SAM E70 Xplained Ultra User's Guide Introduction This user's guide provides detailed information about the SAM E70 Xplained Ultra Evaluation kit and its various features. Figure below illustrates the SAM E70 Xplained Ultra Evaluation kit. Figure 1. SAM E70 Xplained Ultra Evaluation Kit with PHY Daughter Board Features * ATSAME70Q21 Microcontroller * One Mechanical Reset Button * One Mechanical User Push Button * Two User LEDs * 12.0 MHz Oscillator (DSC6003) * 32.768 kHz Oscillator (DSC6083) * 2-MB SDRAM * 4-MB QSPI Flash (SST26VF032BA) (c) 2019 Microchip Technology Inc. DS70005389A-page 1 * Ethernet Interface with External IEEE 802.3az 10Base-T/100Base-TX Ethernet RMII PHY on a Daughter Board * AT24MAC402 256KB EEPROM with EUI-48 Address * ATA6561 CAN Transceiver * Micro SD Card Connector with SDIO Support * Camera Interface Connector * Two Xplained Pro Extension Headers * Graphics Card Interface (R) * CoreSight 20 Connector for 4-bit ETM * Arduino MEGA Shield Connector * External Debugger Connector * USB Interface, Device and Host Mode * Embedded Debugger: - Programming and debugging through USB interface (R) - Auto-ID for board identification in Atmel Studio and MPLAB X - One yellow status LED - One green board power LED - Symbolic debug of complex data types including scope information - Data Gateway Interface: SPI, I2C, four GPIOs - Virtual COM port (CDC) * External Power Input (5-14V) or USB Power (R) * X32 Daughter Board Interface to Support Audio and Bluetooth * One mikroBusTM Interface Kit Overview The Microchip PIC32 SAM E70 Xplained Ultra Development Kit (DM320113) provides a modular (R) development system for Microchip's line of 32-bit Cortex microcontrollers. For a free Microchip demonstration code and additional information, visit the MPLAB HarmonyTM web page at: http://www.microchip.com/MPLABHarmony. The Atmel SAM E70 Xplained Ultra Dvelopment Kit is a hardware platform to evaluate the Microchip ATSAME70Q21. The kit offers a set of features that enables the ATSAME70Q21 users to start with the SAM E70 peripherals and understand how to integrate the device in their design. The SAM E70 Xlpained Ultra kit contains the following items: * One SAM E70 Xplained Ultra Development Kit * One KSZ8061 Ethernet PHY * One Graphics card set up for 565 (16-bit color) graphics Note: If any items are missing in the kit, contact Microchip sales office for assistance. A list of Microchip Sales offices is provided on the last page of this document. The figure below illustrates the SAM E70 Xplained Ultra Evaluation Kit features. (c) 2019 Microchip Technology Inc. DS70005389A-page 2 Figure 2. SAM E70 Xplained Ultra Evaluation Kit (c) 2019 Microchip Technology Inc. DS70005389A-page 3 The table below provides the SAM E70 Xplained Ultra Evaluation kit feature descriptions. Table 1. SAM E70 Xplained Ultra Evaluation Kit Feature and Location Number Description 1 CAN interface 2 X32 Daughter Board interface 3 Mikro interface 4 Ethernet PHY interface 5 Ethernet Clock enable/disable jumper 1. Shorted = disabled 2. Open = enabled 6 EXT1/EXT2 interface 7 Debugger USB 1. Programming 2. Power 3. DGI 8 External Reset Button 9 User Button 10 MCU current measurement jumper 11 SAM E70 Host/Device USB 12 CoreSite 20 (SWD + ETM) debugging interface 13 Barrel power input (2.1mm) 14 User defined LEDs 15 LED2/USB detect jumper 16 Image Sensor interface 17 SWD debugger interface 18 Graphics card interface 19 ATSAME70Q21B 20 SQI external Flash memory (R) (c) 2019 Microchip Technology Inc. DS70005389A-page 4 Table of Contents Introduction......................................................................................................................1 1. Getting Started.......................................................................................................... 6 2. Xplained Ultra............................................................................................................ 8 3. Embedded Debugger................................................................................................ 9 3.1. Hardware Identification System....................................................................................................9 4. System Level Block Diagram................................................................................... 11 5. Hardware Features..................................................................................................12 5.1. 5.2. 5.3. 5.4. 5.5. 5.6. 5.7. 5.8. 5.9. 5.10. 5.11. 5.12. 5.13. 5.14. Xplained Pro Standard Extension Header..................................................................................12 Graphics Connectors or GFX Card Interface............................................................................. 13 SDRAM and LCD Connections.................................................................................................. 16 Camera Connector..................................................................................................................... 18 USB Connectivity....................................................................................................................... 19 Chip Erase Header.....................................................................................................................20 Audio Connectivity......................................................................................................................20 mikroBUSTM Header................................................................................................................... 22 CAN............................................................................................................................................22 Ethernet......................................................................................................................................23 Debug USB Connectivity............................................................................................................24 Switches..................................................................................................................................... 24 AT24MAC402 Serial EEPROM.................................................................................................. 25 Power Sources........................................................................................................................... 26 6. Hardware................................................................................................................. 28 6.1. 6.2. SAM E70 Xplained Ultra Development Board Schematics........................................................ 28 Bill of Materials........................................................................................................................... 50 The Microchip Web Site................................................................................................ 55 Customer Change Notification Service..........................................................................55 Customer Support......................................................................................................... 55 Microchip Devices Code Protection Feature................................................................. 55 Legal Notice...................................................................................................................56 Trademarks................................................................................................................... 56 Quality Management System Certified by DNV.............................................................57 Worldwide Sales and Service........................................................................................58 (c) 2019 Microchip Technology Inc. DS70005389A-page 5 Getting Started 1. Getting Started SAM E70 Xplained Ultra Evaluation Quick Start Follow these steps to explore the Atmel SAM E70 Xplained Ultra evaluation kit: 1. 2. 3. Download and install MPLAB X. Launch MPLAB X. Install MPLAB Harmony 3TM. When Microchip SAM E70 Xplained Ultra is connected to the computer for the first time, the operating (R) system will install a driver software. The driver file supports both 32-bit and 64-bit versions of Microsoft (R) Windows XP/ Vista /7/8/10. Once the kit is powered, the green power LED will be lit and MPLAB X will auto-detect the kit and identify which Xplained Pro extension boards are connected. MPLAB X will provide relevant information like data sheets and kit documentation. The SAM E70 device is programmed and debugged by the on-board Embedded Debugger, hence no external programmer or debugger tool is needed. Design Documentation and Relevant Links The following list provides links to the relevant documents and software for the SAM E70 Xplained Ultra. * Xplained Pro products - Atmel Xplained Pro is a series of small-sized and easy-to-use evaluation kit for Microchip microcontrollers and other Microchip products. It consists of a series of low-cost MCU boards for evaluation and demonstration of features and capabilities of different MCU families. (R) * Microchip MPLAB Integrated Development Environment - A free Microchip MPLAB IDE for development of C/C++ and assembler code for Microchip microcontrollers. * MPLAB HarmonyTM - A free MPLAB Harmony code base is available for user application. The latest MPLAB Harmony code is available for download at:http://www.microchip.com/MPLABHarmony. * EDBG User Guide - This user's guide provides additional information about the on-board Embedded Debugger. * Data Visualizer - Data Visualizer is a program used for processing and visualizing data. The Data Visualizer can receive data from various sources, such as the Embedded Debugger Data Gateway Interface that is found on the Xplained Pro boards and COM ports. (R) (R) * IAR Embedded