1Sheet No.: DG-081014
Date: June, 2008
©SHARP Corporation
GW5BxF15Lxx Series
GW5BxF15Lxx
Series
Light Emitting Diode Module
Notice The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Preliminary
■Features
1. High output (ex: GW5BWF15L00: 540 lm at
IF = 640 mA)
2. 48 LEDs in series-parallel array
3. White from InGaN Blue LED chip + Phosphor
(varies by color)
■Part Numbering
■Agency Approvals/Compliance
1. RoHS compliant
■Applications
1. Illumination
Letters Emission Color Part Number
BD Tungsten (2800°K) GW5BDF15L00
BN High Color Rendering (5000°K) GW5BNF15L00
BN High Color Rendering (6500°K) GW5BNF15L10
BW Normal White (5000°K) GW5BWF15L00
2Sheet No.: DG-081014
Date: June, 2008
GW5BxF15Lxx Series
Preliminary
■Outline Dimensions and Terminal Connections
(2 - φ2.7) R 11.0
Side View
Mounting screw position
Screw size: M2.6
Screw head: φ4.5 MAX.
Light emitting area
Cathode
(Solder terminal)
Anode
(Solder terminal)
(1.4)
+(0.75)
(1.4)
(16.26)
NOTES:
1. Dimensions are in mm
2. ( ): Reference dimensions
GW5xxF15L-1
18.0 ±0.15
18.0 ±0.15
(16.26)
(0.5)
(1.5)
(3.5)
3Sheet No.: DG-081014
Date: June, 2008
GW5BxF15Lxx Series
Preliminary
■Internal Circuit Diagram
■Absolute Maximum Ratings
*1 This value of Power Dissipation assumes the use of an adequate heat sink
to keep the module within its rated 0perating temperature range at the rated current.
Sharp recommends designing to a maximum allowable Tc of 80°C.
*2 Operating Temperature is fixed by the module’s external temperature, and is
measured at the point shown in Figure 7. Follow the derating curve given in Figure 1.
Parameter Symbol Rating Unit
Power dissipation *1 P 8.0 W
Forward current *1 IF720 mA
Reverse voltage VR-15 V
Operating temperature *2 Topr -30 to +90 °C
Storage temperature Tstg -40 to +100 °C
Anode +
Cathode _
GW5xxF15L-2
(Ta = 25°C)
(Ta = 25°C)
4Sheet No.: DG-081014
Date: June, 2008
GW5BxF15Lxx Series
Preliminary
■Electro-optical Characteristics
*1 Measured with the use of an integrating sphere, after 20 ms drive. Accuracy ±20%
*2 Measured with Ohtsuka Electronics Model MCPD-2000. Accuracy: x, y ±0.02
Parameter Symbol Conditions MIN. TYP. MAX. Unit
Forward Voltage VFIF = 640 mA 9.0 10.5 12.0 V
Luminous Flux *1
BW: Normal White φIF = 640 mA 400 540 – lm
BD: Tungsten φIF = 640 mA 300 400 – lm
BN: High Color Rendering φIF = 640 mA 260 350 – lm
Chromaticity *2
BD: Tungsten (2800°K)
x
IF = 640 mA
–0.45 –
y–0.41–
Tc 2550 2800 3050 K
BW: Normal white (5000°K)
x
IF = 640 mA
–0.35 –
y–0.36–
Tc 4700 5000 5300 K
BN: High Color Rendering (5000°K)
x
IF = 640 mA
–0.35 –
y–0.35–
Tc 4700 5000 5300 K
BN: High Color Rendering (6500°K)
x
IF = 640 mA
–0.31 –
y–0.32–
Tc 6000 6500 7000 K
Fig. 1 Derating Curve
NOTE: To keep this part within its rating, enough heatsinking capability
must be employed.
