PBB190 Dual Single-Pole, Normally Closed OptoMOS(R) Relay INTEGRATED CIRCUITS DIVISION Parameter Blocking Voltage Load Current On-Resistance (max) Ratings 400 130 25 Units VP mArms / mADC Features * * * * * * * * 5000Vrms Input/Output Isolation Low Drive Power Requirements High Reliability Arc-Free With No Snubbing Circuits No EMI/RFI Generation Small 8-Pin Package Flammability Rating UL 94 V-0 Surface Mount, Tape & Reel Versions Available Description PBB190 is a dual single-pole, normally closed (1-Form-B) solid state relay with two independently controlled switches that use optically coupled MOSFET technology to provide 5000Vrms of input to output isolation. Its optically coupled outputs, which use the patented OptoMOS architecture, are controlled by a highly efficient infrared LED. Dual single-pole OptoMOS relays provide a more compact design solution than discrete single-pole relays in a variety of applications by incorporating both relays in a single 8-pin package. Approvals Applications * Telecommunications * Telecom Switching * Tip/Ring Circuits * Modem Switching (Laptop, Notebook, Pocket Size) * Hook Switch * Dial Pulsing * Ground Start * Ringing Injection * Instrumentation * Multiplexers * Data Acquisition * Electronic Switching * I/O Subsystems * Meters (Watt-Hour, Water, Gas) * Medical Equipment-Patient/Equipment Isolation * Security * Aerospace * Industrial Controls * UL Recognized Component: File E76270 * CSA Certified Component: Certificate 1175739 * EN/IEC 60950-1 Certified Component: Certificate available on our website Ordering Information Part # PBB190 PBB190S PBB190STR Description 8-Lead DIP (50/Tube) 8-Lead Surface Mount (50/Tube) 8-Lead Surface Mount (1,000/Reel) Pin Configuration + Control - Switch #1 - Control - Switch #1 + Control - Switch #2 - Control - Switch #2 1 8 2 7 3 6 4 5 Load - Switch #1 Load - Switch #1 Load - Switch #2 Load - Switch #2 Switching Characteristics of Normally Closed Devices Form-B IF ILOAD 10% toff DS-PBB190-R03 www.ixysic.com 90% ton 1 INTEGRATED CIRCUITS DIVISION PBB190 Absolute Maximum Ratings @ 25C Parameter Blocking Voltage Reverse Input Voltage LED Forward Current Peak (10ms) Input Power Dissipation 1 Total Power Dissipation 2 Isolation Voltage, Input to Output (60 Seconds) ESD Rating, Human Body Model Operational Temperature Storage Temperature 1 Derate linearly 1.33 mW / C 2 Derate linearly 6.67 mW / C Ratings 400 5 50 1 150 800 Units VP V mA A mW mW 5000 Vrms 8 -40 to +85 -40 to +125 kV C C Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Typical values are characteristic of the device at +25C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. Electrical Characteristics @ 25C Parameter Output Characteristics Load Current 1 Continuous Peak On-Resistance 2 Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Input Characteristics LED Forward Current To Activate 3 To Deactivate Input Voltage Drop Reverse Input Current Common Characteristics Input to Output Capacitance 2 Conditions IF=0mA IF=0mA, t=10ms IF=0mA, IL=130mA IF=2mA, VL=400VP IF=5 mA, VL=10V IF=5mA, VL=50V, f=1MHz Symbol Min Typ Max Units RON ILEAK - - 130 400 25 1 mArms / mADC mAP ton toff COUT - 11 1 2.5 - 0.38 0.35 1.2 - 2 1.5 10 3 - IL IL=130mA IF=5mA VR=5V VF IR 0.2 0.9 - VIO=0V, f=1MHz CIO - IF 1 If both poles operate simultaneously, then the load current must be derated so that the package power dissipation value is not exceeded. 