TDA6120Q/N2 - Philips Semiconductors / NXP Semiconductors

DATA SH EET

Product speciﬁcation

Supersedes data of 2000 Apr 19

File under Integrated Circuits, IC02

2000 Dec 13

INTEGRATED CIRCUITS

TDA6120Q

Video output amplifier

2000 Dec 13 2

Philips Semiconductors Product speciﬁcation

Video output ampliﬁer TDA6120Q

FEATURES

•High large-signal bandwidth of 32 MHz (typ.) at

125 V (p-p)

•High small-signal bandwidth of 47 MHz (typ.) at

60 V (p-p)

•Rise/fall time of 12.5 ns for 125 V (p-p)

•High slew rate of 10 V/ns

•Low static power dissipation of 2.6 W at 200 V supply

voltage

•High maximum output voltage

•Bandwidth independent of voltage gain

•Maximum overall voltage gain over 46 dB

•High Power Supply Rejection Ratio (PSRR)

•Fast cathode current measurement output for dark

current control loop

•Differential voltage input.

GENERAL DESCRIPTION

The TDA6120Q is a single 32 MHz, 125 V (p-p) video

output amplifier contained in a plastic DIL-bent-SIL power

package.Thedeviceuseshigh-voltageDMOStechnology

and is intended to drive the cathodes of a CRT in High

Definition TVs (HDTVs) or monitors.

ORDERING INFORMATION

TYPE

NUMBER PACKAGE

NAME DESCRIPTION VERSION

TDA6120Q DBS13P plastic DIL-bent-SIL power package; 13 leads (lead length 7.7 mm) SOT141-8

2000 Dec 13 3

Philips Semiconductors Product speciﬁcation

Video output ampliﬁer TDA6120Q

BLOCK DIAGRAM

handbook, full pagewidth

MGK440

1×

CURRENT

INPUT

out 1×

in out 4×

MIRROR

1×

in out

CASCODE

MIRROR

4×

in out

CASCODE

+J5 mA

0.7 pF

TDA6120Q

9, 11

n.c.

VCC

VIN−

134

RC−RC+VIN+

GND

OUTC

OUT

OUTM

IIN VDD

Fig.1 Block diagram.

handbook, full pagewidth

MGK441

442 Ω

68 pF

RC−RC+

135791113

24 6 8 10 12

22 Ω

VIN−VIN+

10 nF

CCC

µF

CDD

µF

100

TDA6120Q

22 kΩ

IIN OUTM n.c. n.c. OUT

CRTVIN 220 Ω

50 Ω

Rflash

VCC VDD

Dflash

OUTCGND

+12 V +200 V

Vref

Ria

Fig.2 Top view.

2000 Dec 13 4

Philips Semiconductors Product speciﬁcation

Video output ampliﬁer TDA6120Q

PINNING

SYMBOL PIN DESCRIPTION

RC−1 inverting input pre-emphasis

network

VIN−2 inverting voltage input

RC+ 3 non-inverting input pre-emphasis

network

VIN+ 4 non-inverting voltage input

IIN 5 feedback current input

VCC 6 low supply voltage (12 V)

OUTM 7 cathode current measurement

output

GND 8 power ground

n.c. 9 not connected

VDD 10 high supply voltage (200 V)

n.c. 11 not connected

OUTC 12 cathode output

OUT 13 feedback output

handbook, halfpage

RC−

VIN−

RC+

VIN+

IIN

VCC

OUTM

GND

n.c.

VDD

n.c.

OUTC

OUT

TDA6120Q

MGK438

Fig.3 Pin configuration.

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 60134).

