5962F0252301VXA - Aeroflex / Colorado Springs

1000 Bytes

RAM

ALU

MicroCode

Engine

Interrupt

Controller PTS

Memory

Controller

Queue

Watchdog

Timer PWM

PORT2

Serial

Port HSIO and

Timers

HSI HSO

Alternate

Functions

CPU

Alternate

Functions

PORT1

HOLD

HLDA

BREQ

PWM1

PWM2

Control

Signals

Address /Data Bus

Figure 1. UT80CRH196KDS Microcontroller

FirstPass

Core IP

PORT0

EXTINT

ECB0-

ECB5

FEATURES

20MHz 16-bit Microcontroller compatible with industry

standard’s MCS-96 ISA

- Register to Register Architecture

- 1000 Byte Register RAM

Three 8-bit I/O Ports

On-board Interrupt Controller

Three Pulse-Width Modulated Outputs

High Speed I/O

UART Ser ial Port

Dedicated Baud Rate Generator

Software and Hardware Timers

- 16-Bit Watchdog Timer, Four 16-Bit Software Timers

- Three 16-Bit Counter/Timers

Radiation-hardened process and design; total dose

irradiation testing to MIL-STD-883 Metho d 1019

- Total-dose: 300K rads(Si)

- Onset LET Threshold: 25MeV-cm2/mg

- Saturated cross section: 6.0E-7 cm2/bit

- Latchup immune (LET > 128 MeV-cm2/mg)

 Error detection and correction for external memory accesses

 QML Q and QML V compliant part

 Standard Microcircuit Drawing 5962-02523

INTRODUCTION

The UT80CRH196KDS is compatible with industry standard’ s

MCS-96 instruction set. The UT80CRH196KDS is supported

by commercial hardware and software development tools. Built

on UTMC’s Commercial RadHardTM epitaxial CMOS

technology, the microcontroller is hardened against ionizi ng

dose and charged particles. The microcontroller’s on-board

1000 byte scratch-pa d SRAM and flip-flops can withstand

charged particles with energies up to 25 MeV-cm2/mg.

The UT80CRH196KDS accesses instruction code and data via

a 16-bit address and data bus. The 16-bit bus allo ws the

microcontroller to access 128K bytes of instruction/data

memory. Integrated softw are and hardware timers, hi gh speed

I/O, pulse width modulation circuitry, and UART make the

UT80CRH196KDS ideal for control type app lications. The

CPU’s ALU supports byte and word adds and subtracts, 8 and

16 bit multiplies, 32/16 and 16/8 bit divides, as well as

increment, decrement, negate, compare, and logical operations.

The UT80CRH196KDS’s interrupt controller prioritizes and

vectors 18 interrupt events. Interrupts include normal interrupts

and special interrupts. To reduce power consumpti on, the

microcontroller supports software invoked idle and power down

modes. The UT80CRH196KDS is packaged in a 68-lead quad

flatpack.

Standard Products

UT80CRH196KDS Microcontroller

Datasheet

March, 2008

www.aeroflex.com/radhard

1.0 SIGNAL DESCRIPTION

Port 0 (P0.0 - P0.7): Port 0 is an 8-bit input only port when used

in its default mode. When configured for their alternate function,

five of the bits are bi-directiona l EDAC check bits as s hown in

Table 1.

Port 1 (P1. 0 - P1.7) : Port 1 is an 8-bit, quasi-bidirectional, I/O

port. All pins are quasi-bi directional unless the alternate

function is selected per Table 2. When the pins are configured

for their alternate functions, they act as standard I/O, not quasi-

bidirectional.

Port 2 (P2.0 - P2.7): Port 2 is an 8-bit, multifunctional, I/O port.

These pins are shared with timer 2 functions, serial data I/O and

PWM0 output, per Table 3.

AD0-AD7: The lower 8-bits of the multiplexed address/data

bus. The pins on this port are bidirectional during the data phase

of the bus cycle.

AD8-AD15: The upper 8-bits of the multipl exed address/data

bus. The pins on this port are bidirectional during the data phase

of the 16-bit bus cycle. When runni ng in 8-bit bus width, these

pins are non-multiplexed, dedicated upper address bit ou tputs.

HSI: Inputs to the High Speed Input Unit. Four HSI pins are

available: HSI.0, HSI.1, HSI.2, and HSI.3. Two of these pins

(HSI.2 and HSI.3) are share d with the HSO Unit. Two of these

pins (HSI.0 and HSI.1) have alternate functions for Timer 2.

HSO: Outputs from the High Speed Output Unit. Six HSO pins

are available: HSO.0, HSO.1, HSO.2, HSO.3, HSO.4, and

HSO.5. Pin s HSO.4 and HSO.5 are shared with pins HSI. 2 and

HSI.3 of the HSI Unit respectively.

Table 1. Port 0 Alternate Functions

Port Pin Alternate

Name Alternate Function

P0.0-P0.3,

P0.6 ECB0-ECB4 Error Detection & Correct i on

Check Bits

P0.4

P0.5 Input Port Pins

P0.7 EXTINT Setting IOC1.1=1 will allow P0.7

to be used for EXTINT (INT07)

Table 2. Port 1 Alternate Functions

Port

Pin Alternate

Name Alternate Function

P1.0 P1.0 I/O Pin

P1.1 P1.1 I/O Pin

P1.2 P1.2 I/O Pin

P1.3 PWM1 Setting IOC3.2=1 enables P1.3 as

the Pulse Width Modulator

(PWM1) output pin.

P1.4 PWM2 Setting IOC3.3=1 enables P1.4 as

the Pulse Width Modulator

(PWM2) output pin.

