Preliminary GW5BxF15Lxx Series GW5BxF15Lxx Series Light Emitting Diode Module Features Agency Approvals/Compliance 1. High output (ex: GW5BWF15L00: 540 lm at IF = 640 mA) 2. 48 LEDs in series-parallel array 3. White from InGaN Blue LED chip + Phosphor (varies by color) 1. RoHS compliant Applications 1. Illumination Part Numbering Letters Emission Color Part Number BD Tungsten (2800K) GW5BDF15L00 BN High Color Rendering (5000K) GW5BNF15L00 BN High Color Rendering (6500K) GW5BNF15L10 BW Normal White (5000K) GW5BWF15L00 Notice The content of data sheet is subject to change without prior notice. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. 1 Sheet No.: DG-081014 Date: June, 2008 (c)SHARP Corporation Preliminary GW5BxF15Lxx Series Outline Dimensions and Terminal Connections (2 - 2.7) Anode (Solder terminal) Mounting screw position Screw size: M2.6 Screw head: 4.5 MAX. R 11.0 (1.4) Light emitting area Cathode (Solder terminal) (0.75) (3.5) (16.26) + ) .4 5 .1 0 (16.26) .1 .0 0 5 (1 18 18 .0 (1.5) (0.5) Side View NOTES: 1. Dimensions are in mm 2. ( ): Reference dimensions GW5xxF15L-1 2 Sheet No.: DG-081014 Date: June, 2008 Preliminary GW5BxF15Lxx Series Internal Circuit Diagram Anode + Cathode _ GW5xxF15L-2 Absolute Maximum Ratings Parameter Symbol (Ta = 25C) Rating Unit Power dissipation *1 P 8.0 W Forward current *1 IF 720 mA Reverse voltage VR -15 V Operating temperature *2 Topr -30 to +90 C Storage temperature Tstg -40 to +100 C 1 This value of Power Dissipation assumes the use of an adequate heat sink to keep the module within its rated 0perating temperature range at the rated current. Sharp recommends designing to a maximum allowable Tc of 80C. 2 Operating Temperature is fixed by the module's external temperature, and is measured at the point shown in Figure 7. Follow the derating curve given in Figure 1. * * (Ta = 25C) 3 Sheet No.: DG-081014 Date: June, 2008 GW5BxF15Lxx Series Preliminary Electro-optical Characteristics Parameter Forward Voltage Symbol Conditions VF BW: Normal White Luminous Flux *1 BD: Tungsten BN: High Color Rendering MIN. TYP. MAX. IF = 640 mA 9.0 10.5 12.0 V IF = 640 mA 400 540 - lm IF = 640 mA 300 400 - lm IF = 640 mA 260 350 - lm - 0.45 - x - 0.41 - Tc y 2550 2800 3050 x - 0.35 - BD: Tungsten (2800K) BW: Normal white (5000K) IF = 640 mA IF = 640 mA y Chromaticity *2 - 0.36 - Tc 4700 5000 5300 x - 0.35 - BN: High Color Rendering (5000K) IF = 640 mA - 0.35 - Tc y 4700 5000 5300 x - 0.31 - BN: High Color Rendering (6500K) IF = 640 mA y Tc - 0.32 - 6000 6500 7000 Unit K K K K with the use of an integrating sphere, after 20 ms drive. Accuracy 20% *12 Measured * Measured with Ohtsuka Electronics Model MCPD-2000. Accuracy: x, y 0.02 Fig. 1 Derating Curve 700 Forward Current IF (mA) 600 500 400 300 200 100 0 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 Case Temperature Tc (C) NOTE: To keep this part within its rating, enough heatsinking capability must be employed. GW5xxF15L-3 4 Sheet No.: DG-081014 Date: June, 2008 GW5BxF15Lxx Series Preliminary Fig. 2 Case Temperature Measurement Point Fig. 5 Relative Intensity vs. Viewing Angle 1.1 1.0 0.9 - Relative Intensity 0.8 Measuring Point 0.7 0.6 0.5 0.4 0.3 + 0.2 0.1 0.0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 Angle () GW5xxF15L-18 GW5xxF15L-4 Characteristics Diagrams Fig. 3 Thermal Resistance Junction 1 Case 2 GW5BWC15L02 (5000K White) Atmosphere *Characteristics data are typical data and are not guaranteed data. NOTES: 1 Fig. 6 Forward Voltage vs. Case Temperature Thermal resisitance: 6.5C/W (Reference value) (Junction to Case) 2 Thermal resisitance: Depends on the performance of any attached heat sink. (Case to Atmosphere) IF = 640 mA Forward Voltage VF (V) 12 GW5xxF15L-6 Fig. 4 Heatsink Attachment LED Module Screw Heat-radiation Sheet 11 10 9 -40 Heatsink -20 0 20 40 60 80 Case Temperature Tc (C) GW5xxF15L-10 GW5xxF15L-5 5 Sheet No.: DG-081014 Date: June, 2008 GW5BxF15Lxx Series Preliminary Fig. 7 Forward Current vs. Forward Voltage Fig. 10 Chromaticity Coordinate vs. Case Temperature 800 IF = 640 mA 0.39 700 -30C 600 0.38 0C 500 300 60C 0.36 200 100 8.5 25C 0.37 400 y Forward Current IF (mA) 900 90C 9.0 9.5 10.0 10.5 11.0 0.35 11.5 0.34 0.32 Forward Voltage VF (mA) 0.33 0.34 0.35 0.36 0.37 x GW5xxF15L-8 GW5xxF15L-11 Fig. 8 Relative Luminous Flux vs. Case Temperature IF = 640 mA 120 IF = 640 mA 6000 110 Color Temperature (K) Relative Luminous Flux (%) Fig. 11 Color Temperature vs. Case Temperature 100 90 80 70 60 -40 -20 0 20 60 40 80 100 5500 5000 4500 4000 -40 