SYMBOL PARAMETER MIN. MAX. UNIT

VDD high supply voltage 0 280 V

VCC low supply voltage 0 20 V

Viinput voltage (pins 2 and 4) 0 VCC V

Vi(dif) differential mode input voltage (pins 2 and 4) −VCC +VCC V

Vi(pe) pre-emphasis input voltage (pins 1 and 3) 0 VCC V

Vi(dif)(pe) differential mode pre-emphasis input voltage (pins 1 and 3) −VCC +VCC V

VIIN input voltage (pin 5) 0 2VBE V

VOUTM measurement output voltage 0 20 V

Vooutput voltage (pins 12 and 13) 0 VDD V

Tstg storage temperature −55 +150 °C

Tjjunction temperature −20 +150 °C

VESD voltage peak human body model −2000 V

voltage peak machine model −300 V

2000 Dec 13 5

Philips Semiconductors Product speciﬁcation

Video output ampliﬁer TDA6120Q

handbook, halfpage

−20 160

(1)

(2)

MGK442

04020 80 120

Tamb (°C)

Ptot

(W)

Fig.4 Power derating curve.

(1) Infinite heatsink.

(2) No heatsink.

THERMAL CHARACTERISTICS

QUALITY SPECIFICATION

Quality specification in accordance with

“SNW-FQ-611 part D”

SYMBOL PARAMETER VALUE UNIT

Rth(j-c) thermal resistance from junction to case 3.0 K/W

2000 Dec 13 6

Philips Semiconductors Product speciﬁcation

Video output ampliﬁer TDA6120Q

CHARACTERISTICS

Operating range: Tj=−20 to +150 °C; VDD = 180 to 210 V; VCC = 10.8 to 13.2 V; VOUTM = 3 to 16.5 V;

VVIN−= 1.5 to VCC −6 V; VVIN+= 1.5 to VCC −6 V. Test conditions: Tj=25°C; VDD = 200 V; VCC = 12 V; VVIN+ =3V;

OUTM =6V;C

L=10pF(C

Lconsists of parasitic and cathode capacitance); Rth(h-a) = 4 K/W; test circuit of Fig.5; unless

otherwise speciﬁed.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

IDD(q) quiescent high voltage

supply current VOUTC = 100 V 9 11 13 mA

ICC(q) quiescent low voltage supply

current VVIN−=V

VIN+ 35 45 55 mA

Ibias input bias current

(pins 2 and 4) VOUTC = 100 V −76 −µA

OUTC DC output voltage

(pins 12 and 13) VVIN−=V

VIN+ 85 103 120 V

∆VOUTC(T) DC output voltage

temperature drift

(pins 12 and 13)

VVIN−=V

VIN+; temperature

range 30 °C<T

j< 110 °C−100 −25 +55 mV/K

I(offset)OUTM offset current of

measurement output note 1 −30 0 +30 µA

∆IOUTM/∆IOUTC linearity of current transfer −50 µA<I

OUTC < +50 µA;

note 1 −1.0 −

Ciinput capacitance

(pins 2 and 4) VOUTC =V

OUTC(max) −4−pF

IOUTC(max) maximum dynamic peak

output current (pin 12) 20V<V

OUTC <V

DD −20 V −100 −mA

VOUTC(min) minimum output voltage

(pin 12) −410V

OUTC(max) maximum output voltage

(pin 12) VDD −10 VDD −6−V

VCC(sw) VCC switch level at which

pins OUT and OUTC

become HIGH

−8.8 −V

Gint internal gain 1.68 1.87 2.08

Bssmall-signal bandwidth

(pin 12) VOUTC(AC) = 60 V (p-p);

VOUTC(DC) = 100 V 40 47 −MHz

Bllarge-signal bandwidth

(pin 12) VOUTC(AC) = 125 V (p-p);

VOUTC(DC) = 100 V 28 32 −MHz

tpd cathode output propagation

time 50% input to 50%

output (pin 12)

VOUTC(AC) = 125 V (p-p);

VOUTC(DC) = 100 V; square

wave; f < 1 MHz;

tf(VIN−) = 10 ns;

tr(VIN−) = 10 ns; see

Figs 6 and 7

10 −15 ns

2000 Dec 13 7

Philips Semiconductors Product speciﬁcation

Video output ampliﬁer TDA6120Q

Notes

1. The operating range of the measurement output OUTM is 3 to 16.5 V. Below 3 V, OUTM acts as a voltage source

with an output resistance such that the maximum current input from OUTM is 1.25 mA.

