34 .80 7IRELESS IMPORTANT NOTICE Dear customer, As from August 2nd 2008, the wireless operations of NXP have moved to a new company, ST-NXP Wireless. As a result, the following changes are applicable to the attached document. Company name - Philips Semiconductors is replaced with ST-NXP Wireless. Copyright - the copyright notice at the bottom of each page "(c) Koninklijke Philips Electronics N.V. 200x. All rights reserved", shall now read: "(c) ST-NXP Wireless 200x All rights reserved". Web site - http://www.semiconductors.philips.com is replaced with http://www.stnwireless.com Contact information - the list of sales offices previously obtained by sending an email to sales.addresses@www.semiconductors.philips.com, is now found at http://www.stnwireless.com under Contacts. If you have any questions related to the document, please contact our nearest sales office. Thank you for your cooperation and understanding. ST-NXP Wireless 34 .80 7IRELESS www.stnwireless.com ISP1160 Embedded Universal Serial Bus Host Controller Rev. 05 -- 24 December 2004 Product data 1. General description The ISP1160 is an embedded Universal Serial Bus (USB) Host Controller (HC) that complies with Universal Serial Bus Specification Rev. 2.0, supporting data transfer at full-speed (12 Mbit/s) and low-speed (1.5 Mbit/s). The ISP1160 provides two downstream ports. Each downstream port has an overcurrent (OC) detection input pin and power supply switching control output pin. The downstream ports for the HC can be connected with any USB compliant USB devices and USB hubs that have USB upstream ports. The ISP1160 is well suited for embedded systems and portable devices that require a USB host. The ISP1160 brings high flexibility to the systems that have it built-in. For example, a system that has the ISP1160 built-in allows it to be connected to a device that has a USB upstream port, such as a USB printer, USB camera, USB keyboard, USB mouse, among others. 2. Features Complies with Universal Serial Bus Specification Rev. 2.0 Supports data transfer at full-speed (12 Mbit/s) and low-speed (1.5 Mbit/s) Adapted from Open Host Controller Interface Specification for USB Release 1.0a Selectable one or two downstream ports for HC High-speed parallel interface to most of the generic microprocessors and Reduced Instruction Set Computer (RISC) processors such as: Hitachi(R) SuperHTM SH-3 and SH-4 MIPS-basedTM RISC ARM7TM, ARM9TM, and StrongARM(R) Maximum 15 Mbyte/s data transfer rate between the microprocessor and the HC Supports single-cycle and burst mode DMA operations Built-in FIFO buffer RAM for the HC (4 kbytes) Endpoints with double buffering to increase throughput and ease real-time data transfer for isochronous (ISO) transactions 6 MHz crystal oscillator with integrated PLL for low EMI Built-in software selectable internal 15 k pull-down resistors for HC downstream ports Dedicated pins for suspend sensing output and wake-up control input for flexible applications Operation at either +5 V or +3.3 V power supply voltage Operating temperature range from -40 C to +85 C Available in two LQFP64 packages (SOT314-2 and SOT414-1). ISP1160 Philips Semiconductors Embedded USB Host Controller 3. Applications Personal Digital Assistant (PDA) Digital camera Third-generation (3-G) phone Set-Top Box (STB) Information Appliance (IA) Photo printer MP3 jukebox Game console. 4. Ordering information Table 1: Ordering information Type number ISP1160BD Package Name Description Version LQFP64 plastic low profile quad flat package; 64 leads; body 10 x 10 x 1.4 mm SOT314-2 LQFP64 plastic low profile quad flat package; 64 leads; body 7 x 7 x 1.4 mm SOT414-1 ISP1160BD/01[1] ISP1160BM ISP1160BM/01[2] [1] [2] Improvement in performance as compared to ISP1160BD. Improvement in performance as compared to ISP1160BM. (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 13963 Product data Rev. 05 -- 24 December 2004 2 of 88 xxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx x xxxxxxxxxxxxxx xxxxxxxxxx xxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxx xx xxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxx xxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxx xxxxxxxxxxxxxx xxxxxx xx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxx xxxxx x x NDP_SEL ITL0 (PING RAM) 16 2 to 7, 9 to 14, 16, 17, 63, 64 Rev. 05 -- 24 December 2004 RD_N CS_N WR_N A0 DACK_N EOT DREQ INT RESET_N VCC ITL1 (PONG RAM) 47 OVERCURRENT DETECTION 54 55 50 USB TRANSCEIVER MICROPROCESSOR BUS INTERFACE HOST CONTROLLER USB TRANSCEIVER H_PSW2_N H_OC1_N H_OC2_N 51 52 53 H_DM1 H_DP1 H_DM2 USB bus downstream ports H_DP2 4x 15 k 32 POWER-ON RESET 56 internal reset VOLTAGE REGULATOR CLOCK RECOVERY 3.3 V internal supply PLL GND 7 DGND AGND 58 24 VREG(3V3) VHOLD2 44 19 XTAL2 VHOLD1 6 MHz 43 20, 26, 30, 31, 36, 38, 41, 48, 49, 61 XTAL1 10 n.c. 004aaa059 ISP1160 3 of 88 (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved. 57 Embedded USB Host Controller CLOCK RECOVERY 1, 8, 15, 18, 35, 45, 62 Fig 1. Block diagram. H_PSW1_N ISP1160 D0 to D15 22 21 23 59 27 34 25 29 46 POWER SWITCHING ATL RAM 33 Philips Semiconductors 42 H_SUSPEND 5. Block diagram 9397 750 13963 Product data 40 H_WAKEUP ISP1160 Philips Semiconductors Embedded USB Host Controller 6. Pinning information 49 n.c. 50 H_DM1 51 H_DP1 52 H_DM2 53 H_DP2 54 H_OC1_N 55 H_OC2_N 56 VCC 57 AGND 58 VREG(3V3) 59 A0 60 LOW_PW 61 n.c. 62 DGND 63 D0 64 D1 6.1 Pinning DGND 1 48 n.c. D2 2 47 H_PSW2_N D3 3 46 H_PSW1_N D4 4 45 DGND D5 5 44 XTAL2 D6 6 43 XTAL1 ISP1160BD ISP1160BM ISP1160/01 1160/01(1) D7 7 DGND 8 D8 9 42 H_SUSPEND 41 n.c. 40 H_WAKEUP D9 10 39 TEST_LOW D10 11 38 n.c. D11 12 37 TEST_LOW D12 13 36 n.c. D13 14 35 DGND DGND 15 34 EOT D14 16 RESET_N 32 n.c. 31 n.c. 30 INT 29 TEST_HIGH 28 DACK_N 27 n.c. 26 DREQ 25 VHOLD2 24 WR_N 23 RD_N 22 CS_N 21 n.c. 20 DGND 18 VHOLD1 19 D15 17 33 NDP_SEL 004aaa060 (1) ISP1160/01 is the marking on the IC for the ISP1160BD/01 and 1160/01 is the marking on the IC for the ISP1160BM/01. Fig 2. Pin configuration LQFP64. 6.2 Pin description Table 2: Pin description LQFP64 Symbol[1] Pin Type Description DGND 1 - digital ground D2 2 I/O bit 2 of bidirectional data; slew-rate controlled; TTL input; three-state output D3 3 I/O bit 3 of bidirectional data; slew-rate controlled; TTL input; three-state output (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 13963 Product data Rev. 05 -- 24 December 2004 4 of 88 ISP1160 Philips Semiconductors Embedded USB Host Controller Table 2: Pin description LQFP64...continued Symbol[1] Pin Type Description D4 4 I/O bit 4 of bidirectional data; slew-rate controlled; TTL input; three-state output D5 5 I/O bit 5 of bidirectional data; slew-rate controlled; TTL input; three-state output D6 6 I/O bit 6 of bidirectional data; slew-rate controlled; TTL input; three-state output D7 7 I/O bit 7 of bidirectional data; slew-rate controlled; TTL input; three-state output DGND 8 - digital ground D8 9 I/O bit 8 of bidirectional data; slew-rate controlled; TTL input; three-state output D9 10 I/O bit 9 of bidirectional data; slew-rate controlled; TTL input; three-state output D10 11 I/O bit 10 of bidirectional data; slew-rate controlled; TTL input; three-state output D11 12 I/O bit 11 of bidirectional data; slew-rate controlled; TTL input; three-state output D12 13 I/O bit 12 of bidirectional data; slew-rate controlled; TTL input; three-state output D13 14 I/O bit 13 of bidirectional data; slew-rate controlled; TTL input; three-state output DGND 15 - digital ground D14 16 I/O bit 14 of bidirectional data; slew-rate controlled; TTL input; three-state output D15 17 I/O bit 15 of bidirectional data; slew-rate controlled; TTL input; three-state output DGND 18 - digital ground VHOLD1 19 - voltage holding pin 1; internally connected to the VREG(3V3) and VHOLD2 pins. When VCC is connected to 5 V, this pin will output 3.3 V, hence do not connect it to 5 V. When VCC is connected to 3.3 V, this pin can either be connected to 3.3 V or left unconnected. In all cases, decouple this pin to DGND. n.c. 20 - no connection; leave this pin open CS_N 21 I chip select input RD_N 22 I read strobe input WR_N 23 I write strobe input VHOLD2 24 - voltage holding pin 2; internally connected to the VREG(3V3) and VHOLD1 pins. When VCC is connected to 5 V, this pin will output 3.3 V, hence do not connect it to 5 V. When VCC is connected to 3.3 V, this pin can either be connected to 3.3 V or left unconnected. In all cases, decouple this pin to DGND. DREQ 25 O HC DMA request output (programmable polarity); signals to the DMA controller that the ISP1160 wants to start a DMA transfer; see Section 10.4.1 (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 13963 Product data Rev. 05 -- 24 December 2004 5 of 88 ISP1160 Philips Semiconductors Embedded USB Host Controller Table 2: Pin description LQFP64...continued Symbol[1] Pin Type Description n.c. 26 - no connection; leave this pin open DACK_N 27 I HC DMA acknowledge input; when not in use, this pin must be connected to VCC via an external 10 k resistor TEST_HIGH 28 - this pin must be connected to VCC via an external 10 k resistor INT 29 O HC interrupt output; programmable level, edge triggered and polarity; see Section 10.4.1 n.c. 30 - no connection; leave this