Workbench for ARM - A commercial C/C++ compiler that is available for ARM. A 30-day evaluation version and a code size limited kick-start version are also available for download from their web site. The code size limit is 16-KB for devices with M0, M0+, M1 cores, and 32-KB for devices with other cores. * Keil MDK-ARM Microcontroller Development Kit (R) - The MDK-ARM is a complete software development environment for Cortex -M, Cortex-R4, ARM7TM, and ARM9TM processor-based devices. The MDK-ARM is specifically designed for microcontroller applications, it is user friendly yet powerful enough for the most demanding embedded applications. * Design Documentation (c) 2019 Microchip Technology Inc. DS70005389A-page 6 Getting Started - Package containing schematics, BOM, assembly drawings, 3D plots, layer plots, and so on. * Hardware Users Guide - PDF version of this user guide. (c) 2019 Microchip Technology Inc. DS70005389A-page 7 Xplained Ultra 2. Xplained Ultra The SAM E70 Xplained Ultra implements several Xplained Pro standards like extension headers and connectors. Xplained Pro is an evaluation platform that provides a full Microchip microcontroller experience. The platform consists of a series of Microcontroller (MCU) boards and extension boards that are integrated with the Microchip MPLAB IDE that supports data streaming. The Xplained Pro MCU boards support a wide range of Xplained Pro extension boards, such as audio DACs/CODECs, Ethernet PHYs, graphics cards, and mikroBUSTM that are connected through a set of standardized headers and connectors. Each extension board has an identification (ID) chip to uniquely identify which boards are connected to a Xplained Pro MCU board. This information is used to present relevant user guides, application notes, data sheets, and example code through MPLAB X. (c) 2019 Microchip Technology Inc. DS70005389A-page 8 Embedded Debugger 3. Embedded Debugger The SAM E70 Xplained Ultra contains Microchip Embedded Debugger (EDBG) for on-board debugging. The EDBG is a composite USB device, which is based on the following interfaces: * Debugger * Virtual COM Port * Data Gateway Interface (DGI) Together with the Microchip MPLAB IDE, the EDBG debugger interface can program and debug the ATSAME70Q21. On the SAM E70 Xplained Ultra, the SWD interface is connected between the EDBG and the ATSAME70Q21. The Virtual COM Port is connected to a UART on the ATSAME70Q21 and provides an easy way to communicate with the target application through the terminal software. It offers variable baud rate, parity, and Stop bit settings. The settings on the ATSAME70Q21 must match the settings given in the terminal software. Note: If not set automatically, Data Terminal Ready (DTR) must be set in the terminal software. The DGI consists of several physical interfaces for communication with the host computer. Communication over the interfaces is bidirectional. It can be used to send events and values from the ATSAME70Q21, or as a generic printf-style data channel. Traffic over the interfaces can be timestamped on the EDBG for accurate tracing of events. Note that timestamping imposes an overhead that reduces maximal throughput. The Data Visualizer is used to send and receive data through DGI. The EDBG controls two LEDs on SAM E70 Xplained Ultra: a power LED and a status LED. The following table describes how the LEDs are controlled in different operation modes. Table 3-1. EDBG LED Control Operation Mode Power LED Status LED Normal operation The power LED is lit when power is applied to the board. Activity indicator, LED flashes when any communication happens to the EDBG. Bootloader mode (idle) The power LED and the status LED blinks simultaneously. The power LED and the status LED blinks simultaneously. Bootloader mode (firmware upgrade) The power LED and the status LED blinks in an alternating pattern. The power LED and the status LED blinks in an alternating pattern. For additional information on EDBG, refer to the EDBG User Guide. 3.1 Hardware Identification System All Xplained Pro-compatible extension boards have an Microchip ATSHA204 CryptoAuthenticationTM chip mounted. This chip contains information that identifies the extension with its name and data. When an Xplained Pro extension is connected to an Xplained Pro MCU board, the information is read and sent to the MPLAB X IDE. The Microchip kits extension, installed with MPLAB X, provides relevant information, such as code examples, and links to relevant documents. The following table provides the data fields stored in the ID chip with content examples. (c) 2019 Microchip Technology Inc. DS70005389A-page 9 Embedded Debugger Table 3-2. Xplained Pro ID Chip Content Example Data Field Data Type Example Manufacture ASCII string Microchip'\0' Product Name ASCII string Product Revision ASCII string 04'\0' Product Serial number ASCII string 1774020200000010'\0' Minimum Voltage (mV) uint16_t 3000 Maximum Voltage (mV) uint16_t 3600 Maximum Current (mA) uint16_t 30 (c) 2019 Microchip Technology Inc. DS70005389A-page 10 System Level Block Diagram 4. System Level Block Diagram The following figure illustrates the high-level signal block diagram of the SAM E70 Xplained Ultra Development Kit. Figure 4-1. Signal Level Block Diagram Wire buses that are tied together are connected together. In this system the SPI bus data and clock are shared across several interfaces. The SPI Slave selects are addressed individually with GPIO. System I2C uses I2C0 and connects to the debugger, EXT1, EXT2, and mikroBus/X32. Touch I2C uses I2C2 and only goes from the microcontroller to the graphics connector. The debugger has the following interfaces connected: DGI SPI, DGI I2C, DGI UART, and SWD. UART wires from the microcontroller to the blocks are not shared with each other. (c) 2019 Microchip Technology Inc. DS70005389A-page 11 Hardware Features 5. Hardware Features 5.1 Xplained Pro Standard Extension Header All Xplained Ultra Kits have many dual row, 20-pin, 100 mil extension headers. Xplained Ultra MCU boards have male headers, while Xplained Ultra extensions have their female counterparts as shown in the image below. Note: All pins are not always connected. The extension headers can be used to connect a variety of Xplained Pro extensions to Xplained Ultra MCU boards or to access the pins of the target MCU on Xplained Ultra MCU boards directly. Figure 5-1. Extension Headers All connected pins follow the defined pinout description as shown in the following table. Table 5-1. Xplained Pro Standard Extension Header Pin number Name Description 1 ID Communication line to the ID chip on an extension board 2 GND Ground 3 ADC(+) Analog-to-Digital Converter, alternatively positive part of differential ADC 4 ADC(-) Analog-to-Digital Converter, alternatively negative part of differential ADC 5 GPIO1 General purpose I/O 6 GPIO2 General purpose I/O 7 PWM(+) Pulse-Width Modulation, alternatively positive part of differential PWM 8 PWM(-) Pulse-Width Modulation, alternatively negative part of differential PWM 9 IRQ/INT/GPIO Interrupt request line and general purpose I/O 10 SPI SS B/GPIO SPI Slave Select or general purpose I/O 11 I2C SDA Data line for I2C interface. Always implemented, bus type 12 I2C SCL Clock line for I2C interface. Always implemented, bus type 13 UART RX Receiver line of target device UART (c) 2019 Microchip Technology Inc. DS70005389A-page 12 Hardware Features ...........continued 5.2 Pin number Name Description 14 UART TX Transmitter line of target device UART 15 SPI SS A/GPIO SPI Slave Select or general purpose I/O 16 SPI MOSI Master Out Slave In line of serial peripheral interface. Always implemented, bus type. 17 SPI MISO Master In Slave Out line of serial peripheral interface. Always implemented, bus type. 18 SPI SCK Clock for serial peripheral interface. Always implemented, bus type. 19 GND Ground 20 VCC Power for extension boards (3.3V) Graphics Connectors or GFX Card Interface The SAM E70 Xplained Ultra Development Kit is designed to have a modular graphics interface. This interface enables using several graphics cards, which allow for expandability and different use cases. A 565 adapter card is included in the kit, which takes 16-bit parallel LCD data and converts it to 24-bit data. This card also provides access to ADC for resistive touch screens, hence an external controller is not needed. See table below for pin descriptions. Table 5-2. Graphics Interface Pinout Pin Number Name Description 1 GND Ground 2 GND Ground 3 MCLR Master Clear, Controlled by the debuggers. Allows for a complete system reboot. 4 IRQ1 (LCD Touch) Interrupt request line for cap touch device 5 5.0v VCC 5.0v 6 IRQ2 (Q Touch) Interrupt request line for Q touch devices 7 LCDEN LCD Data Enable 8 IRQ3 (Display Controllers) Interrupt request line for external display controllers 9 LCDHSYNC/NCS3 LCD Horizontal Sync 10 IRQ4 (Resistive touch) Interrupt request line for resistive touch controllers 11 LCDVSYNC/nWE LEC Vertical Sync or Write enable (active-low) 12 5.0v VCC +5.0v 13 LCDPCK/nRD LCD pixel Clock or Read Enable (active-low) 14 I2C SDA Data line for I2C interface. Always implemented, bus type. (c) 2019 Microchip Technology Inc. DS70005389A-page 13 Hardware Features ...........continued Pin Number Name Description 15 LCD D0 LCD Data bit 0 16 I2C SCL Clock line for I2C interface. Always implemented, bus type. 17 LCD D1 LCD Data bit 1 18 SPI SCK Clock for serial peripheral interface. Always implemented, bus type. 19 LCD D2 LCD Data bit 2 20 SPI MOSI Master Out Slave In line of serial peripheral interface. 21 LCD D3 LCD Data bit 3 22 SPI MISO Master In Slave Out line of serial peripheral interface. 