna shall not be installed inside metal cases
Antenna shall be installed also according Antenna manufacturer instructions.
Antenna Diversity Requirements
This product is including an input for a second RX antenna to improve the radio sensitivity.
The function is called Antenna Diversity.
ANTENNA REQUIREMENTS
Frequency range
Depending by frequency band(s) provided by the network
operator, the customer shall use the most suitable antenna for
that/those band(s)
Bandwidth
(GSM/EDGE)
70 MHz in GSM850, 80 MHz in GSM900 & 140 MHz PCS band
Bandwidth
(WCDMA)
70 MHz in WCDMA Band V
80 MHz in WCDMA Band VIII
140 MHz in WCDMA Band II
250 MHz in WCDMA Band I
Impedance
50 ohm
When using the HE910, since there's no antenna connector on the module, the antenna
must be connected to the HE910 antenna pad (F1) by means of a transmission line
implemented on the PCB.
In the case the antenna is not directly connected at the antenna pad of the HE910, then a
PCB line is needed in order to connect with it or with its connector.
The second Rx antenna should not be located in the close vicinity of main antenna. In
order to improve Diversity Gain, Isolation and reduce mutual interaction, the two antennas
should be located at the maximum reciprocal distance possible, taking into consideration
the available space into the application.
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NOTE 1:
The Diversity is not supported on DCS 1800 in 2G and FDD BAND IV
in 3G
NOTE:
If the RX Diversity is not used/connected, disable the Diversity
functionality using the AT#RXDIV command (ref to the AT User guide
for the proper syntax) and leave the pad F1 unconnected.
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7. GPS RECEIVER
The HE910 module is integrating a GPS receiver that could be used in Autonomous or in
A-GPS (assisted GPS) mode.
With the help of advanced digital signal processing algorithms and the use of A-GPS data,
the receiver is capable to achieve sensitivity values of better than -165 dBm as is required
for indoor applications.
The following table is listing the HE910 variants that support the GPS receiver:
Product
GPS Receiver
HE910
YES
HE910-D
NO
HE910-GL
NO
HE910-EUR
NO
HE910-EUD
NO
HE910-EUG
YES
HE910-NAR
NO
HE910-NAD
NO
HE910-NAG
YES
GPS Performances
Advanced real time hardware correlation engine for enhanced sensitivity (better
than -165 dBm for A-GPS).
Fast Acquisition giving rapid Time-to-First-Fix (TTFF)
Capability to monitor up to 28 channels
Stand Alone and Assisted mode
Integrated LNA
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The following Table is listing the main characteristics:
Characteristic
Typical Values
GPS RX Sensitivity
-164dBm
GPS Cold Start Autonomous
-147dBm
GPS Hot Start Autonomous
-161dBm
GPS tracking mode
-166 dBm
GPS Accuracy
3m
TTFF from Cold Start
42 sec
TTF from Warm Start
30sec
TTF from Hot Start
1.8 sec
Power Consumption in Acquisition
46.4 mA @3.8V
Power Consumption in Tracking
37.8 mA @3.8V
Power Consumption in Low Power
Tracking
25.7 mA @3.8V
GPS Signals Pinout
The Pads related to this function are the following:
PAD
Signal
I/O
Function
Type
R9
ANT_GPS
I
GPS Antenna (50 ohm)
RF
R7
GPS_LNA_EN
O
Output enable for
External LNA supply
CMOS 1.8V
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RF Front End Design
The HE910 Module contains an integrated LNA and pre-select SAW filter. This allows the
module to work well with a passive GPS antenna. If the antenna cannot be located near
the HE910, then an active antenna (that is, an antenna with a low noise amplifier built in)
can be used.
7.3.1. RF Signal Requirements
The HE910 can achieve Cold Start acquisition with a signal level of -147 dBm at its input.
This means the GPS receiver can find the necessary satellites, download the necessary
ephemeris data and compute the location within a 5 minute period.
In the GPS signal acquisition process, downloading and decoding the data is the most
difficult task, which is why Cold Start acquisition requires a higher signal level than
navigation or tracking signal levels. For the purposes of this discussion, autonomous
operation is assumed, which makes the Cold Start acquisition level the important design
constraint. If assistance data in the form of time or ephemeris aiding is available, then
even lower signal levels can be used to compute a navigation solution.
Each GPS satellite presents its own signal to the HE910, and best performance is
obtained when the signal levels are between -125 dBm and -117 dBm. These received
signal levels are determined by :
GPS satellite transmit power
GPS satellite elevation and azimuth
Free space path loss
Extraneous path loss such as rain
Partial or total path blockage such as foliage or building
Multipath caused by signal reflection
GPS antenna
Signal path after the GPS antenna
The first three items in the list above are specified in IS-GPS-200E, readily available
multiple sources online. IS-GPS-200E specifies a signal level minimum of -130 dBm will
be presented to the receiver when using a linearly polarized antenna with 3 dBi gain.
The GPS signal is relatively immune to rainfall attenuation and does not really need to be
considered.
However, the GPS signal is heavily influenced by attenuation due to foliage such as tree
canopies, etc., as well as outright blockage caused by building, terrain or other items in
the line of sight to the specific GPS satellite. This variable attenuation is highly dependent
upon GPS satellite location. If enough satellites are blocked, say at a lower elevation, or
all in a general direction, the geometry of the remaining satellites will result is a lower
accuracy of position. The HE910 reports this geometry in the form of PDOP, HDOP and
VDOP.
For example, in a vehicular application, the GPS antenna may be placed embedded into
the dashboard or rear package tray of an automobile. The metal roof of the vehicle will
cause significant blockage, plus any thermal coating applied to the vehicle glass can
attenuate the GPS signal by as much as 15 dB. Again, both of these factors will affect the
performance of the receiver.
Multipath is a phenomena where the signal from a particular satellite is reflected and is
received by the GPS antenna in addition to or in place of the original line of sight signal.
The multipath signal has a path length that is longer than the original line of sight path and
can either attenuate the original signal, or if received in place of the original signal add
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additional error in determining a solution because the distance to the particular GPS
satellite is actually longer than expected. It is this phenomena that makes GPS navigation
in urban canyons (narrow roads surround by high rise buildings) so challenging. In
general, the reflecting of the GPS signal causes the polarization to reverse. The
implications of this are covered in the next section.
7.3.2. GPS Antenna Polarization
The GPS signal as broadcast is a right hand circularly polarized signal. The best antenna
to receive the GPS signal is a right hand circularly (RHCP) polarized antenna.
Remember that IS-GPS-200E specifies the receive power level with a linearly polarized
antenna. A linearly polarized antenna will have 3 dB loss as compared to an RHCP
antenna assuming the same antenna gain (specified in dBi and dBic respectively).
An RHCP antenna is better at rejecting multipath than a linearly polarized antenna.