P1.5 BREQ Bus Request, output activated

when the bus controller has a

pending external memory cycle.

P1.6 HLDA Bus Hold Acknowledge, out put

indicating the release of the bus.

P1.7 HOLD Bus Hold, input requesting control

of the bus.

Table 3. Port 2 Alternate Functions

Port

Pin Alternate

Name Alternate Function

P2.0 TXD Transmit Serial Data.

P2.1 RXD Receive Serial Data.

P2.2 EXTINT External interrupt. Clearing

IOC1.1 will allow P2.2 to be

used for EXTINT (INT07)

P2.3 T2CLK T imer 2 clock input and Serial

port baud rate generator input.

P2.4 T2RST Timer 2 Reset

P2.5 PWM0 Pulse Width Modulator

output 0

P2.6 T2UP-DN Controls the direction of the

Timer 2 counter. Logic High

equals count down. Logic low

equals count up.

P2.7 T2CAPTURE A rising edge on P2.7 causes

the value of Timer 2 to be

captured into this register , and

generates a Timer 2 Capture

interrupt (INT11).

1.1 Hardware Interface

1.1.1 Interfacing with External Memory

The UT80CRH196KDS can interface with a variety of external

memory devices. It supports either a fixed 8-bit bus width or a

dynamic 8-bit/16-bit bus width, internal READ Y control for

slow external memory devices, a bus-hold protocol that enables

external devices to take over the bus, and several bus-control

modes. These features provide a great deal of flexibility when

interfacing with external memory devices.

1.1.1.1 Chip Configuration Register

The Chip Configuration Register (CCR) is used to initialize the

UT80CRH196KDS immediately after reset. The CCR is fetched

from external address 2018H (Chip Con fig uration Byte) after

removal of the reset signal. The Chip Configuration Byte (CCB)

is read as either an 8-bit or 16-bit word depending on the value

of the BUSWIDTH pin. The composition of the bits in the CCR

are shown in Table 4.

There are 8 configuration bits available in the CCR. However,

bits 7 and 6 are not used by the UT80CRH196KDS. Bits 5 and

4 comprise the READY mode control which define internal

limits for waitstates generated by the READY pin. Bit 3 controls

the definition of the ALE/ADV pin for system memory controls

while bit 2 selects between the different write modes. Bit 1

selects whether the UT80CRH196KDS will use a dynamic 16-

bit bus or whether it will be locked in as an 8-bit bus. Finally,

Bit 0 enables the Power Down mode an d allows the user to

disable this mode for protection again st inadvertent power

downs.

1.1.1.2 Bus Width and Memory Configurations

The UT80CRH196KDS external bus can operate as either an 8-

bit or 16-bit multiplexed address/data bus (see figure 2). The

value of bit 1 in the CCR determines the bus operation. A logic

low value on CCR.1 locks the bus controller in 8-bit bus mode.

If, however , CCR.1 is a logic high, then the BUSWIDTH signal

is used to decide the width of the bus. The bus is 16 bits wide

when the BUSWIDTH signal is high, and is 8 bits when the

BUSWIDTH signal is low.

1.1.2 Reset

To reset the UT80CRH196KDS, hol d the RESET pin low for

at least 16 state times after the power supply is within tolerance

and the oscillator has stabilized. Resets following the power-up

reset may be asserted for at least one state time, and the device

will turn on a pull-down transistor for 16 state tim es. This

enables the RESET signal to function as the system reset. The

reset state of the external I/O is shown in Table 9, and the register

reset values are shown in Table 8.

1.1.3 Instruction Set

The instruction set for the UT80CRH196KDS is compatible

with the industry standard MCS-96 instruction set used on the

8XC196KDS.

Notes:

1.The first instruction read following reset will be from location 2080h. All other external memory can be used as instruction and/or data memory.

Table 4. Chip Configuration Register

Bit Function

7 N/A

6 N/A

5IRC1 - Internal READY Mode Control

4IRC0 - Internal READY Mode Control

3Address Valid Strobe Select (ALE/ADV)

2Write Strobe Mode Select (WR and BHE/WRL an d WRH)

1Dynamic Bus Width Enable

0Enable Power Down Mode

Table 5. Memory Map

Memory Description Begin End

External Memory102080H 0FFFFH

Reserved 0205EH 0207FH

PTS Vectors 02040H 0205DH

Upper Interrupt Vectors 02030H 0203FH

Reserved 02020H 0202FH

Reserved 02019H 0201FH

Chip Configuration Byte 02018H 02018H

Reserved 02014H 02017H

Lower Interrupt Vectors 02000H 02013H

External Memory 00400H 1FFFH

Internal Memory (RAM) 0001AH 003FFH

Special Function Registers 00000H 00019H

Table 6. Interrupt Vector Sources, Locations, and Priorities

Number Interrupt Vector Source(s) Interrupt

Vector

Location

PTS

Vector

Location

Priority1

(0 is the

Lowest

Priority)

Special Unimplemented

Opcode Unimplemented Opcode 2012h N/A N/A

Special Software Trap Software Trap 2010h N/A N/A

INT 15 NMI2NMI 203Eh N/A 15

INT 14 HSI FIFO Full HSI FIFO Full 203Ch 205Ch 14

INT 13 EXTINT 12Port 2.2 203Ah 205Ah 13

INT 12 Timer 2 Overflow Timer 2 Overflow 2038h 2058h 12

INT 11 Timer 2 Capture2Timer 2 Capture 2036h 2056h 11

INT 10 HSI FIFO 4 HSI FIFO

Fourth Entry 2034h 2054h 10

INT 9 Receive RI Flag32032h 2052h 9

INT 8 Transmit TI Flag32030h 2050h 8

INT 7 EXTINT2Port 2.2 or Port 0.7 200Eh 204Eh 7

INT 6 Serial Port RI Flag and

TI Flag4200Ch 204Ch 6

INT 5 Software Timer Software Timer 0-3

Timer 2 Reset 200Ah 204Ah 5

INT 4 HSI.02HSI.0 Pin 2008h 2048h 4

INT 3 High Speed

Outputs Events on HSO.0 thru

HSO.5 Lines 2006h 2046h 3

INT 2 HSI Data Available HSI FIFO Full or

HSI Holding Reg.