pin open n.c. 31 O no connection; leave this pin open RESET_N 32 I reset input (Schmitt trigger); a LOW level produces an asynchronous reset (internal pull-up resistor) NDP_SEL 33 I indicates to the HC software the Number of Downstream Ports (NDP) present: 0 -- select 1 downstream port 1 -- select 2 downstream ports only changes the value of the NDP field in the HcRhDescriptorA register; both ports will always be enabled; see Section 10.3.1 (internal pull-up resistor) EOT 34 I DMA master device to inform the ISP1160 of end of DMA transfer; active level is programmable; when not in use, this pin must be connected to VCC via an external 10 k resistor; see Section 10.4.1 DGND 35 - digital ground n.c. 36 - no connection; leave this pin open TEST_LOW 37 - this pin must be connected to DGND via an external 10 k resistor n.c. 38 - no connection; leave this pin open TEST_LOW 39 - this pin must be connected to DGND via a 1 M resistor H_WAKEUP 40 I HC wake-up input; generates a remote wake-up from the suspend state (active HIGH); when not in use, this pin must be connected to DGND via an external 10 k resistor (internal pull-down resistor) n.c. 41 - no connection; leave this pin open H_SUSPEND 42 O HC suspend state indicator output; active HIGH XTAL1 43 I crystal input; connected directly to a 6 MHz crystal; when this pin is connected to an external clock source, pin XTAL2 must be left open XTAL2 44 O crystal output; connected directly to a 6 MHz crystal; when pin XTAL1 is connected to an external clock source, this pin must be left open DGND 45 - digital ground H_PSW1_N 46 O power switching control output for downstream port 1; open-drain output (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 13963 Product data Rev. 05 -- 24 December 2004 6 of 88 ISP1160 Philips Semiconductors Embedded USB Host Controller Table 2: Pin description LQFP64...continued Symbol[1] Pin Type Description H_PSW2_N 47 O power switching control output for downstream port 2; open-drain output n.c. 48 - no connection; leave this pin open n.c. 49 - no connection; leave this pin open H_DM1 50 AI/O USB D- data line for HC downstream port 1 H_DP1 51 AI/O USB D+ data line for HC downstream port 1 H_DM2 52 AI/O USB D- data line for HC downstream port 2; when not in use, this pin must be left open H_DP2 53 AI/O USB D+ data line for HC downstream port 2; when not in use, this pin must be left open H_OC1_N 54 I overcurrent sensing input for HC downstream port 1 H_OC2_N 55 I overcurrent sensing input for HC downstream port 2 VCC 56 - digital power supply input (3.0 V to 3.6 V or 4.75 V to 5.25 V). This pin supplies the internal 3.3 V regulator input. When connected to 5 V, the internal regulator will output 3.3 V to pins VREG(3V3), VHOLD1 and VHOLD2. When connected to 3.3 V, it will bypass the internal regulator. AGND 57 - analog ground VREG(3V3) 58 - internal 3.3 V regulator output; when pin VCC is connected to 5 V, this pin outputs 3.3 V. When pin VCC is connected to 3.3 V, connect this pin to 3.3 V. A0 59 I address input; selects command (A0 = 1) or data (A0 = 0) LOW_PW 60 I if low-current consumption (range of s) is needed during suspend, connect this pin to address A2; otherwise, connect to DGND n.c. 61 - no connection; leave this pin open DGND 62 - digital ground D0 63 I/O bit 0 of bidirectional data; slew-rate controlled; TTL input; three-state output D1 64 I/O bit 1 of bidirectional data; slew-rate controlled; TTL input; three-state output [1] Symbol names ending with underscore N (for example, NAME_N) represent active LOW signals. (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 13963 Product data Rev. 05 -- 24 December 2004 7 of 88 ISP1160 Philips Semiconductors Embedded USB Host Controller 7. Functional description 7.1 PLL clock multiplier A 6 MHz to 48 MHz clock multiplier Phase-Locked Loop (PLL) is integrated on-chip. This allows for the use of a low-cost 6 MHz crystal, which also minimizes EMI. No external components are required for the operation of the PLL. 7.2 Bit clock recovery The bit clock recovery circuit recovers the clock from the incoming USB data stream by using a 4 times oversampling principle. It is able to track jitter and frequency drift as specified in Universal Serial Bus Specification Rev. 2.0. 7.3 Analog transceivers Two sets of transceivers are embedded in the chip for downstream ports with USB connector type A. The integrated transceivers are compliant with the Universal Serial Bus Specification Rev. 2.0. These transceivers interface directly with the USB connectors and cables through external termination resistors. 7.4 Philips Serial Interface Engine (SIE) The Philips SIE implements the full USB protocol layer. It is completely hardwired for speed and needs no firmware intervention. The functions of this block include: synchronization pattern recognition, parallel to serial conversion, bit (de)stuffing, CRC checking and generation, Packet IDentifier (PID) verification and generation, address recognition, and handshake evaluation and generation. 8. Microprocessor bus interface 8.1 Programmed I/O (PIO) addressing mode A generic PIO interface is defined for speed and ease-of-use. It also allows direct interfacing to most microcontrollers. To a microcontroller, the ISP1160 appears as a memory device with a 16-bit data bus and uses the A0 address line to access internal control registers and FIFO buffer RAM. Therefore, the ISP1160 occupies only two I/O ports or two memory locations of a microprocessor. External microprocessors can read from or write to the ISP1160's internal control registers and FIFO buffer RAM through the Programmed I/O (PIO) operating mode. Figure 3 shows the Programmed I/O interface between a microprocessor and the ISP1160. (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 13963 Product data Rev. 05 -- 24 December 2004 8 of 88 ISP1160 Philips Semiconductors Embedded USB Host Controller P bus I/F D [15:0] D [15:0] MICROPROCESSOR RD_N RD_N WR_N WR_N CS_N CS_N ISP1160 A0 A1 INT IRQ1 004aaa061 Fig 3. Programmed I/O interface between a microprocessor and the ISP1160. 8.2 DMA mode The ISP1160 also provides the DMA mode for external microprocessors to access its internal FIFO buffer RAM. Data can be transferred by the DMA operation between a microprocessor's system memory and the ISP1160's internal FIFO buffer RAM. Remark: The DMA operation must be controlled by the external microprocessor system's DMA controller (Master). Figure 4 shows the DMA interface between a microprocessor system and the ISP1160. The ISP1160 provides a DMA channel controlled by DREQ for DACK_N signals for the DMA transfer between a microprocessor's system memory and the ISP1160 HC's internal FIFO buffer RAM. The EOT signal is an external end-of-transfer signal used to terminate the DMA transfer. Some microprocessors may not have this signal. In this case, the ISP1160 provides an internal EOT signal to terminate the DMA transfer as well. Setting the HcDMAConfiguration register (21H to read, A1H to write) enables the ISP1160's HC internal DMA counter for the DMA transfer. When the DMA counter reaches the value set in the HcTransferCounter register (22H to read, A2H to write), an internal EOT signal will be generated to terminate the DMA transfer. P bus I/F MICROPROCESSOR D [15:0] D [15:0] RD_N RD_N WR_N WR_N ISP1160 DACK1_N DREQ1 EOT DACK_N DREQ EOT 004aaa062 Fig 4. DMA interface between a microprocessor and the ISP1160. (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 13963 Product data Rev. 05 -- 24 December 2004 9 of 88 ISP1160 Philips Semiconductors Embedded USB Host Controller 8.3 Control registers access by PIO mode 8.3.1 I/O port addressing Table 3 shows the ISP1160's I/O port addressing. Complete decoding of the I/O port address should include the chip select signal CS_N and the address line A0. However, the direction of access of I/O ports is controlled by the RD_N and WR_N signals. When RD_N is LOW, the microprocessor reads data from the ISP1160's data port. When WR_N is LOW, the microprocessor writes a command to the command port, or writes data to the data port. Table 3: I/O port addressing Port CS_N A0 Access Data bus width (bits) Description 0 0 0 R/W 16 HC data port 1 0 1 W 16 HC command port Figure 5 illustrates how an external microprocessor accesses the ISP1160's internal control registers. CMD/DATA SWITCH 1 command port Host bus I/F data port Commands 0 Command register .. . A0 Control registers 004aaa075 When A0 = 0, microprocessor accesses the data port. When A0 = 1, microprocessor accesses the command port. Fig 5. Access to internal control registers. 8.3.2 Register access phases The ISP1160's register structure is a command-data register pair structure. A complete register access cycle comprises a command phase followed by a data phase. The command (also known as the index of a register) points the ISP1160 to the next register to be accessed. A command is 8 bits long. On a microprocessor's 16-bit data bus, a command occupies the lower byte, with the upper byte filled with zeros. Figure 6 shows a complete 16-bit register access cycle for the ISP1160. The microprocessor writes a command code to the command port, and then reads from or writes the data word to the data port. Take the example of a microprocessor attempting to read the ISP1160's ID, which is saved in the HC's HcChipID register (index 27H, read only). The 16-bit register access cycle is therefore: 1. The microprocessor writes the command code of 27H (0027H in 16-bit width) to the HC command port 2. The microprocessor reads the data word of the chip's ID from the HC data port. (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 13963 Product data Rev. 05 -- 24 December 2004 10 of 88 ISP1160 Philips Semiconductors Embedded USB Host Controller 16-bit register access cycle write command (16 bits) read/write data (16 bits) t MGT937 Fig 6. 