This is because the reflected signal changes polarization to LHCP, which would be
rejected by the RHCP antenna by typically 20 dB or so. If the multipath signal is
attenuating the line of sight signal, then the RHCP antenna would show a higher signal
level than a linearly polarized antenna because the interfering signal is rejected.
However, in the case where the multipath signal is replacing the line of sight signal, such
as in an urban canyon environment, then the number of satellites in view could drop below
that needed to determine a 3D solution. This is a case where a bad signal may be better
than no signal. The system designer needs to make tradeoffs in their application to
determine which is the better choice.
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7.3.3. GPS Antenna Gain
Antenna gain is defined as the extra signal power from the antenna as compared to a
theoretical isotropic antenna (equally sensitive in all directions).
For example, a 25mm by 25m square patch antenna on a reference ground plane (usually
70mm by 70mm) will give an antenna gain at zenith of 5 dBic. A smaller 18mm by 18mm
square patch on a reference ground plane (usually 50mm by 50mm) will give an antenna
gain at zenith of 2 dBic.
While an antenna vendor will specify a nominal antenna gain (usually at zenith, or directly
overhead) they should supply antenna pattern curves specifying gain as a function of
elevation, and gain at a fixed elevation as a function of azimuth. Pay careful attention to
the requirement to meet these specifications, such as ground plane required and any
external matching components. Failure to follow these requirements could result in very
poor antenna performance.
It is important to note that GPS antenna gain is not the same thing as external LNA gain.
Most antenna vendors will specify these numbers separately, but some combine them into
a single number. It is important to know both numbers when designing and evaluating the
front end of a GPS receiver.
For example, antenna X has an antenna gain of 5 dBiC at azimuth and an LNA gain of 20
dB for a combined total of 25 dB. Antenna Y has an antenna gain of -5 dBiC at azimuth
and an LNA gain of 30 dB for a combined total of 25 dB. However, in the system, antenna
X will outperform antenna Y by about 10 dB (refer to next chapter for more details on
system noise floor).
An antenna with higher gain will generally outperform an antenna with lower gain. Once
the signals are above about -130 dBm for a particular satellite, no improvement in
performance would be gained. However, for those satellites that are below about -125
dBm, a higher gain antenna would improve the gain and improve the performance of the
GPS receiver. In the case of really weak signals, a good antenna could mean the
difference between being able to use a particular satellite signal or not.
7.3.4. Active versus Passive Antenna
If the GPS antenna is placed near the HE910 and the RF traces losses are not excessive
(nominally 1 dB), then a passive antenna can be used. This would normally be the lowest
cost option and most of the time the simplest to use. However, if the antenna needs to be
located away from the HE910 then an active antenna may be required to obtain the best
system performance. The active antenna has its own built in low noise amplifier to
overcome RF trace or cable losses after the active antenna.
However, an active antenna has a low noise amplifier (LNA) with associated gain and
noise figure. In addition, many active antennas have either a pre-select filter, a post-select
filter, or both.
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7.3.5. GPS Antenna - PCB Line Guidelines
Ensure that the antenna line impedance is 50ohm.
Keep the antenna line on the PCB as short as possible to reduce the loss.
Antenna line must have uniform characteristics, constant cross section, avoid
meanders and abrupt curves.
Keep one layer of the PCB used only for the Ground plane, if possible.
Surround (on the sides, over and under) the antenna line on PCB with Ground,
avoid having other signal tracks facing directly the antenna line of track.
The ground around the antenna line on PCB has to be strictly connected to the
Ground Plane by placing vias once per 2mm at least.
Place EM noisy devices as far as possible from HE910 antenna line.
Keep the antenna line far away from the HE910 power supply lines.
Keep the antenna line far away from the HE910 GSM RF lines.
If you have EM noisy devices around the PCB hosting the HE910, such as fast
switching ICs, take care of the shielding of the antenna line by burying it inside the
layers of PCB and surround it with Ground planes, or shield it with a metal frame
cover.
If you do not have EM noisy devices around the PCB of HE910, use a strip-line on
the superficial copper layer for the antenna line. The line attenuation will be lower
than a buried one.
7.3.6. RF Trace Losses
RF Trace losses are difficult to estimate on a PCB without having the appropriate tables or
RF simulation software to estimate what the losses would be. A good rule of thumb would
be to keep the RF traces as short as possible, make sure they are 50 ohms impedance
and don’t contain any sharp bends.
7.3.7. Implications of the Pre-select SAW Filter
The HE910 module contains a SAW filter used in a pre-select configuration with the built-
in LNA, that is, the RF input of the HE910 ties directly into the SAW filter. Any circuit
connected to the input of the HE910 would see complex impedance presented by the
SAW filter, particularly out of band, rather than the relatively broad and flat return loss
presented by the LNA. Filter devices pass the desired in band signal to the output,
resulting in low reflected energy (good return loss), and reject the out of band signal by
reflecting it back to the input, resulting in high reflected energy (bad return loss).
If an external amplifier is to be used with the HE910, the overall design should be checked
for RF stability to prevent the external amplifier from oscillating. Amplifiers that are
unconditionally stable at the output will be fine to use with the HE910.
If an external filter is to be connected directly to the HE910, care needs to be used in
making sure neither the external filter nor the internal SAW filter performance is
compromised. These components are typically specified to operate into 50 ohms
impedance, which is generally true in band, but would not be true out of band. If there is
extra gain associated with the external filter, then a 6 dB Pi or T resistive attenuator is
suggested to improve the impedance match between the two components.
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7.3.8. External LNA Gain and Noise Figure
The HE910 can be used with an external LNA such as what might be found in an active
antenna. Because of the internal LNA, the overall gain (including signal losses past the
external LNA) should not exceed 14 dB. Levels higher than that can affect the jamming
detection capability of the HE910. If a higher gain LNA is used, either a resistive Pi or T
attenuator can be inserted after the LNA to bring the gain down to 14 dB .
The external LNA should have a noise figure better than 1 dB. This will give an overall
system noise figure of around 2 dB assuming the LNA gain is 14 dB, or if higher the low
gain mode is automatically managed by the HE910 with its internal AGC.
The external LNA, if having no pre-select filter, needs to be able to handle other signals
other than the GPS signal. These signals are typically at much higher levels. The amplifier
needs to stay in the linear region when presented with these other signals. Again, the
system designer needs to determine all of the unintended signals and their possible levels
that can be presented and make sure the external LNA will not be driven into
compression. If this were to happen, the GPS signal itself would start to be attenuated and
the GPS performance would suffer.
7.3.9. Powering the External LNA (active antenna)
The external LNA needs a source of power. Many of the active antennas accept a 3 volt
or 5 volt DC voltage that is impressed upon the RF signal line. This voltage is not supplied
by the HE910, but can be easily supplied by the host design.
