To our customers,
Old Company Name in Catalogs and Other Documents
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April 1st, 2010
Renesas Electronics Corporation
Issued by: Renesas Electronics Corporation (http://www.renesas.com)
Send any inquiries to http://www.renesas.com/inquiry.
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2009
DESCRIPTION
The
μ
PG2408TB is a GaAs MMIC for L, S-band SPDT (Single Pole Double Throw) switch for 2.4 GHz wireless
LAN, mobile phone and other L, S-band applications.
This device operates with dual control switching voltages of 2.5 to 5.3 V. This device can operate at frequencies
from 0.05 to 3.0 GHz, with low insertion loss and high isolation.
This device is housed in a 6-pin super minimold package (SC-88/SOT-363 type), and is suitable for high-density
surface mounting.
FEATURES
• Switch control voltage : Vcont (H) = 3.0 V TYP.
: Vcont (L) = 0 V TYP.
• Low insertion loss : Lins = 0.40 dB TYP. @ f = 1.0 GHz
: Lins = 0.50 dB TYP. @ f = 2.5 GHz
• High isolation : ISL = 27 dB TYP. @ f = 1.0 GHz
: ISL = 18 dB TYP. @ f = 2.5 GHz
• Handling power : Pin (0.1 dB) = +29.0 dBm TYP. @ f = 0.5 to 3.0 GHz
• High-density surface mounting : 6-pin super minimold package (SC-88/SOT-363 type) (2.0 × 1.25 × 0.9 mm)
APPLICATIONS
• L, S-band digital cellular or cordless telephone
• W-LAN, WLL and BluetoothTM etc.
ORDERING INFORMATION
Part Number Order Number Package Marking Supplying Form
μ
PG2408TB-E4
μ
PG2408TB-E4-A 6-pin super minimold
(SC-88/SOT-363 type)
(Pb-Free)
G5P • Embossed tape 8 mm wide
• Pin 4, 5, 6 face the perforation side of the tape
• Qty 3 kpcs/reel
Remark To order evaluation samples, please contact your nearby sales office.
Part number for sample order:
μ
PG2408TB
DATA SHEET
Caution Although this device is designed to be as robust as possible, ESD (Electrostatic Discharge) can
damage this device. This device must be protected at all times from ESD. Static charges may
easily produce potentials of several kilovolts on the human body or equipment, which can
discharge without detection. Industry-standard ESD precautions must be employed at all times.
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all products and/or types are available in every country. Please check with an NEC Electronics
sales representative for availability and additional information.
0.05 to 3.0 GHz SPDT SWITCH
GaAs INTEGRATED CIRCUIT
μ
PG2408TB
Document No. PG10770EJ01V0DS (1st edition)
Date Published July 2009 NS
Printed in Japan
PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM
Pin No. Pin Name
1 RF1
2 GND
3 RF2
4 Vcont2
5 RFC
4
5
6
3
2
1
(Bottom View)
3
2
1
4
5
6
(Top View)
3
2
1
4
5
6
(Top View)
G5P
RF1
GND
RF2
V
cont
1
V
cont
2
RFC
6 Vcont1
SW TRUTH TABLE
ON Path Vcont1 Vcont2
RFC-RF1 Low High
RFC-RF2 High Low
ABSOLUTE MAXIMUM RATINGS (TA = +25°C, unless otherwise specified)
Parameter Symbol Ratings Unit
Switch Control Voltage Vcont +6.0 Note V
Input Power Pin +33.0 dBm
Operating Ambient Temperature TA −45 to +85 °C
