INTEGRATED CIRCUITS DATA SHEET TDF8704 8-bit high-speed analog-to-digital converter Product specification Supersedes data of April 1993 File under Integrated Circuits, IC02 Philips Semiconductors June 1994 Philips Semiconductors Product specification 8-bit high-speed analog-to-digital converter TDF8704 FEATURES APPLICATIONS * 8-bit resolution * General purpose high-speed analog-to-digital conversion for extended temperature applications * Sampling rate up to 50 MHz * Automotive * Extended temperature range (-40 to +85 C) * RF, satellite and GPS (Global Positioning System) * High signal-to-noise ratio over a large analog input frequency range (7.4 effective bits at 4.43 MHz full-scale input and at fclk = 50 MHz) * Medical * General industrial * Binary 3-state TTL outputs * Digital video (VCR, TV and satellite). * Overflow/underflow 3-state TTL output * TTL compatible digital inputs GENERAL DESCRIPTION * Low-level AC clock input signal allowed The TDF8704T is an 8-bit high-speed analog-to-digital converter (ADC) for general industrial applications. It converts the analog input signal into 8-bit binary-coded digital words at a maximum sampling rate of 50 MHz. All digital inputs and outputs are TTL compatible, although a low-level AC clock input signal is allowed. * Stable internal reference voltage regulator included * Power dissipation only 380 mW (typical) * Low analog input capacitance, no buffer amplifier required * No sample-and-hold circuit required. QUICK REFERENCE DATA SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT VCCA analog supply voltage 4.75 5.0 5.25 V VCCD digital supply voltage 4.75 5.0 5.25 V VCCO output stages supply voltage 4.75 5.0 5.25 V ICCA analog supply current - 37 46 mA ICCD digital supply current - 23 35 mA ICCO output stages supply current - 16 21 mA ILE DC integral linear error - 0.4 1 LSB - 0.2 0.5 LSB - - 2 LSB maximum clock frequency 50 - - MHz total power dissipation - 380 535 mW DLE DC differential linearity error AILE AC integral linearity error fclk(max) Ptot note 1 Note 1. Full-scale sine wave (fi = 4.43 MHz; fclk = 50 MHz). ORDERING INFORMATION PACKAGE PINS PIN POSITION MATERIAL CODE SAMPLING FREQUENCY TDF8704T/2 24 SO24L plastic SOT137-1 20 MHz TDF8704T/4 24 SO24L plastic SOT137-1 40 MHz TDF8704T/5 24 SO24L plastic SOT137-1 50 MHz TYPE NUMBER June 1994 2 Philips Semiconductors Product specification 8-bit high-speed analog-to-digital converter TDF8704 BLOCK DIAGRAM handbook, full pagewidth V CCA CLK VCCD CE 7 16 18 22 STABILIZER CLOCK DRIVER DEC 5 VRT 9 TDF8704 12 D7 13 D6 MSB 14 D5 analog voltage input VI 8 15 D4 ANALOG - TO - DIGITAL CONVERTER LATCHES TTL OUTPUTS 23 D3 data outputs 24 D2 1 D1 2 D0 VRB 4 19 21 OVERFLOW / UNDERFLOW LATCH OGND 20 output ground 6 AGND analog ground 11 17 DGND MSA685 digital ground Fig.1 Block diagram. June 1994 TTL OUTPUT 3 LSB VCCO1 VCCO2 overflow / underflow output Philips Semiconductors Product specification 8-bit high-speed analog-to-digital converter TDF8704 PINNING SYMBOL PIN DESCRIPTION D1 1 data output; bit 1 D0 2 data output; bit 0 (LSB) n.c. 3 not connected VRB 4 reference voltage BOTTOM (decoupling) DEC 5 decoupling input (internal stabilization loop decoupling) AGND 6 analog ground VCCA 7 analog supply voltage (+5 V) VI 8 VRT n.c. D1 1 24 D2 D0 2 23 D3 n.c. 3 22 CE analog input voltage