23 LCD D4 LCD Data bit 4 24 SPI SS SPI Slave Select 25 LCD D5 LCD Data bit 5 26 UART RX Receiver line of target device UART 27 LCD D6 LCD Data bit 6 28 UART TX Transmitter line of target device UART. (from MCU to GFX card) 29 LCD D7 LCD Data bit 7 30 UART RTS UART Ready To Send (from MCU to GFX card) 31 LCD D8 LCD Data bit 8 32 UART CTS UART Clear To Send (from MCU to GFX card) 33 LCD D9 LCD Data bit 9 34 LCD PWM LCD PWM back light control 35 LCD D10 LCD Data bit 10 36 PWM2 Pulse-Width Modulation, 37 LCD D11 LCD Data bit 11 38 GPIO1 General purpose I/O 39 LCD D12 LCD Data bit 12 40 GPIO2 General purpose I/O 41 LCD D13 LCD Data bit 13 42 GPIO3 General purpose I/O 43 LCD D14 LCD Data bit 14 (c) 2019 Microchip Technology Inc. DS70005389A-page 14 Hardware Features ...........continued Pin Number Name Description 44 STBY/RST/GPIO4 Standby/Reset or general purpose I/O. For resetting devices attached to the GFX connector. 45 LCD D15 LCD Data bit 15 46 STBY/RST/GPIO5 Standby2/Reset2 or general purpose I/O 47 LCD D16 LCD Data bit 16 (Not Implemented on this design) 48 ID pin Communication line to the ID chip on an extension board 49 LCD D17 LCD Data bit 17 (Not Implemented on this design) 50 ADC 0 Analog-to-Digital Converter to MCU 51 LCD D18 LCD Data bit 18 (Not Implemented on this design) 52 ADC1 Analog-to-Digital Converter to MCU 53 LCD D19 LCD Data bit 19 (Not Implemented on this design) 54 ADC2 Analog-to-Digital Converter to MCU 55 LCD D20 LCD Data bit 20 (Not Implemented on this design) 56 ADC3 Analog-to-Digital Converter to MCU 57 LCD D21 LCD Data bit 21 (Not Implemented on this design) 58 ADC4 Analog-to-Digital Converter to MCU 59 LCD D22 LCD Data bit 22 60 ADC5 Analog-to-Digital Converter to MCU 61 LCD D23 LCD Data bit 23 62 ADC6 Analog-to-Digital Converter to MCU 63 3.3V VCC +3.3V VCC 64 ADC7 Analog-to-Digital Converter to MCU 65 GND Ground 66 3.3V VCC +3.3V VCC 67 GND Ground 68 GND TAB Mounting Tab 69 GND TAB Mounting Tab (c) 2019 Microchip Technology Inc. DS70005389A-page 15 Hardware Features 5.3 SDRAM and LCD Connections The external bus interface (EBI) on SAM E71 Xplaned Ultra is controlled by the static memory controller (SMC) and SDRAM controllers modules in the ATSAME70Q21B. ATSAME70Q21B has on-die series termination on very I/O pin as shown in figure below. Figure 5-2. On-Die Termination The EBI is connected to the on-board SDRAM and the Xplained Pro Graphics connector. The following figure shows how the SDRAM and LCD share the same sets of data pins, and displays the location of the series termination resistors. Figure 5-3. LCD and SDRAM As the I/O pins have on-die series termination, the impedance of the drivers must be matched to the impedance of the EBI tracks on the PCB using series resistors. The EBI tracks are routed as 50 on SAM E70 Xplained Ultra. The clock and address lines are only driven by the ATSAME70Q21B, while the data lines are driven by the ATSAME70Q21B and the on-board SDRAM. (c) 2019 Microchip Technology Inc. DS70005389A-page 16 Hardware Features Simulation of the transmissions lines using IBIS files for the ATSAME70Q21B and the SDRAM gave the results are shown in the table below. Table 5-3. EBI Simulation Results Driving Circuit Signal Type Driver Impedance Series (from ibis) Termination Z0 ATSAME70Q21B Data/Address 22 24 22 50 Clock 21 25 22 50 Data 11 32 33 50 SDRAM The routing of the data lines to the LCD connector causes stubs on the data lines at the SDRAM (the stubs are even longer when a cable is plugged in). The 200 resistors are placed close to the SDRAM to create a high-impedance path for the signal to the stubs, improving the signal integrity when communicating with the SDRAM. TIP: * The series-termination is always placed near to the driving pin. * The 200 resistors are placed close to the intersection between the SDRAM routing and the routing to the LCD connector. * All designs must be simulated using an IBIS file for the ATSAMV71Q21B and the target peripherals to check whether the signals are within the limits of the devices. (c) 2019 Microchip Technology Inc. DS70005389A-page 17 Hardware Features 5.4 Camera Connector A 2 x 15, 100 mil pin-header camera connector is implemented to provide access to the SAM E70's parallel Image Sensor Interface (ISI). Table 5-4. Camera Interface Pin Description Pin Number Name Function 1 VCC +3.3v 2 GND Ground 3 VCC +3.3v 4 GND Ground 5 Reset Reset 6 PWD ISI PWD 7 I2C SCK Clock line for I2C interface. Always implemented, bus type. 8 I2C SDA Data line for I2C interface. Always implemented, bus type. 9 GND Ground 10 MCK Master Clock 11 GND Ground 12 VSYNC Image Sensor Vertical Sync 13 GND Ground 14 HSYNC Image Sensor Horizontal Sync 15 GND Ground 16 Pixel Clock Image Sensor Pixel Clock 17 GND Ground 18 ISI D0 Image Sensor Data Bit 0 19 ISI D1 Image Sensor Data Bit 1 20 ISI D2 Image Sensor Data Bit 2 21 ISI D3 Image Sensor Data Bit 3 22 ISI D4 Image Sensor Data Bit 4 23 ISI D5 Image Sensor Data Bit 5 24 ISI D6 Image Sensor Data Bit 6 25 ISI D7 Image Sensor Data Bit 7 26 ISI D8 Image Sensor Data Bit 8 27 ISI D9 Image Sensor Data Bit 9 28 ISI D10 Image Sensor Data Bit 10 (c) 2019 Microchip Technology Inc. DS70005389A-page 18 Hardware Features ...........continued 5.5 Pin Number Name Function 29 ISI D11 Image Sensor Data Bit 11 30 GND Ground USB Connectivity Users can connect to the PIC32 USB microcontroller using any one of the following modes: * Host mode: If connecting the device to the Type-A/B Micro connector, an adapter is required. Using this method, a maximum of 400 mA can be supplied from the debug USB port to the host port. If a full 500 mA supply is needed, an external supply must be connected to the application board. * Device mode: Connect the SAM E70 to the target USB Micro-A/B port using a USB cable. This is enough to power the board as a device. If programming and debugging is required, connect the Debug USB Micro-A/B port. The other end of the cable must have a Type-A connector, to connect it to a USB host. * On-The-Go (OTG) mode: Connect the starter kit to the OTG device by using an OTG Micro-A/B cable to the Micro-A/B port. There is a 1x3, 100mil pin-header marked VBUS on the kit. The PB08 pin on the SAM E70 can be connected to the LED2 or to the target USB VBUS DETECT signal by placing a jumper between pin 1 and pin 2, or pin 2 and pin 3 on this pin-header. The USB VBUS DETECT is the target USB voltage divided by 1.64. When connected to the PB08 pin the signal can be used to detect power on the target USB connector. Table 5-5. USB Jumper Description Pin number Name Description 1 LED2 LED2 active-low 2 PB08 Pin and Port to microcontroller 3 VBUS_ Detect VBUS Detect, used to detect when a device cable (micro-B) is plugged into the SAM E70 The SAM E70 Xplained Ultra has a Micro-USB connector to use with the SAM E70 USB module labeled as TARGET USB on the kit. In USB Host mode, the VBUS voltage is provided by the kit, and must be enabled by setting the VBUS Host Enable pin to low. When a USB OTG cable is plugged in, it will automatically trigger the power supply. Table 5-6. USB Interface Pin Description Pin on SAM USB Function PA08 VBUS Host Enable HSDM USB - HSDP USB + (c) 2019 Microchip Technology Inc. DS70005389A-page 19 Hardware Features 5.6 Chip Erase Header A 1x2 pin-header is connected to the SAM E70 chip erase pin, PB12, and 3V3 is marked ERASE. This header can be used to chip erase the SAM E70 by placing the jumper on the header and toggle power to the board. After the power is toggled, the jumper must be removed. Using the chip erase jumper may be the only way to erase a chip with the security bit set, and applications that immediately set invalid clock options, or go into deep sleep without any wake-up sources enabled. 5.7 Audio Connectivity The SAM E70 provides an audio connection through the X32 interface to the two main audio modules in the chip, such as the SSC and the I2S. On this board the SSC interface is considered the main audio interface. See image below. There is a 32-pin interface to the board to support the audio codec or DACs and Bluetooth radios. This interface has two audio supply interfaces, such as the SSC and the I2S. Addition to this other control lines and data interfaces are available. Figure 5-4. SSC/I2S Block Diagram Table 5-7. X32 Audio Interface Pin Description Pin Number Name Description Interface 1 Ground Power GND (c) 2019 Microchip Technology Inc. DS70005389A-page 20 Hardware Features ...........continued Pin Number Name Description Interface 2 GND Ground Power 3 UART RX UART RX, receive to MCU from DB UART 4 UART CTS UART Clear to send UART 5 UART TX UART TX, transmit from MCU to DB UART 6 UART RTS UART Ready to send UART 7 I2C SCL Clock line for I2C interface I2C 8 STBY/RST Standby/Reset control GPIO 9 I2C SDA Data line for I2C interface I2C 10 Audio WS/LRCLK Audio Word Select/ Left Right Clock SSC 11 Audio In Audio into MCU, out from CODEC SSC 12 Audio CLK Audio clock SSC 13 Audio out Audio out of MCU, in to CODEC/DAC SSC 14 REFCLK/MCK Reference clock #1 REFCLK 15 GND Ground - 16 GND Ground - 17 NC Legacy hold over - 18 +3.3v VDD - 19 NC Legacy hold over - 20 +5.0v VDD - 21 (1) Audio WS/ Audio LRCLK Audio Word Select/ Left Right Clock I2S 22 (2) ADC/Card ID pin Analog-to-Digital Converter to read voltage on the daughter card ADC 23 (3) Audio CLK Audio Clock I2S 24 (4) NC - - 25 (5) Audio IN Audio into MCU, out from CODEC I2S 26 (6) NC 27 (7) Audio OUT Audio out of MCU, in to CODEC/DAC I2S 28 (8) NC - - 29 (9) REFCLK2/MCK2 Reference clock #2 REFCLK 30 (10) NC - - 31 (11) GND Ground - (c) 2019 Microchip Technology Inc. - DS70005389A-page 21 Hardware Features ...........continued 5.8 Pin Number Name Description Interface 32 (12) Ground - GND mikroBUSTM Header The mikroBUSTM interface enables using the additional click boards. For additional information and to identify the boards to be used with this development kit, visit the following web site: https:// www.mikroe.com/. Table 5-8. mikroBUSTM interface