Case Temperature Tc (C) -20 0 20 40 60 80 100 Case Temperature Tc (C) GW5xxF15L-9 GW5xxF15L-12 Relative Luminous Flux (%) Fig. 9 Relative Luminous Flux vs. Forward Current 120 100 80 60 40 20 100 200 300 400 500 600 700 800 900 Forward Current IF (mA) GW5xxF15L-7 6 Sheet No.: DG-081014 Date: June, 2008 GW5BxF15Lxx Series Preliminary GW5BDC15L02 (2800K Tungsten) Fig. 15 Relative Luminous Flux vs. Forward Current Relative Luminous Flux (%) *Characteristics data are typical data and are not guaranteed data. Fig. 12 Forward Voltage vs. Case Temperature 120 100 80 60 40 20 100 TBD 200 300 400 500 600 700 800 900 Forward Current IF (mA) GW5xxF15L-13 Fig. 16 Chromaticity Coordinate vs. Case Temperature Fig. 13 Forward Current vs. Forward Voltage Forward Current IF (mA) 900 800 700 600 TBD 500 400 300 200 100 8.5 9.0 9.5 10.0 10.5 11.0 11.5 Forward Voltage VF (mA) Fig. 17 Color Temperature vs. Case Temperature GW5xxF15L-14 Fig. 14 Relative Luminous Flux vs. Case Temperature TBD TBD 7 Sheet No.: DG-081014 Date: June, 2008 GW5BxF15Lxx Series Preliminary GW5BNC15L02 (5000K White) and GW5BNC15L12 (6500K White) Fig. 21 Relative Luminous Flux vs. Forward Current *Characteristics data are typical data and are not guaranteed data. Tc = 25C Relative Luminous Flux (%) Fig. 18 Forward Voltage vs. Case Temperature TBD 120 100 80 60 40 20 100 200 300 400 500 600 700 800 900 Forward Current IF (mA) GW5xxF15L-15 Fig. 22 Chromaticity Coordinate vs. Case Temperature Fig. 19 Forward Current vs. Forward Voltage Forward Current IF (mA) 900 800 700 600 500 TBD 400 300 200 100 8.5 9.0 9.5 10.0 10.5 11.0 11.5 Forward Voltage VF (V) GW5xxF15L-16 Fig. 23 Color Temperature vs. Case Temperature Fig. 20 Relative Luminous Flux vs. Case Temperature TBD TBD 8 Sheet No.: DG-081014 Date: June, 2008 Preliminary GW5BxF15Lxx Series Design Considerations Design Guidelines 1. This product is not designed to be electromagnetic- and ionized-particle-radiation resistant. 2. Always use an adequate heatsink with this part, in combination with either (or both) a thermally conductive sheet or heat-conducting grease. Sharp recommends designing such heat transfer methods to keep the part under its maximum allowable case temperature (Tc) of 80C for the end design's real-world conditions. 3. Sharp recommends keeping the current through this device below 640 mA for best part longevity. 4. Do not allow the circuit design to apply any reverse voltage to the LEDs. 5. This module requires a constant-current source for its drive. A constant-voltage supply may provide more than the rated current due to lowered VF created caused by part heating. 6. If currents in excess of the rated maximum are supplied to this part, hazardous conditions may be created, including excess heating, smoke emission, or a possible fire. Take appropriate measures to control excess current and voltage. 7. If the lead wire to the part comes loose, it could contact the case or heatsink, thereby creating a short circuit and possible shock hazard. Take appropriate measures to prevent the lead wire from coming into contact with other parts. Manufacturing Guidelines Cleaning Instructions 1. Sharp does not recommend cleaning this part, as the silicone resin may be corroded by solvents. Soldering Instructions 1. Sharp recommends soldering by hand, with a thermally-controlled iron at 380C; within 10 seconds for each place. Solder on a surface that does not conduct heat. 2. When soldering, do not touch the tip of the iron to the yellow phosphor. 3. This product is not designed for solder reflow or solder flow methods. 4. Do not subject the package to excessive mechanical force during soldering as it may cause deformation or defects in plated connections. Internal connections may be severed due to mechanical force placed on the package due to the PCB flexing during the soldering process. Mechanical Installation Instructions 1. Sharp recommends taking particular notice of the installation method, as the mounting board's material is aluminized ceramic. If incorrectly installed, problems with non-radiation may occur due to cracking of the mounting board. 2. Use screws, adhesives, or both when mounting this device to its heatsink. When using only adhesives, be sure to check their effectiveness. Use thread locking materials to prevent screws from loosening due to thermal cycling. If the part is separated from its heatsink, a catastrophic temperature rise may occur, causing self-desoldering, device deterioration if not destruction, and smoke emission. 