16-bit register access cycle. Most of the ISP1160's internal control registers are 16-bit wide. Some of the internal control registers, however, are 32-bit wide. Figure 7 shows how the ISP1160's 32-bit internal control register is accessed. The complete cycle of accessing a 32-bit register consists of a command phase followed by two data phases. In the two data phases, the microprocessor first reads or writes the lower 16-bit data, followed by the upper 16-bit data. 32-bit register access cycle write command (16 bits) read/write data (lower 16 bits) read/write data (upper 16 bits) t MGT938 Fig 7. 32-bit register access cycle. To further describe the complete access cycles of the internal control registers, the status of some pins of the microprocessor bus interface are shown in Figure 8. Signals CS_N A0 Valid status Valid status Valid status 0 0 0 1 0 0 RD_N, WR_N RD_N = 1, WR_N = 0 RD_N = 0 (read) or WR_N = 0 (write) RD_N = 0 (read) or WR_N = 0 (write) data bus Command code Register data (lower word) Register data (upper word) 004aaa370 Fig 8. Accessing HC control registers. 8.4 FIFO buffer RAM access by PIO mode Since the ISP1160's internal memory is structured as a FIFO buffer RAM, the FIFO buffer RAM is mapped to dedicated register fields. Therefore, accessing the internal FIFO buffer RAM is similar to accessing the internal control registers in multiple data phases. (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 13963 Product data Rev. 05 -- 24 December 2004 11 of 88 ISP1160 Philips Semiconductors Embedded USB Host Controller FIFO buffer RAM access cycle (transfer counter = 2N) write command (16 bits) read/write data #1 (16 bits) read/write data #2 (16 bits) read/write data #N (16 bits) t MGT941 Fig 9. Internal FIFO buffer RAM access cycle. Figure 9 shows a complete access cycle of the HC internal FIFO buffer RAM. For a write cycle, the microprocessor first writes the FIFO buffer RAM's command code to the command port, and then writes the data words one by one to the data port until half of the transfer's byte count is reached. The HcTransferCounter register (22H to read, A2H to write) is used to specify the byte count of a FIFO buffer RAM's read cycle or write cycle. Every access cycle must be in the same access direction. The read cycle procedure is similar to the write cycle. 8.5 FIFO buffer RAM access by DMA mode The DMA interface between a microprocessor and the ISP1160 is shown in Figure 4. When doing a DMA transfer, at the beginning of every burst the ISP1160 outputs a DMA request to the microprocessor via pin DREQ. After receiving this signal, the microprocessor will reply with a DMA acknowledge to the ISP1160 via pin DACK_N, and at the same time, execute the DMA transfer through the data bus. In the DMA mode, the microprocessor must issue a read or write signal to the ISP1160's pins RD_N or WR_N. The ISP1160 will repeat the DMA cycles until it receives an EOT signal to terminate the DMA transfer. The ISP1160 supports both external and internal EOT signals. The external EOT signal is received as input on pin EOT, and generally comes from the external microprocessor. The internal EOT signal is generated inside the ISP1160. To select either EOT method, set the appropriate DMA configuration register (see Section 10.4.2). For example, setting DMACounterSelect (bit 2) of the HcDMAConfiguration register (21H to read, A1H to write) to logic 1 will enable the DMA counter for DMA transfer. When the DMA counter reaches the value of the HcTransferCounter register, the internal EOT signal will be generated to terminate the DMA transfer. The ISP1160 supports either single-cycle DMA operation or burst mode DMA operation; see Figure 10 and Figure 11. (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 13963 Product data Rev. 05 -- 24 December 2004 12 of 88 ISP1160 Philips Semiconductors Embedded USB Host Controller DREQ DACK_N RD_N or WR_N D [15:0 ] data #1 data #2 data #N EOT 004aaa368 N = 1/2 byte count of transfer data. Fig 10. DMA transfer in single-cycle mode. DREQ DACK_N RD_N or WR_N D [15:0 ] data #1 data #K data #(K+1) data #2K data #(N-K+1) data #N EOT 004aaa369 N = 1/2 byte count of transfer data, K = number of cycles/burst. Fig 11. DMA transfer in burst mode. In Figure 10 and Figure 11, the DMA transfer is configured such that DREQ is active HIGH and DACK_N is active LOW. 8.6 Interrupts The ISP1160 has an interrupt request pin INT. 8.6.1 Pin configuration The interrupt output signals have four configuration modes: Mode 0 Mode 0 level trigger, active LOW Mode 1 Mode 1 level trigger, active HIGH Mode 2 Mode 2 edge trigger, active LOW Mode 3 Mode 3 edge trigger, active HIGH. (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 13963 Product data Rev. 05 -- 24 December 2004 13 of 88 ISP1160 Philips Semiconductors Embedded USB Host Controller Figure 12 shows these four interrupt configuration modes. They are programmable through the HcHardware Configuration register (see Section 10.4.1), which is also used to disable or enable the signals. INT active clear or disable INT INT Mode 0 level triggered, active LOW INT active clear or disable INT INT Mode 1 level triggered, active HIGH INT active INT 166 ns Mode 2 edge triggered, active LOW INT active INT 166 ns MGT944 Mode 3 edge triggered, active HIGH Fig 12. Interrupt pin operating modes. 8.6.2 Interrupt output pin (INT) To program the four configuration modes of the HC's interrupt output signal (INT), set InterruptPinTrigger and InterruptOutputPolarity (bits 1 and 2) of the HcHardwareConfiguration register (20H to read, A0H to write). InterruptPinEnable (bit 0) is used as the master enable setting for pin INT. INT has many associated interrupt events as shown as in Figure 13. (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 13963 Product data Rev. 05 -- 24 December 2004 14 of 88 ISP1160 Philips Semiconductors Embedded USB Host Controller ClkReady OPR_Reg HCSuspended ATLInt SOFITLInt ClkReady OPR_Reg HcPInterruptEnable register AllEOTInterrupt MIE HCSuspended ATLInt HcInterruptEnable register AllEOTInterrupt SOFITLInt HcPInterrupt register RHSC FNO UE OR RD SF group 1 SO RHSC group 2 OR FNO HcHardwareConfiguration register UE RD SF LE INT LATCH SO InterruptPinEnable 004aaa102 HcInterruptStatus register Fig 13. HC interrupt logic. There are two groups of interrupts represented by group 1 and group 2 in Figure 13. A pair of registers control each group. Group 2 contains six possible interrupt events (recorded in the HcInterruptStatus register). On occurrence of any of these events, the corresponding bit would be set to logic 1; and if the corresponding bit in the HcInterruptEnable register is also logic 1, the 6-input OR gate would output a logic 1. This output is AND-ed with the value of MIE (bit 31 of HcInterruptEnable). Logic 1 at the AND gate will cause the OPR bit in the HcPInterrupt register to be set to logic 1. Group 1 contains six possible interrupt events, one of which is the output of group 2 interrupt sources. The HcPInterrupt and HcPInterruptEnable registers work in the same way as the HcInterruptStatus and HcInterruptEnable registers in the interrupt group 2. The output from the 6-input OR gate is connected to a latch, which is controlled by InterruptPinEnable (bit 0 of the HcHardwareConfiguration register). In the event in which the software wishes to temporarily disable the interrupt output of the ISP1160 Host Controller, the following procedure should be followed: 1. Make sure that the InterruptPinEnable bit in the HcHardwareConfiguration register is set to logic 1. 2. Clear all bits in the HcPInterrupt register. 3. Set the InterruptPinEnable bit to logic 0. (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 13963 Product data Rev. 05 -- 24 December 2004 15 of 88 ISP1160 Philips Semiconductors Embedded USB Host Controller To re-enable the interrupt generation: 1. Set all bits in the HcPInterrupt register. 2. Set the InterruptPinEnable bit to logic 1. Remark: The InterruptPinEnable bit in the HcHardwareConfiguration register latches the interrupt output. When this bit is set to logic 0, the interrupt output will remain unchanged, regardless of any operations on the interrupt control registers. If INT1 is asserted, and the Host Controller Driver (HCD) wishes to temporarily mask off the INT signal without clearing the HcPInterrupt register, the following procedure should be followed: 1. Make sure that the InterruptPinEnable bit is set to logic 1. 2. Clear all bits in the HcPInterruptEnable register. 3. Set the InterruptPinEnable bit to logic 0. To re-enable the interrupt generation: 1. Set all bits in the HcPInterruptEnable register according to the HCD requirements. 