Loaded

2004h 2044h 2

INT 1 EDAC Bit Error Single Bit Error

Single Bit Error OVF

Double Bit Error

2002h 2042h 1

INT 0 Timer Overflow Timer 1 or Timer 2 2000h 2040h 0

All of the previous maskable interrupts can be assigned to the PTS.

Any PTS interrupt has priority over all other maskable interrupts.

Notes:

1. The Unimplemented Opcode and Software Trap interrupts are not prioritized. The Interrupt Controller immediately services these interrupts when they are

asserted. NMI has the highest priority of all prioritized interrupts. Any PTS interrupt has priority over lower priority interrupts, and over all other maskable

interrupts. The standard maskable interrupts are serviced according to their priority number with INT0 has the lowest priority of all interrupts.

2. These interrupts can be configured to fun ction as independent, external interrupts.

3. If the Serial interrupt is masked and the Receive and Trans mit interrupts are enabled, the RI flag and TI flag generate separate Receive and Transmit interrupts.

4. If the Receive and Transmit interrupts are masked and the Serial interrupt is enabled, both RI flag and TI flag generate a Serial Port interrupt.

Notes:

1. For some functions that share a register address in HWindow0, the opposite access type (read/write) is available in HWindow 15 if

indicated by the three asterisks (***).

2. These registers are not available in the industry standard 8XC196KDS. Therefore, ind ustry standard development software will not recognize these

mnemonics, and you will only be able to access them via their physical addresses.

Table 7. SFR Memory Mapping

Addr ess HWi n 0 Rea d HW in 0 Write HWi n 1 HWin 151

019H Stack Pntr (hi) Stack Pntr (hi) Stack Pntr (hi) Stack Pntr (hi)

018H Stack Pntr (lo) Stack Pntr (lo) Stack Pntr (lo) Stack Pntr (lo)

017H IOS2 PWM0_CTRL PWM2_CTRL ***

016H IOS1 IOC1 PWM1_CTRL ***

015H IOS0 IOC0 EDAC-CS2***

014H WSR WSR WSR WSR

013H INT_MASK1 INT_MASK1 INT_MASK1 INT_MASK1

012H INT_PEND1 INT_PEND1 INT_PEND1 INT_PEND1

011H SP_STAT SP_CON RESERVED ***

010H PORT 2 PORT 2 RESERVED PSW2

00FH PORT 1 PORT 1 Tim e r 3(hi)2RESERVED

00EH PORT 0 BAUD RATE Timer 3(lo)2RESERVED

00DH Timer 2 (hi) Timer 2 (hi) WDT-SCALE2T2CAPTURE (hi)

00CH Timer 2 (lo) Timer 2 (lo) IOC3 T2CAPT URE (lo)

00BH Timer 1 (hi) IOC2 INT_PRI(hi)2***

00AH Timer 1 (lo) Watchdog INT_PRI(lo)2***

009H INT_PEND INT_PEND INT_PEND INT_PEND

008H INT_MASK INT_MASK INT_MASK INT_MASK

007H SBUF (RX) SBUF (TX) PTSSRV (hi) ***

006H HSI_status HSO_command PTSSRV (lo) ***

005H HSI_time(hi) HSO_time (hi) PTSSEL (hi) ***

004H HSI_time (lo) HSO_time (lo) PTSSEL (lo) ***

003H RESERVED HSI_mode RESERVED ***

002H RESERVED RESERVED RESERVED RESERVED

001H Zero_reg (hi) Zero_reg (hi) Zero-reg (hi) Z ero_reg (hi)

000H Zero_reg (lo) Zero_reg (lo) Zero_reg (lo) Zero_reg (lo)