Storage Temperature Tstg −55 to +150 °C
Note ⎪Vcont1 − Vcont2⎪ ≤ 6.0 V
RECOMMENDED OPERATING RANGE (TA = +25°C, unless otherwise specified)
Parameter Symbol MIN. TYP. MAX. Unit
Operating Frequency f 0.05 − 3.0 GHz
Switch Control Voltage (H) Vcont (H) 2.5 3.0 5.3 V
Switch Control Voltage (L) Vcont (L) −0.2 0 0.2 V
Control Voltage Difference
Δ
Vcont (H),
Δ
Vcont (L)Note
−0.1 0 0.1 V
Note
Δ
Vcont (H) = Vcont1 (H) − Vcont2 (H)
Δ
Vcont (L) = Vcont1 (L) − Vcont2 (L)
Data Sheet PG10770EJ01V0DS
2
μ
PG2408TB
ELECTRICAL CHARACTERISTICS
(TA = +25°C, Vcont (H) = 3.0 V, Vcont (L) = 0 V, DC blocking capacitors = 56 pF, unless otherwise specified)
Parameter Symbol Test Conditions MIN. TYP. MAX. Unit
Insertion Loss 1 Lins1 f = 0.05 to 0.5 GHz Note 1 − 0.40 0.55 dB
Insertion Loss 2 Lins2 f = 0.5 to 1.0 GHz − 0.40 0.55 dB
Insertion Loss 3 Lins3 f = 1.0 to 2.0 GHz − 0.48 0.63 dB
Insertion Loss 4 Lins4 f = 2.0 to 2.5 GHz − 0.50 0.65 dB
Insertion Loss 5 Lins5 f = 2.5 to 3.0 GHz − 0.56 0.70 dB
Isolation 1 ISL1 f = 0.05 to 0.5 GHz Note 1 24 27
− dB
Isolation 2 ISL2 f = 0.5 to 1.0 GHz 24 27 − dB
Isolation 3 ISL3 f = 1.0 to 2.0 GHz 16 19 − dB
Isolation 4 ISL4 f = 2.0 to 2.5 GHz 15 18 − dB
Isolation 5 ISL5 f = 2.5 to 3.0 GHz 14 17 − dB
Input Return Loss 1 RLin1 f = 0.05 to 0.5 GHz Note 1 15 20
− dB
Input Return Loss 2 RLin2 f = 0.5 to 3.0 GHz 15 20 − dB
Output Return Loss 1 RLout1 f = 0.05 to 0.5 GHz Note 1 15 20
− dB
Output Return Loss 2 RLout2 f = 0.5 to 3.0 GHz 15 20 − dB
0.1 dB Loss Compression Pin (0.1 dB) f = 2.0/2.5 GHz +27.0 +29.0 − dBm
Input Power Note 2 f = 0.5 to 3.0 GHz − +29.0 − dBm
Input 3rd Order Intercept Point IIP3 f = 0.5 to 3.0 GHz, 2 tone,
5 MHz spicing
− +60 − dBm
Switch Control Current Icont No RF input − 0.3 20
μ
A
Switch Control Speed tSW 50% CTL to 90/10% RF − 50 500 ns
Notes 1. DC blocking capacitors = 1 000 pF at f = 0.05 to 0.5 GHz
2. P
in (0.1 dB) is the measured input power level when the insertion loss increases 0.1 dB more than that of
linear range.
Caution It is necessary to use DC blocking capacitors with this device.
The value of DC blocking capacitors should be chosen to accommodate the frequency of
operation, bandwidth, switching speed and the condition with actual board of your system. The
range of recommended DC blocking capacitor value is less than 100 pF for frequencies above 0.5
GHz, and 1 000pF for frequencies above 0.5 GHz.
Data Sheet PG10770EJ01V0DS 3
μ
PG2408TB
EVALUATION CIRCUIT
V
cont
1
V
cont
2
RF1
RF2
RFC
C1
Note
C1
C1
C2
C2
4
5
6
3
2
1
Note C1 : 0.05 to 0.5 GHz 1 000 pF
: 0.5 to 3.0 GHz 56 pF
C2 : 1 000 pF
The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
APPLICATION INFORMATION
L
ESD
C1
C1
C1
Switch
• LESD provides a means to increase the ESD protection on a specific RF port, typically the port attached to the
antenna.
• The value may be tailored to provide specific electrical responses.
• The RF ground connections should be kept as short as possible and connected to directly to a good RF ground
for best performance.
