BAS85 Schottky barrier diode Rev. 05 -- 25 March 2009 Product data sheet 1. Product profile 1.1 General description Planar Schottky barrier diode with an integrated guard ring for stress protection, encapsulated in a small hermetically sealed glass SOD80C Surface-Mounted Device SMD package with tin-plated metal discs at each end. It is suitable for "automatic placement" and as such it can withstand immersion soldering. 1.2 Features n n n n Low forward voltage High breakdown voltage Guard-ring protected Hermetically sealed glass SMD package 1.3 Applications n n n n Ultra high-speed switching Voltage clamping Protection circuits Blocking diodes 1.4 Quick reference data Table 1. Quick reference data Symbol Parameter Min Typ Max Unit IF forward current Conditions - - 200 mA VR reverse voltage - - 30 V VF forward voltage - - 800 mV IF = 100 mA BAS85 NXP Semiconductors Schottky barrier diode 2. Pinning information Table 2. Pinning Pin Description 1 cathode 2 anode Simplified outline Graphic symbol [1] k 1 a 2 sym001 [1] The marking band indicates the cathode. 3. Ordering information Table 3. Ordering information Type number BAS85 Package Name Description Version - hermetically sealed glass surface-mounted package; 2 connectors SOD80C 4. Marking Table 4. Marking codes Type number Marking code[1] BAS85 marking band [1] grey: made in Philippines purple: made in China 5. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter VR reverse voltage Conditions IF forward current [1] Max Unit 30 V - 200 mA - 200 mA IF(AV) average forward current IFRM repetitive peak forward current tp 1 s; 0.5 - 300 mA IFSM non-repetitive peak forward current tp = 10 ms - 5 A Tj junction temperature - 125 C Tamb ambient temperature -65 +125 C Tstg storage temperature -65 +150 C [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. BAS85_5 Product data sheet Min - (c) NXP B.V. 2009. All rights reserved. Rev. 05 -- 25 March 2009 2 of 9 BAS85 NXP Semiconductors Schottky barrier diode 6. Thermal characteristics Table 6. Symbol Rth(j-a) [1] Thermal characteristics Parameter Conditions thermal resistance from junction to ambient in free air [1] Min Typ Max Unit - - 320 K/W Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. 7. Characteristics Table 7. Characteristics Tamb = 25 C unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit VF forward voltage IF = 0.1 mA - - 240 mV IF = 1 mA - - 320 mV IF = 10 mA - - 400 mV IF = 30 mA - - 500 mV - - 800 mV IF = 100 mA IR reverse current VR = 25 V Cd diode capacitance VR = 1 V; f = 1 MHz [1] - - 2.3 A - - 10 pF Pulse test: tp 300 s; 0.02. BAS85_5 Product data sheet [1] (c) NXP B.V. 2009. All rights reserved. Rev. 05 -- 25 March 2009 3 of 9 BAS85 NXP Semiconductors Schottky barrier diode mra540 IF(AV) (mA) mld358 103 250 IF (mA) 200 (1) (2) (3) 102 150 10 100 (1) (2) (3) 1 50 0 0 50 100 150 10-1 0 0.4 0.8 Tamb (C) VF (V) 1.2 (1) Tamb = 125 C FR4 PCB, standard footprint (2) Tamb = 85 C (3) Tamb = 25 C Fig 1. Average forward current as a function of ambient temperature; derating curve Fig 2. mgc682 105 IR (nA) Forward current as a function of forward voltage; typical values mgc681 12 (1) Cd (pF) 104 8 103 (2) 102 4 10 1 (3) 10-1 0 0 10 20 VR (V) 0 30 (1) Tamb = 85 C 10 20 VR (V) 30 f = 1 MHz; Tamb = 25 C (2) Tamb = 25 C (3) Tamb = -40 C Fig 3. Reverse current as a function of reverse voltage; typical values Fig 4. Diode capacitance as a function of reverse voltage; typical values BAS85_5 Product data sheet (c) NXP B.V. 2009. All rights reserved. Rev. 05 -- 25 March 2009 4 of 9 BAS85 NXP Semiconductors Schottky barrier diode 8. Package outline 0.3 0.3 1.60 1.45 3.7 3.3 Dimensions in mm Fig 5. 06-03-16 Package outline SOD80C 9. Packing information Table 8. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number BAS85 [1] Package Description SOD80C 4 mm pitch, 8 mm tape and reel 2500 10000 -115 -135 For further information and the availability of packing methods, see Section 13. BAS85_5 Product data sheet Packing quantity (c) NXP B.V. 2009. All rights reserved. Rev. 05 -- 25 March 2009 5 of 9 BAS85 NXP Semiconductors Schottky barrier diode 10. Soldering 4.55 4.30 2.30 solder lands solder paste 2.25 1.70 1.60 solder resist occupied area Dimensions in mm 0.90 (2x) Fig 6. sod080c Reflow soldering footprint SOD80C 6.30 4.90 2.70 1.90 solder lands solder resist occupied area 2.90 1.70 tracks Dimensions in mm sod080c Fig 7. Wave soldering footprint SOD80C BAS85_5 Product data sheet (c) NXP B.V. 2009. All rights reserved. Rev. 05 -- 25 March 2009 6 of 9 BAS85 NXP Semiconductors Schottky barrier diode 11. Revision history Table 9. Revision history Document ID Release date Data sheet status Change notice Supersedes BAS85_5 20090325 Product data sheet - BAS85_4 Modifications: * The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. * * * * * * * Legal texts have been adapted to the new company name where appropriate. Table 1 "Quick reference data": added Section 4 "Marking": enhanced Figure 5: superseded by minimized package outline drawing Section 9 "Packing information": added Section 10 "Soldering": added Section 12 "Legal information": updated BAS85_4 20000525 Product specification - BAS85_3 BAS85_3 19961001 Product specification - BAS85_2 BAS85_2 19960320 Product specification - - BAS85_5 Product data sheet (c) NXP B.V. 2009. All rights reserved. Rev. 05 -- 25 March 2009 7 of 9 BAS85 NXP Semiconductors Schottky barrier diode 12. Legal information 12.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term `short data sheet' is explained in section "Definitions". [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 12.2 Definitions Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 12.3 Disclaimers General -- Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes -- NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use -- NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Quick reference data -- The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Export control -- This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. 12.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 13. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com BAS85_5 Product data sheet (c) NXP B.V. 2009. All rights reserved. Rev. 05 -- 25 March 2009 8 of 9 BAS85 NXP Semiconductors Schottky barrier diode 14. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 10 11 12 12.1 12.2 12.3 12.4 13 14 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . General description. . . . . . . . . . . . . . . . . . . . . . Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . Quick reference data. . . . . . . . . . . . . . . . . . . . . Pinning information . . . . . . . . . . . . . . . . . . . . . . Ordering information . . . . . . . . . . . . . . . . . . . . . Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . Thermal characteristics. . . . . . . . . . . . . . . . . . . Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . Package outline . . . . . . . . . . . . . . . . . . . . . . . . . Packing information. . . . . . . . . . . . . . . . . . . . . . Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Revision history . . . . . . . . . . . . . . . . . . . . . . . . . Legal information. . . . . . . . . . . . . . . . . . . . . . . . Data sheet status . . . . . . . . . . . . . . . . . . . . . . . Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . . Contact information. . . . . . . . . . . . . . . . . . . . . . Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1 1 1 1 2 2 2 2 3 3 5 5 6 7 8 8 8 8 8 8 9 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'. (c) NXP B.V. 2009. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 25 March 2009 Document identifier: BAS85_5