Pin Description 5.9 Pin Number Name Function 1 GND Ground 2 +5V +5.0V 3 SDA I2C SDA 4 SCL I2C SCL 5 TX UART TX 6 RX UART RX 7 INT Interrupt request line 8 PWM Pulse-Width Modulation 9 GND Ground 10 +3.3V Ground 11 MOSI Master Out Slave In line of serial peripheral interface 12 MISO Master In Slave Out line of serial peripheral interface 13 SCK Clock for serial peripheral interface 14 CS Chip Select for serial peripheral interface. (Active-low) 15 RST Reset 16 AN Analog-to-Digital Converter. CAN The development kit provides access to the a CAN-FD interface that is post transceiver. The SAM E70 Xplained Ultra has two MCAN modules that perform communications according to ISO11898-1 (Robert Bosch GmbH CAN specification 2.0 part A and B). Bosch CAN FD specification V1.0. MCAN1 is connected to an on-board ATA6561 CAN physical-layer transceiver. These connections are described in the following table. (c) 2019 Microchip Technology Inc. DS70005389A-page 22 Hardware Features Table 5-9. Connections Between the ATSAME70Q21 and the ATA6561 5.10 Pin Number Name Description 1 CAN_H CAN High Signal 2 GND Ground 3 CAN_L CAN Low Signal Ethernet The SAM E70 Xplained Ultra kit has a modular Ethernet PHY system that allows for different PHYs to be plugged into the board. This interface is set up to use a Reduced Media-Independent Interface (RMII), as well as a SPI bus interface with GPIO. Figure 5-5. Ethernet PHY Header Configuration Table 5-10. Ethernet Interface Pinout Description Pin Number Name Description 1 GPIO General purpose I/O 2 GPIO General purpose I/O 3 RXD1 Receive Data 1 4 RXD0 Receive Data 0 (c) 2019 Microchip Technology Inc. DS70005389A-page 23 Hardware Features ...........continued 5.11 Pin Number Name Description 5 RXER Receive Error 6 RXDV Receive Data Valid 7 MDC - 8 MDIO - 9 IRQ Interrupt request line 10 RESET Reset control to the Ethernet PHY 11 GPIO General purpose I/O 12 EGND Shield Ground 13 (1) TXEN Transmit Enable 14 (2) TXD0 Transmit Data 15 (3) TDX1 Transmit Data 16 (4) MOSI Master Out Slave In line of serial peripheral interface 17 (5) MISO Master In Slave Out line of serial peripheral interface 18 (6) GND Ground 19 (7) NC No Connect 20 (8) REFCLK (in) Reference Clock input (50 MHz) 21 (9) GND GND 22 (10) +3.3v VDD +3.3V VDD 23 (11) CS Chip Select for serial peripheral interface 24 (12) SCK Clock for serial peripheral interface 25 -30 EGND Shield Ground Debug USB Connectivity The starter kit includes an EDBG USB microcontroller that provides debugger connectivity over the USB. The EDBG MCU is hard-wired to the SAM E70 device to provide protocol translation. An external programmer, such as MPLAB ICD4, may be used with the development kit through either the SWD interface or through the Coresite 20 interface. 5.12 Switches The starter kit provides the following two push button switches. The push button switches do not have any debounce circuitry and require the use of internal pull-up resistors. This enables the user to investigate the software debounce techniques. When Idle, the switches are pulled high (+3.3V,) and when pressed, they are grounded. (c) 2019 Microchip Technology Inc. DS70005389A-page 24 Hardware Features * User switch * Reset switch 5.13 AT24MAC402 Serial EEPROM The development board has an on-board 2-Kbit I2C serial EEPROM which is available for user applications. This serial EEPROM has a unique EUI-48, EUI-64, and 128-bit serial number. The unique number can be seen in the Microchip MPLAB Xplained window or Atmel Studio Xplained window after the kit has been plugged into the PC. Figure 5-6. SAM E70 Xplained Ultra Window Note: The above figure provides an example of the Xplained window with the MAC48 address. Users can change the device address using the solder pads on the board, but all address bits have been defaulted to one, refer to schematics for additional information. For additional usage information of on this part, refer to "AT24MAC402 and AT24MAC602 data sheet", which is available for download from the (c) 2019 Microchip Technology Inc. DS70005389A-page 25 Hardware Features following location: http://ww1.microchip.com/downloads/en/DeviceDoc/Atmel-8807-SEEPROMAT24MAC402-602-Datasheet.pdf. 5.14 Power Sources The SAM E70 Xlplained Ultra evaluation kit has several power systems to it. This section covers the power sub system in detail. Figure below shows a high-level block diagram of the power system. Figure 5-7. Power Sources Block Diagram The following options can be used to power the development kit: * Using the Micro-USB connector that is connected to the EDBG known as Debug USB. * Using the Micro-USB connector which is known as Target USB. * Using the Barrel Jack. This input can take a large range of power inputs from 5.5V to 19V. * Using the Arduino headers. This has several options one must be careful of when using this method. Not all power rails are protected from the user error. VIN connects to the input side of the main buck supply (step down), and it is similar to the barrel jack (2.1 mm). * Using the 2 x 2 x 0.1 header, located on the side of the board, which has a 3.3v and 5.0v capable inputs. The SAM E70 Xplained Ultra kit can be powered by several power sources as described in the following table. (c) 2019 Microchip Technology Inc. DS70005389A-page 26 Hardware Features Table 5-11. Power Sources for SAM E70 Xplained Ultra Connector Marking Power Input Voltage Requirements Current Requirements External Power 5V 2% (100 mV) for USB host operation. 4.3V to 5.5V if USB host operation is not required. Recommended minimum current is 1A to be able to provide enough current for the connected USB devices and the board. Recommended maximum current is 2A due to the input protection maximum current specification. 5V0 Embedded Debugger USB 4.4V to 5.25V (according to USB spec.) 500 mA (according to USB spec.) DEBUG USB Target USB 4.4V to 5.25V (according to USB spec.) 500 mA (according to USB spec.) TARGET USB External Jack Input 5.5v to 19V 1A minimum, 2.5A is recommended. 6A maximum. VIN The development kit will detech and choose the available power sources based on the following options: * * * * External jack input External power Embedded debugger USB Target USB (c) 2019 Microchip Technology Inc. DS70005389A-page 27 VBUS_HOST_EN VBUS_HOST_EN (c) 2019 Microchip Technology Inc. DGI_I2C DGI_I2C ID_SYS TRACE ID_SYS TARGET_RESET TEST1 FF FF FF FF A11-0422 62 87 5F 0E 35 07 92 86 F4 6 4 9 8 0 2 F3 5 7 E8 9 6 9F 0C 4D 00 A11-0423 $ >_ A12-1342 FE A B 2 6 E0 FW1 TESTDOC1 A12-1341 PCBADOC1 SAM E70 Xplained Ultra Development Board Schematics SWD EXT2 EXT2 TRACE ID3/ID4 A08-2907 SAME70 Xplained Ultra PCB PCB1 SJ-5076 E4 SJ-5076 E3 Product number/revision Serial number A09-0611 Label PCBA LABEL1 SJ-5076 E2 SJ-5076 E1 6.1 SWD EXT1 EXT1 CAMERA U_SHT_6_Ext and Test Headers_R4 SHT_6_Ext and Test Headers_R4.SchDoc ID3/ID4 TARGET_RESET GFX-SYNC GFX-SYNC D8 D9 D10 EBI-GFX-DATA U_SHT_10_GFX Connector_R4 SHT_10_GFX Connector_R4.SchDoc ETHERNET CAN GFX-CTRL CAMERA EBI-GFX-DATA U_SHT_8_Ethernet and CAN_R4 SHT_8_Ethernet and CAN_R4.SchDoc I2C GFX-CTRL ETHERNET CAN I2C SD_CARD SDRAM D10 D9 D8 SCREW M2.5x5mm Pan Phillip Screw S2 SCREW M2.5x5mm Pan Phillip Screw S1 Hardware EDBG_SWD SDRAM SD_CARD EBI QSPI EBI PC11 QSPI U_SHT_7_Memory_R4 SHT_7_Memory_R4.SchDoc MikroBUS AUDIO U_SHT_9_MikroBUS and X32 Audio_R4 SHT_9_MikroBUS and X32 Audio_R4.SchDoc PC11 MikroBUS AUDIO SPI SPI ADCH ADCH DIG ADCL DIG COM IOL IOL COM ADCL IOH U_SHT_5_Shield Headers_R4 SHT_5_Shield Headers_R4.SchDoc IOH 6. EDBG_SWD TARGET_RESET_SENSE DGI_GPIO DGI_GPIO TARGET_RESET_SENSE DGI_SPI EDBG_UART DGI_SPI EDBG_UART EDBG_TARGET_RESET TARGET_VOLTAGE U_SHT_3_EDBG_R4 SHT_3_EDBG_R4.SchDoc TARGET_VOLTAGE DETECT/LED TARGET_USB_N DETECT/LED TARGET_USB_P TARGET_USB_P EDBG_TARGET_RESET TARGET_RESET TARGET_USB_N U_SHT_2_Power_R4 SHT_2_Power_R4.SchDoc U_SHT_4_Target_MCU_R4 SHT_4_Target_MCU_R4.SchDoc Hardware DS70005389A-page 28 5 - 14V DC - 1.5 A GND GND 2 VBUS DD+ ID GND SHIELD1 SHIELD2 SHIELD3 SHIELD4 EGND_MCU 1 2 3 4 5 6 7 8 9 R200 0R EGND_MCU DNP C200 4.7n ZX62D-AB-5P8 J200 GND GND GND IO3 IO2 IO1 1 2 4 TPD3E001DRLR D200 GND GND VCC TARGET_USB_N TARGET_USB_P VCC_TARGET_USB_P5V0 R203 22uF VCC_TARGET_P3V3 J202 HEADER 2x2 1125-1202S0R138R1 Power Connector G GND C201 When Vin = 5V the regulator uses a 100% duty-cycle mode (passthrough). NEB 21 R VIN 3 1 Q200 IRLML5203PBF 10k 1 2 3 1 3 2 4 1M R201 4.7uF C205 SGND C203 1uF 26 2 5 6 7 8 21 27 13 14 15 16 17 18 19 25 23 GND TARGET_USB_N TARGET_USB_P GND Q201 AO3413 D202 1 GND 2 C207 R209 PA08 3 Q203 FDN304P R212 1 C208 BoS GND D204 1 Q204 MOSFET_P_GSD IRLML5203PBF R211 GND C209 4.7nF R210 SGND VCC_P3V3 2 D203 MBR230LSFT1 2 1 R208 100n 2 MBR230LSFT1 VCC_IN_P5V0 Vout=5.00 Vout=0.8 (1+(R209/R210)) C206 100n L200 XAL4020-222ME MBR230LSFT1 2 3 VBUS_HOST_EN R204 3 24 22 4 9 10 11 12 20 Polarity Protection MIC24052YJL-TR NC FB CS SW SW SW SW SW BST VCC_TARGET_USB_P5V0 EN PGND PGND PGND PGND PGND PGND VIN PVIN PVIN PVIN PVIN PVIN PVIN PVIN PG SGND U200 28 VDD 1 PVDD VCC_EDBG_USB_P5V0 GND 4.7uF C204 GND 2.2uF C202 1.2R 1 MBR230LSFT1 1 R202 10k 1k 19.6K J201 5 3 1 2.49K 475R BLM18PG471SN1 L201 3 EN VIN U201 GND NC VOUT 0R R215 4 6 3 1 PB08 GND DETECT/LED JS203 MTSW-103-08-L-S-276 2 J203 EL17-21SYGC D205 LED2 VCC_P3V3 EN VIN U202 4 5 GND C212 1uF NC VOUT 5 2 1 GND MIC5528-3.3YMT VOUT 3.3V linear regulator Target 500mA low noise LDO voltage regulator Noise: 28uVrms Accuracy 2% Dropout 500 mV at 500 mA (maximum) Quiescent current 38 uA Current limit 525 mA (minimum) Thermal shutdown and current limit protection C211 1uF VBUS_DETECT GND GND C210 1uF R214 0R 1 MIC5504-3.3YM5 Iout max = 300mA Accuracy 2% Low noise: 175 uVrms (10 Hz to 100 kHz) Dropout 150mV at full load Quiescent current 38 uA (no load) Current limit 900 mA (Max) Thermal shutdown and current limit