Data Sheet PG10770EJ01V0DS
4
μ
PG2408TB
ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD
C1
C2
C1
C1
C2
6pin SMM SPDT SW
Vc1
Vc2
IN
OUT 1
OUT 2
C1
C1
C2
V
cont
2
RF2
RFC
RF1
V
cont
1
C2
C1
G5P
USING THE NEC EVALUATION BOARD
Symbol Test Conditions Values
C1 f = 0.05 to 0.5 GHz 1 000 pF
f = 0.5 to 3.0 GHz 56 pF
C2 1 000 pF
Data Sheet PG10770EJ01V0DS 5
μ
PG2408TB
TYPICAL CHARACTERISTICS (
T
A
= +25
°
C, DC blocking capacitors = 56 pF, unless otherwise specified
)
Insertion Loss L
ins
(dB)
Frequency f (GHz)
RFC-RF1/RF2
INSERTION LOSS vs. FREQUENCY
–0.1
–0.3
–0.6 1.5 3.0
0.5 1.0 2.0 2.5
0.0
–0.2
–0.4
–0.5
V
cont (H)
= 3.0 V V
cont (H)
= 3.0 V
Isolation ISL (dB)
Frequency f (GHz)
RFC-RF1/RF2
ISOLATION vs. FREQUENCY
0
–5
–10
–15
–20
–25
–30
–35
–40 1.5 3.0
0.5 1.0 2.0 2.5
0.0
Input Return Loss RL
in
(dB)
Frequency f (GHz)
RFC-RF1/RF2
INPUT RETURN LOSS vs. FREQUENCY
0
–5
–10
–15
–20
–25
–30 1.5 3.0
0.5 1.0 2.0 2.5
0.0
V
cont (H)
= 3.0 V V
cont (H)
= 3.0 V
Output Return Loss RL
out
(dB)
Frequency f (GHz)
RFC-RF1/RF2
OUTPUT RETURN LOSS vs. FREQUENCY
0
–5
–10
–15
–20
–25
–30 1.5 3.0
0.5 1.0 2.0 2.5
0.0
Insertion Loss L
ins
(dB)
Switch Control Voltage (H) V
cont (H)
(V)
RFC-RF1/RF2 INSERTION LOSS,
Icont vs. SWITCH CONTROL VOLTAGE (H)
–0.2
–0.3
–0.4
–0.5
–0.6
–0.7
–0.8
f = 2.5 GHz
I
cont
: No RF Input
I
cont
6
5
4
3
2
1
0
Switch Control Current I
cont
( A)
μ
L
ins
3.0 5.0
2.5 3.5 4.0
2.0 4.5 3.0 5.0
2.5 3.5 4.0
2.0 4.5
Isolation ISL (dB)
Switch Control Voltage (H) V
cont (H)
(V)
RFC-RF1/RF2 ISOLATION vs.
SWITCH CONTROL VOLTAGE (H)
0
–5
–10
–15
–20
–25
–30
–35
–40
f = 2.5 GHz
Remark The graphs indicate nominal characteristics.
Data Sheet PG10770EJ01V0DS
6
μ
PG2408TB
0.1 dB Loss Compression Input Power P
in (0.1 dB)
(dBm)
Switch Control Voltage (H) V
cont (H)
(V)
RFC-RF1/RF2 P
in (0.1 dB)
vs.
SWITCH CONTROL VOLTAGE (H)
36
34
32
30
28
26
24 3.0 5.0
2.0 2.5 3.5 4.0 4.5
Input Return Loss RL
in
(dB)
Switch Control Voltage (H) V
cont (H)
(V)
RFC-RF1/RF2 INPUT RETURN LOSS vs.
SWITCH CONTROL VOLTAGE (H)
Output Return Loss RL
out
(dB)
Switch Control Voltage (H) V
cont (H)
(V)
RFC-RF1/RF2 OUTPUT RETURN LOSS vs.
SWITCH CONTROL VOLTAGE (H)
Insertion Loss L
ins
(dB)
Input Power P
in
(dBm)
RFC-RF1/RF2 INSERTION LOSS,
I
cont
vs. INPUT POWER
0
–0.5
–1.0
–1.5
–2.0
–2.5
–3.0 25 35
20 30
15
6
5
4
3
2
1
0
Switch Control Current I
cont
( A)
μ
f = 2.5 GHz
V
cont (H)
= 3.0 V
L
ins
I
cont
f = 2.5 GHz
0.1 dB Loss Compression Input Power P
in (0.1 dB)
(dBm)
Frequency f (GHz)
RFC-RF1/RF2
P
in (0.1 dB)
vs. FREQUENCY
38
36
34
32
30
28
26
24
22
20 1.5 3.0
0.5 1.0 2.0 2.5
0.0
DC blocking capacitors:
f = 0.5 to 3.0 GHz 56 pF
f < 0.5 GHz 1 000 pF
V
cont (H)
= 3.0 V
3.0 5.0
2.5 3.5 4.0
2.0 4.5
0
–5
–10
–15
–20
–25
–30
–35
–40
–45
–50
f = 2.5 GHz
3.0 5.0
2.5 3.5 4.0
2.0 4.5
f = 2.5 GHz
0
–5
–10
–15
–20
–25
–30
–35
–40
–45
–50
Remark The graphs indicate nominal characteristics.
Data Sheet PG10770EJ01V0DS 7
μ
PG2408TB
MOUNTING PAD LAYOUT DIMENSIONS
6-PIN SUPER MINIMOLD (SC-88/SOT-363 type) (UNIT: mm)
0.65 0.65
1.9
0.8
0.4
Remark The mounting pad layout in this document is for reference only.