2. Set the InterruptPinEnable bit to logic 1. 9. Host Controller (HC) 9.1 HC's four USB states The ISP1160's USB HC has four USB states--USBOperational, USBReset, USBSuspend and USBResume--that define the HC's USB signalling and bus states responsibilities. The signals are visible to the Host Controller Driver (HCD) via the ISP1160 USB HC's control registers. (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 13963 Product data Rev. 05 -- 24 December 2004 16 of 88 ISP1160 Philips Semiconductors Embedded USB Host Controller USBOperational USBReset write USBOperational write USBReset write USBOperational write USBResume USBReset USBSuspend write hardware or software reset USBResume write or remote wake-up USBReset write MGT947 USBSuspend Fig 14. The ISP1160 HC's USB states. The USB states are reflected in the HostControllerFunctionalState field of the HcControl register (01H to read, 81H to write), which is located at bits 7 and 6 of the register. The HCD can perform only the USB state transitions shown in Figure 14. Remark: The Software Reset in Figure 14 is not caused by the HcSoftwareReset command. It is caused by the HostControllerReset field of the HcCommandStatus register (02H to read, 82H to write). 9.2 Generating USB traffic USB traffic can be generated only when the ISP1160 USB HC is in the USBOperational state. Therefore, the HCD must set the HostControllerFunctionalState field of the HcControl register before generating USB traffic. A simplistic flow diagram showing when and how to generate USB traffic is shown in Figure 15. For greater accuracy, refer to the Universal Serial Bus Specification Rev. 2.0 for the USB protocol and the ISP1160 USB HC's register usage. (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 13963 Product data Rev. 05 -- 24 December 2004 17 of 88 ISP1160 Philips Semiconductors Embedded USB Host Controller Reset Exit no Initialize HC Entry HC state = USBOperational Need USB traffic? HC informs HCD of USB traffic results yes Prepare PTD data in P system RAM Transfer PTD data into HC FIFO buffer RAM HC performs USB transactions via USB bus I/F HC interprets PTD data MGT948 Fig 15. ISP1160 HC USB transaction loop. Description of Figure 15: 1. Reset This includes hardware reset by pin RESET_N and software reset by the HcSoftwareReset command (A9H). The reset function will clear all the HC's internal control registers to their reset status. After reset, the HCD must initialize the ISP1160 USB HC by setting some registers. 2. Initialize HC It includes: a. Setting the physical size for the HC's internal FIFO buffer RAM by setting the HcITLBufferLength register (2AH to read, AAH to write) and the HcATLBufferLength register (2BH to read, ABH to write). b. Setting the HcHardwareConfiguration register according to requirements. c. Clearing interrupt events, if required. d. Enabling interrupt events, if required. e. Setting the HcFmInterval register (0DH to read, 8DH to write). f. Setting the HC's Root Hub registers. g. Setting the HcControl register to move the HC into the USBOperational state. See also Section 9.5. 3. Entry The normal entry point. The microprocessor returns to this point when there are HC requests. 4. Need USB traffic USB devices need the HC to generate USB traffic when they have USB traffic requests such as: a. Connecting to or disconnecting from downstream ports b. Issuing the Resume signal to the HC. To generate USB traffic, the HCD must enter the USB transaction loop. (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 13963 Product data Rev. 05 -- 24 December 2004 18 of 88 ISP1160 Philips Semiconductors Embedded USB Host Controller 5. Prepare PTD data in P system RAM The communication between the HCD and the ISP1160 HC is in the form of Philips Transfer Descriptor (PTD) data. The PTD data provides USB traffic information about the commands, status and USB data packets. The physical storage media of PTD data for the HCD is the microprocessor's system RAM. For the ISP1160's HC, the storage media is the internal FIFO buffer RAM. The HCD prepares PTD data in the microprocessor's system RAM for transfer to the ISP1160's HC internal FIFO buffer RAM. 6. Transfer PTD data into HC's FIFO buffer RAM When PTD data is ready in the microprocessor's system RAM, the HCD must transfer the PTD data from the microprocessor's system RAM into the ISP1160's internal FIFO buffer RAM. 7. HC interprets PTD data The HC determines what USB transactions are required based on the PTD data that has been transferred into the internal FIFO buffer RAM. 8. HC performs USB transactions via USB bus interface The HC performs the USB transactions with the specified USB device endpoint through the USB bus interface. 9. HC informs HCD of the USB traffic results The USB transaction status and the feedback from the specified USB device endpoint will be put back into the ISP1160's HC internal FIFO buffer RAM in PTD data format. The HCD can read back the PTD data from the internal FIFO buffer RAM. 9.3 PTD data structure The Philips Transfer Descriptor (PTD) data structure provides communication between the HCD and the ISP1160's USB HC. The PTD data contains information required by the USB traffic. PTD data consists of a PTD followed by its payload data, as shown in Figure 16. FIFO buffer RAM top PTD PTD data #1 payload data PTD PTD data #2 payload data PTD PTD data #N payload data bottom MGT949 Fig 16. PTD data in FIFO buffer RAM. (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 13963 Product data Rev. 05 -- 24 December 2004 19 of 88 ISP1160 Philips Semiconductors Embedded USB Host Controller The PTD data structure is used by the HC to define a buffer of data that will be moved to or from an endpoint in the USB device. This data buffer is set up for the current frame (1 ms frame) by the HCD. The payload data for every transfer in the frame must have a PTD as the header to describe the characteristic of the transfer. The PTD data is DWORD (double-word or 4-byte) aligned. 9.3.1 PTD data header definition The PTD forms the header of the PTD data. It tells the HC the transfer type, where the payload data should go, and the actual size of the payload data. A PTD is an 8-byte data structure that is very important for HCD programming. Table 4: Philips Transfer Descriptor (PTD): bit allocation Bit 7 6 5 Byte 0 Byte 1 Active EndpointNumber[3:0] Byte 4 Byte 7 1 0 Toggle ActualBytes[9:8] Last Speed MaxPacketSize[9:8] TotalBytes[7:0] reserved Format B5_5 reserved DirectionPID[1:0] TotalBytes[9:8] FunctionAddress[6:0] reserved (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 13963 Product data 2 MaxPacketSize[7:0] Byte 3 Byte 6 3 CompletionCode[3:0] Byte 2 Byte 5 4 ActualBytes[7:0] Rev. 05 -- 24 December 2004 20 of 88 ISP1160 Philips Semiconductors Embedded USB Host Controller Table 5: Philips Transfer Descriptor (PTD): bit description Symbol Access Description ActualBytes[9:0] R/W Contains the number of bytes that were transferred for this PTD. CompletionCode[3:0] R/W 0000 NoError General TD or isochronous data packet processing completed with no detected errors. 0001 CRC Last data packet from endpoint contained a CRC error. 0010 BitStuffing Last data packet from endpoint contained a bit stuffing violation. 0011 DataToggleMismatch Last packet from endpoint had data toggle PID that did not match the expected value. 0100 Stall TD was moved to the Done queue because the endpoint returned a STALL PID. 0101 DeviceNotResponding Device did not respond to token (IN) or did not provide a handshake (OUT). 0110 PIDCheckFailure Check bits on PID from endpoint failed on data PID (IN) or handshake (OUT). 0111 UnexpectedPID Received PID was not valid when encountered or PID value is not defined. 1000 DataOverrun The amount of data returned by the endpoint exceeded either the size of the maximum data packet allowed from the endpoint (found in the MaximumPacketSize field of endpoint descriptor) or the remaining buffer size. 1001 DataUnderrun The endpoint returned is less than MaximumPacketSize and that amount was not sufficient to fill the specified buffer. 1010 reserved - 1011 reserved - 1100 BufferOverrun During an IN, the HC received data from an endpoint faster than it could be written to system memory. 