7.3.10. External LNA Enable
The HE910 is already provided by an internal LNA. In case the Application needs to
include an additional LNA stage, the module is provided by a digital signal usable to
enable the power supply of the external amplifier. The signal is set to High only when the
GPS receiver is active.
The electrical characteristics of the GPS_LNA_EN signal are:
Level
Min
Max
Output high level
1.6V
1.9
Output low level
0V
0.2V
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An example of GPS Antenna Supply circuit is shown in the following image:
Figure 7-1 GPS Antenna Suply circuit
NOTE:
The maximum DC voltage applicable to the ANT_GPS pin is 5V. In
case this is exceeded, a series capacitor has to be included in the
design to avoid exceeding the maximum input DC level.
7.3.11. Shielding
Shielding the RF circuitry generally is ineffective because the interference is getting into
the GPS antenna itself, the most sensitive portion of the RF path. The antenna cannot be
shielded because then it can’t receive the GPS signals.
There are two solutions, one is to move the antenna away from the source of interference
or the second is to shield the digital interference to prevent it from getting to the antenna.
7.3.12. GPS Antenna – Installation
The HE910 due to its characteristics of sensitivity is capable to perform a Fix
inside the buildings. (In any case the sensitivity could be affected by the building
characteristics i.e. shielding).
The Antenna must not be co-located or operating in conjunction with any other
antenna or transmitter.
Antenna must not be installed inside metal cases.
Antenna must be installed also according to the Antenna manufacturer instructions
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8. LOGIC LEVEL SPECIFICATIONS
The following table shows the logic level specifications used in the HE910 interface
circuits:
Absolute Maximum Ratings -Not Functional
Parameter
Min
Max
Input level on any digital pin (CMOS 1.8) with respect to ground
-0.3V
2.1V
Input level on any digital pin (CMOS 1.2) with respect to ground
-0.3V
1.4V
Operating Range - Interface levels (1.8V CMOS)
Level
Min
Max
Input high level
1.5V
1.9V
Input low level
0V
0.35V
Output high level
1.6V
1.9V
Output low level
0V
0.2V
Operating Range - Interface levels (1.2V CMOS)
Level
Min
Max
Input high level
0.9V
1.3V
Input low level
0V
0.3V
Output high level
1V
1.3V
Output low level
0V
0.1V
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Current characteristics
Level
Typical
Output Current
1mA
Input Current
1uA
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Unconditional Shutdown
Signal
Function
I/O
PAD
HW_SHUTDOWN*
Unconditional Shutdown of the Module
I
R13
HW_SHUTDOWN* is used to unconditionally shutdown the HE910. Whenever this signal
is pulled low, the HE910 is reset. When the device is reset it stops any operation. After the
release of the line, the HE910 is unconditionally shut down, without doing any detach
operation from the network where it is registered. This behaviour is not a proper shut
down because any GSM device is requested to issue a detach request on turn off. For this
reason the HW_SHUTDOWN* signal must not be used to normally shutting down the
device, but only as an emergency exit in the rare case the device remains stuck waiting
for some network response.
The HW_SHUTDOWN* is internally controlled on start-up to achieve always a proper
power-on reset sequence, so there's no need to control this pin on start-up.
It may only be used to reset a device already on that is not responding to any command.
NOTE:
Do not use this signal to power off the HE910. Use the ON/OFF signal
to perform this function or the AT#SHDN command.
Unconditional Shutdown Signal Operating levels:
Signal
Min
Max
HW_SHUTDOWN* Input high
1.5V
1.9V
HW_SHUTDOWN* Input low
0V
0.35V
* this signal is internally pulled up so the pin can be left floating if not used.
If unused, this signal may be left unconnected. If used, then it must always be connected
with an open collector transistor, to permit to the internal circuitry the power on reset and
under voltage lockout functions.
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9. USB PORT
The HE910 includes one integrated universal serial bus (USB 2.0 HS) transceiver.
USB 2.0 HS Description
This port is compliant with the USB 2.0 HS.
The USB FS is supported for AT interface and data communication.
The following table is listing the available signals:
The USB_DPLUS and USB_DMINUS signals have a clock rate of 480 MHz.
The signal traces should be routed carefully. Trace lengths, number of vias and capacitive
loading should be minimized. The characteristic impedance value should be as close as
possible to 90 Ohms differential.
In case there is a need to add an ESD protection the suggested connection is the
following:
Figure 9-1 ESD8V0L2B-03L
NOTE:
VUSB pin should be disconnected before activating the Power Saving
Mode.
In case of a Firmware upgrade using the USB port, it could be done
only using an USB 2.0 HS device.
PAD
Signal
I/O
Function
Type
NOTE
B15
USB_D+
I/O
USB differential
Data (+)
3.3V
C15
USB_D-
I/O
USB differential
Data (-)
3.3V
A13
VUSB
AI
Power sense for the
internal USB
transceiver.
5V
Accepted
range:
4.4V to 5.25V
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10. SPI PORT
The HE910 Module is provided by one SPI interface.
The SPI interface defines two handshake lines for flow control and mutual wake-up of the
modem and the Application Processor: SRDY (slave ready) and MRDY (master ready).
The AP has the master role, that is, it supplies the clock.
The following table is listing the available signals:
The signal 1V8_SEL must be connected to the VDD_IO1 input pin to properly supply this
digital section.
NOTE:
Due to the shared functions, when the SPI port is used, it is not
possible to use the AUX_UART port.
PAD
Signal
I/O
Function
Type
COMMENT
D15
SPI_MOSI
I
SPI MOSI
CMOS 1.8V
Shared with
TX_AUX
E15
SPI_MISO
O
SPI MISO
CMOS 1.8V
Shared with
RX_AUX
F15
SPI_CLK
I
SPI Clock
CMOS 1.8V
H15
SPI_MRDY
I
SPI_MRDY
CMOS 1.8V
J15
SPI_SRDY
O
SPI_SRDY
CMOS 1.8V
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SPI Connections
Figure 10-1 SPI Connections
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11. USB HSIC
The HE910 Module is provided by one USB HSIC interface.
The USB HSIC (High Speed Inter Processor) Interface allows supporting the inter-
processor communication between an application processor (AP) – the host, and the
modem processor (CP) – the HE910
The following table is listing the available signals:
The signal 1V8_SEL must be connected to the VDD_IO1 input pin to properly supply this
digital section.