When designing PCB, please consider workability of mounting, solder joint reliability, prevention of solder
bridge and so on, in order to optimize the design.
Data Sheet PG10770EJ01V0DS
8
μ
PG2408TB
PACKAGE DIMENSIONS
6-PIN SUPER MINIMOLD (SC-88/SOT-363 type) (UNIT: mm)
0.9±0.1
0.7
0 to 0.1
0.15
+0.1
–0.05
0.2
+0.1
–0.05
2.0
+0.15
–0.20
1.3
0.650.65
1.25±0.1
2.1±0.1
0.1 MIN.
Data Sheet PG10770EJ01V0DS 9
μ
PG2408TB
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions. For soldering
methods and conditions other than those recommended below, contact your nearby sales office.
Soldering Method Soldering Conditions Condition Symbol
Infrared Reflow Peak temperature (package surface temperature) : 260°C or below
Time at peak temperature : 10 seconds or less
Time at temperature of 220°C or higher : 60 seconds or less
Preheating time at 120 to 180°C : 120±30 seconds
Maximum number of reflow processes : 3 times
Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below
IR260
Wave Soldering Peak temperature (molten solder temperature) : 260°C or below
Time at peak temperature : 10 seconds or less
Preheating temperature (package surface temperature) : 120°C or below
Maximum number of flow processes : 1 time
Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below
WS260
Partial Heating Peak temperature (terminal temperature) : 350°C or below
Soldering time (per side of device) : 3 seconds or less
Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below
HS350
Caution Do not use different soldering methods together (except for partial heating).
Data Sheet PG10770EJ01V0DS
10
μ
PG2408TB
Bluetooth is a trademark owned by Bluetooth SIG, Inc., U.S.A.
The information in this document is current as of July, 2009. The information is subject to change
without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets,
etc., for the most up-to-date specifications of NEC Electronics products. Not all products and/or
types are available in every country. Please check with an NEC Electronics sales representative for
availability and additional information.
No part of this document may be copied or reproduced in any form or by any means without the prior
written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may
appear in this document.
NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual
property rights of third parties by or arising from the use of NEC Electronics products listed in this document
or any other liability arising from the use of such products. No license, express, implied or otherwise, is
granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others.
Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
circuits, software and information in the design of a customer's equipment shall be done under the full
responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by
customers or third parties arising from the use of these circuits, software and information.
While NEC Electronics endeavors to enhance the quality and safety of NEC Electronics products, customers
agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. In addition, NEC
Electronics products are not taken measures to prevent radioactive rays in the product design. When customers
use NEC Electronics products with their products, customers shall, on their own responsibility, incorporate
sufficient safety measures such as redundancy, fire-containment and anti-failure features to their products in
order to avoid risks of the damages to property (including public or social property) or injury (including death) to
persons, as the result of defects of NEC Electronics products.
NEC Electronics products are classified into the following three quality grades: "Standard", "Special" and
"Specific".
The "Specific" quality grade applies only to NEC Electronics products developed based on a customer-
designated "quality assurance program" for a specific application. The recommended applications of an NEC
Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of
each NEC Electronics product before using it in a particular application.
The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC
Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications
not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to
determine NEC Electronics' willingness to support a given application.
(Note)
•
•
•
•
•
•
M8E0904E
(1)
(2)
"NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its
majority-owned subsidiaries.
"NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as
defined above).
Computers, office equipment, communications equipment, test and measurement equipment, audio
and visual equipment, home electronic appliances, machine tools, personal electronic equipment
and industrial robots.
Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support).
Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems and medical equipment for life support, etc.
"Standard":
"Special":
"Specific":
Data Sheet PG10770EJ01V0DS 11
μ
PG2408TB
Caution GaAs Products This product uses gallium arsenide (GaAs).
GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe
the following points.
• Follow related laws and ordinances when disposing of the product. If there are no applicable laws
and/or ordinances, dispose of the product as recommended below.
1. Commission a disposal company able to (with a license to) collect, transport and dispose of
materials that contain arsenic and other such industrial waste materials.
2. Exclude the product from general industrial waste and household garbage, and ensure that the
product is controlled (as industrial waste subject to special control) up until final disposal.
• Do not burn, destroy, cut, crush, or chemically dissolve the product.
• Do not lick the product or in any way allow it to enter the mouth.
μ
PG2408TB