GW5xxF15L-3
500
400
300
700
600
200
Forward Current IF (mA)
Case Temperature Tc (°C)
100
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100
0
5Sheet No.: DG-081014
Date: June, 2008
GW5BxF15Lxx Series
Preliminary
■Characteristics Diagrams
●GW5BWC15L02 (5000°K White)
*Characteristics data are typical data and are not guaranteed data.
Fig. 2 Case Temperature
Measurement Point
Fig. 3 Thermal Resistance
Fig. 4 Heatsink Attachment
Measuring Point
+
-
GW5xxF15L-4
1
1
2
2
Junction
NOTES:
Thermal resisitance: 6.5°C/W (Reference value)
(Junction to Case)
Thermal resisitance: Depends on the performance
of any attached heat sink.
(Case to Atmosphere)
Case Atmosphere
GW5xxF15L-6
Screw
Heatsink
LED Module Heat-radiation
Sheet
GW5xxF15L-5
Fig. 5 Relative Intensity vs. Viewing Angle
Fig. 6 Forward Voltage vs.
Case Temperature
1.1
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
-90 -80 -70 -60 -50 -40 -30 -20 -10 0
Angle (°)
Relative Intensity
10 20 30 40 50 60 70 80 90
GW5xxF15L-18
12
11
10
9
-40 -20 0 20 40
Case Temperature Tc (°C)
Forward Voltage V
F
(V)
60 80
I
F
= 640 mA
GW5xxF15L-10
6Sheet No.: DG-081014
Date: June, 2008
GW5BxF15Lxx Series
Preliminary
Fig. 7 Forward Current vs. Forward Voltage
Fig. 8 Relative Luminous Flux vs.
Case Temperature
Fig. 9 Relative Luminous Flux vs.
Forward Current
120
110
100
90
80
70
60
-40 -20 0 20 40
Case Temperature Tc (°C)
Relative Luminous Flux (%)
60 80 100
I
F
= 640 mA
GW5xxF15L-9
120
100
80
60
40
20
100 200 300 400 500
Forward Current IF (mA)
Relative Luminous Flux (%)
600 700 800 900
GW5xxF15L-7
Fig. 10 Chromaticity Coordinate vs.
Case Temperature
Fig. 11 Color Temperature vs.
Case Temperature
0.39
0.38
0.37
0.36
0.35
0.34
0.32 0.33 0.34 0.35 0.36
x
y
0.37
IF = 640 mA
90°C
60°C
25°C
0°C
-30°C
GW5xxF15L-11
Case Temperature Tc (°C)
Color Temperature (°K)
6000
5500
5000
4500
4000
-40 -20 0 20 40 60 80 100
IF = 640 mA
GW5xxF15L-12
7Sheet No.: DG-081014
Date: June, 2008
GW5BxF15Lxx Series
Preliminary
●GW5BDC15L02 (2800°K Tungsten)
*Characteristics data are typical data and are not guaranteed data.
Fig. 12 Forward Voltage vs.
Case Temperature
Fig. 13 Forward Current vs.
Forward Voltage
Fig. 14 Relative Luminous Flux vs.
Case Temperature
TBD
600
500
400
900
800
700
300
200
100
8.5 9.0 9.5 10.0 10.5
Forward Voltage V
F
(mA)
Forward Current I
F
(mA)
11.0 11.5
GW5xxF15L-14
TBD
Fig. 15 Relative Luminous Flux vs.
Forward Current
Fig. 16 Chromaticity Coordinate vs.
Case Temperature
Fig. 17 Color Temperature vs.
Case Temperature
120
100
80
60
40
20
100 200 300 400 500
Forward Current IF (mA)
Relative Luminous Flux (%)
600 700 800 900
GW5xxF15L-13
TBD
TBD
8Sheet No.: DG-081014
Date: June, 2008
GW5BxF15Lxx Series
Preliminary
●GW5BNC15L02 (5000°K White) and
GW5BNC15L12 (6500°K White)
*Characteristics data are typical data and are not guaranteed data.