protection Minimum capacitance required on output is 1uF (< 200mOhm ESR) VCC_P5V0 3.3V linear regulator EDBG and Accessories GND 2 D201 100k 2 100k 2 3 100uF/16V C213 10n GND 22u/10V C214 BLM18PG471SN1 L203 BLM18PG471SN1 L202 GND C215 C218 1uF VCC_EDBG_P3V3 C216 1uF VCC_P3V3 VCC_TARGET_P3V3 GND GND TARGET_VOLTAGE BLM18PG471SN1 L204 GND C217 R207 GREEN GND 3 EP 7 100n 100n 5V to 14V input, 5V out Power Supply, 2A R205 16k R206 30k R213 330R 2 1 R216 47k (c) 2019 Microchip Technology Inc. GND R217 47k VCC_EXT_P5V0_P14V0 Hardware DS70005389A-page 29 J300 VBUS DD+ ID GND SHIELD1 SHIELD2 SHIELD3 SHIELD4 GND GND EGND_EDBG R301 0R GND GND GND VCC 0R 0R 0R R311 R312 IO3 IO2 IO1 1 2 4 TPD3E001DRLR D300 0R 330R 0R 0R R307 330R R308 330R R309 330R R310 330R R305 R306 R317 Input filter on USB power input. GND C301 1 nF C0G BLM18PG471SN1 L300 R318 39R 3 GND GND 10p C303 EDBG_USB_FS_N EDBG_USB_FS_P EDBG_USB_HS_N EDBG_USB_HS_P ID1 EDBG_RESET EDBG_DGI_SCL EDBG_FORCE_BOOT EDBG_ADC0 DGI_GPIO0 DGI_GPIO1 DGI_GPIO2 DGI_GPIO3 EDBG_DGI_SDA PA00 / PA18 PA01 / PA17 PA02 / PX47 PA03 PA04 PA05 PA06 / PA13 PA07 / PA19 PA08 PA09 PA10 PA11 PA12 / PA25 PA14 / PX11 PA15 / PX45 PA16 PA20 / PX18 PA21 / PX22 PA22 / PX20 PA23 / PX46 PA24 / PX17 PA26 / PB05 PA27 PA28 PA29 PA30 PA31 C7 USB_VBIAS B9 DMFS B8 DPFS 1 2 XC300 GND 3 4 12.00MHz GND 2.2uF C306 GND 22p C309 ID2 AT32UC3A4256J-C1UR 2.2uF C308 1 nF C0G GND C307 VCC_EDBG_P3V3 GND GND 100n C305 BLM18PG471SN1 L301 GND 22p C304 A10 USB_VBUS A9 DMHS A8 DPHS G8 G10 E1 F9 E9 G9 E8 H10 F8 D8 C10 C9 G7 K7 J7 E7 H9 K10 H6 G6 J10 F7 A2 A1 B4 A4 C2 MOSFET_N_GSD DMN2075U Q301 VCC_EDBG_P3V3 EDBG_CDC_USART_RX EDBG_CDC_USART_TX GND R319 1 MOSFET_P_GSD IRLML5203PBF Q300 VCC_EDBG_P3V3 1 100k C302 1 nF C0G R316 39R VCC_EDBG_USB_P5V0 Current limiters, 10mA @3.3V SDA SCL DGI_GPIO0 DGI_GPIO1 DGI_GPIO2 DGI_GPIO3 TXD RXD ID4 ID2 ID1 R313 1k R314 1k R315 1k EDBG_FORCE_BOOT TP300 TP301 R302 R303 R304 EDBG_UART DGI_I2C R300 1M EGND_EDBG 4.7n DNP C300 1 2 3 4 5 6 7 8 9 Shield CONN USB MICRO B RECPT SMT R/A DGI_I2C TARGET_VOLTAGE DGI_GPIO EDBG_UART Connect the test points during startup of the EDBG to force it into bootloader mode. The test points should be covered with solder so that it is easier to get a good contact. DGI_GPIO 5 3 2 3 100k ID_4 ID_2 ID_1 J6 VDDANA H8 GNDANA ID_SYS VDDIN ID_SYS E10 VDDCORE F10 GNDCORE 2 6.81k R320 XIN0 XOUT0 K5 K6 A5 A6 B7 A7 PC00 / PX14 PC01 PC02 PC03 PC04 PC05 D9 GND 100n C310 VCC_EDBG_P3V3 GND 100n C311 100n C312 RESET_N 100n C313 J9 2.2uF C314 GND 0R EDBG_SPI_DGI_MISO EDBG_SPI_DGI_MOSI EDBG_SPI_DGI_SCK EDBG_SPI_DGI_SS R321 STATUS_LED_CTRL POWER_LED_CTRL C315 2.2uF VCC_EDBG_P3V3 EDBG_RESET_N EDBG_JTAG_TCK EDBG_JTAG_TDI EDBG_JTAG_TDO EDBG_JTAG_TMS VCC_EDBG_P3V3 GND G4 G2 G3 J1 H1 G1 F3 F4 E3 E4 D2 D1 D3 K4 D4 F1 H2 K1 J2 H4 J3 K2 K3 J4 G5 H5 K9 TCK K8 TDI J8 TDO H7 TMS PX00 PX01 PX02 PX03 PX04 PX05 PX06 PX07 PX08 PX09 PX10 PX12 PX13 PX15 / PX32 PX16 / PX53 PX19 / PX59 PX21 PX23 PX24 PX25 PX26 PX27 PX28 PX29 PX30 PX31 U300 R322 330R R323 330R R324 330R R325 330R GND TP307 TP306 TP302 TP303 TP304 TP305 R326 330R R327 0R R328 39R R329 0R DGI_SPI Programming interface of the embedded debugger. The test points will be connected by needles in the test fixture for programming. GND test point is TP400. MISO MOSI SCK SS R332 1M 2N7002DW 5 Q302A GND TARGET_RESET_SENSE 2N7002DW Q302B Current limiter, 10mA @3.3V 2 D302 EL17-21SYGC GREEN EL17-21UYC/A3 YELLOW LED 2 D301 EDBG_SWD LED 1 VCC_EDBG_P3V3 EDBG Power and Status LEDs TARGET_CHIP_RESET TRACESWO SWCLK EDBG_SWD SWDIO R330 1M EDBG_TARGET_RESET D10 VDDIN B10 GNDPLL EDBG_SWDIO EDBG_SWCLK B1 B2 B3 C4 A3 D7 D6 C6 C5 D5 C1 VDDIO VDDIO VDDIO VDDIO VDDIO VDDIO E5 B5 J5 B6 F2 F6 DGI_SPI PB00 PB01 PB02 PB03 PB04 PB06 PB07 PB08 PB09 PB10 PB11 GNDIO GNDIO GNDIO GNDIO GNDIO GNDIO F5 C3 H3 E2 C8 E6 2 1 R331 330R 6 1 2 1 R333 330R 3 (c) 2019 Microchip Technology Inc. 4 VCC_EDBG_P3V3 Hardware DS70005389A-page 30 CAN QSPI VCC_P3V3 USER LED PA13 PA12 PA17 PD31 PA14 PA11 PC14 PC12 PWMC1_PWML1 PWMC1_PWMH0 PWMC0_PWMH3 ISI_D11 GPIO_INT WKUP7/PIODC5(3) CANTX1 CANRX1 PC11 TRACESWO SWDIO SWCLK PA05 PA11 PC11 PA08 PB08 USER_LED0 USER_BUTTON0 GPIO VBUS HOST EN TP400 USER BUTTON PD08 PD04 PD05 PD06 PD07 TRACECLK TRACED0 TRACED1 TRACED2 TRACED3 TARGET_RESET GND PB05 PB06 PB07 PD18 PD17 PB01 RTS2 SCK2 TK R403 PA12 PA26 PA01 PWMC1_PWMH0 PWMC1_PWMFI1 WKUP1(1) 0R PA28 PB04 PA24 PA23 PA31 PB02 PA13 PB13 PB03 PWMC1_PWML1 SCK0 RTS0 PC14 PA18 PB00 PD19 PA05 PA29 PCK2 R404 TF CTS2 PWMC1_PWML3 TCLK2 CANTX1 PB06 PB07 PB05 PB12 SWDIO SWCLK TRACESWO ERASE PWMC1_PWMFI2 TXD1 RTS1 PWMC0_PWMH0 PWMC1_PWMH2 CTS0 PB06 PB07 PB05 PB12 SWDIO SWCLK TRACESWO ERASE PA25 PA21 PA30 PA18 PC12 PB04 PA21 TXD1 RXD1 PD12 PD22 PD21 PD20 PA02 PD28 PA23 PA09 SPI0_NPCS2 SPI0_SPCK SPI0_MOSI SPI0_MISO SPI0_SPCK SPI0_MOSI SPI0_MISO TARGET_RESET PD22 PD21 PD20 PA03 PA04 GPIO / EXT2 PIN9 GPIO / EXT1 PIN9 GPIO / LED0 GPIO / BTN0 R401 TWD0 TWCK0 CTS1 RXD1 PWMC1_PWMEXTRG0 PWMC1_PWMEXTRG1 CANRX1 0R 39R VBUS_HOST_EN DETECT/LED SWO SWDIO SWCLK nRESET TRACECLK TRACED0 TRACED1 TRACED2 TRACED3 CANTX CANRX IO0 IO1 IO2 IO3 CLK CS DIG53 DIG51 DIG49 DIG47 DIG45 DIG43 DIG41 DIG39 DIG37 DIG35 DIG33 DIG31 DIG29 DIG27 DIG25 DIG23 DIG22 DIG24 DIG26 DIG28 DIG30 DIG32 DIG34 DIG36 DIG38 DIG40 DIG42 DIG44 DIG46 DIG48 DIG50 DIG52 EDBG_SWD SWDIO SWCLK TRACESWO TARGET_CHIP_RESET DIG TRACE EDBG_UART TXD RXD DGI_GPIO3 DGI_GPIO2 DGI_GPIO1 DGI_GPIO0 SS SCK MOSI MISO SWDIO SWCLK TRACESWO TARGET_CHIP_RESET EDBG_UART DGI_GPIO DGI_SPI RESET SPI_SCK SPI_MOSI SPI_MISO SPI DGI_SPI SPI DGI_GPIO TRACE EDBG_SWD LED 3 GND NRST JTAGSEL C404 10p 44 61 95 115 135 138 GND_01 GND_02 GND_03 GND_04 GND_05 GND_06 VBG 9 VREFP 8 VREFN 140 C402 100n 100n VCC_TARGET_P3V3 HEADER 1x2 J400 JS400 C400 VDDIO PB12 ERASE 1 2 83 BLM18PG471SN1 L400 GND GND ADVREF VCC_TARGET_P3V3 100n C401 TP401 TP402 TARGET_RESET PE00 PE01 PE02 PE03 PE04 PE05 PB00 PB01 PB02 PB03 PB04 PB05 PB06 PB07 PB08 PB09 PB12 PB13 PA00 PA01 PA02 PA03 PA04 PA05 PA06 PA07 PA08 PA09 PA10 PA11 PA12 PA13 PA14 PA15 PA16 PA17 PA18 PA19 PA20 PA21 PA22 PA23 PA24 PA25 PA26 PA27 PA28 PA29 PA30 PA31 U400 137 HSDP 136 HSDM 4 6 7 10 27 28 21 20 26 31 105 109 79 89 141 142 87 144 102 99 93 91 77 73 114 35 36 75 66 64 68 42 51 49 45 25 24 23 22 32 37 46 56 59 62 70 112 129 116 118 85 TST TST JTAGSEL 104 XIN_12 XIN_32 TARGET_USB_P TARGET_USB_N PE00 PE01 PE02 PE03 PE04 PE05 PB12 PB13 PB00 PB01 PB02 PB03 PB04 PB05 PB06 PB07 PB08 PA08 PA09 PA10 PA11 PA12 PA13 PA14 PA15 PA16 PA17 PA18 PA19 PA20 PA21 PA22 PA23 PA24 PA25 PA26 PA27 PA28 PA29 PA30 PA31 PA00 PA01 PA02 PA03 PA04 PA05 PA06 R406 5.62k SWD EL17-21UYC/A3 YELLOW VDDIN DIG QSPI CAN VDDUTMII JS402 GND C409 10uF/10V GND C408 100n 100n C403 100n C405 GND 100n C406 VDDIO De-Coupling close to pins 30, 43, 72, 80 and 96 J402 Pin header 1x2 RA ATSAME70Q21B-ANT C407 100n VDDIO 134 VDDUTMII VDDPLLUSB 143 VDDPLLUSB SWD D400 R400 330R 2 1 PA05 USER_LED0 USER_BUTTON0 PA11 L401 L402 GND VDDCORE 100n C410 100n C411 GND 100n C415 PD00 PD01 PD02 PD03 PD04 PD05 PD06 PD07 PD08 PD09 PD10 PD11 PD12 PD13 PD14 PD15 PD16 PD17 PD18 PD19 PD20 PD21 PD22 PD23 PD24 PD25 PD26 PD27 PD28 PD29 PD30 PD31 1 132 131 128 126 125 121 119 113 110 101 98 92 88 84 106 78 74 69 67 65 63 60 57 55 52 53 47 71 108 34 2 GND 2.2uF C417 + Resistors R448 thru R467 are critical impedance termination resistors which must be placed as close as possible to the SDRAM data pins 100n C414 100n C416 GND 100n C418 VDDCORE De-Coupling close to pins 29, 33, 50, 81 and 107 JS401 GND 100n C412 J401 HEADER 1x2 VDDCORE GND 100n C413 PC00 PC01 PC02 PC03 PC04 PC05 PC06 PC07 PC08 PC09 PC10 PC11 PC12 PC13 PC14 PC15 PC16 PC17 PC18 PC19 PC20 PC21 PC22 PC23 PC24 PC25 PC26 PC27 PC28 PC29 PC30 PC31 11 38 39 40 41 58 54 48 82 86 90 94 17 19 97 18 100 103 111 117 120 122 124 127 130 133 13 12 76 16 15 14 VDDOUT PD00 PD01 PD02 PD03 PD04 PD05 PD06 PD07 PD08 PD09 PD10 PD11 PD12 PD13 PD14 PD15 PD16 PD17 PD18 PD19 PD20 PD21 PD22 PD23 PD24 PD25 PD26 PD27 PD28 PD29 PD30 PD31 PC00 PC01 PC02 PC03 PC04 PC05 PC06 PC07 PC08 PC09 PC10 PC11 PC12 PC13 PC14 PC15 PC16 PC17 PC18 PC19 PC20 PC21 PC22 PC23 PC24 PC25 PC26 PC27 PC28 PC29 PC30 PC31 PWMC0_H1 PWMC0_H2 PWMC0_H0 SPI0_NPCS3 PWMC0_L2 R407 DNP 0R R408 GPIO 0R PWMC1_L3 UTXD3 URXD3 TWD0 TWCK0 RF RD RK AFE0_AD3 DAC0 DAC1 CANRX0 CANTX0 AFE1_AD06 GPIO GPIO SPI0_SPCK SPI0_MISO SPI0_MOSI TWD0 TWCK0 TXD0 RXD0 WKUP5 PWMC0_H0 PD24 PA10 PA22 PC31 PB13 PD00 PB03 PB02 PC31 MCDA0 MCDA1 MCDA2 MCDA3 MCCK MCCDA GPIO A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 SDA10 BA0 SDCK SDCKE SDCS RASB CASB SDWE A0/NBS0 NWR1/NBS1 D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 D10 D11 D12 D13 D14 D15 PA30 PA31 PA26 PA27 PA25 PA28 PC16 PC20 PC21 PC22 PC23 PC24 PC25 PC26 PC27 PC28 PC29 PD13 PA20 PD23 PD14 PC15 PD16 PD17 PD29 PC18 PD15 PC00 PC01 PC02 PC03 PC04 PC05 PC06 PC07 PE00 PE01 PE02 PE03 PE04 PE05 PA15 PA16 PA03 PA04 PD30 PA18 PB00 PB01 PB02 PB03 PD24 PB01 PA22 PB00 PA10 PD26 PD11 PD21 PA19 PA20 PA05 PD22 PD20 PD21 PA03 PA04 PB01 PB00 PD28 PA00 TWD0 TWCK0 AFE0_AD0 PCK2 RXD0 TXD0 CTS0 RTS0 RF TK RK TF RD TD GPIO TIOA11 TIOA11 BAO TD AFE1_AD06 AFE0_AD0 AFE0_AD8 AFE1_AD1 AFE1_AD5 AFE1_AD6 AFE0_AD3 PD26 PC31 PD30 PA19 PC13 PC30 PA17 PC12 PD11 TXD0 RXD0 TXD2 RXD2 UTXD4 URXD4 TWD2 TWCK2 0R 0R 0R 0R R468 R469 R470 R471 R472 R473 R474 R475 R476 R477 R478 R479 R480 R481 R482 R483 R448 R449 R450 R451 R452 R453 R454 R455 R456 R457 R458 R459 R460 R461 R462 R463 R464 R465 R466 R467 R429 R430 R431 R432 R433 R434 R435 R436 R437 R438 R439 R440 R441 R442 R443 R444 R427 R428 R426 R425 R421 R422 R423 R424 22R 22R 22R 22R 22R 22R 22R 22R 22R 22R 22R 22R 22R 22R 22R 22R 22R 22R 22R 22R 22R 22R 22R 22R 22R 22R 22R 22R 22R 22R 22R 22R 22R 22R 22R 22R 0R 0R 0R 0R 0R 0R 0R 0R 0R 0R 0R 0R 0R 0R 0R 330R 0R 0R 39R 0R 0R 0R 0R 0R R418 DNP 0R R419 DNP 0R R420 DNP 0R R417 R414 R415 R416 R413 SPI0_SPCK 