V RB 4 21 VCCO2 9 reference voltage TOP (decoupling) DEC 5 20 OGND 10 not connected AGND 6 O/UF 11 overflow/underflow data output D7 12 data output; bit 7 (MSB) D6 13 data output; bit 6 D5 14 data output; bit 5 D4 15 data output; bit 4 CLK 16 clock input DGND 17 digital ground VCCD 18 digital supply voltage (+5 V) VCCO1 19 supply voltage for output stages 1 (+5 V) OGND 20 output ground VCCO2 21 supply voltage for output stages 2 (+5 V) CE 22 chip enable input (TTL level input, active LOW) D3 23 data output; bit 3 D2 24 data output; bit 2 June 1994 handbook, halfpage 19 VCCO1 TDF8704 V CCA 7 18 V CCD VI 8 17 DGND V RT 9 16 CLK n.c. 10 15 D4 O/UF 11 14 D5 D7 12 13 D6 MSA686 Fig.2 Pin configuration. 4 Philips Semiconductors Product specification 8-bit high-speed analog-to-digital converter TDF8704 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VCCA analog supply voltage -0.3 +7.0 V VCCD digital supply voltage -0.3 +7.0 V VCCO output stages supply voltage -0.3 +7.0 V VCC supply voltage differences between VCCA and VCCD -1.0 +1.0 V VCC supply voltage differences between VCCO and VCCD -1.0 +1.0 V VCC supply voltage differences between VCCA and VCCO -1.0 +1.0 V VI input voltage referenced to AGND -0.3 +7.0 V Vclk(p-p) AC input voltage for switching (peak-to-peak value) referenced to DGND - VCCD V IO output current - 10 mA Tstg storage temperature -55 +150 C Tamb operating ambient temperature -40 +85 C Tj junction temperature - +150 C HANDLING Inputs and outputs are protected against electrostatic discharges in normal handling. However, to be totally safe, it is desirable to take normal precautions appropriate to handling integrated circuits. THERMAL CHARACTERISTICS SYMBOL Rth j-a June 1994 PARAMETER thermal resistance from junction to ambient in free air 5 VALUE UNIT 75 K/W Philips Semiconductors Product specification 8-bit high-speed analog-to-digital converter TDF8704 CHARACTERISTICS (see Tables 1 and 2) VCCA = V7 to V6 = 4.75 to 5.25 V; VCCD = V18 to V17 = 4.75 to 5.25 V; VCCO = V19 and V21 to V20 = 4.75 to 5.25 V; AGND and DGND shorted together; VCCA to VCCD = -0.25 to +0.25 V; VCCO to VCCD = -0.25 to +0.25 V; VCCA to VCCD = -0.25 to +0.25 V; Tamb = -40 to +85 C; typical readings taken at VCCA = VCCD = 5 V and Tamb = 25 C; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Supply VCCA analog supply voltage 4.75 5.0 5.25 V VCCD digital supply voltage 4.75 5.0 5.25 V VCCO output stages supply voltage 4.75 5.0 5.25 V ICCA analog supply current - 37 46 mA ICCD digital supply current - 23 35 mA ICCO output stages supply current - 16 21 mA all outputs LOW Inputs CLOCK INPUT CLK (REFERENCED TO DGND) VIL LOW level input voltage 0 - 0.8 V VIH HIGH level input voltage 2.0 - VCCD V IIL LOW level input current Vclk = 0.4 V -400 - - A IIH HIGH level input current Vclk = 2.7 V - - 100 A Vclk = VCCD - - 300 A ZI input impedance fclk = 50 MHz - 2 - k CI input capacitance fclk = 50 MHz - 4.5 - pF 1.25 1.29 V VI (ANALOG INPUT VOLTAGE REFERENCED TO AGDN; SEE FIGS 3 AND 4 AND TABLE 1) VI(B) input voltage (BOTTOM) VI(0) input voltage output code = 0 1.42 1.48 1.51 V Vos(B) offset voltage (BOTTOM) VI(0) to VI(B) 210 225 240 V VI(T) input voltage (TOP) 3.37 3.46 3.58 V VI(255) input voltage output code = 255 3.14 3.22 3.30 V Vos(T) offset voltage (TOP) VI(T) to VI(255) 225 240 255 V VI(p-p) input