1101 BufferUnderrun During an OUT, the HC could not retrieve data from the system memory fast enough to keep up with the USB data rate. Active R/W Set to logic 1 by firmware to enable the execution of transactions by the HC. When the transaction associated with this descriptor is completed, the HC sets this bit to logic 0, indicating that a transaction for this element will not be executed when it is next encountered in the schedule. Toggle R/W Used to generate or compare the data PID value (DATA0 or DATA1). It is updated after each successful transmission or reception of a data packet. MaxPacketSize[9:0] R The maximum number of bytes that can be sent to or received from the endpoint in a single data packet. EndpointNumber[3:0] R USB address of the endpoint within the function. Last R Last PTD of a list (ITL or ATL). Logic 1 indicates that the PTD is the last PTD. Speed R Speed of the endpoint: 0 -- full speed 1 -- low speed TotalBytes[9:0] R Specifies the total number of bytes to be transferred with this data structure. For Bulk and Control only, this can be greater than MaximumPacketSize. (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 13963 Product data Rev. 05 -- 24 December 2004 21 of 88 ISP1160 Philips Semiconductors Embedded USB Host Controller Table 5: Philips Transfer Descriptor (PTD): bit description...continued Symbol Access DirectionPID[1:0] R Description 00 SETUP 01 OUT 10 IN 11 reserved B5_5 R/W This bit is logic 0 at power-on reset. When this feature is not used, software used for the ISP1160 is the same for the ISP1161 and the ISP1161A. When this bit is set to logic 1 in this PTD for interrupt endpoint transfer, only one PTD USB transaction will be sent out in 1 ms. Format R The format of this data structure. If this is a Control, Bulk or Interrupt endpoint, then Format = 0. If this is an Isochronous endpoint, then Format = 1. FunctionAddress[6:0] R This is the USB address of the function containing the endpoint that this PTD refers to. 9.4 HC's internal FIFO buffer RAM structure 9.4.1 Partitions According to the Universal Serial Bus Specification Rev. 2.0, there are four types of USB data transfers: Control, Bulk, Interrupt and Isochronous. The HC's internal FIFO buffer RAM has a physical size of 4 kbytes. This internal FIFO buffer RAM is used for transferring data between the microprocessor and USB peripheral devices. This on-chip buffer RAM can be partitioned into two areas: Acknowledged Transfer List (ATL) buffer and Isochronous (ISO) Transfer List (ITL) buffer. The ITL buffer is a Ping-Pong structured FIFO buffer RAM that is used to keep the payload data and their PTD header for Isochronous transfers. The ATL buffer is a non Ping-Pong structured FIFO buffer RAM that is used for the other three types of transfers. The ITL buffer can be further partitioned into ITL0 and ITL1 for the Ping-Pong structure. The ITL0 and ITL1 buffers always have the same size. The microprocessor can put ISO data into either the ITL0 buffer or the ITL1 buffer. When the microprocessor accesses an ITL buffer, the HC can take over the other ITL buffer at the same time. This architecture improves the ISO transfer performance. The HCD can assign the logical size for the ATL buffer and ITL buffers at any time, but normally at initialization after power-on reset. This is done by setting the HcATLBufferLength register (2BH to read, ABH to write) and the HcITLBufferLength register (2AH to read, AAH to write), respectively. The total length (ATL buffer + ITL buffer) should not exceed the maximum RAM size of 4 kbytes. Figure 17 shows the partitions of the internal FIFO buffer RAM. When assigning buffer RAM sizes, follow this formula: ATL buffer length + 2 x (ITL buffer size) 1000H (that is, 4 kbytes) where: ITL buffer size = ITL0 buffer length = ITL1 buffer length The following assignments are examples of legal uses of the internal FIFO buffer RAM: * ATL buffer length = 800H, ITL buffer length = 400H. This is the maximum use of the internal FIFO buffer RAM. (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 13963 Product data Rev. 05 -- 24 December 2004 22 of 88 ISP1160 Philips Semiconductors Embedded USB Host Controller * ATL buffer length = 400H, ITL buffer length = 200H. This is insufficient use of the internal FIFO buffer RAM. * ATL buffer length = 1000H, ITL buffer length = 0H. This will use the internal FIFO buffer RAM for only ATL transfers. FIFO buffer RAM top ITL0 ISO_A ITL1 ISO_B ITL buffer programmable sizes ATL buffer ATL control/bulk/interrupt data not used bottom 4 kbytes MGT950 Fig 17. HC internal FIFO buffer RAM partitions. The actual requirement for the buffer RAM needs to reach not the maximum size. You can make your selection based on your application. The following are some calculations of the ISO_A or ISO_B space for a frame of data: * Maximum number of useful data sent during one USB frame is 1280 bytes (20 ISO packets of 64 bytes). The total RAM size needed is: 20 x 8 + 1280 = 1440 bytes. * Maximum number of packets for different endpoints sent during one USB frame is 150 (150 ISO packets of 1 byte). The total RAM size needed is: 150 x 8 + 150 x 1 = 1350 bytes. * The Ping buffer RAM (ITL0) and the Pong buffer RAM (ITL1) have a maximum size of 2 kbytes each. All data needed for one frame can be stored in the Ping or the Pong buffer RAM. When the embedded system wants to initiate a transfer to the USB bus, the data needed for one frame is transferred to the ATL buffer or the ITL buffer. The microprocessor detects the buffer status through interrupt routines. When the HcBufferStatus register (2CH to read only) indicates that the buffer is empty, then the microprocessor writes data into the buffer. When the HcBufferStatus register indicates that the buffer is full, the data is ready on the buffer, and the microprocessor needs to read data from the buffer. For every 1 ms, there might be many events to generate interrupt requests to the microprocessor for data transfer or status retrieval. However, each of the interrupt types defined in this specification can be enabled or disabled by setting HcPInterruptEnable register bits accordingly. (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 13963 Product data Rev. 05 -- 24 December 2004 23 of 88 ISP1160 Philips Semiconductors Embedded USB Host Controller The data transfer can be done via the PIO mode or the DMA mode. The data transfer rate can go up to 15 Mbyte/s. In the DMA operation, the single-cycle or multi-cycle burst modes are supported. Multi-cycle burst modes of 1, 4 or 8 cycles per burst are supported for the ISP1160. 9.4.2 Data organization PTD data is used for every data transfer between a microprocessor and the USB bus, and the PTD data resides in the buffer RAM. For an OUT or SETUP transfer, the payload data is placed just after the PTD, after which the next PTD is placed. For an IN transfer, RAM space is reserved for receiving a number of bytes that is equal to the total bytes of the transfer. After this, the next PTD and its payload data are placed (see Figure 18). Remark: The PTD is defined for both the ATL and ITL type data transfer. For ITL, the PTD data is put into ITL buffer RAM, and the ISP1160 takes care of the Ping-Pong action for the ITL buffer RAM access. RAM buffer top 000H PTD of OUT transfer payload data of OUT transfer PTD of IN transfer empty space for IN total data PTD of OUT transfer payload data of OUT transfer bottom 7FFH MGT952 Fig 18. Buffer RAM data organization. The PTD data (PTD header and its payload data) is a structure of DWORD alignment. This means that the memory address is organized in blocks of 4 bytes. Therefore, the first byte of every PTD and the first byte of every payload data are located at an address that is a multiple of 4. Figure 19 illustrates an example in which the first payload data is 14 bytes long, meaning that the last byte of the payload data is at the location 15H. The next addresses (16H and 17H) are not multiples of 4. Therefore, the first byte of the next PTD will be located at the next multiple-of-four address (18H). (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 13963 Product data Rev. 05 -- 24 December 2004 24 of 88 ISP1160 Philips Semiconductors Embedded USB Host Controller RAM buffer top 00H PTD (8 bytes) 08H payload data (14 bytes) 15H 18H PTD (8 bytes) 20H payload data MGT953 Fig 19. PTD data with DWORD alignment in buffer RAM. 9.4.3 Operation and C program example Figure 20 shows the block diagram for internal FIFO buffer RAM operations in the PIO mode. The ISP1160 provides one register as the access port for each buffer RAM. For the ITL buffer RAM, the access port is the ITLBufferPort register (40H to read, C0H to write). For the ATL buffer RAM, the access port is the ATLBufferPort register (41H to read, C1H to write). The buffer RAM is an array of bytes (8 bits) while the access port is a 16-bit register. Therefore, each read/write operation on the port accesses two consecutive memory locations, incrementing the pointer of the internal buffer RAM by two. The lower byte of the access port register corresponds to the data byte at the even location of the buffer RAM, and the upper byte corresponds to the next data byte at the odd location of the buffer RAM. Regardless of the number of data bytes to be transferred, the command code must be issued merely once, and it will be followed by a number of accesses of the data port (see Section 8.4). When the pointer of the buffer RAM reaches the value of the HcTransferCounter register, an internal EOT signal will be generated to set bit 2, AllEOTInterrupt, of the HcPInterrupt register and update the HcBufferStatus register, to indicate that the whole data transfer has been completed. For ITL buffer RAM, every start of frame (SOF) signal (1 ms) will cause toggling between ITL0 and ITL1 but this depends on the buffer status. If both ITL0BufferFull and ITL1BufferFull of the HcBufferStatus register are already logic 1, meaning that both ITL0 and ITL1 buffer RAMs are full, the toggling will not happen. In this case, the microprocessor will always have access to ITL1. (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 13963 Product data Rev. 05 -- 24 December 2004 25 