2. The ratio of the change in supply voltage to the change in input voltage when there is no change in output voltage.

to(r) cathode output rise time

10% output to 90% output

(pin 12)

VOUTC(AC) = 125 V (p-p);

VOUTC(DC) = 100 V; square

wave; f < 1 MHz;

tf(VIN−) = 10 ns;

tr(VIN−) = 10 ns; see Fig.6

10 12.5 18 ns

to(f) cathode output fall time 90%

output to 10% output

(pin 12)

VOUTC(AC) = 125 V (p-p);

VOUTC(DC) = 100 V; square

wave; f < 1 MHz;

tf(VIN−) = 10 ns;

tr(VIN−) = 10 ns; see Fig.7

10 12.5 15 ns

tst settling time 50% input to

(99% <output <101%)

(pin 12)

VOUTC(AC) = 125 V (p-p);

VOUTC(DC) = 100 V; square

wave f < 1 MHz;

tf(VIN−) = 10 ns;

tr(VIN−) = 10 ns; see

Figs 6 and 7

−−350 ns

SRrslew rate rise between

30Vto(V

DD −30 V) (pin 12) VVIN−= 2 V (p-p); square

wave; f < 1 MHz;

tf(VIN−) = 10 ns;

tr(VIN−) =10ns

−8−V/ns

SRfslew rate fall between

(VDD −30 V) to 30 V (pin 12) VVIN−= 2 V (p-p); square

wave; f < 1 MHz;

tf(VIN−) = 10 ns;

tr(VIN−) =10ns

−10 −V/ns

OVr cathode output voltage

overshoot rise (pin 12) VOUTC(AC) = 125 V (p-p);

VOUTC(DC) = 100 V; square

wave; f < 1 MHz;

tf(VIN−) = 10 ns;

tr(VIN−) = 10 ns; see

Figs 6 and 7

−5−%

OVf cathode output voltage

overshoot fall (pin 12) VOUTC(AC) = 125 V (p-p);

VOUTC(DC) = 100 V; square

wave; f < 1 MHz;

tf(VIN−) = 10 ns;

tr(VIN−) = 10 ns; see

Figs 6 and 7

−20 −%

PSRRh high voltage power supply

rejection ratio f < 50 kHz; note 2 −44 −dB

PSRRl low voltage power supply

rejection ratio f < 50 kHz; note 2 −48 −dB

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

2000 Dec 13 8

Philips Semiconductors Product speciﬁcation

Video output ampliﬁer TDA6120Q

handbook, full pagewidth

MGK443

442 Ω

22 Ω

Ria

47 Ω

RCC

47 Ω

RDD

147 Ω

Rflash

68 pF

22 kΩ

2 MΩ

1 kΩ

100 kΩ

CCCC

50 Ω

RaRba

1 kΩ

Rbb

RC−

VIN−

VIN

+12 V +200 V

Vref RC+

VIN+

IIN

VCC

OUTM

GND Im

VDD

OUTC

OUT

VOUT

C11 10 µF

C10 22 nF

C13 10 µF

47 µF

CCC

10 nF

6.8 pF

3.3 pF C9

136 pF

CDDD

10 µF

CDD

10 nF

C12 22 nF

TDA6120Q

Fig.5 Test circuit with gain of 40 dB.

Overall gain Gint Rf

-----

×=

2000 Dec 13 9

Philips Semiconductors Product speciﬁcation

Video output ampliﬁer TDA6120Q

162.5

150

100

37.5

163.75

161.25

tst

overshoot (in %)

to(r)

Voc

MGK444

tpd

Fig.6 Output (pins 12 and 13; rising edge) as a function of input signal.

2000 Dec 13 10

Philips Semiconductors Product speciﬁcation

Video output ampliﬁer TDA6120Q

162.5

150

100

37.5 38.75

36.25

overshoot (in %)

MGK445

Voc

tpd

tst

to(r)

Fig.7 Output (pins 12 and 13; falling edge) as a function of input signal.