Fig. 18 Forward Voltage vs.
Case Temperature
Fig. 19 Forward Current vs.
Forward Voltage
Fig. 20 Relative Luminous Flux vs.
Case Temperature
TBD
600
500
400
900
800
700
300
200
100
8.5 9.0 9.5 10.0 10.5
Forward Voltage V
F
(V)
Forward Current I
F
(mA)
11.0 11.5
GW5xxF15L-16
TBD
Fig. 21 Relative Luminous Flux vs.
Forward Current
Fig. 22 Chromaticity Coordinate vs.
Case Temperature
Fig. 23 Color Temperature vs.
Case Temperature
120
100
80
60
40
20
100 200 300 400 500
Forward Current IF (mA)
Relative Luminous Flux (%)
600 700 800 900
Tc = 25°C
GW5xxF15L-15
TBD
TBD
9Sheet No.: DG-081014
Date: June, 2008
GW5BxF15Lxx Series
Preliminary
■Design Considerations
Design Guidelines
1. This product is not designed to be electromagnetic- and ionized-particle-radiation resistant.
2. Always use an adequate heatsink with this part, in combination with either (or both) a thermally conductive sheet
or heat-conducting grease. Sharp recommends designing such heat transfer methods to keep the part under its
maximum allowable case temperature (Tc) of 80°C for the end design’s real-world conditions.
3. Sharp recommends keeping the current through this device below 640 mA for best part longevity.
4. Do not allow the circuit design to apply any reverse voltage to the LEDs.
5. This module requires a constant-current source for its drive. A constant-voltage supply may provide more than
the rated current due to lowered VF created caused by part heating.
6. If currents in excess of the rated maximum are supplied to this part, hazardous conditions may be created, including
excess heating, smoke emission, or a possible fire. Take appropriate measures to control excess current and voltage.
7. If the lead wire to the part comes loose, it could contact the case or heatsink, thereby creating a short circuit and pos-
sible shock hazard. Take appropriate measures to prevent the lead wire from coming into contact with other parts.
■Manufacturing Guidelines
Cleaning Instructions
1. Sharp does not recommend cleaning this part, as the silicone resin may be corroded by solvents.
Soldering Instructions
1. Sharp recommends soldering by hand, with a thermally-controlled iron at 380°C; within 10 seconds for each
place. Solder on a surface that does not conduct heat.
2. When soldering, do not touch the tip of the iron to the yellow phosphor.
3. This product is not designed for solder reflow or solder flow methods.
4. Do not subject the package to excessive mechanical force during soldering as it may cause deformation or
defects in plated connections. Internal connections may be severed due to mechanical force placed on the pack-
age due to the PCB flexing during the soldering process.
Mechanical Installation Instructions
1. Sharp recommends taking particular notice of the installation method, as the mounting board’s material is alumi-
nized ceramic. If incorrectly installed, problems with non-radiation may occur due to cracking of the mounting board.
2. Use screws, adhesives, or both when mounting this device to its heatsink. When using only adhesives, be sure
to check their effectiveness. Use thread locking materials to prevent screws from loosening due to thermal
cycling. If the part is separated from its heatsink, a catastrophic temperature rise may occur, causing self-des-
oldering, device deterioration if not destruction, and smoke emission.
3. When screw mounting:
• Refer to Fig. 24 for the recommended dimensions.
• Screw torque: within 0.2 N•m.
• Use thread locking materials.
• Use materials with low galvanic action, such as stainless steel.
• Do not use flathead screws, which can cause substrate cracks due to stress at the screw holes.
• Do not install the part into a board which is warped in a convex direction. This part can be easily damaged by
torquing it to a convexedly-warped mounting surface.
• To maximize thermal efficiency between the device and its heatsink, Sharp recommends a thermally-conduc-
tive sheet and conductive grease.
• Circuit board cracks can be caused when screws are tightened; be sure to check the actual conditions carefully.