Table 8: Special Function Register Reset Values

Internal Register Binary Reset State Hexadecimal Reset

Value

Stack Pointer (SP) XXXX XXXX XXXX XXXX XXXX

I/O Status Register 2 (IOS2) 0000 0000 00

I/O Status Register 1 (IOS1) 0000 0000 00

I/O Status Register 0 (IOS0) 0000 0000 00

Window Select Register (WSR) 0000 0000 00

Interrupt Mask Register 1 (INT_MASK1) 0000 0000 00

Interrupt Pe nd ing Register 1

(INT_PEND1) 0000 0000 00

Serial Port Status Register (SP_STAT) 0000 1011 0B

Port 2 Register (PORT2) 110X XXX1 XX

Port 1 Register (PORT1) 1111 1111 FF

Port 0 Register (PORT0) XXXX XXXX XX

Timer 2 Value Register (TIMER2) 0000 0000 0000 0000 0000

Timer 1 Value Register (TIMER1) 0000 0000 0000 0000 0000

Interrupt Pending Register (INT_PEND) 0000 0000 00

Interrupt Mask Register (INT_MASK) 0000 0000 00

Receive Serial Port Register (SBUF

(RX)) 0000 0000 00

HSI Status Register (HSI_status) X0X0 X0X0 XX

HSI Time Register (HSI_time) XXXX XXXX XXXX XXXX XXXX

Zero Register (ZERO_REG) 0000 0000 0000 0000 0000

PWM0 Control Register (PWM0_CTRL) 0000 0000 00

I/O Control Register 1 (IOC1) 0010 0001 21

I/O Control Register 0 (IOC0) 0000 00X0 0X

Serial Port Control Register (SP_CON) 0000 1011 0B

Baud Rate Register (BAUD_RATE) 0000 0000 0000 0001 0001

I/O Control Register 2 (IOC2) X00X X000 XX

Watch Dog Timer Register (WATCH-

DOG) 0000 0000 00

Transmit Serial Port Buffer (SBUF (TX)) 0000 0000 00

HSO Command Register

(HSO_command) 0000 0000 00

HSO Time Register (HSO_time) 0000 0000 0000 0000 0000

HSI Mode Register (HSI_mode) 1111 1111 FF

PWM2 Control Register (PWM2_CTRL) 0000 0000 00

PWM1 Control Register (PWM1_CTRL) 0000 0000 00

EDAC Control and Status Register

(EDAC_CS) 0000 0000 00

Timer 3 Value Register (TIMER3) 0000 0000 0000 0000 0000

Watchdog Timer Prescaler

(WDT_SCALE) 0000 0000 00

I/O Control Register 3 (IOC3) 1111 0000 F0

Interrupt Priority Register (INT_PRI) 0000 0000 00

PTS Service Register (PTSSRV) 0000 0000 0000 0000 0000

PTS Select Register (PTSSEL) 0000 0000 0000 0000 0000

Timer 2 Capture Register

(T2CAPTURE) 0000 0000 0000 0000 0000

Program Counter (PC) 0010 0000 1000 0000 2080

Chip Configuration Register (CCR) XX10 1111 XF

Table 8: Special Function Register Reset Values

Internal Register Binary Reset State Hexadecimal Reset

Value

Table 9: External I/O Reset State

External I/O I/O Function After Reset I/O State During

Reset I/O State After Reset

Address/Data Bus (AD15:0) Address/Data Bus Pulled High Driven Output

ALE

ADV ALE Pulled High Driven Output

RD RD Pulled High Driven Output

WRL WR Pulled High Driven Output

Port 0 (P0.0-P0.3; P0.6)

ECB(4:0) [P0.0-P0.3; P0.6] and

ECB(4:0) Undefined Inputs1Undefined I/O1,2

Port 0 (P0.4 and P0.5) P0.4 and P0.5 Undefined Inputs1Undefined Inputs1

Port 0 (P0. 7)

EXTINT P0.7 Undefined Input1Undefined Input1

NMI NMI Pulled Down Pulled Down

HSI.0

T2RST HSI.0 Disabled Input1Disabled Input1

HSI.1

T2CLK HSI.1 Disabled Input1Disabled Input1

HSI.2/HSO.4 Undefined Disabled I/O1Disabled I/O1

HSI.3/HSO.5 Undefined Disabled I/O1Disabled I/O1

HSO.0 through HSO.3 HSO.0-HSO.3 Pulled Down Driv en Low

Outputs

Port 1 (P1.0-P1.7)

PWM1; PWM2;

BREQ; HLDA; HOLD

P1.0-P1.7 Pulled Up Pulled Up

Port 2 (P2.0)

TXD TXD Pulled Up Driven High

Output

Port 2 (P2. 1)

RXD RXD Undefined Input1Undefined Input1

Port 2 (P2. 2)

EXTINT P2.2 and EXTINT Undefined Input1Undefined Input1

Port 2 (P2. 3)

T2CLK P2.3 and T2CLK Undefined Input1Undefined Input1

Port 2 (P2. 4)

T2RST P2.4 Undefined Input1Undefined Input1

Notes:

1. These pins must not be left floating. Input voltages must not exceed VDD during power-up.

2. Do not directly tie these pins to VDD or GND; if EDACEN goes low, they may be driven by the UT80CRH196KDS and bus contention may occur.

Port 2 (P2. 5)

PWM0 PWM0 Pulled Down Driven Low Output

Port 2 (P2. 6)

T2UP-DN P2.6 Pulled Up Pulled Up

Port 2 (P2. 7)

T2CAPTURE P2.7 and T2CAPTURE Pulled Up Pulled Up

EDACEN EDACEN Undefined Input1Undefined Input1

ECB5/ADV_RD_WR ECB5/ADV_RD_WR Undefined I/O1Undefined I/ O 1,2

READY READY Undefined Input1Undefined Input1

BUSWIDTH BUSWIDTH Undefined Input1Undefined Input 1

BHE

WRH BHE Pulled Up Driven Output

CLKOUT CLKOUT Driven Output Driven Output

INST INST Pulled Down Driven Output

RESET RESET Pulled Low by

System Pulled Up

Table 9: External I/O Reset State

External I/O I/O Function After Reset I/O State During

Reset I/O State After Reset

UT80CRH196KDS UT80CRH196KDS

Bus Control

16-Bit

Multiplexed

Address/Data

8-Bit

Multiplexed

Address/Data

8-Bit

Latched

Address High

Bus Control

AD0-AD15

AD0-AD7

AD8-AD15

16-Bit Bus 8-Bit Bus

Figure 2. Bus Wi dth Options

UT80CRH196KDS

TOP VIEW

Figure 3. 68-pin Quad Flatpack Package

AD0

AD1

AD2

AD3

AD4

AD5

AD6

AD7

AD8

AD9

AD10

AD11

AD12

AD13

AD14

AD15

P2.3/T2CLK

HSI.3/HSO.5

HS0.0

HS0.1

BREQ/P1.5

HLDA/P1.6

HOLD/P1.7

T2UP-DN/P2.6

HS0.2

HS0.3

VSS

EDACEN

T2CAPTURE/P2.7

PWM0/P2.5

WR/WRL

BHE/WRH

T2RST/P2.4

READY

P0.7/EXTINT

P0.6/ECB0

P0.2/ECB1

P0.0/ECB2

P0.1/ECB3

P0.3/ECB4

NMI

ECB5/ADV_RD_WR

VDD

VSS

XTAL1

VSS

CLKOUT

BUSWIDTH

INST

ALE/ADV

P0.5

P0.4

VSS

VDD

VSS

EXTINT/P2.2

RESET

RXD/P2.1

TXD/P2.0

P1.0

P1.1

P1.2

PWM1/P1.3

PWM2/P1.4

T2RST/HSI.0

T2CLK/HSI.1

HSI.2/HS0.4

Legend for I/O fields:

TO = TTL compatible output

TI = TTL compatible input

CI = CMOS only input

TUO = TTL compatible output

(internally pulled high)

TDO = TTL compatible output

(internally pulled low)

TUI = TTL compatible input

(internally pulled high)

TDI = TTL compatible input

(internally pulled low)

TB = TTL compatible bidirectional

TUQ = TTL compatible quasi-bidirectional

(internally pulled high)

TUB = TTL compatible bidirectional

(internally pulled high)

TUBS = TTL compatible bidirectional Schmitt

Trigger (internally pulled high)

PWR = +5V (VDD)

GND = OV (VSS)

Table 10: 68-lead Fl at Pack Pin Descriptions

QFP Pin# I/O Name Active Description

1PWR V

DD --- Digital supply voltage (+5V). There are 2 VDD pi ns, both of

which must be connected.

2TO

ADV_RD_WR --- Advanced Read and Write. This pin has multiplexed functional-

ity: coincident with the Address/Data bus multiplexing. When

address information is output on the AD pins, ADV_RD_WR is

output. When data information is on the AD pins, ECB5 is an I/

O. ADV_RD_WR is output high for an external memory read

cycle, and low for an external memory write cycle.

TB ECB51-- EDAC Check Bit 5. Asserting the EDACEN pin will cause the

error detection and correction engine to pass the EDAC Check

Bit 5 through pin 2 of the UT80CRH196KDS during th e data

phase of an external memory cycle.

3 TDI NMI Hig h Non-Maskable Interrupt. A posit ive transiti on causes a vector

through the NMI interrupt at location 203Eh. Assert NMI for at

least 1 state time to guarantee acknowledgment by the interrupt

controller.

4 TI P0.3 --- Port 0 Pin 3. An input only port pin that is read at location 0Eh

in HWindow 0.

TB ECB41--- EDAC Check Bit 4. Asserting the EDACEN pin will cause the

error detection and correction engine to pass the EDAC Check

Bit 4 through pin 4 of the UT80CRH196KDS.

5 TI P0.1 --- Port 0 Pin 1. An input only port pin that is read at location 0Eh

in HWindow 0.

TB ECB31--- EDAC Check Bit 3. Asserting the EDACEN pin will cause the

error detection and correction engine to pass the EDAC Check

Bit 3 through pin 5 of the UT80CRH196KDS.

6 TI P0.0 - -- Port 0 Pin 0. An input only port pi n that is read at location 0Eh

in HWindow 0.

TB ECB21--- EDAC Check Bit 2. Asserting the EDACEN pin will cause the

error detection and correction engine to pass the EDAC Check

Bit 2 through pin 6 of the UT80CRH196KDS.

7 TI P0.2 - -- Port 0 Pin 2. An input only port pi n that is read at location 0Eh

in HWindow 0.

TB ECB11--- EDAC Check Bit 1. Asserting the EDACEN pin will cause the

error detection and correction engine to pass the EDAC Check

Bit 1 through pin 7 of the UT80CRH196KDS.

8 TI P0.6 - -- Port 0 Pin 6. An input only port pi n that is read at location 0Eh

in HWindow 0.

TB ECB01--- EDAC Check Bit 0. Asserting the EDACEN pin will cause the

error detection and correction engine to pass the EDAC Check

Bit 0 through pin 8 of the UT80CRH196KDS.

9 TI P0.7 - -- Port 0 Pin 7. An input only port pi n that is read at location 0Eh

in HWindow 0.

TI EXTINT Hi gh External Interrupt. Setting IOC1.1 = 1 enables pin 9 as the

source for the external interrupt EXTINT. A rising edge on this

pin will generate EXTINT (INT07, 200Eh). Assert EXTINT for

at least 2 state times to ensure acknowledgment by the interrupt

controller.

During Power Down mode, asserting EXTINT places the chip

back into normal operation, even if EXTINT is masked.

10 TI P0.5 --- Po rt 0 Pi n 5. An input only port pin that is read at location 0Eh

in HWindow 0.

11 TI P0.4 --- Port 0 Pin 4. An input only port pin that is read at locatio n 0Eh

in HWindow 0.

12 GND VSS --- Digital circuit ground (0V). There are 4 VSS pins, all of whi ch

must be connected and one additional recommended VSS con-

nection.

13 PWR VDD --- Digital supply voltage (+5V). There are 2 VDD pins, bot h of

which must be connected.

14 GND VSS --- Digital circuit ground (0V). There are 4 VSS pins, all of whi ch

must be connected and one additional recommended VSS con-

nection.

Table 1 0: 68-lead Flat Pack Pin Descriptions

QFP Pin# I/O Name Active Description

15 TI P2 .2 --- Port 2 Pin 2. An input only port pin that is wri tten at location

10h of HWindow 0. P2.2 will always generate EXTINT1

(INT13, 203Ah) unless masked by the INT_MASK1 register.