For the detailed use of USB HSIC port please refer to the related Application Note
PAD
Signal
I/
O
Function
Type
COMMENT
A12
HSIC_USB_DATA
I/
O
USB HSIC data
signal
CMOS 1.2V
A11
HSIC_USB_STRB
I/
O
USB HSIC
strobe signal
CMOS 1.2V
H15
HSIC_SLAVE_WAKEUP
I
Slave Wake Up
CMOS 1.8V
Shared with
SPI_MRDY
F15
HSIC_HOST_WAKEUP
O
Host Wake Up
CMOS 1.8V
Shared with
SPI CLK
K15
HSIC_SUSPEND_REQUEST
O
Slave Suspend
Request
CMOS 1.8V
Shared with
GPIO08
J15
HSIC_HOST_ACTIVE
I
Active Host
Indication
CMOS 1.8V
Shared with
SPI_SRDY
D13
VDD_IO1
I
VDD_IO1 Input
To be
connected to
E13
E13
1V8_SEL
O
1V8 SEL for
VDD_IO1
To be
connected to
D13
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NOTE:
Due to the shared functions, when the USB_HSIC port is used, it is not
possible to use the SPI and the GPIO_08.
The USB_HSIC is not active by default but it has to be enabled using
the AT#PORTCFG command (refer to the AT User guide for the
detailed syntax description).
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12. SERIAL PORTS
The HE910 module is provided with by 2 Asynchronous serial ports:
MODEM SERIAL PORT 1 (Main)
MODEM SERIAL PORT 2 (Auxiliary)
Several configurations can be designed for the serial port on the OEM hardware, but the
most common are:
RS232 PC com port
microcontroller UART @ 1.8V (Universal Asynchronous Receive Transmit)
microcontroller UART @ 5V or other voltages different from 1.8V
Depending from the type of serial port on the OEM hardware a level translator circuit may
be needed to make the system work.
The electrical characteristics of the Serial ports are explained in the following tables:
Absolute Maximum Ratings -Not Functional
Parameter
Min
Max
Input level on any digital
pin (CMOS 1.8) with
respect to ground
-0.3V
2.1V
Operating Range - Interface levels (1.8V CMOS)
Level
Min
Max
Input high level
1.5V
1.9V
Input low level
0V
0.35V
Output high level
1.6V
1.9
Output low level
0V
0.2V
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MODEM SERIAL PORT 1 (USIF0)
The serial port 1 on the HE910 is a +1.8V UART with all the 7 RS232 signals.
It differs from the PC-RS232 in the signal polarity (RS232 is reversed) and levels.
RS232
Pin #
Signal
HE910
Pad Number
Name
Usage
1
C109/DCD
N14
Data Carrier Detect
Output from the
HE910 that indicates
the carrier presence
2
C104/RXD
M15
Transmit line *see
Note
Output transmit line of
HE910 UART
3
C103/TXD
N15
Receive line *see
Note
Input receive of the
HE910 UART
4
C108/DTR
M14
Data Terminal
Ready
Input to the HE910
that controls the DTE
READY condition
5
GND
M12, B13,
P13, E14 …
Ground
Ground
6
C107/DSR
P14
Data Set Ready
Output from the
HE910 that indicates
the module is ready
7
C106/CTS
P15
Clear to Send
Output from the
HE910 that controls
the Hardware flow
control
8
C105/RTS
L14
Request to Send
Input to the HE910
that controls the
Hardware flow control
9
C125/RING
R14
Ring Indicator
Output from the
HE910 that indicates
the incoming call
condition
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The following table shows the typical input value of internal pull-up resistors for RTS DTR
and TXD input lines and in all module states:
STATE
RTS DTR TXD
Pull up tied to
ON
5K to 12K
1V8
OFF
Schottky diode
RESET
Schottky diode
POWER SAVING
5K to 12K
1V8
The input line ON_OFF and RESET state can be treated as in picture below
Figure 12-1 Input Line ON_OFF
NOTE:
According to V.24, some signal names are referred to the application
side, therefore on the HE910 side these signal are on the opposite
direction:
TXD on the application side will be connected to the receive line (here
named C103/TXD)
RXD on the application side will be connected to the transmit line (here
named C104/RXD)
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NOTE:
For a minimum implementation, only the TXD, RXD lines can be
connected, the other lines can be left open provided a software flow
control is implemented.
NOTE:
In order to avoid a back powering effect it is recommended to avoid
having any HIGH logic level signal applied to the digital pins of the
HE910 when the module is powered off or during an ON/OFF
transition.
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MODEM SERIAL PORT 2 (USIF1)
The secondary serial port on the HE910 is a CMOS1.8V with only the RX and TX signals.
The signals of the HE910 serial port are:
The signal 1V8_SEL must be connected to the VDD_IO1 input pin in order to use this
port.
NOTE:
Due to the shared pins, when the Modem Serial port is used, it is not
possible to use the SPI functions.
NOTE:
In order to avoid a back powering effect it is recommended to avoid
having any HIGH logic level signal applied to the digital pins of the
HE910 when the module is powered off or during an ON/OFF
transition.
PAD
Signal
I/O
Function
Type
COMMENT
D15
TX_AUX
O
Auxiliary UART (TX
Data to DTE)
CMOS 1.8V
SHARED WITH
SPI_MTSR
E15
RX_AUX
I
Auxiliary UART (RX
Data from DTE)
CMOS 1.8V
SHARED WITH
SPI_MRST
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RS232 level translation
In order to interface the HE910 with a PC com port or a RS232 (EIA/TIA-232) application
a level translator is required. This level translator must:
invert the electrical signal in both directions;
Change the level from 0/1.8V to +15/-15V.
Actually, the RS232 UART 16450, 16550, 16650 & 16750 chipsets accept signals with
lower levels on the RS232 side (EIA/TIA-562), allowing a lower voltage-multiplying ratio
on the level translator. Note that the negative signal voltage must be less than 0V and
hence some sort of level translation is always required.
The simplest way to translate the levels and invert the signal is by using a single chip level
translator. There are a multitude of them, differing in the number of drivers and receivers
and in the levels (be sure to get a true RS232 level translator not a RS485 or other
standards).
By convention the driver is the level translator from the 0-1.8V UART to the RS232 level.
The receiver is the translator from the RS232 level to 0-1.8V UART.
In order to translate the whole set of control lines of the UART you will need:
5 drivers
3 receivers
An example of RS232 level adaptation circuitry could be done using a MAXIM transceiver
(MAX218)
In this case the chipset is capable to translate directly from 1.8V to the RS232 levels
(Example done on 4 signals only).
Figure 12-2 RS232 Level
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The RS232 serial port lines are usually connected to a DB9 connector with the following
layout:
Figure 12-3 RS232 serial port lines
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13. AUDIO SECTION OVERVIEW
The Audio of the HE910 Module is carried by DVI digital audio interface.
The audio port can be directly connected to end device using digital interface, or via one
of the several compliant codecs (in case an analog audio is needed).