2 Measurement taken within 1 second of on-time. 3 For high temperature operation (>60C), a minimum LED drive current of 4mA is recommended. www.ixysic.com A ms pF mA V A pF R03 INTEGRATED CIRCUITS DIVISION PBB190 PERFORMANCE DATA* 30 Typical LED Forward Voltage Drop (N=50, IF=5mA) Typical Turn-On Time (N=50, IF=5mA, IL=100mA) 20 Typical Turn-Off Time (N=50, IF=5mA, IL=100mA) 20 20 15 10 Device Count (N) Device Count (N) Device Count (N) 25 15 10 5 15 10 5 5 0 Typical LED Forward Current to Activate (N=50, IL=100mA) 0.714 0.716 0.718 0.720 0.722 0.724 0.726 0.728 0.838 0.920 1.002 1.084 1.166 1.248 1.330 1.412 Turn-On Time (ms) Turn-Off Time (ms) Typical On-Resistance Distribution (N=50, IF=0mA, IL=100mA) Typical Blocking Voltage Distribution (N=50, IF=2mA) 25 15 10 5 20 15 10 5 13.0 0.29 0.32 0.35 0.38 0.41 0.44 0.47 0.50 LED Forward Current (mA) 730 30 20 10 715 1.1 1.0 -40 IF=10mA IF=5mA IF=2mA -20 20 40 60 Temperature (C) 80 100 3000 2000 50 0 Turn-On Time vs. Temperature (IL=75mA) 5000 700 600 500 300 -40 10 20 30 40 LED Forward Current (mA) 50 Turn-Off Time vs. Temperature (IL=75mA) 4500 IF=5mA 400 0 4000 0 10 20 30 40 LED Forward Current (mA) 0 20 40 60 Temperature (C) 80 4000 IF=2mA 3500 3000 2500 2000 IF=5mA 1500 IF=2mA -20 Turn-Off Time (Ps) Turn-On Time (Ps) 1.2 495 1000 800 1.3 470 475 480 485 490 Blocking Voltage (VP) Typical Turn-Off Time vs. LED Forward Current (IL=100mA) 6000 720 900 1.4 5 460 465 725 Typical LED Forward Voltage Drop vs. Temperature 1.5 10 5000 0 1.6 15 14.5 710 0 1.10 1.15 1.20 1.25 1.30 1.35 1.40 1.45 1.50 1.55 LED Forward Voltage (V) IF=50mA IF=20mA 13.5 13.8 14.0 14.3 On-Resistance (:) Turn-Off Time (Ps) 40 Turn-On Time (Ps) LED Forward Current (mA) 735 13.3 Typical Turn-On Time vs. LED Forward Current (IL=100mA) LED Forward Voltage vs. LED Forward Current 50 20 0 0 0 LED Forward Voltage Drop (V) 25 Device Count (N) Device Count (N) 20 Device Count (N) 0 0 1.235 1.240 1.245 1.250 1.255 1.260 1.265 LED Forward Voltage (V) 100 1000 -40 -20 0 20 40 60 Temperature (C) 80 100 *Unless otherwise noted, data presented in these graphs is typical of device operation at 25C. For guaranteed parameters not indicated in the written specifications, please contact our application department. R03 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION PBB190 PERFORMANCE DATA* 0.45 0.40 16 15 14 0 20 40 60 Temperature (C) 80 12 -40 100 Blocking Voltage (VP) 0.12 0.11 0.10 0.09 0.08 -20 0 20 40 60 Temperature (C) -20 100 0 20 40 60 Temperature (C) 100 -0.15 -2.0 -1.5 -1.0 350 300 470 250 465 460 455 450 440 -40 -0.5 0.0 0.5 1.0 Load Voltage (V) 1.5 2.0 Typical Leakage vs. Temperature Measured Across Pins 5&6, 7&8 (IF=5mA, VL=400V) 200 150 100 50 445 -20 0 20 40 60 Temperature (C) 100 0 -40 -20 0 20 40 60 Temperature (C) 80 100 Energy Rating Curve Load Current (A) 80 60 40 20 0 100 150 Load Voltage (V) 80 1.0 100 50 80 475 120 0 -0.05 Typical Blocking Voltage vs. Temperature (IF=5mA) Output Capacitance vs. Load Voltage (IF=5mA, f=1MHz) 140 Output Capacitance (pF) 80 0.00 -0.10 480 0.13 0.05 Leakage (nA) -20 0.14 Load