39R SPI0_MISO GTSUCOMP R409 DNP 0R SPI0_MOSI R410 0R SPI0_NPCS1 LED_TIOB7 PWMC0_PWMH3 PB01 PB00 PD16 PD15 PD19 PD18 PD27 PD28 PD22 PD20 PD11 PD21 PD25 PC09 PA17 PA04 TWCK0 PA03 TWD0 ADVREF PA02 PC19 PD11 PD27 PD10 PA06 PA05 PD30 PD28 PA03 PA04 R411 1k R412 1k D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 D10 D11 D12 D13 D14 D15 A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 CLK CKE CS RAS CAS WE LDQM UDQM MCDA0 MCDA1 MCDA2 MCDA3 MCCK MCCDA DETECT EBI SDRAM AUDIO MikroBUS ADCH ADCL COM IOH IOL I2C SD_CARD PIN9_I2C_SDA PIN7_I2C_SCL PIN2_ADC(+) PIN14_PCK2 PIN3_RXD0 PIN5_TXD0 PIN4_CTS0 PIN6_RTS0 PIN10_RF PIN12_TK RK PIN10_TF PIN11_RD PIN13_TD PIN8_IRQ REFCLK PIN9_AFEO_AD8 PIN3_BAO PIN1_ADC(+) PIN2_RST PIN3_CS PIN4_SCK PIN5_MISO PIN6_MOSI PIN11_SDA PIN12_SCL PIN13_TX PIN14_RX PIN15_IRQ PIN16_PWM(+) AD8 AD9 AD10 AD11 DAC0 DAC1 CANRX CANTX AD0 AD1 AD2 AD3 AD4 AD5 AD6 AD7 DIG21 DIG20 DIG19 DIG18 DIG17 DIG16 DIG15 DIG14 DIG10 DIG9 DIG8 DIG13 DIG12 DIG11 I2C_SCL I2C_SDA AREF DIG2 DIG1 DIG0 DIG7 DIG6 DIG5 DIG4 DIG3 SDA SCL I2C IOL IOH COM ADCL ADCH 0R 39R TWD0 TWCK0 SPI0 SPCK SPI0 MOSI SPI0 MISO SPI0 NPCS1 GTXCK GTXEN GTX0 GTX1 GRXDV GRX0 GRX1 GRXER GMDC GMDIO GPIO GPIO SPI0_MOSI SPI0_MISO SPI0_SPCK ISI_PWD GPIO WKUP5 WKUP2 AFE0_AD0 AFE1_AD1 GPIO GPIO PWMC0_H2 PWMC0_L2 WKUP2 GPIO TWD0 TWCK0 RXD1 TXD1 SPI0_NPCS3 SPI0_MOSI SPI0_MISO SPI0_SPCK PD30 PC13 PA06 PD11 PC19 PD26 PA02 PA24 PA03 PA04 PA21 PB04 PD27 PD21 PD20 PD22 PD00 PD01 PD02 PD03 PD04 PD05 PD06 PD07 PD08 PD09 PC10 PA29 PD21 PD20 PD22 PC19 PA19 PD28 PA02 AFE1_AD06 AFE0_AD8 RTS0 CTS0 PWMC0_H0 TIOB5 WKUP5 GPIO TWD0 TWCK0 RXD0 TXD0 SPI0_NPCS1 SPI0_MOSI SPI0_MISO SPI0_SPCK PC31 PA19 PB03 PB02 PA00 PC30 PD28 PC17 PA03 PA04 PB00 PB01 PD25 PD21 PD20 PD22 PC08 NWR PD19 nCS PC30 DCX PC11 nRD PC09 LCDPWM 39R 0R 39R 0R 0R R491 39R R492 0R R493 39R R494 39R R495 0R R496 39R R497 39R R498 0R R499 0R R500 0R R501 0R R502 0R R503 0R R504 0R R505 0R R506 0R R507 DNP 0R R508 0R R509 0R R490 R489 R488 R486 R487 USART_RX USART_TX USART_RTS USART_CTS LED TIOB7 PD19 PWMC0 H2 PD11 GPIO1 GPIO2 LCDDISP GPIO3 PC13 STBY/RST GPIO4 RESET2 GPIO5 ONE WIRE INTERFACE ID3 / ID4 PD30 ADC0 AFE0 AD0 PA21 ADC1 RXD1 PC31 ADC2 AFE1 AD06 ADC3 PB01 TXD0 PC13 ADC4 AFE1 AD1 ADC5 ADC6 ADC7 PA03 PA04 PD22 PD21 PD20 PD25 R485 R484 IRQ2 (Q Touch) h) IRQ3 (Display Cntrl) IRQ4 (R Touch) TWD0 TWCK0 ISI_PWD GPIO PCK0 ISI_VSYNC ISI_HSYNC ISI_PCK ISI_D0 ISI_D1 ISI_D2 ISI_D3 ISI_D4 ISI_D5 ISI_D6 ISI_D7 ISI_D8 ISI_D9 ISI_D10 ISI_D11 PD28 WKUP5 PA02 WKUP2 PD28 WKUP5 PA06 GPIO PA03 PA04 PC19 PA13 PA06 PD25 PD24 PA24 PD22 PD21 PB03 PA09 PA05 PD11 PD12 PA27 PD27 PD28 PD30 PD31 GFX-CTRL CAMERA TXCK TXEN TXD0 TXD1 RXDV RXD0 RXD1 RXER MDC MDIO RESET SIGDET MOSI MISO SCLK CS GPIO0 GPIO1 GPIO2 PIN3_ADC(+) PIN4_ADC(-) PIN5_GPIO PIN6_GPIO PIN7_PWM(+) PIN8_PWM(-) PIN9_IRQ/GPIO PIN10_SPI_SS_B/GPIO PIN11_TWI_SDA PIN12_TWI_SCL PIN13_UART_RX PIN14_UART_TX PIN15_SPI_SS_A PIN16_SPI_MOSI PIN17_SPI_MISO PIN18_SPI_SCK PIN3_ADC(+) PIN4_ADC(-) PIN5_GPIO PIN6_GPIO PIN7_PWM(+) PIN8_PWM(-) PIN9_IRQ/GPIO PIN10_SPI_SS_B/GPIO PIN11_TWI_SDA PIN12_TWI_SCL PIN13_UART_RX PIN14_UART_TX PIN15_SPI_SS_A PIN16_SPI_MOSI PIN17_SPI_MISO PIN18_SPI_SCK PIN13_LCDPCLK PIN11_LCDVSYNC PIN9_LCDHSYNC PIN7_LCDEN PIN4_IRQ1 PIN6_IRQ2 PIN8_IRQ3 PIN10_IRQ4 PIN14_D0 PIN16_D1 PIN18_D2 PIN20_D3 PIN22_D4 PIN24_D5 PIN26_D6 PIN28_D7 PIN30_D8 PIN32_D9 PIN34_D10 PIN36_D11 PIN38_D12 PIN40_D13 PIN42_D14 PIN44_D15 PIN46_D16 PIN48_D17 PIN50_D18 PIN52_D19 PIN54_D20 PIN56_D21 PIN58_D22 PIN60_D23 PIN62_D24 PIN64_D25 I2C_SDA I2C_SCK PWD RST MCK VSYNC HSYNC PCK D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 D10 D11 ETHERNET EXT2 EXT1 GFX-SYNC GFX-CTRL CAMERA XIN_32 10n TARGET_RESET R511 0R 4 3 VDD OUT Y401 STB GND 1 2 GND R514 0R GND OUT Y400 NC VDD 3 4 GND 100n C420 VCC_TARGET_P3V3 DSC6083CE2A-032K768 2 1 GND DSC6003CI2A-012.0000 32.768 kHz Oscillator GND 100n C419 GND R515 0R C422 C421 100pF 12 MHz Oscillator GND VCC_TARGET_P3V3 XIN_12 TP403 R510 330R VCC_P3V3 _ RESET button with current limit and noise filter TS604VM1-035CR DGI_I2C TS604VM1-035CR 30 VDDIO_01 43 VDDIO_02 72 VDDIO_03 80 VDDIO_04 96 VDDIO_05 BLM18PG471SN1 BLM18PG471SN1 VDDPLL 123 VDDUTMIC VDDOUT SW401 R512 2.2k R513 330R 3 4 1 2 R516 0R TARGET_RESET_SENSE SDA DGI_I2C SCL SW400 R405 39R 3 4 1 2 1 2 5 1 2 29 VDDCORE_01 33 VDDCORE_02 50 VDDCORE_03 81 VDDCORE_04 107 VDDCORE_05 VDDPLL VDDUTMIC 139 L403 L404 3 BLM18PG471SN1 BLM18PG471SN1 MikroBUS AUDIO SD_CARD SDRAM EBI GFX-SYNC EXT1 EXT2 (c) 2019 Microchip Technology Inc. ETHERNET TARGET_RESET EDBG_TARGET_RESET VCC_TARGET_P3V3 Hardware DS70005389A-page 31 ADCL ADCH DIG DIG53 DIG51 DIG49 DIG47 DIG45 DIG43 DIG41 DIG39 DIG37 DIG35 DIG33 DIG31 DIG29 DIG27 DIG25 DIG23 DIG22 DIG24 DIG26 DIG28 DIG30 DIG32 DIG34 DIG36 DIG38 DIG40 DIG42 DIG44 DIG46 DIG48 DIG50 DIG52 AD8 AD9 AD10 AD11 DAC0 DAC1 CANRX CANTX AD0 AD1 AD2 AD3 AD4 AD5 AD6 AD7 VCC_TARGET_P3V3 VCC_P5V0 GND GND VCC_EXT_P5V0_P14V0 VCC_TARGET_P3V3 ADCL ADCH DIG CANTX1 PWMC1_PWMFI2 TXD1 RTS1 PWMC0_PWMH0 PWMC1_PWMH2 CTS0 PWMC1_PWMH0 PWMC1_PWMFI1 WKUP1(1) RTS2 SCK2 TK PA28 PB04 PA24 PA23 PA31 PB02 PA12 PA26 PA01 PD18 PD17 PB01 CTS1 RXD1 PWMC1_PWMEXTRG0 PWMC1_PWMEXTRG1 CANRX1 PA25 PA21 PA30 PA18 PC12 PC14 PWMC1_PWML1 SCK0 RTS0 PA13 PB13 PB03 SSQ-108-21-F-S J502 PCK2 TF CTS2 PWMC1_PWML3 TCLK2 1 2 3 4 5 6 7 8 RF RD RK AFE0_AD3 DAC0 DAC1 CANRX0 CANTX0 PD24 PA10 PA22 PC31 PB13 PD00 PB03 PB02 SSQ-108-21-F-S J501 SSQ-108-21-F-S PA18 PB00 PD19 PA05 PA29 1 2 3 4 5 6 7 8 TD AFE1_AD06 AFE0_AD0 AFE0_AD8 AFE1_AD1 AFE1_AD5 AFE1_AD6 AFE0_AD3 PD26 PC31 PD30 PA19 PC13 PC30 PA17 PC12 IOREF TARGET_RESET VCC_3V3 VCC_5V0 GND GND VIN 1 2 3 4 5 6 7 8 J500 Pin 34 Pin 32 Pin 30 Pin 28 Pin 26 Pin 24 Pin 22 Pin 20 Pin 18 Pin 16 Pin 14 Pin 12 Pin 10 Pin 8 Pin 6 Pin 4 Pin 3 Pin 5 Pin 7 Pin 9 Pin 11 Pin 13 Pin 15 Pin 17 Pin 19 Pin 21 Pin 23 Pin 25 Pin 27 Pin 29 Pin 31 Pin 33 GND GND GND J503 HMTSW-103-23-F-D-237 SPI_SCK SPI_MISO 5 3 1 6 4 2 GND SPI_MOSI VCC VCC_P5V0 SPI VCC_P5V0 J504 SSQ-118-01-G-D VCC_P5V0 RESET SPI_SCK SPI_MISO SPI_MOSI Note that 5V0 is connected to J704 pin 2 TARGET_RESET PD22 SPI0_SPCK PD20 SPI0_MISO PD21 SPI0_MOSI D52 D50 D48 D46 D44 D42 D40 D38 D36 D34 D32 D30 D28 D26 D24 D22 35 33 31 29 27 25 23 21 19 17 15 13 11 9 7 5 3 1 36 34 32 30 28 26 24 22 20 18 16 14 12 10 8 6 4 2 (c) 2019 Microchip Technology Inc. D53 D51 D49 D47 D45 D43 D41 D39 D37 D35 D33 D31 D29 D27 D25 D23 TP500 PB01 PB00 PD16 PD15 PD19 PD18 PD27 PD28 SSQ-108-21-F-S J507 8 7 6 5 4 3 2 1 TXD0 RXD0 TXD2 RXD2 UTXD4 URXD4 TWD2 TWCK2 PA02 PWMC0_H1 PC19 PWMC0_H2 PD11 PWMC0_H0 PD27 SPI0_NPCS3 PA06 / PD10 GPIO PA05 PWMC1_PWML3 PD30 UTXD3 PD28 URXD3 SSQ-108-21-F-S J506 8 7 6 5 4 3 2 1 Note that 5V0 is connected to J507 pin 1 and 2 SPI GND PD22 SPI0_SPCK PD20 SPI0_MISO PD21/PD11 SPI0_MOSI/GTSUCOMP PD25 SPI0_NPCS1 PC09 LED TIOB7 PA17 PWMC0_PWMH3 PA04 TWCK0 PA03 TWD0 ADVREF SSQ-110-21-F-S J505 10 9 8 7 6 5 4 3 2 1 IOL IOH DIG21 DIG20 DIG19 DIG18 COM DIG17 DIG16 DIG15 DIG14 DIG7 DIG6 DIG5 DIG4 DIG3 DIG2 DIG1 DIG0 DIG13 DIG12 DIG11 DIG10 DIG9 DIG8 I2C_SCL I2C_SDA AREF COM IOL IOH Hardware DS70005389A-page 32 D11 D9 D7 D5 D3 D1 I2C_SCK RST ISI_D11 ISI_D9 ISI_D7 ISI_D5 ISI_D3 ISI_D1 TWCK0 GPIO D1 D1 D3 D3 D D55 D D77 D 9 D9 D11 GND RST I2C_SCK VCC_P3V3 GND VCC VCC_P3V3 ARM JTAG 2 4 6 8 10 12 14 16 18 20 1 3 5 7 9 11 13 15 17 19 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 GND PWD I2C_SDA MCK VSYNC HSYNC PCK D0 D2 D2 D4 D4 D6 D6 D 8 D8 D 10 D10 GND VCC_P3V3 TSM-115-01-L-DV J601 VCC TRST NC / TDI SWDIO / TMS SWDCLK / TCLK RTCK SWO / TDO RESET NC NC 1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 CAMERA HMTSW-110-23-F-D-237 J600 Camera Interface Connector PD31 PD28 PA27 PD11 PA09 PD21 PA04 PA13 0R 0R 0R 0R R603 R600 PB06 SWDIO R601 PB07 SWCLK R602 PB05 TRACESWO PIN17_SPI_MISO PIN15_SPI_SS_A PIN13_UART_RX PIN11_TWI_SDA PIN9_IRQ/GPIO PIN7_PWM(+) PIN5_GPIO PIN3_ADC(+) TARGET_RESET SWDIO SWCLK TRACESWO TARGET_CHIP_RESET SWD EXT1 extension header GND ID_EXT1 ADC(+) GPIO PWM(+) IRQ/GPIO TWI_SDA UART_RX SPI_SS_A SPI_MISO 1 3 5 7 9 11 13 15 17 19 J602 2 4 6 8 10 12 14 16 18 20 HEADER 2x10 1125-1210S0R138R1 EXT1 VCC_P3V3 GND ADC(-) GPIO PWM(-) SPI_SS_B/GPIO TWI_SCL UART_TX SPI_MOSI SPI_SCK EXT1 GND 9 11 13 15 17 19 1 3 5 J603 2 4 6 8 10 12 14 16 18 20 ID_SYS 3132-20MS0BK00R3 VTREF GND GND KEY (NC) GND NC NC GND GND GND TRACE (CoreSight 20) VCC_P3V3 ID_SYS ID_1 ID_4 ID_2 ID_EXT4 PWD I2C_SDA MCK VSYNC HSYNC PCK D0 D2 D4 D6 D8 D10 ISI_PWD TWD0 PCK0 ISI_VSYNC ISI_HSYNC ISI_PCK ISI_D0 ISI_D2 ISI_D4 ISI_D6 ISI_D8 ISI_D10 PC19 PA03 PA06 PD25 PD24 PA24 PD22 PB03 PA05 PD12 PD27 PD30 PIN4_ADC(-) PIN6_GPIO PIN8_PWM(-) PIN10_SPI_SS_B/GPIO PIN12_TWI_SCL PIN14_UART_TX PIN16_SPI_MOSI PIN18_SPI_SCK AFE0_AD8 CTS0 TIOB5 GPIO TWCK0 TXD0 SPI0_MOSI SPI0_SPCK PA19 PB02 PC30 PC17 PA04 PB01 PD21 PD22 SPI0_MISO SPI0_NPCS1 RXD0 TWD0 WKUP5 PWMC0_H0 RTS0 AFE1_AD06 PD20 PD25 PB00 PA03 PD28 PA00 PB03 PC31 SWD (c) 2019 Microchip Technology Inc. ID3/ID4 TMS/SWDIO TCK/SWCLK TDO/SWO TDI nRST RTCK/TRACECLK SWO/TraceD0 nTRST/TraceD1 DBGRQ/TraceD2 DBGACK/TraceD3 EXT2 J604 nRESET TRACECLK TRACED0 TRACED1 TRACED2 TRACED3 SWDIO SWCLK SWO VCC_P3V3 GND ADC(-) GPIO PWM(-) SPI_SS_B/GPIO TWI_SCL UART_TX SPI_MOSI SPI_SCK EXT2 TRACE 2 4 6 8 10 12 14 16 18 20 50 single ended for trace signals TARGET RESET PD08 TRACECLK PD04 TRACED0 PD05 TRACED1 PD06 TRACED2 PD07 TRACED3 1 3 5 7 9 11 13 15 17 19 HEADER 2x10 1125-1210S0R138R1 PB06 SWDIO PB07 SWCLK PB05 TRACESWO EXT2 extension header GND ID_EXT2 ADC(+) GPIO PWM(+) IRQ/GPIO TWI_SDA UART_RX SPI_SS_A SPI_MISO PIN17_SPI_MISO PIN15_SPI_SS_A PIN13_UART_RX PIN11_TWI_SDA PIN9_IRQ/GPIO PIN7_PWM(+) PIN5_GPIO PIN3_ADC(+) SPI0_MISO SPI0_NPCS3 RXD1 TWD0 WKUP2 PWMC0_H2 GPIO AFE0_AD0 PD20 PD27 PA21 PA03 PA02 PC19 PA06 PD30 PIN4_ADC(-) PIN6_GPIO PIN8_PWM(-) PIN10_SPI_SS_B/GPIO PIN12_TWI_SCL PIN14_UART_TX PIN16_SPI_MOSI PIN18_SPI_SCK