Electrical Characteristics
The product is providing the Digital Audio Interface (DVI) on the following Pins:
13.1.1. CODEC Examples
Please refer to the HE910 Digital Audio Application note
Digital Voice Interface (DVI)
PAD
Signal
I/O
Function
Note
Type
B9
DVI_WA0
I/O
Digital Audio
Interface (Word
Alignment / LRCLK)
CMOS 1.8V
B6
DVI_RX
I
Digital Audio
Interface (RX)
CMOS 1.8V
B7
DVI_TX
O
Digital Audio
Interface (TX)
CMOS 1.8V
B8
DVI_CLK
I/O
Digital Audio
Interface (BCLK)
CMOS 1.8V
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14. GENERAL PURPOSE I/O
The HE910 module is provided by a set of Digital Input / Output pins
Input pads can only be read; they report the digital value (high or low) present on the pad
at the read time.
Output pads can only be written or queried and set the value of the pad output.
An alternate function pad is internally controlled by the HE910 firmware and acts
depending on the function implemented.
The following table shows the available GPIO on the HE910:
PAD
Signal
I/O
Function
Type
Drive
strength
Default
State
Note
C8
GPIO_01
I/O
Configurable
GPIO
CMOS
1.8V
1 mA
INPUT
Alternate
function STAT
LED
C9
GPIO_02
I/O
Configurable
GPIO
CMOS
1.8V
1 mA
INPUT
C10
GPIO_03
I/O
Configurable
GPIO
CMOS
1.8V
1 mA
INPUT
C11
GPIO_04
I/O
Configurable
GPIO
CMOS
1.8V
1 mA
INPUT
B14
GPIO_05
I/O
Configurable
GPIO
CMOS
1.8V
1 mA
INPUT
C12
GPIO_06
I/O
Configurable
GPIO
CMOS
1.8V
1 mA
INPUT
C13
GPIO_07
I/O
Configurable
GPIO
CMOS
1.8V
1 mA
INPUT
K15
GPIO_08
I/O
Configurable
GPIO
CMOS
1.8V
1 mA
INPUT
VDD_IO1 has
to be
connected to
1V8_SEL
L15
GPIO_09
I/O
Configurable
GPIO
CMOS
1.8V
1 mA
INPUT
VDD_IO1 has
to be
connected to
1V8_SEL
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GPIO Logic levels
Where not specifically stated, all the interface circuits work at 1.8V CMOS logic levels.
The following table shows the logic level specifications used in the HE910 interface
circuits:
Absolute Maximum Ratings -Not Functional
Parameter
Min
Max
Input level on any digital
pin (CMOS 1.8) with
respect to ground
-0.3V
2.1V
Operating Range - Interface levels (1.8V CMOS)
Level
Min
Max
Input high level
1.5V
1.9V
Input low level
0V
0.35V
Output high level
1.6V
1.9
Output low level
0V
0.2V
G15
GPIO_10
I/O
Configurable
GPIO
CMOS
1.8V
1 mA
INPUT
VDD_IO1 has
to be
connected to
1V8_SEL
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Using a GPIO Pad as INPUT
The GPIO pads, when used as inputs, can be connected to a digital output of another
device and report its status, provided this device has interface levels compatible with the
1.8V CMOS levels of the GPIO.
If the digital output of the device to be connected with the GPIO input pad has interface
levels different from the 1.8V CMOS, then it can be buffered with an open collector
transistor with a 47K pull up to 1.8V.
NOTE:
In order to avoid a back powering effect it is recommended to avoid
having any HIGH logic level signal applied to the digital pins of the
HE910 when the module is powered off or during an ON/OFF
transition.
Using a GPIO Pad as OUTPUT
The GPIO pads, when used as outputs, can drive 1.8V CMOS digital devices or
compatible hardware. When set as outputs, the pads have a push-pull output and
therefore the pull-up resistor may be omitted.
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Indication of network service availability
The STAT_LED pin status shows information on the network service availability and Call
status. The function is available as alternate function of GPIO_01 (to be enabled using the
AT#GPIO=1,0,2 command).
In the HE910 modules, the STAT_LED needs an external transistor to drive an external
LED.
Therefore, the status indicated in the following table is reversed with respect to the pin
status.
Device Status
LED status
Device off
Permanently off
Not Registered
Permanently on
Registered in idle
Blinking 1sec on + 2 sec off
Registered in idle + power saving
It depends on the event that triggers the
wakeup (In sync with network paging)
Voice Call Active
Permanently on
Dial-Up
Blinking 1 sec on + 2 sec off
A schematic example could be:
Figure 14-1 State_Led
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RTC Bypass out
The VRTC pin brings out the Real Time Clock supply, which is separate from the rest of
the digital part, allowing having only RTC going on when all the other parts of the device
are off.
To this power output a backup capacitor can be added in order to increase the RTC
autonomy during power off of the battery. NO Devices must be powered from this pin.
In order to keep the RTC active when VBATT is not supplied it is possible to back up the
RTC section connecting a backup circuit to the related VRTC signal (pad C14 on module’s
Pinout).
For additional details on the Backup solutions please refer to the related application note
(xE910 RTC Backup Application Note)
External SIM Holder Implementation
Please refer to the related User Guide (SIM Holder Design Guides, 80000NT10001a).
VAUX Power Output
A regulated power supply output is provided in order to supply small devices from the
module. The signal is present on Pad R11 and it is in common with the PWRMON
(module powered ON indication) function.
This output is always active when the module is powered ON.
The operating range characteristics of the supply are:
Level
Min
Typical
Max
Output voltage
1.78V
1.80V
1.82V
Output current
-
-
60mA
Output bypass capacitor
(inside the module)
1uF
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ADC Converter
14.8.1. Description
The HE910 is provided by one AD converter. It is able to read a voltage level in the range
of 0÷1.2 volts applied on the ADC pin input, store and convert it into 10 bit word.
The following table is showing the ADC characteristics:
Min
Typical
Max
Units
Input Voltage range
0
-
1.2
Volt
AD conversion
-
-
10
bits
Input Resistance
1
-
-
Mohm
Input Capacitance
-
1
-
pF
The input line is named as ADC_IN1 and it is available on Pad B1
14.8.2. Using ADC Converter
An AT command is available to use the ADC function
The command is AT#ADC=1,2
The read value is expressed in mV
Refer to SW User Guide or AT Commands Reference Guide for the full description of this
function.
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15. MOUNTING THE HE910 ON THE APPLICATION
General
The HE910 modules have been designed in order to be compliant with a standard lead-
free SMT process.
Module finishing & dimensions
Figure 15-1 Module finishing
Pin B1
Dimensions in mm
Bottom view
Lead-free Alloy:
Surface finishing Ni/Au for all solder pads
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Figure 15-2 Module dimensions
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Recommended foot print for the application
TOP VIEW
Figure 15-3 Foot print
In order to easily rework the HE910 is suggested to consider on the application a 1.5 mm
placement inhibit area around the module.
It is also suggested, as common rule for an SMT component, to avoid having a
mechanical part of the application in direct contact with the module.
NOTE:
In the customer application, the region under WIRING INHIBIT (see
figure above) must be clear from signal or ground paths.
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Stencil
Stencil’s apertures layout can be the same of the recommended footprint (1:1), we
suggest a thickness of stencil foil ≥ 120 µm.
