
Document No TMR-XX0S001A
Issued date 2003/09/12
Milli-Ohm Resistors
MR Series
page 2/2
TA-I TECHNOLOGY CO., LTD
5. Electrical & Mechanical Performance
:
Item Specification Testing Method
Resistance to
soldering heat
1
、
damage
2
、
△
R/R
≦±1
%
Dipping into 260±
5℃
solder for 10±1 sec.
Measuring after 1 hr recovery time.
Solderability
Surface area must
be covered with
new solder 95%.
Dipping specimen with flux into 235±
5℃
solder for 2±
0.5 sec.
Thermal shock 1
、
No mechanical
damage.
2
、
△
R/R
≦
±2%
Loading with rating current for 30 min at
room temperature , the put into –55
℃
chamber within8~12 sec for 15 min.
Temperature
cycling
1
、
No mechanical
damage.
2
、
△
R/R
≦
±1%
Cycling with step1 to step4 for 5 cycles
Step Temperature Time
1 -55±
3℃
30 min
2 Room temp 10~15 min
3 155±
2℃
30 min
4 Room temp 10~15 min
Load life in
humidity
1
、
No mechanical
damage.
2
、
△
R/R
≦
±3%
The test chamber with temperature 40±
2℃
and R.H.=90~95%, load with rater DC
Current for 1.5hr ON/0.5hr OFF repeatedly
for 1000hr.
Load life
(Endurance)
1
、
No mechanical
damage.
2
、
△
R/R
≦
±2%
The test chamber with temperature 70±
2℃
and load with rated DC Current for 1.5hr
ON/0.5hr OFF repeatedly for 1000hr.
Testing method is according to JIS-C 5202