voltage amplitude (peak-to-peak value) 1.69 1.74 1.79 V IL load current on VRT and VRB -300 - +300 A IIL LOW level input current VI = 1.25 V - 0 - A IIH HIGH level input current VI = 3.46 V 40 150 400 A ZI input impedance fi = 4.43 MHz - 10 - k CI input capacitance fi = 4.43 MHz - 14 - pF June 1994 1.21 6 Philips Semiconductors Product specification 8-bit high-speed analog-to-digital converter SYMBOL PARAMETER TDF8704 CONDITIONS MIN. TYP. MAX. UNIT INPUT CE (REFERENCED TO DGND) SEE TABLE 2 VIL LOW level input voltage 0 - 0.8 V VIH HIGH level input voltage 2.0 - VCCD V IIL LOW level input current VIL = 0.4 V -400 - - A IIH HIGH level input current VIH = 2.7 V - - 20 A VRT to VRB - 200 - IO = 1 mA; Tamb = 0 to +85 C 0 - 0.4 V IO = 1 mA; Tamb = 0 to -40 C - - 0.6 V Reference resistance Rref reference resistance Outputs DIGITAL OUTPUTS D7 TO D0 (REFERENCED TO DGND) VOL LOW level output voltage VOH HIGH level output voltage IO = -0.4 mA 2.7 - VCCD V IOZ output current in 3-state mode 0.4 V < VO < VCCD -20 - +20 A TDF8704T/2 20 - - MHz TDF8704T/4 40 - - MHz TDF8704T/5 50 - - MHz Switching characteristics CLOCK INPUT CLK (NOTE 1; SEE FIG.15) fclk(max) maximum clock frequency tCPH clock pulse width HIGH 7 - - ns tCPL clock pulse width LOW 7 - - ns Analog signal processing LINEARITY ILE DC integral linearity error - 0.4 1.0 LSB DLE DC differential linearity error - 0.2 0.5 LSB AILE AC integral linearity error note 2 - - 2.0 LSB -0.5 dB analog bandwidth (note 3) full-scale sine wave - 12 - MHz 75% full-scale sine wave - 16 - MHz tSTLH analog input settling time LOW-to-HIGH full-scale square wave; Fig.8; note 4 - 2.5 3.5 ns tSTHL analog input settling time HIGH-to-LOW full-scale square wave; Fig.8; note 4 - 3.0 4.0 ns BANDWIDTH (fclk = 40 MHZ) B June 1994 7 Philips Semiconductors Product specification 8-bit high-speed analog-to-digital converter SYMBOL PARAMETER TDF8704 CONDITIONS MIN. TYP. MAX. UNIT HARMONICS (fclk = 40 MHZ) h1 fundamental harmonics (full scale) fi = 4.43 MHz hall harmonics (full scale); all components fi = 4.43 MHz second harmonics total harmonic distortion - 0 dB - -64 -60 dB - -58 -55 dB fi = 4.43 MHz - -56 - dB without harmonics; fclk = 40 MHz; fi = 4.43 MHz 46 48 - dB fi = 1.25 MHz - 7.8 - bits fi = 4.43 MHz - 7.6 - bits fi = 4.43 MHz - 7.5 - bits fi = 7.5 MHz - 7.3 - bits fi = 10 MHz - 7.0 - bits fi = 4.43 MHz - 7.4 - bits fi = 7.5 MHz - 7.2 - bits fi = 10 MHz - 6.9 - bits fclk = 40 MHz - -56 - dB 10-11 - times/ samples third harmonics THD - SIGNAL-TO-NOISE RATIO S/N signal-to-noise ratio EFFECTIVE BITS; NOTE 5; SEE FIGS 9, 10 AND 11 EB effective bits TDF8704T/2 fclk = 20 MHz effective bits TDF8704T/4 fclk = 40 MHz effective bits TDF8704T/5 fclk = 50 MHz TWO-TONE (NOTE 6) TTIR two-tone intermodulation rejection BIT ERROR RATE BER bit error rate fclk = 40 MHz; - fi = 4.43 MHz; VI = 16 LSB at code 128 DIFFERENTIAL GAIN (NOTE 7) Gdiff differential gain fclk = 20 MHz; fi = 4.43 MHz - 0.6 - % fclk = 40 MHz; fi = 4.43 MHz - 0.8 - deg DIFFERENTIAL PHASE (NOTE 7) diff June 1994 differential phase 8 Philips Semiconductors Product specification 8-bit high-speed analog-to-digital converter SYMBOL PARAMETER TDF8704 CONDITIONS MIN. TYP. MAX. UNIT Timing (note 8; see Figs 5 and 7; fclk = 50 MHz) - - 2 ns output hold time 5 - - ns output delay time - 12 15 ns tds sampling delay time th td 3-state output delay times (see Figs 6 and 7) tdZH enable HIGH - 6 10 ns tdZL enable LOW - 12 16 ns tdHZ disable HIGH - 50 54 ns tdLZ disable LOW - 10 14 ns Notes 1. In addition to a good layout of the digital and analog ground, it is recommended that the rise and fall times of the clock must be less than 1 ns. 2. Full-scale sine wave (fi = 4.43 MHz; fclk = 50 MHz). 