Assert EXTINT1 for at least 2 state times to guarantee acknowl-

edgment by the interrupt controll er.

TI EXTINT High External Interrupt. Setting IOC1.1 = 0 enables pin 15 as the

source for the external interrupt EXTINT. A rising edge on this

pin will generate EXTINT (INT07, 200Eh). Assert EXTINT for

at least 2 state times to ensure acknowledgment by the interrupt

controller.

During Power Down mode, asserting EXTINT places the chip

back into normal operation, even if EXTINT is masked.

16 TUBS RESET Low Master Reset. The first external reset signal supplied to the

UT80CRH196KDS must be active for at least 16 state times.

All subsequent RESET assertions need only be active for 1 state

time because the UT80CRH196KDS will continue driving the

RESET signal for an additional 16 state times. See section 1.1.2

for more information on the RESET function of the

UT80CRH196KDS.

17 TI P2.1 --- Port 2 Pin 1. An input only port pin that is read at locat ion 10h

of HWindow 0.

Setting SPCON.3 = 0 enables the P2.1 function of pin 17.

TB RXD --- RXD is a bidirectional serial data port. When operating in Serial

Modes 1, 2, and 3, RXD receives serial data. When using Serial

Mode 0, RXD operates as an input and an open-drain output for

data.

Setting SPCON.3 = 1 enables the RXD function of pin 17.

182TUO P2 .0 --- Port 2 Pin 0. An output only port pin that is written at location

10h of HWindow 0.

Setting IOC1.5 = 0 enables the P2.0 function of pin 18.

TUO TXD --- T ransmit Serial Data (TXD). When set to Serial Mode 1, 2, or 3,

TXD transmits serial port data. When using Serial Mode 0,

TXD is used as the Serial Clock output.

Setting IOC1.5 = 1 enables the TXD fun c tion of pin 18.

TUI ICT Low In-Circuit Test. The UT80CRH196KDS will enter the In-Cir-

cuit Test mode if this pin is held low during the rising edge of

RESET.

Table 10: 68-lead Fl at Pack Pin Descriptions

QFP Pin# I/O Name Active Description

19 TUQ P1.0 --- Port 1 Pin 0. A quasi-bidirectional port pin that is read and writ-

ten at location 0Fh of HWindow 0.

20 TUQ P1.1 --- Port 1 Pin 1. A quasi-bidirectional port pin that is read and writ-

ten at location 0Fh of HWindow 0.

21 TUQ P1.2 --- Port 1 Pin 2. A quasi-bidirectional port pin that is read and writ-

ten at location 0Fh of HWindow 0.

22 TUQ P1.3 --- Port 1 Pin 3. A quasi-bidirectional port pin that is read and writ-

ten at location 0Fh of HWindow 0.

Setting IOC3.2 = 0 enables the P1.3 function of pin 22.

TUO PWM1 --- Pulse Width Modulator (PWM) Output 1. The output signal

will be a waveform whose duty cycle is programmed by the

PWM1_CONTROL register, and the frequency is selected by

IOC2.2.

Setting IOC3.2 = 1 enables the PWM1 function of pin 22.

23 TUQ P1.4 --- Port 1 Pin 4. A quasi-bidirectional port pin that is read and writ-

ten at location 0Fh of HWindow 0.

Setting IOC3.3 = 0 enables the P1.4 function of pin 23.

TUO PWM2 --- Pulse Width Modulator (PWM) Output 2. The output signal

will be a waveform whose duty cycle is programmed by the

PWM2_CONTROL register, and the frequency is selected by

IOC2.2.

Setting IOC3.3 = 1 enables the PWM2 function of pin 23.

24 TI HSI.0 --- High Speed Input Module, in put pi n 0. Unle ss m a sked, a rising

edge on this input will generate the HSI.0 Pin interrupt (INT04,

2008h). Assert the HSI.0 pin for at least 2 state times to ensure

acknowledgment by the interrupt con troller.

Setting IOC0.0 = 1 enables pin 24 as an HSI input, and allows

events on this pin to be loaded into the HSI FIFO.

TI T2RST High Timer 2 Reset. A rising edge on the T2RST pin resets Timer 2.

To enable the T2RST function of pin 24, set IOC0.3 = 1 and

IOC0.5 = 1.

Table 1 0: 68-lead Flat Pack Pin Descriptions

QFP Pin# I/O Name Active Description

25 TI HSI.1 --- High Speed Input Module, input pin 1.

Setting IOC0.2 = 1 enables pin 25 as an HSI input, and allows

events on this pin to be loaded into the HSI FIFO.

TI T2CLK --- Timer 2 Clock.

Setting IOC0.7 = 1 and IOC3.0 = 0 enables pin 25 to function as

the Timer 2 clock source.

26 TO HSO.4 --- High Speed Output Module, output pin 4. This pin can simulta-

neously operate in the HSI and HSO mod es of operation. As a

result, this pin acts as an output that the HSI monitors.

Setting IOC1.4 = 1 enables the HSO.4 function of pin 26.

TI HSI.2 --- High Speed Input Module, input pin 2. This pin can simulta-

neously operate in the HSI and HSO mod es of operation. As a

result, this pin can monitor events on the HSO.

Setting IOC0.4 = 1 enables pin 26 as an HSI input pin, and

allows events on this pin to be loaded into the HSI FIFO.

27 TO HSO.5 --- High Speed Output Module, output pin 5. This pin can simulta-

neously operate in the HSI and HSO mod es of operation. As a

result, this pin acts as an output that the HSI monitors.

Setting IOC1.6 = 1 enables the HSO.5 function of pin 27.