FLASHOVER PROTECTION

The TDA6120Q needs an external protection diode

combinedwitha50 Ωresistorto protectthevideo amplifier

against CRT flashover discharge.

An external 147 Ω carbon high-voltage resistor in

combination with a 2 kV spark gap between the cathode

and ground will limit the maximum clamp current (for this

resistor value, the CRT has to be connected to the main

printed-circuit board).

This external network causes an increase in the rise and

fall times and a decrease in the overshoot.

Pin 10 must be decoupled to pin 8:

•By a capacitor >100 nF with good HF behaviour (e.g.

foil). This capacitor must be placed as close as possible

to pins 10 and 8; definitely within 5 mm.

•By a capacitor >10 µF on the picture tube base

printed-circuit board (common for 3 output stages).

2000 Dec 13 11

Philips Semiconductors Product speciﬁcation

Video output ampliﬁer TDA6120Q

TEST AND APPLICATION INFORMATION

Dissipation

Regarding dissipation, distinction must be made between

static dissipation (independent of frequency) and dynamic

dissipation (proportional to frequency). The static

dissipationoftheTDA6120Qis duetosupplycurrents,and

currents in the feedback network and CRT.

The static dissipation is given by the following equation:

Where:

Rf= feedback resistance

IOUTC = DC cathode current.

Thedynamic dissipationisgivenby thefollowingequation:

Pdyn =V

DD ×(CL+C

int)×f×VOUTC(p-p) ×b

Where:

CL= load capacitance

Cint = effective internal load capacitance

(approximately 7 pF)

f = frequency

VOUTC(p-p) = output voltage (peak-to-peak value)

b = non-blanking duty cycle (0.8).

The IC must be mounted on the picture tube base

printed-circuit board to minimize the load capacitance CL.

Switch-off

The TDA6120Q is equipped with a switch-off circuit to

guarantee a controlled switch-off behaviour of the output

pins. The switch-off function is activated when the low

supply voltage (VCC) drops below a reference level

(VCC(sw)). Then the voltage at output pins OUT and OUTC

is pulled to the high supply voltage level (VDD),

independant of input pin voltage levels.

Pstat VCC ICC VDD IDD

VOUTC VOUTC

------------------ VOUTC IOUTC

×–×–

×+×=

2000 Dec 13 12

Philips Semiconductors Product speciﬁcation

Video output ampliﬁer TDA6120Q

INTERNAL PIN CONFIGURATION

handbook, full pagewidth

MGK439

ESD

TDA6120Q

ESD

RC+

VIN+

RC−OUTC

VDD

VCC

OUT

OUTM

GND

VIN−

IIN

Fig.8 Internal pin diagram.

2000 Dec 13 13

Philips Semiconductors Product speciﬁcation

Video output ampliﬁer TDA6120Q

PACKAGE OUTLINE

UNIT A e1

A2bpcD

(1) E(1) Z(1)

deD

hLL

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC EIAJ

mm 17.0

15.5 4.6

4.4 0.75

0.60 0.48

0.38 24.0

23.6 20.0

19.6 10 3.4

12.2

11.8 1.7

5.08 2.4

1.6

62.00

1.45

2.1

1.8

3.4

3.1 4.3

DIMENSIONS (mm are the original dimensions)

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

8.4

7.0

SOT141-8

0 5 10 mm

scale

0.25

0.6

0.03

Ze2

113

97-12-16

99-12-17

DBS13P: plastic DIL-bent-SIL power package; 13 leads (lead length 7.7 mm) SOT141-8

non-concave

view B: mounting base side

2000 Dec 13 14

Philips Semiconductors Product speciﬁcation

Video output ampliﬁer TDA6120Q

SOLDERING

Introduction to soldering through-hole mount

packages

This text gives a brief insight to wave, dip and manual

soldering.A more in-depth accountofsolderingICs can be

found in our

“Data Handbook IC26; Integrated Circuit

Packages”

(document order number 9398 652 90011).