PCB pad design
Non solder mask defined (NSMD) type is recommended for the solder pads on the PCB.
Figure 15-4 PCB
PCB
Copper Pad
Pad
Solder Mask
SMD
(Solder Mask Defined)
NSMD
(Non Solder Mask Defined)
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PCB pad dimensions
The recommendation for the PCB pads dimensions are described in the following image
(dimensions in mm)
Figure 15-5 PCB pads dimensions
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It is not recommended to place via or micro-via not covered by solder resist in an area of
0,3 mm around the pads unless it carries the same signal of the pad itself (see following
figure).
Figure 15-6 PCB pads
Holes in pad are allowed only for blind holes and not for through holes.
Recommendations for PCB pad surfaces:
Finish
Layer thickness [µm]
Properties
Electro-less Ni /
Immersion Au
3 –7 / 0.05 – 0.15
good solder ability protection,
high shear force values
The PCB must be able to resist the higher temperatures which are occurring at the lead-
free process. This issue should be discussed with the PCB-supplier. Generally, the
wettability of tin-lead solder paste on the described surface plating is better compared to
lead-free solder paste.
It is not necessary to panel the application’s PCB, however in that case it is suggested to
use milled contours and predrilled board breakouts; scoring or v-cut solutions are not
recommended.
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Solder paste
Lead free
Solder paste
Sn/Ag/Cu
We recommend using only “no clean” solder paste in order to avoid the cleaning of the
modules after assembly
15.7.1. HE910 Solder reflow
Recommended solder reflow profile:
Figure 15-7 HE910 Solder reflow
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Profile Feature
Pb-Free Assembly
Average ramp-up rate (TL to TP)
3°C/second max
Preheat
– Temperature Min (Tsmin)
– Temperature Max (Tsmax)
– Time (min to max) (ts)
150°C
200°C
60-180 seconds
Tsmax to TL
– Ramp-up Rate
3°C/second max
Time maintained above:
– Temperature (TL)
– Time (tL)
217°C
60-150 seconds
Peak Temperature (Tp)
245 +0/-5°C
Time within 5°C of actual Peak
Temperature (tp)
10-30 seconds
Ramp-down Rate
6°C/second max.
Time 25°C to Peak Temperature
8 minutes max.
NOTE:
All temperatures refer to topside of the package, measured on the
package body surface
Warning:
The HE910 module withstands one reflow process only.
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Packing system (Tray)
The HE910 modules are packaged on trays of 36 pieces each. These trays can be used
in SMT processes for pick & place handling.
Figure 15-8 Packing system 1
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Figure 15-9 Packing system 2
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Packing System (Reel)
The HE910 can be packaged on reels of 200 pieces each.
See figure for module positioning into the carrier.
Figure 15-10 Packing System 3
15.9.1. Carrier Tape Detail
Figure 15-11 Carrier tape detail
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15.9.2. Reel Detail
Figure 15-12 Reel detail 1
Figure 15-13 Reel detail 2
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15.9.3. Packaging Detail
Figure 15-14 Packaging detail
Moisture sensitivity
The HE910 is a Moisture Sensitive Device level 3, in according with standard IPC/JEDEC
J-STD-020, take care all the relatives requirements for using this kind of components.
Moreover, the customer has to take care of the following conditions:
a) Calculated shelf life in sealed bag: 12 months at <40°C and <90% relative humidity
(RH).
b) Environmental condition during the production: 30°C / 60% RH according to
IPC/JEDEC J-STD-033A paragraph 5.
c) The maximum time between the opening of the sealed bag and the reflow process
must be 168 hours if condition b) “IPC/JEDEC J-STD-033A paragraph 5.2” is
respected
d) Baking is required if conditions b) or c) are not respected
e) Baking is required if the humidity indicator inside the bag indicates 10% RH
f) or more
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16. SAFETY RECOMMANDATIONS
READ CAREFULLY
Be sure the use of this product is allowed in the country and in the environment required.
The use of this product may be dangerous and has to be avoided in the following areas:
Where it can interfere with other electronic devices in environments such as
hospitals, airports, aircrafts, etc
Where there is risk of explosion such as gasoline stations, oil refineries, etc
It is responsibility of the user to enforce the country regulation and the specific
environment regulation.
Do not disassemble the product; any mark of tampering will compromise the warranty
validity.
We recommend following the instructions of the hardware user guides for a correct wiring
of the product. The product has to be supplied with a stabilized voltage source and the
wiring has to be conforming to the security and fire prevention regulations.
The product has to be handled with care, avoiding any contact with the pins because
electrostatic discharges may damage the product itself. Same cautions have to be taken
for the SIM, checking carefully the instruction for its use. Do not insert or remove the SIM
when the product is in power saving mode.
The system integrator is responsible of the functioning of the final product; therefore, care
has to be taken to the external components of the module, as well as of any project or
installation issue, because the risk of disturbing the GSM network or external devices or
having impact on the security. Should there be any doubt, please refer to the technical
documentation and the regulations in force.
Every module has to be equipped with a proper antenna with specific characteristics. The
antenna has to be installed with care in order to avoid any interference with other
electronic devices and has to guarantee a minimum distance from the body (20 cm). In
case of this requirement cannot be satisfied, the system integrator has to assess the final
product against the SAR regulation.
The European Community provides some Directives for the electronic equipments
introduced on the market. All the relevant information’s are available on the European
Community website:
http://europa.eu.int/comm/enterprise/rtte/dir99-5.htm
The text of the Directive 99/05 regarding telecommunication equipments is available,
while the applicable Directives (Low Voltage and EMC) are available at:
http://europa.eu.int/comm/enterprise/electr_equipment/index_en.htm
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17. CONFORMITY ASSESSMENT ISSUES
1999/5/EC Directive
The HE910, HE910-D, HE910-EUG, HE910-EUR, HE910-EUD, HE910-NAG, HE910-
NAR, HE910-NAD modules have been evaluated against the essential requirements of
the 1999/5/EC Directive.
Bulgarian
С настоящето Telit Communications S.p.A. декларира, че 2G/3G
module отговаря на съществените изисквания и другите
приложими изисквания на Директива 1999/5/ЕС.
Czech
Telit Communications S.p.A. tímto prohlašuje, že tento 2G/3G module je ve
shodě se základními požadavky a dalšími příslušnými ustanoveními
směrnice 1999/5/ES.
Danish
Undertegnede Telit Communications S.p.A. erklærer herved, at følgende
udstyr 2G/3G module overholder de væsentlige krav og øvrige relevante
krav i direktiv 1999/5/EF.
Dutch
Hierbij verklaart Telit Communications S.p.A. dat het toestel 2G/3G module
in overeenstemming is met de essentiële eisen en de andere relevante
bepalingen van richtlijn 1999/5/EG.