10 Sheet No.: DG-081014
Date: June, 2008
GW5BxF15Lxx Series
Preliminary
Storage and Handling
1. Store these parts between 5° and 30°C, at a relative humidity of less than 60%.
2. After breaking the package seal, maintain the environment within 5° to 30°C, at a relative humidity of less than
60%, and mount the parts within one week.
3. This part is not designed to directly resist excessive moisture, such as dew or condensation; or corrosive (salt)
air or corrosive gases, such as Cl, H2S, NH3, SO2, NOX. Exposure can corrode plated connections, causing
solderability problems.
4. This part can be easily damaged by external stress. Make sure it is not mechanically stressed during or after
assembly.
5. This part has a very high light output. Looking directly at it during full power output can cause injury.
6. Sharp recommends taking proper personal and environmental static control precautions when handling this part.
7. Sharp recommends handling these parts in a clean, non-dusty environment since surface dust may be difficult
to remove and can affect the optical performance of the part.
8. Sharp recommends confirming the part’s performance, reliability, and resistance to any of these conditions, if it
is to be used in any of these environments:
• Direct sunlight, outdoor exposure, dusty conditions
• In water, oil, medical fluids, and organic solvents
• Excessive moisture, such as dew or condensation
• Corrosive (salt) air or corrosive gases, such as Cl, H2S, NH3, SO2, NOX
■Presence of ODCs (RoHS Compliance)
This product shall not contain the following materials, and they are not used in the production process for this
product:
• Regulated substances: CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform). Specific
brominated flame retardants such as the PBBOs and PBBs are not used in this product at all.
This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC).
• Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated diphenyl
ethers (PBDE).
Fig. 24 Screw-mounting Dimensions
16.26 ±0.05
(2-M2.6)
GW5xxF15L-17
■Important Notices
· The circuit application examples in this publication are
provided to explain representative applications of
SHARP devices and are not intended to guarantee any
circuit design or license any intellectual property rights.
SHARP takes no responsibility for any problems
related to any intellectual property right of a third party
resulting from the use of SHARP’s devices.
· Contact SHARP in order to obtain the latest device
specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the
specifications, characteristics, data materials, struc-
ture, and other contents described herein at any time
without notice in order to improve design or reliability.
Manufacturing locations are also subject to change
without notice.
· Observe the following points when using any devices
in this publication. SHARP takes no responsibility for
damage caused by improper use of the devices which
does not meet the conditions and absolute maximum
ratings to be used specified in the relevant specification
sheet nor meet the following conditions:
(i) The devices in this publication are designed for use
in general electronic equipment designs such as:
--- Personal computers
--- Office automation equipment
--- Telecommunication equipment (terminal)
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
(ii) Measures such as fail-safe function and redundant
design should be taken to ensure reliability and safety
when SHARP devices are used for or in connection
with equipment that requires higher reliabilty such as:
--- Transportation control and safety equipment
(i.e., aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii) SHARP devices shall not be used for or in connec-
tion with equipment that requires an extremely high
level of reliability and safety such as:
--- Space applications
--- Telecommunication equipment (trunk lines)
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g.
scuba)
· If the SHARP devices listed in this publication fall
within the scope of strategic products described in the
Foreign Exchange and Foreign Trade Law of Japan, it
is necessary to obtain approval to export such SHARP
devices.
· This publication is the proprietary product of SHARP
and is copyrighted, with all rights reserved. Under the
copyright laws, no part of this publication may be repro-
duced or transmitted in any form or by any means,
electronic or mechanical, for any purpose, in whole or
in part, without the express written permission of
SHARP. Express written permission is also required
before any use of this publication may be made by a
third party.
· Contact and consult with a SHARP representative if
there are any questions about the contents of this pub-
lication.
11 Sheet No.: DG-081014
Date: June, 2008
GW5BxF15Lxx Series
Preliminary