Wave soldering is the preferred method for mounting of

through-hole mount IC packages on a printed-circuit

board.

Soldering by dipping or by solder wave

The maximum permissible temperature of the solder is

260 °C; solder at this temperature must not be in contact

with the joints for more than 5 seconds.

Thetotal contacttimeofsuccessivesolder wavesmustnot

exceed 5 seconds.

The device may be mounted up to the seating plane, but

the temperature of the plastic body must not exceed the

specified maximum storage temperature (Tstg(max)). If the

printed-circuit board has been pre-heated, forced cooling

may be necessary immediately after soldering to keep the

temperature within the permissible limit.

Manual soldering

Apply the soldering iron (24 V or less) to the lead(s) of the

package, either below the seating plane or not more than

2 mm above it. If the temperature of the soldering iron bit

is less than 300 °C it may remain in contact for up to

10 seconds. If the bit temperature is between

300 and 400 °C, contact may be up to 5 seconds.

Suitability of through-hole mount IC packages for dipping and wave soldering methods

Note

1. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.

PACKAGE SOLDERING METHOD

DIPPING WAVE

DBS, DIP, HDIP, SDIP, SIL suitable suitable(1)

2000 Dec 13 15

Philips Semiconductors Product speciﬁcation

Video output ampliﬁer TDA6120Q

DATA SHEET STATUS

Note

1. Please consult the most recently issued data sheet before initiating or completing a design.

DATA SHEET STATUS PRODUCT

STATUS DEFINITIONS (1)

Objective speciﬁcation Development This data sheet contains the design target or goal speciﬁcations for

product development. Speciﬁcation may change in any manner without

notice.

Preliminary speciﬁcation Qualiﬁcation This data sheet contains preliminary data, and supplementary data will be

published at a later date. Philips Semiconductors reserves the right to

make changes at any time without notice in order to improve design and

supply the best possible product.

Product speciﬁcation Production This data sheet contains ﬁnal speciﬁcations. Philips Semiconductors

reserves the right to make changes at any time without notice in order to

improve design and supply the best possible product.

DEFINITIONS

Short-form specification  The data in a short-form

specification is extracted from a full data sheet with the

same type number and title. For detailed information see

the relevant data sheet or data handbook.

Limiting values definition Limiting values given are in

accordance with the Absolute Maximum Rating System

(IEC 60134). Stress above one or more of the limiting

values may cause permanent damage to the device.

These are stress ratings only and operation of the device

atthese or atanyotherconditions above thosegivenin the

Characteristics sections of the specification is not implied.

Exposure to limiting values for extended periods may

affect device reliability.

Application information  Applications that are

described herein for any of these products are for

illustrative purposes only. Philips Semiconductors make

norepresentationorwarrantythatsuchapplicationswill be

suitable for the specified use without further testing or

modification.

DISCLAIMERS

Life support applications  These products are not

designed for use in life support appliances, devices, or

systems where malfunction of these products can

reasonably be expected to result in personal injury. Philips

Semiconductorscustomersusingorsellingtheseproducts

for use in such applications do so at their own risk and

agree to fully indemnify Philips Semiconductors for any

damages resulting from such application.

Right to make changes  Philips Semiconductors

reserves the right to make changes, without notice, in the

products, including circuits, standard cells, and/or

software, described or contained herein in order to

improve design and/or performance. Philips

Semiconductors assumes no responsibility or liability for

theuse ofanyoftheseproducts, conveysnolicence ortitle

under any patent, copyright, or mask work right to these

products,and makes no representations orwarrantiesthat

these products are free from patent, copyright, or mask

work right infringement, unless otherwise specified.

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed

without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license

under patent- or other industrial or intellectual property rights.

Internet: http://www.semiconductors.philips.com

2000 70

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Printed in The Netherlands 753504/04/pp16 Date of release: 2000 Dec 13 Document order number: 9397 750 07562