of 88 ISP1160 Philips Semiconductors Embedded USB Host Controller 1 command port Host bus I/F Control registers data port Commands 0 Command register A0 22H/A2H TransferCounter EOT 24H/A4H PInterrupt 2 2CH BufferStatus = 40H/C0H ITLBufferPort 41H/C1H ATLBufferPort 0 1 internal EOT (16-bit width) toggle SOF T 000H 000H BufferStatus 000H Pointer automatically increments by 2 001H 001H 001H 3FFH 3FFH 7FFH ITL0 buffer RAM (8-bit width) ITL1 buffer RAM (8-bit width) ATL buffer RAM (8-bit width) MGT951 Fig 20. PIO access to internal FIFO buffer RAM. Following is an example of a C program that shows how to write data into the ATL buffer RAM. The total number of data bytes to be transferred is 80 (decimal) that will be set into the HcTransferCounter register as 50H. The data consists of four types of PTD data: 1. The first PTD header (IN) is 8 bytes, followed by 16 bytes of space reserved for its payload data; 2. The second PTD header (IN) is also 8 bytes, followed by 8 bytes of space reserved for its payload data; 3. The third PTD header (OUT) is 8 bytes, followed by 16 bytes of payload data with values beginning from 0H to FH incrementing by 1; 4. The fourth PTD header (OUT) is also 8 bytes, followed by 8 bytes of payload data with values beginning from 0H to EH incrementing by 2. In all PTDs, we have assigned device address as 5 and endpoint 1. ActualBytes is always zero (0). TotalBytes equals the number of payload data bytes transferred. However, note that for bulk and control transfers, TotalBytes can be greater than MaxPacketSize. Table 6 shows the results after running this program. (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 13963 Product data Rev. 05 -- 24 December 2004 26 of 88 ISP1160 Philips Semiconductors Embedded USB Host Controller However, if communication with a peripheral USB device is desired, the device should be connected to the downstream port and pass enumeration. //The example program for writing ATL buffer RAM #include #include #include //Define register commands #define wHcTransferCounter 0x22 #define wHcuPInterrupt 0x24 #define wHcATLBufferLength 0x2b #define wHcBufferStatus 0x2c // Define I/O Port Address for HC #define HcDataPort 0x290 #define HcCmdPort 0x292 //Declare external functions to be used unsigned int HcRegRead(unsigned int wIndex); void HcRegWrite(unsigned int wIndex,unsigned int wValue); void main(void) { unsigned int i; unsigned int wCount,wData; // Prepare PTD data to be written into HC ATL buffer RAM: unsigned int PTDData[0x28]= { 0x0800,0x1010,0x0810,0x0005, //PTD header for IN token #1 //Reserved space for payload data of IN token #1 0x0000,0x0000,0x0000,0x0000, 0x0000,0x0000,0x0000,0x0000, 0x0800,0x1008,0x0808,0x0005, //PTD header for IN token #2 //Reserved space for payload data of IN token #2 0x0000,0x0000,0x0000,0x0000, 0x0800,0x1010,0x0410,0x0005, //PTD header for OUT token #1 0x0100,0x0302,0x0504,0x0706, //Payload data for OUT token #1 0x0908,0x0b0a,0x0d0c,0x0f0e, 0x0800,0x1808,0x0408,0x0005, //PTD header for OUT token #2 0x0200,0x0604,0x0a08,0x0e0c //Payload data for OUT token #2 }; HcRegWrite(wHcuPInterrupt,0x04); //Clear EOT interrupt bit //HcRegWrite(wHcITLBufferLength,0x0); HcRegWrite(wHcATLBufferLength,0x1000); //RAM full use for ATL //Set the number of bytes to be transferred HcRegWrite(wHcTransferCounter,0x50); wCount = 0x28; //Get word count outport (HcCmdPort,0x00c1); //Command for ATL buffer write (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 13963 Product data Rev. 05 -- 24 December 2004 27 of 88 ISP1160 Philips Semiconductors Embedded USB Host Controller //write 80 (0x50) bytes of data into ATL buffer RAM for (i=0;i VCC Vesd electrostatic discharge voltage ILI < 1 A Tstg storage temperature [1] Conditions [1] -0.5 +6.0 V - 100 mA -2000 +2000 V -60 +150 C Equivalent to discharging a 100 pF capacitor via a 1.5 k resistor (Human Body Model). 15. Recommended operating conditions Table 67: Recommended operating conditions Symbol Parameter Conditions Min VCC supply voltage with internal regulator 4.0 5.0 5.5 V internal regulator bypass 3.0 3.3 3.6 V 0 VCC 5.5 V 0 - 3.6 V [1] Typ Max Unit VI input voltage VI(AI/O) input voltage on analog I/O pins D+ and D- VO(od) open-drain output pull-up voltage 0 - VCC V Tamb ambient temperature -40 - +85 C [1] Maximum value is 5 V tolerant. (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 13963 Product data Rev. 05 -- 24 December 2004 71 of 88 ISP1160 Philips Semiconductors Embedded USB Host Controller 16. Static characteristics Table 68: Static characteristics; supply pins VCC = 3.0 V to 3.6 V or 4.0 V to 5.5 V; VGND = 0 V; Tamb = -40 C to +85 C; typical values at Tamb = 25 C; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit VCC = 5 V [1] VREG(3V3) internal regulator output 3.0 3.3 3.6 V ICC operating supply current - 47 - mA ICC(susp) suspend supply current - 40 500 A VCC = 3.3 V ICC operating supply current ICC(susp) suspend supply current [1] [2] [2] - 50 - mA - 150 500 A In the suspend mode, the minimum voltage is 2.7 V. For details on power consumption, refer to Philips Application Note AN10022 ISP1160x Low Power Consumption. Table 69: Static characteristics: digital pins VCC = 3.0 V to 3.6 V or 4.0 V to 5.5 V; VGND = 0 V; Tamb = -40 C to +85 C; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Input levels VIL LOW-level input voltage - - 0.8 V VIH HIGH-level input voltage 2.0 - - V Schmitt trigger inputs Vth(LH) positive-going threshold voltage 1.4 - 1.9 V Vth(HL) negative-going threshold voltage 0.9 - 1.5 V Vhys hysteresis voltage 0.4 - 0.7 V - - 0.4 V - - 0.1 V 2.4 - - V VREG(3V3) - 0.1 - - V -5 - +5 A - - 5 pF -5 - +5 A Output levels VOL LOW-level output voltage IOL = 4 mA VOH HIGH-level output voltage IOH = 4 mA IOL = 20 A [1] IOH = 20 A Leakage current ILI input leakage current CIN pin capacitance [2] pin to GND Open-drain outputs OFF-state output current IOZ [1] [2] Not applicable for open-drain outputs. The maximum and minimum values are applicable to transistor input only. The value will be different if internal pull-up or pull-down resistors are used. (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 13963 Product data Rev. 05 -- 24 December 2004 72 of 88 ISP1160 Philips Semiconductors Embedded USB Host Controller Table 70: Static characteristics: analog I/O pins D+ and D- VCC = 3.0 V to 3.6 V or 4.0 V to 5.5 V; VGND = 0 V; Tamb = -40 C to +85 C; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit VDI differential input sensitivity |VI(D+) - VI(D-)| 0.2 - - V VCM differential common mode voltage includes VDI range 0.8 - 2.5 V VIL LOW-level input voltage - - 0.8 V VIH HIGH-level input voltage 2.0 - - V Input levels [1] Output levels VOL LOW-level output voltage RL = 1.5 k to +3.6 V - - 0.3 V VOH HIGH-level output voltage RL = 15 k to GND 2.8 - 3.6 V -10 - +10 A Leakage current OFF-state leakage current ILZ Capacitance transceiver capacitance pin to GND - - 10 pF RPD pull-down resistance on HC's D+/D- enable internal resistors 10 - 20 k ZDRV driver output impedance steady-state drive 29 - 44 ZINP input impedance 10 - - M CIN Resistance [1] [2] [2] D+ is the USB positive data pin; D- is the USB negative data pin. Includes external resistors of 18 1 % on both pins H_D+ and H_D-. (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 13963 Product data Rev. 05 -- 24 December 2004 73 of 88 ISP1160 Philips Semiconductors Embedded USB Host Controller 17. Dynamic characteristics Table 71: Dynamic characteristics VCC = 3.0 V to 3.6 V or 4.0 V to 5.5 V; VGND = 0 V; Tamb = -40 C to +85 C; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit 160 - - s - - - ms Reset tW(RESET_N) pulse width on input RESET_N crystal oscillator running crystal oscillator stopped [1] Crystal oscillator fXTAL crystal frequency - 6 - MHz RS series resistance - - 100 CLOAD load capacitance - 18 - pF Cx1, Cx2 = 22 pF External clock input tJ external clock jitter - - 500 ps tDUTY clock duty cycle 45 50 55 % tCR, tCF rise time and fall time - - 3 ns [1] Dependent on the crystal oscillator start-up time. Table 72: Dynamic characteristics: analog I/O pins D+ and D- VCC = 3.0 V to 3.6 V or 4.0 V to 5.5 V; VGND = 0 V; Tamb = -40 C to +85 C; CL = 50 pF; see Figure 42 for test circuit; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Driver characteristics tFR rise time CL = 50 pF; 10 % to 90 % of |VOH - VOL| 4 - 20 ns tFF fall time CL = 50 pF; 90 % to 10 % of |VOH - VOL| 4 - 20 ns FRFM differential rise/fall time matching (tFR/tFF) 90 - 111.11 % VCRS output signal crossover voltage 1.3 - 2.0 V [1] [2] [1] [1][2] Excluding the first transition from Idle state. Characterized only, not tested. Limits guaranteed by design. (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 13963 Product data Rev. 05 -- 24 December 2004 74 of 88 ISP1160 Philips Semiconductors Embedded USB Host Controller 17.1 Programmed I/O timing Table 73: Dynamic characteristics: programmed interface timing Symbol Parameter tAS tAH Conditions Min Typ Max Unit address set-up time before WR_N HIGH 5 - - ns address hold time after WR_N HIGH 8 - - ns tSHSL first RD_N/WR_N after A0 HIGH 300 - - ns tSLRL CS_N LOW to RD_N LOW 0 - - ns tRHSH RD_N HIGH to CS_N HIGH 0 - - ns tRLRH RD_N LOW pulse width 33 - - ns tRHRL RD_N HIGH to next RD_N LOW 110 - - ns TRC RD_N cycle 143 - - ns tRHDZ RD_N data hold time 3 - 22 ns tRLDV RD_N LOW to data valid - - 32 ns tWL WR_N LOW pulse width 26 - - ns tWHWL WR_N HIGH to next WR_N LOW 110 - - ns TWC WR_N cycle 136 - - ns tSLWL CS_N LOW to WR_N LOW 0 - - ns tWHSH WR_N HIGH to CS_N HIGH 0 - - ns tWDSU WR_N data set-up time 5 - - ns tWDH WR_N data hold time 8 - - ns Read timing Write timing (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 13963 Product data Rev. 05 -- 24 December 2004 75 of 88 ISP1160 Philips Semiconductors Embedded USB Host Controller CS_N t SLWL t SLRL t SHSL t RLRH A0 t WHSH t RHSH t RHRL T RC RD_N t RLDV t RHDZ D [15:0] data valid tAS data valid data valid data valid t WHWL t AH t WL TWC WR_N t WDH data valid D [15:0] data valid t WDSU data valid data valid data valid 004aaa367 Fig 35. Programmed interface timing. 