3. When screw mounting: * Refer to Fig. 24 for the recommended dimensions. * Screw torque: within 0.2 N*m. * Use thread locking materials. * Use materials with low galvanic action, such as stainless steel. * Do not use flathead screws, which can cause substrate cracks due to stress at the screw holes. * Do not install the part into a board which is warped in a convex direction. This part can be easily damaged by torquing it to a convexedly-warped mounting surface. * To maximize thermal efficiency between the device and its heatsink, Sharp recommends a thermally-conductive sheet and conductive grease. * Circuit board cracks can be caused when screws are tightened; be sure to check the actual conditions carefully. 9 Sheet No.: DG-081014 Date: June, 2008 Preliminary GW5BxF15Lxx Series Fig. 24 Screw-mounting Dimensions 16.26 0.05 (2-M2.6) GW5xxF15L-17 Storage and Handling 1. Store these parts between 5 and 30C, at a relative humidity of less than 60%. 2. After breaking the package seal, maintain the environment within 5 to 30C, at a relative humidity of less than 60%, and mount the parts within one week. 3. This part is not designed to directly resist excessive moisture, such as dew or condensation; or corrosive (salt) air or corrosive gases, such as Cl, H2S, NH3, SO2, NOX. Exposure can corrode plated connections, causing solderability problems. 4. This part can be easily damaged by external stress. Make sure it is not mechanically stressed during or after assembly. 5. This part has a very high light output. Looking directly at it during full power output can cause injury. 6. Sharp recommends taking proper personal and environmental static control precautions when handling this part. 7. Sharp recommends handling these parts in a clean, non-dusty environment since surface dust may be difficult to remove and can affect the optical performance of the part. 8. Sharp recommends confirming the part's performance, reliability, and resistance to any of these conditions, if it is to be used in any of these environments: * Direct sunlight, outdoor exposure, dusty conditions * In water, oil, medical fluids, and organic solvents * Excessive moisture, such as dew or condensation * Corrosive (salt) air or corrosive gases, such as Cl, H2S, NH3, SO2, NOX Presence of ODCs (RoHS Compliance) This product shall not contain the following materials, and they are not used in the production process for this product: * Regulated substances: CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform). Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all. This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC). * Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated diphenyl ethers (PBDE). 10 Sheet No.: DG-081014 Date: June, 2008 Preliminary Important Notices GW5BxF15Lxx Series --- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- Traffic signals --- Gas leakage sensor breakers --- Alarm equipment --- Various safety devices, etc. * The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP's devices. (iii) SHARP devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: --- Space applications --- Telecommunication equipment (trunk lines) --- Nuclear power control equipment --- Medical and other life support equipment (e.g. scuba) * Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARP reserves the right to make changes in the specifications, characteristics, data materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice. * If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Law of Japan, it is necessary to obtain approval to export such SHARP devices. * Observe the following points when using any devices in this publication. SHARP takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) The devices in this publication are designed for use in general electronic equipment designs such as: --- Personal computers --- Office automation equipment --- Telecommunication equipment (terminal) --- Test and measurement equipment --- Industrial control --- Audio visual equipment --- Consumer electronics * This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express written permission is also required before any use of this publication may be made by a third party. * Contact and consult with a SHARP representative if there are any questions about the contents of this publication. (ii) Measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when SHARP devices are used for or in connection with equipment that requires higher reliabilty such as: 11 Sheet No.: DG-081014 Date: June, 2008