AFE1_AD1 GPIO PWMC0_L2 GPIO TWCK0 TXD1 SPI0_MOSI SPI0_SPCK TRACE PC13 PD11 PD26 PA24 PA04 PB04 PD21 PD22 CAMERA Hardware DS70005389A-page 33 SDRAM I2C PC11 I2C SDRAM LDQM UDQM WE CS RAS CAS CLK CKE A11 A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 SDA SCL A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 SDA10 J703 R R700 GND J6 LDQM J2 UDQM GND C701 100n GND C702 100n GND C703 100n A6 B7 C7 D7 D6 E7 F7 G7 G1 F1 E1 D2 D1 C1 B1 A2 B2 VSSQ C6 VSSQ E2 VSSQ F6 VSSQ B6 VDDQ C2 VDDQ E6 VDDQ F2 VDDQ DQ0 DQ1 DQ2 DQ3 DQ4 DQ5 DQ6 DQ7 DQ8 DQ9 DQ10 DQ11 DQ12 DQ13 DQ14 DQ15 16Mbit SDRAM IS42S16100H-7BLI SDRAM A1 VSS R1 VSS A7 VDD R7 VDD H6 VDD WE J7 GND A11 A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 U701 K2 CLK L1 CKE M1 N6 P7 P6 R6 R2 P2 P1 N2 N1 M2 N7 PC18 A0/NBS0 PD15 NWR1/NBS1 C700 2.2uF 4 8 SDRAM (16MBit) PD29 SDWE VCC_TARGET_P3V3 GND VCC AT24MAC402-MAHM-T 7 WP 5 SDA 6 SCL U700 1 A0 2 A1 3 A2 L7 CS K6 RAS K7 CAS R704 100k GND MAC24_WP MAC24_A0 MAC24_A1 MAC24_A2 R712 R713 R714 R715 R716 R717 R718 R719 R720 R721 R722 R723 R724 R725 R726 R727 33R 33R 33R 33R 33R 33R 33R 33R 33R 33R 33R 33R 33R 33R 33R 33R EBI SD_CARD EBI DETECT MCCK MCCDA MCDA0 MCDA1 MCDA2 MCDA3 MCDA0 MCDA1 MCDA2 MCDA3 PC16 GPIO PC00 PC01 PC02 PC03 PC04 PC05 PC06 PC07 PE00 PE01 PE02 PE03 PE04 PE05 PA15 PA16 PA25 MCCK PA28 MCCDA PA30 PA31 PA26 PA27 GND GND VCC_TARGET_P3V3 C705 100n GND C706 100n GND C708 100n GND C709 100n Resistors R712 thru R727 are critical impedance termination resistors which must be placed as close as possible to the SDRAM data pins DQ0 DQ1 DQ2 DQ3 DQ4 DQ5 DQ6 DQ7 DQ8 DQ9 DQ10 DQ11 DQ12 DQ13 DQ14 DQ15 GND C704 100n VCC_TARGET_P3V33 Serial EEPROM with EIA-48 MAC address PC15 SDCS PD16 RASB PD17 CASB PD23 SDCK PD14 SDCKE VCC_TARGET_P3V3 PA20 BA0 PC20 PC21 PC22 PC23 PC24 PC25 PC26 PC27 PC28 PC29 PD13 PA03 TWD0 PA04 TWCK0 GND J702 J701 R701 10k R702 10k R703 10k 10k SD_CARD D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 200R 200R 200R 200R 200R 200R 200R 200R 200R 200R 200R 200R 200R 200R 200R 200R VCC_TARGET_P3V3 VCC_TARGET_P3V3 VCC_TARGET_P3V3 microSD-CARD D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 D10 D11 D12 D13 D14 D15 R705 10k R728 R729 R730 R731 R732 R733 R734 R735 R736 R737 R738 R739 R740 R741 R742 R743 SD_WP SD_CD SD_CLK SD_CMD SD_D0 SD_D1 SD_D2 SD_D3 R710 10k R711 10k 9 10 QSPI EBI-GFX-DATA SW_B IO0 IO1 IO2 IO3 CLK CS PA13 PA12 PA17 PD31 PA14 PA11 VSS VDD QIO0 QIO1 QIO2 QIO3 QSCK QCS 6 4 5 2 3 7 6 1 GND 8 SST26VF032BA C711 10uF GND GND C712 100n VCC_TARGET_P3V3 GND VCC_TARGET_P3V3 SI/IO0 VCC SO/IO1 WP/IO2 HOLD/IO3 4 SCK VSS 0 CS PAD (NC) U702 C710 GND GND SST26VF032BA 11 G1 12 G2 13 G3 14 G4 DM3AT-SF-PEJM5 SW_A 5 CLK 3 CMD J700 7 D0 8 D1 1 D2 2 D3 C/D is connected to COM when a card is placed into the socket. TP700 R706 100k R707 100k R708 100k R709 100k EBI-GFX-DATA (c) 2019 Microchip Technology Inc. QSPI 100n VCC_TARGET_P3V3 Hardware DS70005389A-page 34 CAN GPIO2 GPIO1 RXD1 RXD0 RXER RXDV MDC MDIO SIGDET RESET GPIO0 CANRX CANTX PC12 CANRX1 GND C800 15p GND VCC_P5V0 EGND_PHY R801 0R CANTX1 GND PC14 GND 0R C801 100n J801 Design comment: Design comment: J800 GND 3 2 1 12 11 10 9 8 7 6 5 4 3 2 1 ATA6563 U800 1 TXD 2 GND 3 VCC 4 RXD SLM-112-01-L-S SLM-103-01-L-S PA02 PD28 PD06 PD05 PD07 PD04 PD08 PD09 PA29 PC10 WKUP2 WKUP5 GRX1 GRX R 1 GRX0 GRX R 0 GRXER GRX R ER GRXDV GRX R DV GMDC GMDIO GPIO GPIO GPIO R800 EGND_PHY GPIO PA19 RESET PC10 IRQ PA29 MDIO PD09 MDC PD08 CRS_DV PD04 RXER PD07 RXD0 PD05 RXD1 PD06 WKUP5 PD28 WKUP2 PA02 8 STBY 7 CANH 6 CANL 5 VIO J803 3 2 1 J802 12 11 10 9 8 7 6 5 4 3 2 1 GND C802 100n CANH CANL VCC_P3V3 EGND_PHY 4.7n DNP C803 MISO MOSI TXD1 TXD0 TXEN GND PD20 PD21 PD03 PD02 PD01 PD00 PHY_REFCLK PD22 SCLK PC19 CS 1M R802 Ethernet PHY Header Configuration SLM-112-01-L-S SLM-103-01-L-S SCLK CS TXCK MISO MOSI TXD1 TXD0 TXEN PD22 PC19 PD00 PD20 PD21 PD03 PD02 PD01 GND GND C806 100n OUT VDD Y800 GND STBY R805 10k 2 1 4.7uF C804 GND 3 2 1 2 1 JS805 Pin header 1x2 RA J805 HEADER 1x3 RT Pin Header 1X3 J804 GND ASEMB-50.000MHZ-LC-T 3 4 C805 100n VCC_P3V3 VCC_P3V3 SPI0_SPCK ISI_PWD GTXCK SPI0_MISO SPI0_MOSI GTX11 GTX00 GTXEN ETHERNET R803 62R (c) 2019 Microchip Technology Inc. R804 62R ETHERNET Hardware DS70005389A-page 35 CAN MikroBUS MikroBUS (c) 2019 Microchip Technology Inc. PWM(+) ( ) PWM(+ IRQ/GPIO Q UART_RX UART_RX UART_TX UART_TX TWI SCL T WI_S CL TWI_SDA TWI_SDA GND VCC_P5V0 VCC_ _ The external PLL is added specifically support Ethernet AVB applications. The timer output TIOA11 can be used to generate a reference clock which is connected to the PLL, the PLL can multiply this frequency to reconstruct a remote clock for the Audio system. GND VCC_P3V3 CC_P3V3 C ADC(+ ADC(+) ( ) RESET SPI_SS_A SPI_SS_A SPI_SCK SPI_SCK SPI MISO S PI_M ISO SPI_MOSI SPI_MOSI J901 1 PWM 2 INT 3 RX 4 TX 5 SCL 6 SDA 7 +5V 8 GND GND C900 39p DNP 3 4 GND REFCLK TIOA11 PD21 12.00MHz GND XC900 1 2 GND C901 39p R900 0R DNP TD PD26 RD PA10 TWD0 PA03 TWCK0 PA04 TXD0 PB01 RXD0 PB00 DNP DNP GND PIN13_TD PIN11_RD PIN9_I2C_SDA PIN7_I2C_SCL PIN5_TXD0 PIN3_RXD0 2 4 6 8 10 12 14 16 18 20 0R R901 HMTSW-110-23-F-D-237 J902 6 7 5 CS2100CP-CZZ XTO XTI/REF_CLK CLK_IN (DNP) 2 1 MCLK DNP DNP VCC_TARGET_P3V3 GND C902 100n 39R R902 VCC_TARGET_P3V3 VCC_P5V0 GND USART_CTS USART_CTS USART_RTS USART_RTS STBY/RST_B STBY/RST _B DMM/I2S_WS I2S_CK I2S _CK Programmable PLL GND VD U900 DNP 4 10 SDA/CDIN AUX_OUT 9 3 SCL/CCLK CLK_OUT 8 AD0/CS GND USART_RX USART_RX USART_TX USART_TX I2C_SCL I2C_SCL I2C_SDA I2C _SDA I2S_DIN _DIN I2S I2S_DOUT I2S _DOUT 1 3 5 7 9 11 13 15 17 19 PIN4_CTS0 PIN6_RTS0 PIN8_IRQ CTS0 PB02 RTS0 PB03 GPIO PD11 PIN6_MOSI PIN5_MISO PIN4_SCK PIN3_CS PIN2_RST PIN1_ADC(+) PD21 PD20 PD22 PA05 PD11 PC31 SPI0_MOSI SPI0_MISO SPI0_SPCK GPIO GPIO AFE1_AD06 J900 1 AN 2 RST 3 CS 4 SCK 5 MISO 6 MOSI 7 +3.3V 8 GND PIN10_TF PIN10_RF TF PB00 RF PD24 PIN16_PWM(+) PIN15_IRQ PIN14_RX PIN13_TX PIN12_SCL PIN11_SDA PA00 PD28 PB00 PB01 PA04 PA03 PWMC0_H0 WKUP5 RXD0 TXD0 TWCK0 TWD0 mikroBUSTM Header (Female) RK R PA22 RK AUDIO PIN9_AFEO_AD8 J903 2 4 6 8 10 12 ANALOG_POT ANALOG POT GND HMTSW-106-23-F-D-237 1 3 5 7 9 11 "X32" HEADER SIGNAL CONFIGURATION I2SC1_WS I2SC1_BCK I2SC1 DI I2SC1_DI I2SC1_DO I2SC1 DO I2SC1_MCK I2SC1 MCK D8 AUDIO PIN2_ADC(+) AFE0_AD0 AFE0 AD0 PD30 PIN3_BAO D9 D10 PA19 PE01 PE02 PA20 PE00 AFE0_AD8 D9 D10 BA0 D8 PIN12_TK PIN14_PCK2 TK PB01 PCK2 PA18 R903 0R 0R R904 DNP MikroBUS Hardware DS70005389A-page 36 Hardware TARGET_RESET J1000 R1000 10k D8 D9 D10 MH1 MH2 GND GND I2C_SDA I2C_SCL SPI_BCLK SPI_MOSI SPI_MISO SPI_CS USART_RX USART_TX USART_RTS USART_CTS BL WKUP5 WKUP2 WKUP5 GPIO VCC_P5V0 PD28 PA02 PD28 PA06 TWD0 TWCK0 SPI0 SPCK SPI0 MOSI SPI0 MISO SPI0 NPCS1 PA03 PA04 PD22 PD21 PD20 PD25 BL PC09 PD19 PD11 PWMC0 H2 GPIO1 GPIO2 GPIO3 LCDDISP PC13 GPIO4 STBY/RST GPIO5 RESET2 ONE WIRE INTERFACE ID3 / ID4 PD30 ADC0 AFE0 AD0 PA21 ADC1 RXD1 PC31 ADC2 AFE1 AD06 PC13 ADC3 AFE1 AD1 ADC4 ADC5 ADC6 ADC7 VCC_P3V3 GND (c) 2019 Microchip Technology Inc. IRQ1 (LCD Touch) IRQ2 (Q Touch) IRQ3 (Display Cntrl) IRQ2 (R Touch) 100k R1001 PIN4_IRQ1 PIN6_IRQ2 PIN8_IRQ3 PIN10_IRQ4 PIN14_D0 PIN16_D1 PIN18_D2 PIN20_D3 PIN22_D4 PIN24_D5 PIN26_D6 PIN28_D7 PIN30_D8 PIN32_D9 PIN34_D10 PIN36_D11 PIN38_D12 PIN40_D13 PIN42_D14 PIN44_D15 PIN46_D16 PIN48_D17 PIN50_D18 PIN52_D19 PIN54_D20 PIN56_D21 PIN58_D22 PIN60_D23 PIN62_D24 PIN64_D25 GFX-CTRL D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 D10 D11 D12 D13 D14 D15 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 42 44 46 48 50 52 54 56 58 60 62 64 66 68 69 EBI-GFX-DATA PC11 PC30 PD19 PC08 EBI-GFX-DATA GFX-SYNC GFX-SYNC PIN7_LCDEN PIN9_LCDHSYNC PIN11_LCDVSYNC PIN13_LCDPCLK GND 1 3 MCLR 5 VCC_P5V0 DE/nRD 7 LCDEN HSYNC/DCX LCDHSYNC 9 VSYNC/nCS LCDVSYNC 11 PCLK/nWR LCDPCLK 13 PC00 15 D0_LCD PC01 17 D1_LCD PC02 19 D2_LCD PC03 21 D3_LCD PC04 23 D4_LCD PC05 25 D5_LCD PC06 D6_LCD 27 PC07 D7_LCD 29 PE00 D8_LCD 31 PE01 D9_LCD 33 PE02 D10_LCD 35 PE03 D11_LCD 37 PE04 D12_LCD 39 PE05 D13_LCD 41 PA15 D14_LCD 43 PA16 D15_LCD 45 D16_LCD 47 D17_LCD 49 D18_LCD 51 D19_LCD 53 D20_LCD 55 D21_LCD 57 D22_LCD 59 D23_LCD 61 63 VCC_P3V3 65 67 GND GFX-CTRL PIC32 GFX CONNECTOR W_MOUNTING LOC ID3/ID4 DS70005389A-page 37 Hardware (c) 2019 Microchip Technology Inc. DS70005389A-page 38 Hardware (c) 2019 Microchip Technology Inc. DS70005389A-page 39 Hardware (c) 2019 Microchip Technology Inc. DS70005389A-page 40 Hardware (c) 2019 Microchip Technology Inc. DS70005389A-page 41 Hardware (c) 2019 Microchip Technology Inc. DS70005389A-page 42 Hardware (c) 2019 Microchip Technology Inc. DS70005389A-page 43 Hardware (c) 2019 Microchip Technology Inc. DS70005389A-page 44 Hardware (c) 2019 Microchip Technology Inc. DS70005389A-page 45 Hardware (c) 2019 Microchip Technology Inc. DS70005389A-page 46 Hardware (c) 2019 Microchip Technology Inc. DS70005389A-page 47 Hardware (c) 2019 Microchip Technology Inc. DS70005389A-page 48 Hardware (c) 2019 Microchip Technology Inc. DS70005389A-page 49 Hardware 6.2 Bill of Materials Qty Designator Description 1 C200 Ceramic capacitor, 22 uF, SMD 1206, X5R, 25V, 10% 1 C201 Ceramic capacitor, 2.2 uF, SMD 0805, X5R, 25V, 10%, (de20024) 3 C202, C203, C804 Ceramic capacitor, 4.7 uF, SMD 0805, X5R, 25V, 10 % 6 C204, C206, C207, C212, C213, C220 Ceramic capacitor 1 UF 16V 10% X5R 0603 1 C205 Ceramic capacitor, 100 uF, SMD 1210, X5R, 16V, 20% 1 C208 Ceramic capacitor, 10 nF, SMD 0402, X7R, 25V, +/-10% 1 C209 Ceramic capacitor, 22 uF, SMD 0805, X5R, 10V, A20% 4 C214, C219, C300, C803 Ceramic capacitor, 4.7 uF, SMD 0402, X7R, 25V 3 C301, C302, C307 Ceramic capacitor, 1 nF, SMD 0402, C0G, 50V, +/-5% 2 C303, C404 Ceramic capacitor, 10 pF, SMD 0402, NP0, 50V, +/-5% 2 C304, C309 Ceramic capacitor, 22 pF, SMD 0402, NP0, 50V, +/-5% 5 C306, C308, C314, C315, C700 Ceramic capacitor, 2.2 uF, SMD 0402, X5R, 6.3V, +/-20% 42 