Current (A) 17 13 Maximum Load Current vs. Temperature (IF=0mA) -40 0.10 18 Load Current (A) 0.50 Typical Load Current vs. Load Voltage (IF=0mA) 0.15 19 0.55 0.35 -40 On-Resistance vs. Temperature (IF=0mA, IL=75mA) 20 0.60 On Resistance (:) LED Forward Current (mA) 0.65 LED Forward Current to Activate vs. Temperature (IL=75mA) 200 0.8 0.6 0.4 0.2 0.0 10Ps 100Ps 1ms 10ms 100ms Time 1s 10s 100s *Unless otherwise noted, data presented in these graphs is typical of device operation at 25C. For guaranteed parameters not indicated in the written specifications, please contact our application department. 4 www.ixysic.com R03 INTEGRATED CIRCUITS DIVISION PBB190 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classification PBB190 / PBB190S MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the body temperature of this device may be (TC - 5)C or greater. The classification temperature sets the Maximum Body Temperature allowed for this device during lead-free reflow processes. For through-hole devices, and any other processes, the guidelines of J-STD-020 must be observed. Device Classification Temperature (Tc) Dwell Time (tp) Max Reflow Cycles PBB190 PBB190S 250C 250C 30 seconds 30 seconds 1 3 Board Wash IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include, but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based. R03 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION PBB190 Mechanical Dimensions PBB190 2.540 0.127 (0.100 0.005) 9.652 0.381 (0.380 0.015) 8-0.800 DIA. (8-0.031 DIA.) 2.540 0.127 (0.100 0.005) 9.144 0.508 (0.360 0.020) 6.350 0.127 (0.250 0.005) Pin 1 PCB Hole Pattern 7.620 0.254 (0.300 0.010) 0.457 0.076 (0.018 0.003) 3.302 0.051 (0.130 0.002) 7.620 0.127 (0.300 0.005) 7.239 TYP. (0.285) 4.064 TYP (0.160) 0.254 0.0127 (0.010 0.0005) 7.620 0.127 (0.300 0.005) Dimensions mm (inches) 0.813 0.102 (0.032 0.004) PBB190S 9.652 0.381 (0.380 0.015) 2.540 0.127 (0.100 0.005) 6.350 0.127 (0.250 0.005) Pin 1 0.635 0.127 (0.025 0.005) 3.302 0.051 (0.130 0.002) 9.525 0.254 (0.375 0.010) 0.457 0.076 (0.018 0.003) PCB Land Pattern 2.54 (0.10) 8.90 (0.3503) 1.65 (0.0649) 7.620 0.254 (0.300 0.010) 0.254 0.0127 (0.010 0.0005) 0.65 (0.0255) 4.445 0.127 (0.175 0.005) Dimensions mm (inches) 0.813 0.102 (0.032 0.004) 6 www.ixysic.com R03 INTEGRATED CIRCUITS DIVISION PBB190 PBB190STR Tape & Reel 330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) K0 =4.90 (0.193) K1 =4.20 (0.165) Embossed Carrier Embossment W=16.00 (0.63) Bo=10.30 (0.406) Ao=10.30 (0.406) P1=12.00 (0.472) User Direction of Feed Dimensions mm (inches) NOTES: 1. Dimensions carry tolerances of EIA Standard 481-2 2. Tape complies with all "Notes" for constant dimensions listed on page 5 of EIA-481-2 For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits' Standard Terms and Conditions of Sale, IXYS Integrated Circuits assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits' product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits reserves the right to discontinue or make changes to its products at any time without notice. 7 Specification: DS-PBB190-R03 (c)Copyright 2018, IXYS Integrated Circuits OptoMOS(R) is a registered trademark of IXYS Integrated Circuits All rights reserved. Printed in USA. 6/29/2018