3. Determined by beat frequency method on a reconstructed sine wave signal for no missing codes and no glitches. 4. The analog input settling time is the minimum time required for the input signal to be stabilized after a sharp full-scale input (square-wave signal) in order to sample the signal and obtain correct output data. 5. Effective bits are obtained via a Fast Fourier Transform (FFT) treatment taking 4K acquisition points per period. The calculation takes into account all harmonics and noise up to half of the clock frequency (NYQUIST frequency). Conversion to signal-to-noise ratio: S/N = EB x 6.02 + 1.76 dB. 6. Intermodulation measured relative to either tone with analog input frequencies of 4.43 MHz and 4.53 MHz. The two input signals have the same amplitude and the total amplitude of both signals provides full scale to the converter. 7. Measurement taken using video analyser VM700A. 8. Output data acquisition: the output data is available after the maximum delay time of td. MBD868 3.49 handbook, halfpage MSA689 3.44 1.29 andbook, halfpage 1.28 V I (T) V I (B) V I (T) V I (B) (V) (V) (V) (V) 1.27 3.47 3.42 0.1 mV/K 1.26 V I (T) 17 mV/V V I (T) 3.45 0.05 mV/K 1.25 3.40 1.24 V I (B) 7 mV/V V I (B) 3.43 60 Fig.3 June 1994 20 20 1.23 60 100 Tamb ( o C) 3.38 4.25 Influence of Tamb on VI(T) and VI(B) under 5 V supply. Fig.4 9 4.75 5.25 1.22 VCC (V) 5.75 Influence of supply voltage on VI(T) and VI(B) under Tamb = 25 C. Philips Semiconductors Product specification 8-bit high-speed analog-to-digital converter Table 1 TDF8704 Output coding and input voltage (typical values; referenced to AGND). BINARY OUTPUT BITS VI(p-p) O/UF Underflow <1.48 1 0 1.48 1 - . . . . STEP D7 D6 D5 D4 D3 D2 D1 D0 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 . . . . . . . . . . . . . . . . . 254 . 0 1 1 1 1 1 1 1 0 255 3.46 0 1 1 1 1 1 1 1 1 Overflow >3.46 1 1 1 1 1 1 1 1 1 Table 2 Mode selection. CE D7 TO D0 O/UF 1 high impedance high impedance 0 active; binary active t CPL handbook, full pagewidth t CPH 1.4 V CLK sample N sample N 1 Vl sample N 2 N t ds th 2.4 V DATA D0 to D7 DATA N 2 DATA N 1 DATA N DATA N 1 1.4 V 0.4 V td Fig.5 Timing diagram for data output. June 1994 10 MSA688 - 1 Philips Semiconductors Product specification 8-bit high-speed analog-to-digital converter handbook, full pagewidth TDF8704 V CCD CE 50 % t dHZ t dZH HIGH 90 % output data 50 % t dLZ LOW t dZL HIGH output data 50 % LOW TEST V CCD 3.3 k S1 TDF8704 tdLZ VCCD tdZL VCCD tdHZ GND tdZH GND 15 pF MLB880 CE fCE = 100 kHz. Fig.6 Timing diagram and test conditions of 3-state output delay time. handbook, halfpage D0 to D7 15 pF MBB956 - 1 Fig.7 Load circuit for timing measurement. June 1994 S1 10 % 11 Philips Semiconductors Product specification 8-bit high-speed analog-to-digital converter TDF8704 t STHL t STLH handbook, full pagewidth code 255 VI 50 % 50 % code 0 2 ns 2 ns CLK 50 % 50 % 0.5 ns MBD869 0.5 ns Fig.8 Analog input settling-time