17.2 DMA timing 17.2.1 Table 74: Single-cycle DMA timing Dynamic characteristics: single-cycle DMA timing Symbol Parameter Conditions Min Typ Max Unit Read/write timing tRLRH RD_N pulse width 33 - - ns tRLDV read process data set-up time 26 - - ns tRHDZ read process data hold time 0 - 20 ns tWSU write process data set-up time 5 - - ns tWHD write process data hold time 0 - - ns tAHRH DACK_N HIGH to DREQ HIGH 72 - - ns tALRL DACK_N LOW to DREQ LOW - - 21 ns - - - ns [1] TDC DREQ cycle tSHAH RD_N/WR_N HIGH to DACK_N HIGH 0 - - ns tRHAL DREQ HIGH to DACK_N LOW 0 - - ns tDS DREQ pulse spacing 146 - - ns [1] TDC = tRHAL + tDS + tALRL (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 13963 Product data Rev. 05 -- 24 December 2004 76 of 88 ISP1160 Philips Semiconductors Embedded USB Host Controller T DC DREQ t DS t ALRL t SHAH t RHAL DACK_N t AHRH t RLDV D [15:0] (read) t RHDZ data valid D [15:0] (write) data valid t WSU RD_N or WR_N 004aaa371 t WHD Fig 36. Single-cycle DMA timing. 17.2.2 Table 75: Burst mode DMA timing Dynamic characteristics: burst mode DMA timing Symbol Parameter Conditions Min Typ Max Unit Read/write timing (for 4-cycle and 8-cycle burst mode) tRLRH WR_N/RD_N LOW pulse width 42 - - ns tRHRL WR_N/RD_N HIGH to next WR_N/RD_N LOW 60 - - ns TRC WR_N/RD_N cycle 102 - - ns tSLRL RD_N/WR_N LOW to DREQ LOW 22 - 64 ns tSHAH RD_N/WR_N HIGH to DACK_N HIGH 0 - - ns tSLAL DREQ HIGH to DACK_N LOW 0 - - ns - - - ns - - ns [1] TDC DREQ cycle tDS(read) DREQ pulse spacing (read) 4-cycle burst mode 105 tDS(read) DREQ pulse spacing (read) 8-cycle burst mode 150 - - ns tDS(write) DREQ pulse spacing (write) 4-cycle burst mode 72 - - ns tDS(write) DREQ pulse spacing (write) 8-cycle burst mode 167 - - ns tRLIS RD_N/WR_N LOW to EOT LOW 0 - - ns [1] TDC = tSLAL + (4 or 8)TRC + tDS (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 13963 Product data Rev. 05 -- 24 December 2004 77 of 88 ISP1160 Philips Semiconductors Embedded USB Host Controller t DS DREQ t RHSH t SLRL t SLAL DACK_N t SHAH t RHRL RD_N or WR_N 004aaa372 T RC t RLRH Fig 37. Burst mode DMA timing. 17.2.3 External EOT timing for single-cycle DMASETUP DREQ DACK_N RD_N or WR_N EOT t RLIS > 0 ns 004aaa373 Fig 38. External EOT timing for single-cycle DMA. 17.2.4 External EOT timing for burst mode DMA DREQ DACK_N RD_N or WR_N EOT t RLIS > 0 ns 004aaa374 Fig 39. External EOT timing for burst mode DMA. (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 13963 Product data Rev. 05 -- 24 December 2004 78 of 88 ISP1160 Philips Semiconductors Embedded USB Host Controller 18. Application information 18.1 Typical interface circuit +5 V +3.3 V VDD +5 V +3.3 V +5 V MOSFET (2x) SH7709 ISP1160 Vbus_DN2 Vbus_DN1 VCC +3.3 V +5 V D[15:0] D[15:0] A1 A0 CS5 RD_N RD/WR_N CS_N RD_N WR_N DREQ0 DACK0_N DREQ DACK_N H_OC1_N H_OC2_N H_PSW2_N H_PSW1_N H_DM1 H_DP1 H_DM2 H_DP2 EXTAL CLKOUT Vreg FB3 22 (2x) VHOLD1 VHOLD2 INT PTC0 PTC1 H_WAKEUP NDP_SEL H_SUSPEND USB downstream port #2 VDD 47 pF (2x) XTAL EXTAL2 FB2 +3.3 V EOT IRQ2 USB downstream port #1 47 pF (2x) VREG(3V3) +5 V FB1 22 (2x) FB4 32 kHz XTAL2 RESET_N RSTOUT XTAL2 6 MHz XTAL1 GND 7 DGND AGND 22 pF 22 pF 004aaa072 For MOSFET, RDSon = 150 m. Fig 40. Typical interface circuit to Hitachi SH-3 (SH7709) RISC processor. 18.2 Interfacing a ISP1160 to a SH7709 RISC processor This section shows a typical interface circuit between the ISP1160 and a RISC processor. The Hitachi SH-3 series RISC processor SH7709 is used as the example. The main ISP1160 signals to be taken into consideration for connecting to a SH7709 RISC processor are: * A 16-bit data bus: D[15:0] for the ISP1160. The ISP1160 is `little endian' compatible. * The address line A0 is needed for a complete addressing of the ISP1160 internal registers: - A0 = 0 will select the Data Port of the Host Controller - A0 = 1 will select the Command Port of the Host Controller * The CS_N line is used for chip selection of the ISP1160 in a certain address range of the RISC system. This signal is active LOW. * RD_N and WR_N are common read and write signals. These signals are active LOW. (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 13963 Product data Rev. 05 -- 24 December 2004 79 of 88 ISP1160 Philips Semiconductors Embedded USB Host Controller * There is a DMA channel standard control line: DREQ and DACK_N. The DREQ signal has programmable active levels. * An interrupt line INT is used by the HC. It has programmable level/edge and polarity (active HIGH or LOW). * The internal 15 k pull-down resistors are used for the HC's two USB downstream ports. * The RESET_N signal is active LOW. Remark: SH7709's system clock input is for reference only. Refer to SH7709's specification for its actual use. The ISP1160 can work under either 3.3 V or 5.0 V power supply; however, its internal core works at 3.3 V. When using 3.3 V as the power supply input, the internal DC/DC regulator will be bypassed. It is best to connect all four power supply pins (VCC, VREG(3V3), VHOLD1 and VHOLD2) to the 3.3 V power supply (for more information, see Section 11). All of the ISP1160's I/O pins are 5 V-tolerant. This feature allows the ISP1160 the flexibility to be used in an embedded system under either a 3.3 V or a 5 V power supply. A typical SH7709 interface circuit is shown in Figure 40. 18.3 Typical software model This section shows a typical software requirement for an embedded system that incorporates the ISP1160. The software model for a Digital Still Camera (DSC) is used as the example for illustration (as shown in Figure 41). The host stack provides API for Class driver and device driver, both of which provide API for application tasks for host function. (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 13963 Product data Rev. 05 -- 24 December 2004 80 of 88 ISP1160 Philips Semiconductors Embedded USB Host Controller Application layer MECHANISM CONTROL TASK IMAGE PROCESSING TASKS FILE MANAGEMENT PRINTER UI/CONTROL OS DEVICE DRIVERS Class driver MASS STORAGE CLASS DRIVER PRINTING CLASS DRIVER USB host stack HOST STACK ISP1160 HAL USB Upstream Printer RISC LEN CONTROL ROM ISP1160 RAM Flash card Reader/ Writer USB Downstream 004aaa073 Digital Still Camera Fig 41. The ISP1160 software model for DSC application. 19. Test information The dynamic characteristics of the analog I/O pins D+ and D- as listed in Table 72 were determined using the circuit shown in Figure 42. test point 22 D.U.T. 15 k CL 50 pF MGT967 Full-speed mode: load capacitance CL = 50 pF. Full-speed mode only: internal 1.5 k pull-up resistor on pin D+. Fig 42. Load impedance. (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 13963 Product data Rev. 05 -- 24 December 2004 81 of 88 ISP1160 Philips Semiconductors Embedded USB Host Controller 20. Package outline LQFP64: plastic low profile quad flat package; 64 leads; body 10 x 10 x 1.4 mm SOT314-2 c y X A 48 33 49 32 ZE e E HE A A2 (A 3) A1 wM bp pin 1 index 64 Lp L 17 detail X 16 1 ZD e v M A wM bp D B HD v M B 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e mm 1.6 0.20 0.05 1.45 1.35 0.25 0.27 0.17 0.18 0.12 10.1 9.9 10.1 9.9 0.5 HD HE 12.15 12.15 11.85 11.85 L Lp v w y 1 0.75 0.45 0.2 0.12 0.1 Z D (1) Z E (1) 1.45 1.05 1.45 1.05 7o o 0 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT314-2 136E10 MS-026 JEITA EUROPEAN PROJECTION ISSUE DATE 00-01-19 03-02-25 Fig 43. LQFP64 (SOT314-2) package outline. (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 13963 Product data Rev. 05 -- 24 December 2004 82 of 88 ISP1160 Philips Semiconductors Embedded USB Host Controller LQFP64: plastic low profile quad flat package; 64 leads; body 7 x 7 x 1.4 mm SOT414-1 c y X 48 A 33 49 32 ZE e A A2 E HE (A 3) A1 wM bp pin 1 index Lp L 64 17 1 detail X 16 ZD e v M A wM bp D B HD v M B 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HD HE L Lp v w y mm 1.6 0.15 0.05 1.45 1.35 0.25 0.23 0.13 0.20 0.09 7.1 6.9 7.1 6.9 0.4 9.15 8.85 9.15 8.85 1 0.75 0.45 0.2 0.08 0.08 Z D (1) Z E (1) 0.64 0.36 0.64 0.36 o 7 o 0 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT414-1 136E06 MS-026 JEITA EUROPEAN PROJECTION ISSUE DATE 00-01-19 03-02-20 Fig 44. LQFP64 (SOT414-1) package outline. (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 13963 Product data Rev. 05 -- 24 December 2004 83 of 88 ISP1160 Philips Semiconductors Embedded USB Host Controller 21. Soldering 21.1 Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended. In these situations reflow soldering is recommended. 