TI HSI.3 --- High Speed Input Module, input pin 3. This pin can simulta-

neously operate in the HSI and HSO mod es of operation. As a

result, this pin can monitor events on the HSO.

Setting IOC0.6 = 1 enables pin 27 as an HSI input pin, and

allows events on this pin to be loaded into the HSI FIFO.

28 TDO HSO.0 --- High Speed Output Module, output pin 0. The HSO.0 pin is a

dedicated output for the HSO module.

29 TDO HSO.1 --- High Speed Output Module, output pin 1. The HSO.1 pin is a

dedicated output for the HSO module.

Table 10: 68-lead Fl at Pack Pin Descriptions

QFP Pin# I/O Name Active Description

30 TUQ P1.5 --- Port 1 Pin 5. A quasi-bidirectional port pin that is read and writ-

ten at location 0Fh of HWindow 0.

Setting WSR.7 = 0 enables the P1.5 function of pin 30.

TUO BREQ Low Bus Request. The BREQ output signal asserts during a HOLD

cycle when the internal bus controller has a pending external

memory cycle.

During a HOLD cycle, BREQ will not be asserted until the

HLDA signal is asserted. Once asserted, BREQ does not deas-

sert until the HOLD signal is released.

Setting WSR.7 = 1 enables the BREQ function of pin 30.

312TUQ P1.6 --- Port 1 Pin 6. A quasi-bidirectional port pin that is read and writ-

ten at location 0Fh of HWindow 0.

Setting WSR.7 = 0 enables the P1.6 function of pin 31.

TUO HLDA Low Bus Hold Acknowledge. The UT80CRH198KD asserts the

HLDA signal as a result of anot her device activating the HOLD

signal. By asserting this signal, the UT80CRH196KDS is ind i-

cating that it has released the bus.

Setting WSR.7 = 1 enables the HLDA function of pin 31.

32 TUQ P1.7 --- Port 1 Pin 7. A quasi-bidirectional port pin that is read and writ-

ten at location 0Fh of HWindow 0.

Setting WSR.7 = 0 enables the P1.7 function of pin 32.

TUI HOLD Low Bus Hold. The HOLD signal is used to request control of the

bus by another DMA device.

Setting WSR.7 = 1 enables the HOLD function of pin 32.

33 TUQ P2.6 --- Port 2 Pin 6. A quasi-bidirectional port pin that is read and writ-

ten at location 10h of HWindow 0.

Setting IOC2.1 = 0 enables the P2.6 function of pin 33.

TUI T2UP-DN --- Timer 2 Up or Down. The T2UP-DN pin will dynamically

change the direction that Timer 2 counts.

T2UP-DN = 1 then Timer 2 counts down.

T2UP-DN = 0 then Timer 2 counts up.

Setting IOC2.1 = 1 enables the T2UP-DN function of pi n 33.

When IOC2.1 = 0, Timer 2 will only count up.

Table 1 0: 68-lead Flat Pack Pin Descriptions

QFP Pin# I/O Name Active Description

34 TDO HSO.2 --- High Speed Output Module, output pin 2. The HSO.2 pin is a

dedicated output for the HSO module.

35 TDO HSO.3 --- High Speed Output Module, output pin 3. The HSO.3 pin is a

dedicated output for the HSO module.

36 GND VSS --- Digital circuit ground (0V). There are 4 VSS pins, all of which

must be connected and one additional recommended VSS con-

nection.

37 TI EDACEN Low EDAC Enable. Asserting the EDACEN signal activates the

error detection and correction engine. This causes the

UT80CRH196KDS to include ECB(5:0) as the EDAC check bit

pins in all external memory cycles.

38 TUQ P2.7 --- Port 2 Pin 7. A quasi-bidirectional port pin that is read and writ-

ten at location 10h of HWindow 0.

TUQ T2CAPTURE High Timer 2 Capture. A rising edge on this pin loads the value of

Timer 2 into the T2CAPTURE register , and generates a Timer 2

Capture interrupt (INT11, 2036h). Assert the T2CAPTURE sig-

nal for at least 2 state times to guarantee acknowledgment by the

interrupt controller . Using INT_Mask1.3 controls whether or not

a rising edge causes an interrupt.

39 TDO P2.5 --- Port 2 Pin 5. An output only port pin that is written at location

10h of HWindow 0.

Setting IOC1.0 = 0 enables the P2.5 function of pin 39.

TDO PWM0 --- Pulse Width Modulator (PWM) Output 0. The output signal

will be a waveform whose duty cycle is programmed by the

PWM0_CONTROL register, and the frequency is selected by

IOC2.2.

Setting IOC1.0 = 1 enables the PWM0 function of pin 39.

402TUO WR Low Write. The WR signal indicates that an external write is occur-

ring. Activation of this signal onl y occurs during external mem-

ory writes.

Setting CCR.2 = 1 enables the WR function of pin 40.

TUO WRL Low Write Low. The WRL signal is activated when writing the low

byte of a 16-bit wide word, and is always asserted for 8-bit wide

memory writes.

Setting CCR.2 = 0 enables the WRL function of pin 40.

Table 10: 68-lead Fl at Pack Pin Descriptions

QFP Pin# I/O Name Active Description

41 TUO BHE Low Byte High Enable. The assertion of the BHE signal will occur

for all 16-bit word writes, and high byte writes in both 8- and 16-

bit wide bus cycles.

Setting CCR.2 = 1 enables the BHE fu ncti on of pin 41.

TUO WRH Low Write High. The WRH signal is asserted for high byte writes,

and word writes for 16-bit wide bus cycles. Additionally, WRH

is asserted for all write operations when using an 8-bit wide bus

cycle.

Setting CCR.2 = 0 enables the WRH fu nction of pi n 41.