diagram. MBD870 0 handbook, full pagewidth amplitude (dB) 20 40 60 80 100 120 0 1.25 2.49 3.74 4.98 6.23 7.47 Effective bits: 7.89; THD = -61.05 dB. Harmonic levels (dB): 2nd = -84.07; 3rd = -62.50; 4th = -92.01; 5th = -66.56; 6th = -101.15. Fig.9 Fast Fourier Transform (fclk = 20 MHz; fi = 1.25 MHz). June 1994 12 8.72 f (MHz) 9.96 Philips Semiconductors Product specification 8-bit high-speed analog-to-digital converter TDF8704 MBD871 0 handbook, full pagewidth amplitude (dB) 20 40 60 80 100 120 0 2.48 4.96 7.44 9.93 12.4 14.9 17.4 f (MHz) 19.9 Effective bits: 7.61; THD = -57.11 dB. Harmonic levels (dB): 2nd = -68.53; 3rd = -58.36; 4th = -74.89; 5th = -65.37; 6th = -76.08. Fig.10 Fast Fourier Transform (fclk = 40 MHz; fi = 4.43 MHz). MBD872 0 handbook, full pagewidth amplitude (dB) 20 40 60 80 100 120 0 3.12 6.24 9.35 12.5 15.6 18.7 Effective bits: 6.91; THD = -46.13 dB. Harmonic levels (dB): 2nd = -59.66; 3rd = -46.67; 4th = -70.80; 5th = -57.96; 6th = -72.16. Fig.11 Fast Fourier Transform (fclk = 50 MHz; fi = 10 MHz). June 1994 13 21.8 f (MHz) 24.9 Philips Semiconductors Product specification 8-bit high-speed analog-to-digital converter TDF8704 INTERNAL PIN CONFIGURATIONS handbook, halfpage VCCO1 handbook, halfpage VCCO2 V CCA D7 to D0 O/UF VI DGND AGND (x 90) MLB037 MLB036 Fig.12 TTL data and overflow/underflow outputs. Fig.13 Analog inputs. book, halfpage VCCO1 CE DGND MLB038 Fig.14 CE (3-state) input. June 1994 14 Philips Semiconductors Product specification 8-bit high-speed analog-to-digital converter handbook, full pagewidth TDF8704 V CCA VRT VRB DEC AGND MSA687 Fig.15 VRB, VRT and DEC. handbook, full pagewidth VCCD V ref CLK 30 k DGND MCD189 - 1 Fig.16 CLK input. June 1994 30 k 15 Philips Semiconductors Product specification 8-bit high-speed analog-to-digital converter TDF8704 APPLICATION INFORMATION handbook, halfpage D1 1 D0 2 24 23 D2 D3 (2) n.c. 3 22 (1) V RB 4 21 CE VCCO2 47 pF AGND DEC 5 10 nF AGND 6 AGND 20 19 TDF8704 V CCA 7 VI 8 18 17 OGND VCCO1 VCCD DGND (1) V RT 100 nF 9 16 CLK (2) n.c. 10 O / UF 11 D7 12 15 D4 AGND 14 13 D5 D6 MSA684 The analog and digital supplies should be separated and decoupled. (1) VRB and VRT are decoupling pins for the internal reference ladder; do not draw current from these pins in order to achieve good linearity. (2) Pins 3 and 10 should be connected to DGND in order to prevent noise influence. Fig.17 Application diagram. June 1994 16 Philips Semiconductors Product specification 8-bit high-speed analog-to-digital converter TDF8704 PACKAGE OUTLINE handbook, full pagewidth 15.6 15.2 7.6 7.4 10.65 10.00 0.1 S S A 0.9 (4x) 0.4 24 13 2.45 2.25 1.1 1.0 0.3 0.1 2.65 2.35 0.32 0.23 pin 1 index 1 1.1 0.5 12 detail A 1.27 0.49 0.36 0.25 M (24x) Dimensions in mm. Fig.18 Plastic small outline package; 24 leads; large body; SOT137-1. June 1994 17 0 to 8o MBC235 - 1 Philips Semiconductors Product specification 8-bit high-speed analog-to-digital converter TDF8704 applied to the substrate by screen printing, stencilling or pressure-syringe dispensing before device placement. SOLDERING Plastic small-outline packages Several techniques exist for reflowing; for example, thermal conduction by heated belt, infrared, and vapour-phase reflow. Dwell times vary between 50 and 300 s according to method. Typical reflow temperatures range from 215 to 250 C. BY WAVE During placement and before soldering, the component must be fixed with a droplet of adhesive. After curing the adhesive, the component can be soldered. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 min at 45 C. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder bath is 10 s, if allowed to cool to less than 150 C within 6 s. Typical dwell time is 4 s at 250 C. REPAIRING SOLDERED JOINTS (BY HAND-HELD SOLDERING IRON OR PULSE-HEATED SOLDER TOOL) Fix the component by first soldering two, diagonally opposite, end pins. Apply the heating tool to the flat part of the pin only. Contact time must be limited to 10 s at up to 300 C. When using proper tools, all other pins can be soldered in one operation within 2 to 5 s at between 270 and 320 C. (Pulse-heated soldering is not recommended for SO packages.) A modified wave soldering technique is recommended using two solder waves (dual-wave), in which a turbulent wave with high upward pressure is followed by a smooth laminar wave. Using a mildly-activated flux eliminates the need for removal of corrosive residues in most applications. For pulse-heated solder tool (resistance) soldering of VSO packages, solder is applied to the substrate by dipping or by an extra thick tin/lead plating before package placement. BY SOLDER PASTE REFLOW Reflow soldering requires the solder paste (a suspension of fine solder particles, flux and binding agent) to be DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. June 1994 18 Philips Semiconductors Product specification 8-bit high-speed analog-to-digital converter NOTES June 1994 19 TDF8704 Philips Semiconductors - a worldwide company Argentina: IEROD, Av. Juramento 1992 - 14.b, (1428) BUENOS AIRES, Tel. (541)786 7633, Fax. (541)786 9367 Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. (02)805 4455, Fax. (02)805 4466 Austria: Triester Str. 64, A-1101 WIEN, P.O. Box 213, Tel. (01)60 101-1236, Fax. (01)60 101-1211 Belgium: Postbus 90050, 5600 PB EINDHOVEN, The Netherlands, Tel. (31)40 783 749, Fax. (31)40 788 399 Brazil: Rua do Rocio 220 - 5th floor, Suite 51, CEP: 04552-903-SAO PAULO-SP, Brazil. P.O. Box 7383 (01064-970). Tel. (011)821-2327, Fax. (011)829-1849 Canada: INTEGRATED CIRCUITS: Tel. (800)234-7381, Fax. (708)296-8556 DISCRETE SEMICONDUCTORS: 601 Milner Ave, SCARBOROUGH, ONTARIO, M1B 1M8, Tel. (0416)292 5161 ext. 2336, Fax. (0416)292 4477 Chile: Av. Santa Maria 0760, SANTIAGO, Tel. (02)773 816, Fax. (02)777 6730 Colombia: IPRELENSO LTDA, Carrera 21 No. 56-17, 77621 BOGOTA, Tel. (571)249 7624/(571)217 4609, Fax. (571)217 4549 Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S, Tel. (032)88 2636, Fax. (031)57 1949 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. (9)0-50261, Fax. (9)0-520971 France: 4 Rue du Port-aux-Vins, BP317, 92156 SURESNES Cedex, Tel. (01)4099 6161, Fax. (01)4099 6427 Germany: PHILIPS COMPONENTS UB der Philips G.m.b.H., P.O. Box 10 63 23, 20043 HAMBURG, Tel. (040)3296-0, Fax. (040)3296 213. Greece: No. 15, 25th March Street, GR 17778 TAVROS, Tel. (01)4894 339/4894 911, Fax. (01)4814 240 Hong Kong: PHILIPS HONG KONG Ltd., Components Div., 6/F Philips Ind. Bldg., 24-28 Kung Yip St., KWAI CHUNG, N.T., Tel. (852)424 5121, Fax. (852)428 6729 India: Philips INDIA Ltd, Components Dept, Shivsagar Estate, A Block , Dr. Annie Besant