21.2 Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 270 C depending on solder paste material. The top-surface temperature of the packages should preferably be kept: * below 225 C (SnPb process) or below 245 C (Pb-free process) - for all BGA, HTSSON..T and SSOP..T packages - for packages with a thickness 2.5 mm - for packages with a thickness < 2.5 mm and a volume 350 mm3 so called thick/large packages. * below 240 C (SnPb process) or below 260 C (Pb-free process) for packages with a thickness < 2.5 mm and a volume < 350 mm3 so called small/thin packages. Moisture sensitivity precautions, as indicated on packing, must be respected at all times. 21.3 Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results: * Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 13963 Product data Rev. 05 -- 24 December 2004 84 of 88 ISP1160 Philips Semiconductors Embedded USB Host Controller * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 C or 265 C, depending on solder material applied, SnPb or Pb-free respectively. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. 21.4 Manual soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C. 21.5 Package related soldering information Table 76: Suitability of surface mount IC packages for wave and reflow soldering methods Package[1] Soldering method BGA, HTSSON..T[3], LBGA, LFBGA, SQFP, SSOP..T[3], TFBGA, USON, VFBGA Reflow[2] not suitable suitable DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP, not suitable[4] HSQFP, HSSON, HTQFP, HTSSOP, HVQFN, HVSON, SMS suitable PLCC[5], SO, SOJ suitable suitable recommended[5][6] suitable LQFP, QFP, TQFP not SSOP, TSSOP, VSO, VSSOP not recommended[7] suitable CWQCCN..L[8], not suitable not suitable [1] [2] PMFP[9], WQCCN..L[8] For more detailed information on the BGA packages refer to the (LF)BGA Application Note (AN01026); order a copy from your Philips Semiconductors sales office. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods. (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 13963 Product data Wave Rev. 05 -- 24 December 2004 85 of 88 ISP1160 Philips Semiconductors Embedded USB Host Controller [3] These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature exceeding 217 C 10 C measured in the atmosphere of the reflow oven. The package body peak temperature must be kept as low as possible. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. Wave soldering is suitable for SSOP, TSSOP, VSO and VSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by using a hot bar soldering process. The appropriate soldering profile can be provided on request. Hot bar soldering or manual soldering is suitable for PMFP packages. [4] [5] [6] [7] [8] [9] 22. Revision history Table 77: Revision history Rev Date 05 CPCN 20041224 200412019 Description Product data (9397 750 13963) Modifications: * * Figure 2 "Pin configuration LQFP64.": added a figure note. * Section 9.8.1 "Using an internal OC detection circuit": fourth paragraph, second sentence, changed source to drain and drain to source. Table 2 "Pin description LQFP64": in the description for pin 60, changed address A1 to A2. 04 20030704 - Product data (9397 750 11371) 03 20030227 - Product data (9397 750 10765) 02 20020912 - Product data (9397 750 09628) 01 20020104 - Objective data (9397 750 09161) (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 13963 Product data Rev. 05 -- 24 December 2004 86 of 88 ISP1160 Philips Semiconductors Embedded USB Host Controller 23. Data sheet status Level Data sheet status[1] Product status[2][3] Definition I Objective data Development This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. II Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. III Product data Production This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). [1] Please consult the most recently issued data sheet before initiating or completing a design. [2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. [3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. 24. Definitions customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Short-form specification -- The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Right to make changes -- Philips Semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. When the product is in full production (status `Production'), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Limiting values definition -- Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information -- Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 25. Disclaimers Life support -- These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors 26. Trademarks ARM7 and ARM9 -- are trademarks of ARM Ltd. GoodLink -- is a trademark of Koninklijke Philips Electronics N.V. Hitachi -- is a registered trademark of Hitachi Ltd. MIPS-based -- is a trademark of MIPS Technologies, Inc. SoftConnect -- is a trademark of Koninklijke Philips Electronics N.V. StrongARM -- is a registered trademark of ARM Ltd. SuperH -- is a trademark of Hitachi Ltd. Contact information For additional information, please visit http://www.semiconductors.philips.com. For sales office addresses, send e-mail to: sales.addresses@www.semiconductors.philips.com. Product data Fax: +31 40 27 24825 (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 13963 Rev. 05 -- 24 December 2004 87 of 88 ISP1160 Philips Semiconductors Embedded USB Host Controller Contents 1 2 3 4 5 6 6.1 6.2 7 7.1 7.2 7.3 7.4 8 8.1 8.2 8.3 8.4 8.5 8.6 9 9.1 9.2 9.3 9.4 9.5 9.6 9.7 9.8 9.9 10 10.1 10.2 10.3 10.4 10.5 10.6 11 12 13 14 15 16 17 17.1 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 Functional description . . . . . . . . . . . . . . . . . . . 8 PLL clock multiplier. . . . . . . . . . . . . . . . . . . . . . 8 Bit clock recovery . . . . . . . . . . . . . . . . . . . . . . . 8 Analog transceivers . . . . . . . . . . . . . . . . . . . . . 8 Philips Serial Interface Engine (SIE). . . . . . . . . 8 Microprocessor bus interface. . . . . . . . . . . . . . 8 Programmed I/O (PIO) addressing mode . . . . . 8 DMA mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Control registers access by PIO mode . . . . . . 10 FIFO buffer RAM access by PIO mode . . . . . 11 FIFO buffer RAM access by DMA mode. . . . . 12 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Host Controller (HC) . . . . . . . . . . . . . . . . . . . . 16 HC's four USB states . . . . . . . . . . . . . . . . . . . 16 Generating USB traffic . . . . . . . . . . . . . . . . . . 17 PTD data structure . . . . . . . . . . . . . . . . . . . . . 19 HC's internal FIFO buffer RAM structure . . . . 22 HC operational model . . . . . . . . . . . . . . . . . . . 28 Microprocessor loading. . . . . . . . . . . . . . . . . . 31 Internal pull-down resistors for downstream ports. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 Overcurrent detection and power switching control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 Suspend and wake-up . . . . . . . . . . . . . . . . . . 34 HC registers . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 HC control and status registers . . . . . . . . . . . 37 HC frame counter registers. . . . . . . . . . . . . . . 44 HC Root Hub registers . . . . . . . . . . . . . . . . . . 48 HC DMA and interrupt control registers . . . . . 57 HC miscellaneous registers . . . . . . . . . . . . . . 62 HC buffer RAM control registers . . . . . . . . . . . 64 Power supply . . . . . . . . . . . . . . . . . . . . . . . . . . 69 Crystal oscillator . . . . . . . . . . . . . . . . . . . . . . . 69 Power-on reset (POR) . . . . . . . . . . . . . . . . . . . 70 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 71 Recommended operating conditions. . . . . . . 71 Static characteristics. . . . . . . . . . . . . . . . . . . . 72 Dynamic characteristics . . . . . . . . . . . . . . . . . 74 Programmed I/O timing. . . . . . . . . . . . . . . . . . 75 (c) Koninklijke Philips Electronics N.V. 2004. Printed in The Netherlands All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Date of release: 24 December 2004 Document order number: 9397 750 13963 17.2 18 18.1 18.2 18.3 19 20 21 21.1 21.2 21.3 21.4 21.5 22 23 24 25 26 DMA timing. . . . . . . . . . . . . . . . . . . . . . . . . . . Application information . . . . . . . . . . . . . . . . . Typical interface circuit . . . . . . . . . . . . . . . . . . Interfacing a ISP1160 to a SH7709 RISC processor. . . . . . . . . . . . . . . . . . . . . . . Typical software model . . . . . . . . . . . . . . . . . . Test information. . . . . . . . . . . . . . . . . . . . . . . . Package outline . . . . . . . . . . . . . . . . . . . . . . . . Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Introduction to soldering surface mount packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . Reflow soldering. . . . . . . . . . . . . . . . . . . . . . . Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . Manual soldering . . . . . . . . . . . . . . . . . . . . . . Package related soldering information . . . . . . Revision history . . . . . . . . . . . . . . . . . . . . . . . Data sheet status. . . . . . . . . . . . . . . . . . . . . . . Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 76 79 79 79 80 81 82 84 84 84 84 85 85 86 87 87 87 87