English
Hereby, Telit Communications S.p.A., declares that this 2G/3G module is in
compliance with the essential requirements and other relevant provisions of
Directive 1999/5/EC.
Estonian
Käesolevaga kinnitab Telit Communications S.p.A. seadme 2G/3G module
vastavust direktiivi 1999/5/EÜ põhinõuetele ja nimetatud direktiivist
tulenevatele teistele asjakohastele sätetele.
German
Hiermit erklärt Telit Communications S.p.A., dass sich das Gerät 2G/3G
module in Übereinstimmung mit den grundlegenden Anforderungen und
den übrigen einschlägigen Bestimmungen der Richtlinie 1999/5/EG
befindet.
Greek
ΜΕ ΤΗΝ ΠΑΡΟΥΣΑ Telit Communications S.p.A. ΔΗΛΩΝΕΙ ΟΤΙ 2G/3G
module ΣΥΜΜΟΡΦΩΝΕΤΑΙ ΠΡΟΣ ΤΙΣ ΟΥΣΙΩΔΕΙΣ ΑΠΑΙΤΗΣΕΙΣ ΚΑΙ ΤΙΣ
ΛΟΙΠΕΣ ΣΧΕΤΙΚΕΣ ΔΙΑΤΑΞΕΙΣ ΤΗΣ ΟΔΗΓΙΑΣ 1999/5/ΕΚ.
Hungarian
Alulírott, Telit Communications S.p.A. nyilatkozom, hogy a 2G/3G module
megfelel a vonatkozó alapvetõ követelményeknek és az 1999/5/EC
irányelv egyéb elõírásainak.
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Finnish
Telit Communications S.p.A. vakuuttaa täten että 2G/3G module tyyppinen
laite on direktiivin 1999/5/EY oleellisten vaatimusten ja sitä koskevien
direktiivin muiden ehtojen mukainen.
French
Par la présente Telit Communications S.p.A. déclare que l'appareil 2G/3G
module est conforme aux exigences essentielles et aux autres dispositions
pertinentes de la directive 1999/5/CE.
Icelandic
Hér með lýsir Telit Communications S.p.A. yfir því að 2G/3G module er í
samræmi við grunnkröfur og aðrar kröfur, sem gerðar eru í tilskipun
1999/5/EC
Italian
Con la presente Telit Communications S.p.A. dichiara che questo 2G/3G
module è conforme ai requisiti essenziali ed alle altre disposizioni pertinenti
stabilite dalla direttiva 1999/5/CE.
Latvian
Ar šo Telit Communications S.p.A. deklarē, ka 2G/3G module atbilst
Direktīvas 1999/5/EK būtiskajām prasībām un citiem ar to saistītajiem
noteikumiem.
Lithuanian
Šiuo Telit Communications S.p.A. deklaruoja, kad šis 2G/3G module
atitinka esminius reikalavimus ir kitas 1999/5/EB Direktyvos nuostatas.
Maltese
Hawnhekk, Telit Communications S.p.A., jiddikjara li dan 2G/3G module
jikkonforma mal-ħtiġijiet essenzjali u ma provvedimenti oħrajn relevanti li
hemm fid-Dirrettiva 1999/5/EC.
Norwegian
Telit Communications S.p.A. erklærer herved at utstyret 2G/3G module er i
samsvar med de grunnleggende krav og øvrige relevante krav i direktiv
1999/5/EF.
Polish
Niniejszym Telit Communications S.p.A. oświadcza, że 2G/3G module jest
zgodny z zasadniczymi wymogami oraz pozostałymi stosownymi
postanowieniami Dyrektywy 1999/5/EC
Portuguese
Telit Communications S.p.A. declara que este 2G/3G module está
conforme com os requisitos essenciais e outras disposições da Directiva
1999/5/CE.
Slovak
Telit Communications S.p.A. týmto vyhlasuje, že 2G/3G module spĺňa
základné požiadavky a všetky príslušné ustanovenia Smernice 1999/5/ES.
Slovenian
Telit Communications S.p.A. izjavlja, da je ta 2G/3G module v skladu z
bistvenimi zahtevami in ostalimi relevantnimi določili direktive 1999/5/ES.
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Spanish
Por medio de la presente Telit Communications S.p.A. declara que el
2G/3G module cumple con los requisitos esenciales y cualesquiera otras
disposiciones aplicables o exigibles de la Directiva 1999/5/CE.
Swedish
Härmed intygar Telit Communications S.p.A. att denna 2G/3G module står
I överensstämmelse med de väsentliga egenskapskrav och övriga
relevanta bestämmelser som framgår av direktiv 1999/5/EG.
In order to satisfy the essential requirements of 1999/5/EC Directive, the HE910, HE910-
EUG modules are compliant with the following standards:
RF spectrum use (R&TTE art. 3.2)
EN 300 440-2 V1.4.1
EN 301 511 V9.0.2
EN 301 908-1 V4.2.1
EN 301 908-2 V4.2.1
EMC (R&TTE art. 3.1b)
EN 301 489-1 V1.8.1
EN 301 489-3 V1.4.1
EN 301 489-7 V1.3.1
EN 301 489-24 V1.5.1
Health & Safety (R&TTE art. 3.1a)
EN 60950-1:2006 + A11:2009 + A1:2010 +
A12:2011
In order to satisfy the essential requirements of 1999/5/EC Directive, the HE910-NAG
modules are compliant with the following standards:
RF spectrum use (R&TTE art. 3.2)
EN 300 440-2 V1.4.1
EN 301 511 V9.0.2
EMC (R&TTE art. 3.1b)
EN 301 489-1 V1.8.1
EN 301 489-3 V1.4.1
EN 301 489-7 V1.3.1
Health & Safety (R&TTE art. 3.1a)
EN 60950-1:2006 + A11:2009 + A1:2010 +
A12:2011
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The HE910-D, HE910-EUR, HE910-EUD modules are compliant with the following
standards:
RF spectrum use (R&TTE art. 3.2)
EN 301 511 V9.02
EN 301 908-1 V4.2.1
EN 301 908-2 V4.2.1
EMC (R&TTE art. 3.1b)
EN 301 489-1 V1.8.1
EN 301 489-7 V1.3.1
EN 301 489-24 V1.5.1
Health & Safety (R&TTE art. 3.1a)
EN 60950-1:2006 + A11:2009 + A1:2010 +
A12:2011
The HE910-NAR, HE910-NAD modules are compliant with the following standards:
RF spectrum use (R&TTE art. 3.2)
EN 301 511 V9.02
EMC (R&TTE art. 3.1b)
EN 301 489-1 V1.8.1
EN 301 489-7 V1.3.1
Health & Safety (R&TTE art. 3.1a)
EN 60950-1:2006 + A11:2009 + A1:2010 +
A12:2011
The conformity assessment procedure referred to in Article 10 and detailed in Annex IV of
Directive 1999/5/EC has been followed with the involvement of the following Notified
Body:
AT4 wireless, S.A.