Rd. Worli, Bombay 400 018 Tel. (022)4938 541, Fax. (022)4938 722 Indonesia: Philips House, Jalan H.R. Rasuna Said Kav. 3-4, P.O. Box 4252, JAKARTA 12950, Tel. (021)5201 122, Fax. (021)5205 189 Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. (01)640 000, Fax. (01)640 200 Italy: PHILIPS COMPONENTS S.r.l., Viale F. Testi, 327, 20162 MILANO, Tel. (02)6752.3302, Fax. (02)6752 3300. Japan: Philips Bldg 13-37, Kohnan 2 -chome, Minato-ku, TOKYO 108, Tel. (03)3740 5028, Fax. (03)3740 0580 Korea: (Republic of) Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. (02)794-5011, Fax. (02)798-8022 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. (03)750 5214, Fax. (03)757 4880 Mexico: Philips Components, 5900 Gateway East, Suite 200, EL PASO, TX 79905, Tel. 9-5(800)234-7381, Fax. (708)296-8556 Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB Tel. (040)783749, Fax. (040)788399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. (09)849-4160, Fax. (09)849-7811 Philips Semiconductors Norway: Box 1, Manglerud 0612, OSLO, Tel. (022)74 8000, Fax. (022)74 8341 Pakistan: Philips Electrical Industries of Pakistan Ltd., Exchange Bldg. ST-2/A, Block 9, KDA Scheme 5, Clifton, KARACHI 75600, Tel. (021)587 4641-49, Fax. (021)577035/5874546. Philippines: PHILIPS SEMICONDUCTORS PHILIPPINES Inc, 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. (02)810 0161, Fax. (02)817 3474 Portugal: PHILIPS PORTUGUESA, S.A., Rua dr. Antonio Loureiro Borges 5, Arquiparque - Miraflores, Apartado 300, 2795 LINDA-A-VELHA, Tel. (01)14163160/4163333, Fax. (01)14163174/4163366. Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231, Tel. (65)350 2000, Fax. (65)251 6500 South Africa: S.A. PHILIPS Pty Ltd., Components Division, 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000, Tel. (011)470-5911, Fax. (011)470-5494. Spain: Balmes 22, 08007 BARCELONA, Tel. (03)301 6312, Fax. (03)301 42 43 Sweden: Kottbygatan 7, Akalla. S-164 85 STOCKHOLM, Tel. (0)8-632 2000, Fax. (0)8-632 2745 Switzerland: Allmendstrasse 140, CH-8027 ZURICH, Tel. (01)488 2211, Fax. (01)481 77 30 Taiwan: PHILIPS TAIWAN Ltd., 23-30F, 66, Chung Hsiao West Road, Sec. 1. Taipeh, Taiwan ROC, P.O. Box 22978, TAIPEI 100, Tel. (02)388 7666, Fax. (02)382 4382. Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, Bangkok 10260, THAILAND, Tel. (662)398-0141, Fax. (662)398-3319. Turkey: Talatpasa Cad. No. 5, 80640 GULTEPE/ISTANBUL, Tel. (0 212)279 2770, Fax. (0212)269 3094 United Kingdom: Philips Semiconductors Limited, P.O. Box 65, Philips House, Torrington Place, LONDON, WC1E 7HD, Tel. (071)436 41 44, Fax. (071)323 03 42 United States: INTEGRATED CIRCUITS: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. (800)234-7381, Fax. (708)296-8556 DISCRETE SEMICONDUCTORS: 2001 West Blue Heron Blvd., P.O. Box 10330, RIVIERA BEACH, FLORIDA 33404, Tel. (800)447-3762 and (407)881-3200, Fax. (407)881-3300 Uruguay: Coronel Mora 433, MONTEVIDEO, Tel. (02)70-4044, Fax. (02)92 0601 For all other countries apply to: Philips Semiconductors, International Marketing and Sales, Building BAF-1, P.O. Box 218, 5600 MD, EINDHOVEN, The Netherlands, Telex 35000 phtcnl, Fax. +31-40-724825 SCD31 (c) Philips Electronics N.V. 1994 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 533061/1500/03/pp20 Document order number: Date of release: June 1994 9397 734 10011