C210, C211, C215, C217, C218, C305, C310, C311, C312, C313, C400, C401, C402, C403, C405, C406, C407, C408, C410, C411, C412, C413, C414, C415, C416, C418, C419, C420, C701, C702, C703, C704, C705, C706, C707, C708, C709, C711, C801, C802, C805, C806 Ceramic capacitor, 100 nF, SMD 0402, X7R, 16V, +/-10% 1 C409 Ceramic capacitor, 10 uF, SMD 0603, X5R, 10V, 20% 1 C417 Capacitor Tantalum 10V 2.2 uF 10% ESR = 6 ohm, 1206 1 C710 Ceramic capacitor, 10 uF, SMD 0805, X5R, 10V, 10 %, (de19441) 1 C800 Ceramic capacitor, 15 pF, SMD 0402, NP0, 50V, +/-5% 2 D200, D300 TVS Diode Low-Capacitor 3-CH ESD-Protection for HS Data Interfaces SOT553 4 D201, D202, D203, D204 2A, 30V,Vf = 0.43V, Schottky diode, SOD-123 FL 2 D205, D301 LED, Green, Wave length = 575nm, SMD 0805, 70 2 D302, D400 LED, Yellow, Wave length = 5 91nm, SMD 0805, 70 (c) 2019 Microchip Technology Inc. DS70005389A-page 50 Hardware ...........continued Qty Designator Description 1 J200 Through-hole DC jack 2.1 mm, 12V, 3A 1 J201 Pin header, 2 x 2, Right Angle, 2.54 mm, THT, Pin-in-Paste 1 J202 CONN RCPT USB MICRO AB SMD 1 J300 mikroBUSTM USB 2.0 Receptacle Connector 5 Position Surface Mount, Right Angle; through- hole 1 J204 1 x 3 pin header, 2.54 mm pitch, THM 2 J400, J401 1 x 2 pin header, 2.54 mm pitch, Pin-in-Paste THM 2 J402, J805 1 x 2 pin header, right angle, 2.54 mm pitch, through-hole 7 J500, J501, J502, J506, J507, J900, J901 1 x 8 receptacle pin header, low- insertion force, 2.54 mm pitch THM, Pin-in-Paste 1 J503 2 x 3 pin header, 2.54 mm pitch, Pin-in-Paste THM 1 J504 2 x18 female pin header, 2.54 mm pitch, THM 1 J505 1 x 10 receptacle pin header, low insertion force, 2.54 mm pitch THM, Pin-in-Paste 2 J600, J902 2 x 10 pin header, 2.54 mm pitch, Pin-in-Paste THM, 1 mm hole 1 J601 Samtec TSM series, 2 x 15 pin header, straight, 2.54 mm pitch SMD 2 J602, J604 Pin header, 2 x 10, Right Angle, 2.54 mm, THM, Pin-in-Paste 1 J603 50-mil header, shrouded, pin 7 removed, SMD 1 J700 Micro SD Card Connector, (8 + 2) Position Push - Push, SMT, Right Angle Gold 2 J800, J802 1 x 12 - THM - Female Receptacle - 0.05 pitch 2 J801, J803 1 x 3 - THM - Female Receptacle - 0.05 pitch 1 J804 1 x 3 pin header, 2.54 mm pitch, Right angle THM, Pin-in-Paste 1 J903 2 x 6 pin header, 2.54 mm pitch, Pin-in-Paste, 1 mm hole 1 J1000 PIC32 GFX Connector W_MOUNTING LOC_2199230-3 5 JS204, JS400, JS401, JS402, JS805 Jumper cap for 2.54 mm pin header 11 L201, L202, L203, L204, L300, SMD RF inductor 0603. Z = 470 Ohm (@100 MHz), Max L301, L400, L401, L402, L403, R(dc)=0.65 Ohm, Max current = 1A L404 1 L200 2.2 AH Shielded Power Inductor, 4 x 4 x 2 mm, Isat = 5.6A , Irms = 4 .0A , DCR = 35.2 mI(c) 2 MH1, MH2 Round Standoff Threaded M2.5 x 0.45 Steel 0.098 (H2.50 mm) (c) 2019 Microchip Technology Inc. DS70005389A-page 51 Hardware ...........continued Qty Designator Description 3 Q200, Q204, Q206 P-ch. MOSFET. -30V, -3.0A continuous, -24A Peak. RDS(ON) = 0.098 Ohm@VGS = -10V, RDS(ON) = 0.165 Ohm@VGS = -4.5V, -2.5V<VGS(th)<-1.0V 1 Q201 P-CH MOSFET, SOT-23, 20V, 3A, Rds(on) = 0.097 mOhm@3A, 4.5V 2 Q202, Q203 P-Channel Power MOSFET 20V 2.4A continuous 10A peak 1 Q205 N-channel MOSFET, SOT23, 20V, 4.2A 2 Q300, Q301 N-Channel MOSFET. 60V, 0.300A continuous, 1.2A Peak. RDS(ON) = 3.8 Ohm@VGS = 4.5V, VGS(th) < 2.5V 11 R200, R201, R700, R701, R702, R703, R705, R710, R711, R805, R1000 Thick film resistor, SMD 0402, 1/16W, 1% 1 R202 RES 19.6 kOhm 1% 1/16W 0402 1 R203 RES SMD 2.49 kOhm 1% 1/16W 0402 76 R204, R207, R208, R220, R221, R301, R302, R303, R304, R305, R311, R312, R319, R325, R327, R403, R404, R408, R410, R414, R415, R416, R417, R421, R422, R423, R424, R425, R427, R428, R429, R430, R431, R432, R433, R434, R435, R436, R437, R438, R439, R440, R441, R442, R443, R444, R445, R446, R447, R485, R486, R487, R489, R492, R495, R498, R499, R500, R501, R502, R503, R504, R505, R506, R508, R509, R511, R514, R600, R601, R602, R603, R800, R801, R901, R903 RES 0.0 Ohm 1/16W 0402 SMD 5 R205, R300, R328, R330, R802 Thick film resistor, 1M, SMD 0402, 1/16W, 1% 6 R206, R313, R314, R315, R411, R412 Thick film resistor, 1K, SMD 0402, 1/16W, 1% 3 R209, R210, R215 Thick film resistor, 47K, SMD 0402, 1/16W, 1% (c) 2019 Microchip Technology Inc. DS70005389A-page 52 Hardware ...........continued Qty Designator Description 10 R211, R212, R216, R218, R704, R706, R707, R708, R709, R1001 Thick film resistor, 100K, SMD 0402, 1/16W, 1% 15 R213, R217, R306, R307, R308, R309, R310, R320, R321, R322, R323, R324, R329, R331, R400 Thick film resistor, 330R, SMD 0402, 1/16W, 1% 1 R214 Thick film resistor, 30K, SMD 0402, 1/16W, 1% 16 R219, R316, R317, R326, R401, R405, R413, R426, R484, R488, R490, R491, R493, R494, R496, R497 Thick film resistor, 39R, SMD 0402, 1/16W, 1% 1 R222 RES SMD 475 Ohm 1% 1/16W 0402 1 R318 Thick film resistor, 6.81K, SMD 0402, 1/16W, 1% 1 R406 Thick film resistor, 5.62K, SMD 0402, 1/16W, 1% 36 R448, R449, R450, R451, R452, R453, R454, R455, R456, R457, R458, R459, R460, R461, R462, R463, R464, R465, R466, R467, R468, R469, R470, R471, R472, R473, R474, R475, R476, R477, R478, R479, R480, R481, R482, R483 RES 22 Ohm 1/20W 5% 0201 SMD 2 R803, R804 Thick film resistor, 62R, SMD 1210, 0.5W, 1% 1 U200 Microchip Buck Regulator 12V 6A MIC24052 QFN-28 1 U201 LDO 3.3V 0.3A SOT-23-5 1 U202 LDO 3.3V 0.5A 6TDFN 1 U300 EDBG controller 1 U400 ARM Cortex -M7 microcontroller,LQFP144 1 U700 2 Kbit I2C EEPROM, single EUI-48 MAC, 1.7-5.5V, 2 x 3 mm UDFN (8MA2) 1 U701 16 Mbit SDRAM (512K Words x 16 Bits x 2 Banks), 143 MHz 3,3V 1 U702 FLASH 32MBIT_8SOIC (W5.3 mm) SST26VF032BAT-104I/SM 1 U800 High-speed CAN Transceiver with Standby mode CAN FD Ready 1 XC300 Fox FQ5032B 12.0000 MHz 20pF SMD crystal 738B-12, Fox FQ5032B 12.0 MHz SMD crystal 738B-12 (c) 2019 Microchip Technology Inc. (R) (R) DS70005389A-page 53 Hardware ...........continued Qty Designator Description 1 Y400 Oscillator 32.768 KHz 1.71-3.3V DSC60xxL3.2xW2.5H0.9 1 Y401 Oscillator 12.000 MHz 1.71-3.3V DSC60xxL3.2xW2.5H0.9 1 Y800 Oscillator 50 MHz 1.71-3.3V DSC60xxL3.2xW2.5H0.9 2 SW201, SW400 SWITCH, SMD, 260 gf, 6.4 mm X 6.2 mm 4 E1, E2, E3, E4 2.8 mm adhesive feet, diam 8.0 mm 2 S1, S2 M2.5 x 5 mm Pan Phillip Screw (c) 2019 Microchip Technology Inc. DS70005389A-page 54 The Microchip Web Site Microchip provides online support via our web site at http://www.microchip.com/. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information: * Product Support - Data sheets and errata, application notes and sample programs, design resources, user's guides and hardware support documents, latest software releases and archived software * General Technical Support - Frequently Asked Questions (FAQ), technical support requests, online discussion groups, Microchip consultant program member listing * Business of Microchip - Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives Customer Change Notification Service Microchip's customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip web site at http://www.microchip.com/. Under "Support", click on "Customer Change Notification" and follow the registration instructions. Customer Support Users of Microchip products can receive assistance through several channels: * * * * Distributor or Representative Local Sales Office Field Application Engineer (FAE) Technical Support Customers should contact their distributor, representative or Field Application Engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http://www.microchip.com/support Microchip Devices Code Protection Feature Note the following details of the code protection feature on Microchip devices: * Microchip products meet the specification contained in their particular Microchip Data Sheet. * Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. * There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. * Microchip is willing to work with the customer who is concerned about the integrity of their code. (c) 2019 Microchip Technology Inc. DS70005389A-page 55 * Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable." Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Legal Notice Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights unless otherwise stated. Trademarks The Microchip name and logo, the Microchip logo, AnyRate, AVR, AVR logo, AVR Freaks, BitCloud, chipKIT, chipKIT logo, CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KeeLoq, Kleer, LANCheck, LINK MD, maXStylus, maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB, OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip Designer, QTouch, SAM-BA, SpyNIC, SST, SST Logo, SuperFlash, tinyAVR, UNI/O, and XMEGA are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. ClockWorks, The Embedded Control Solutions Company, EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS, mTouch, Precision Edge, and Quiet-Wire are registered trademarks of Microchip Technology Incorporated in the U.S.A. Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, BodyCom, CodeGuard, CryptoAuthentication, CryptoAutomotive, CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial Programming, ICSP, INICnet, Inter-Chip Connectivity, JitterBlocker, KleerNet, KleerNet logo, memBrain, Mindi, MiWi, motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE, Ripple Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI, SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. (c) 2019 Microchip Technology Inc. DS70005389A-page 56 (c) 2019, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. ISBN: 978-1-5224-4113-7 Quality Management System Certified by DNV ISO/TS 16949 Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California (R) (R) and India. The Company's quality system processes and procedures are for its PIC MCUs and dsPIC (R) DSCs, KEELOQ code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001:2000 certified. (c) 2019 Microchip Technology Inc. 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