Parque Tecnologico de Andalucía
C/ Severo Ochoa 2
29590 Campanillas – Málaga
SPAIN
Notified Body No: 1909
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Thus, the following marking is included in the product:
The full declaration of conformity can be found on the following address:
http://www.telit.com/
There is no restriction for the commercialisation of the HE910, HE910-D, HE910-EUG,
HE910-EUR, HE910-EUD, HE910-NAG, HE910-NAR, HE910-NAD modules in all the
countries of the European Union.
Final product integrating this module must be assessed against essential requirements of
the 1999/5/EC (R&TTE) Directive. It should be noted that assessment does not
necessarily lead to testing. Telit Communications S.p.A. recommends carrying out the
following assessments:
RF spectrum use (R&TTE art. 3.2)
It will depend on the antenna used on the
final product.
EMC (R&TTE art. 3.1b)
Testing
Health & Safety (R&TTE art. 3.1a)
Testing
Alternately, assessment of the final product against EMC (Art. 3.1b) and Electrical safety
(Art. 3.1a) essential requirements can be done against the essential requirements of the
EMC and the LVD Directives:
Low Voltage Directive 2006/95/EC and product safety
Directive EMC 2004/108/EC for conformity for EMC
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FCC/IC Regulatory notices
Modification statement
Telit has not approved any changes or modifications to this device by the user. Any
changes or modifications could void the user’s authority to operate the equipment.
Telit n’approuve aucune modification apportée à l’appareil par l’utilisateur, quelle qu’en
soit la nature. Tout changement ou modification peuvent annuler le droit d’utilisation de
l’appareil par l’utilisateur.
Interference statement
This device complies with Part 15 of the FCC Rules and Industry Canada licence-exempt
RSS standard(s). Operation is subject to the following two conditions: (1) this device may
not cause interference, and (2) this device must accept any interference, including
interference that may cause undesired operation of the device.
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils
radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes : (1)
l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter
tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en
compromettre le fonctionnement.
Wireless notice
This equipment complies with FCC and IC radiation exposure limits set forth for an
uncontrolled environment. The antenna should be installed and operated with minimum
distance of 20 cm between the radiator and your body. Antenna gain must be below:
Frequency band
HE910, HE910-D
HE910-NAR, HE910-NAD, HE910-NAG
GSM 850/FDD V
5.22 dBi
5.29 dBi
PCS 1900/FDD II
3.31 dBi
4.02 dBi
FDD IV
6.45 dBi
6.32 dBi
This transmitter must not be co-located or operating in conjunction with any other antenna
or transmitter.
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Cet appareil est conforme aux limites d'exposition aux rayonnements de la IC pour un
environnement non contrôlé. L'antenne doit être installé de façon à garder une distance
minimale de 20 centimètres entre la source de rayonnements et votre corps. Gain de
l'antenne doit être ci-dessous:
Frequency band
HE910, HE910-D
HE910-NAR, HE910-NAD, HE910-NAG
GSM 850/FDD V
5.22 dBi
5.29 dBi
PCS 1900/FDD II
3.31 dBi
4.02 dBi
FDD IV
6.45 dBi
6.32 dBi
L'émetteur ne doit pas être colocalisé ni fonctionner conjointement avec à autre antenne
ou autre émetteur.
FCC Class B digital device notice
This equipment has been tested and found to comply with the limits for a Class B digital
device, pursuant to part 15 of the FCC Rules. These limits are designed to provide
reasonable protection against harmful interference in a residential installation. This
equipment generates, uses and can radiate radio frequency energy and, if not installed
and used in accordance with the instructions, may cause harmful interference to radio
communications. However, there is no guarantee that interference will not occur in a
particular installation. If this equipment does cause harmful interference to radio or
television reception, which can be determined by turning the equipment off and on, the
user is encouraged to try to correct the interference by one or more of the following
measures:
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the
receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
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18. DOCUMENT HISTORY
Revision
Date
Changes
0
2011-03-31
Preliminary Version
1
2011-05-19
Updated pinout on UART1
2
2011-05-25
Update chapter 13
3
2011-07-25
Added DVI app note references; chapter 4.1
4
2011-07-29
Updated audio, on_off/reset and digital sections
5
2011-10-18
Added STAT_LED info, Updated SPI pinout
Pads A8, A9, D14, A14 now reserved
Power supply extended to 3.3 V
par 4.3 renamed as “unconditional shutdown”
6
2011-12-22
USIF0 USIF1 names added to Main and AUX
serial ports
Updated IO logic levels
Updated module’s mechanical drawing
IO levels selection 1.8/1.2 removed (now only
1.8)
7
2012-01-16
Added HE910-GA and –D; added Conformity
assessment chapter
8
2012-02-03
Chapter 5.1 updated
9
2012-02-07
Chapter 4.2 updated
10
2012-03-16
Added ADC in pinout description; added GPS
specification; updated Chapter 13 and 14;
11
2012-03-26
Chapter 2.1, 2.1.2, 3.3, 5.4, 14.9
12
2012-03-27
Added HE910-EU and NA products
13
2012-03-28
Updated paragraph 14.9
14
2012-05-08
Added EUR, EUD, NAR, NAD variants; added
Sensitivity and TX Power Class specifications.
Updated par 14.7.1 and 14.3
15
2012-05-30
Updated Chapter 16.2; 7.3.8
16
2012-06-06
Pin R13 renamed as HW_SHUTDOWN*, Pin
P11 renamed
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17
2012-06-14
Updated RTT&E info on HE910-NAG, NAR,
NAD
18
2012-06-15
Updated RTT&E info on HE910-NAG, NAR,
NAD ; updated par 3.1;
19
2012-06-26
Pin P11 now reserved; updated par 3.1; par 4.2
20
2012-08-09
Updated par 9,1 5.3.2, 13.4, 3.1, 13.5
21
2013-04-29
Updated par 3.1, 5.1, 5.3.2, 6.4, 7, 9.1 ; added
14.8
22
2013-08-02
Updated Chapter 4, 13.4
23
2013-08-30
Updated Chapter 3.1, 4.1, 5.2, 5.3.3, 8, 9.1, 11,
13.1
24
2013-12-20
Updated Chapter 4.1, 4.2, 5.3.1.1, 5.3.1.2, 8;
added USB_HSIC, Updated the Stat Led
schematic example; updated packaging tray
drawing; added PCB Guidelines for FCC.
25
2015-03-03
Add new product HE910-GL
26
2015-04-09
Removed product HE910-GA
27
2015-05-25
Updated Chapter 15.8 Packing system (Tray)
28
2015-09-03
Updated Chapter 6.1 on HE910-GL product
29
2017-01-27
2017 template applied
[01.2017]
Mod. 0805 2017-01 Rev.6