42 TI P2.4 --- Po rt 2 Pi n 4. An input only port pin that is read at location 10h

of HWindow 0.

TI T2RST High Timer 2 Reset. Asserting the T2RST signal will reset Timer 2.

To enable the T2RST function of pin 42, set IOC0.3 = 1 and

IOC0.5 = 0.

43 TI READY High READY input. The READY signal is used to lengt hen mem ory

cycles by inserting “wait states” for interfacing to slow peripher-

als. When the READY signal is high, no “wait states” are gener-

ated, and the CPU operation continues in a normal fashion. If

READY is low during the fallin g edge of CLKOUT, the mem -

ory controll er insert s “wait states” into the memory cycle. “Wait

state” generation will continue until a falling edge of CLKOUT

detects READY as logically high, or until the number of “wait

states” is equal to the number prog rammed into CCR.4 and

CCR.5.

Note: The READY signal is only used for external memory

accesses, and is functional during the CCR fetch.

44 TI P2.3 --- Po rt 2 Pi n 3. An input only port pin that is read at location 10h

of HWindow 0.

TI T2CLK --- Timer 2 Clock input. Setting IOC0.7 = 0 and IOC3.0 = 0

enables this pin as the external clock source for Timer 2.

IOC0.7: IOC3.0: Timer 2 Clock Source:

X 1 Internal Clock Source

0 0 P2.3 External Clock Source

1 0 HSI.1 External Clock Source

45 TUB AD15 --- Bit 15 of the Address/Data bus. This pin is a dedicated address

pin when operating with 8-bit wide bus cycles. For 16-bit wide

bus cycles, this pin is used as multiplexed address and data.

Table 1 0: 68-lead Flat Pack Pin Descriptions

QFP Pin# I/O Name Active Description

46 TUB AD14 --- Bit 14 of the Address/Data bus. This pin is a dedicated address

pin when operating with 8-bit wide bus cycles. For 16-bit wide

bus cycles, this pin is used as multiplexed address and data.

47 TUB AD13 --- Bit 13 of the Address/Data bus. This pin is a dedicated address

pin when operating with 8-bit wide bus cycles. For 16-bit wide

bus cycles, this pin is used as multiplexed address and data.

48 TUB AD12 --- Bit 12 of the Address/Data bus. This pin is a dedicated address

pin when operating with 8-bit wide bus cycles. For 16-bit wide

bus cycles, this pin is used as multiplexed address and data.

49 TUB AD11 --- Bi t 11 of the Address/Data bus. This pin is a dedicated address

pin when operating with 8-bit wide bus cycles. For 16-bit wide

bus cycles, this pin is used as multiplexed address and data.

50 TUB AD10 --- Bit 10 of the Address/Data bus. This pin is a dedicated address

pin when operating with 8-bit wide bus cycles. For 16-bit wide

bus cycles, this pin is used as multiplexed address and data.

51 TUB AD9 --- Bit 9 of the Address/Data bus. This pin is a dedicated address

pin when operating with 8-bit wide bus cycles. For 16-bit wide

bus cycles, this pin is used as multiplexed address and data.

52 TUB AD8 --- Bit 8 of the Address/Data bus. This pin is a dedicated address

pin when operating with 8-bit wide bus cycles. For 16-bit wide

bus cycles, this pin is used as multiplexed address and data.

53 TUB AD7 --- Bit 7 of th e Address/D a ta bus. This pin is used as multiplexed

address and data for both 8- and 16-bi t wid e bus cycl es.

54 TUB AD6 --- Bit 6 of th e Address/D a ta bus. This pin is used as multiplexed

address and data for both 8- and 16-bi t wid e bus cycl es.

55 TUB AD5 --- Bit 5 of th e Address/D a ta bus. This pin is used as multiplexed

address and data for both 8- and 16-bi t wid e bus cycl es.

56 TUB AD4 --- Bit 4 of th e Address/D a ta bus. This pin is used as multiplexed

address and data for both 8- and 16-bi t wid e bus cycl es.

57 TUB AD3 --- Bit 3 of th e Address/D a ta bus. This pin is used as multiplexed

address and data for both 8- and 16-bi t wid e bus cycl es.

58 TUB AD2 --- Bit 2 of th e Address/D a ta bus. This pin is used as multiplexed

address and data for both 8- and 16-bi t wid e bus cycl es.

59 TUB AD1 --- Bit 1 of th e Address/D a ta bus. This pin is used as multiplexed

address and data for both 8- and 16-bi t wid e bus cycl es.

60 TUB AD0 --- Bit 0 of th e Address/D a ta bus. This pin is used as multiplexed

address and data for both 8- and 16-bi t wid e bus cycl es.

Table 10: 68-lead Fl at Pack Pin Descriptions

QFP Pin# I/O Name Active Description

Notes:

1. These pins should be pulled high or low when using EDAC (i.e. EDACEN = 0) to prevent the voltages on these pins from floating to the switching threshold of

the input buffers during long read cycles.

2. These pins must be high on the rising edge of RESET in order to avoid entering any test modes.

3. This pin is a recommended VSS connection. The remaining 4 VSS pins are required to be tied to the circuit card ground plane.

612TUO RD Low Read. The RD signal is an output to external memory that is

only asserted during external memory reads.

622TUO ALE High Address Latch Enable. The ALE signal is an output to external

memory that is only asserted during external memory accesses.

ALE is used to specify that valid address information is avail-

able on the address/data bus, and signals the start of a bus cycle.

ALE is used by an external latch to demultiplex the address from

the address/data bus. Setting CCR .3 = 1 enables the ALE func-

tion of pin 62.

TUO ADV Low Address Valid. The ADV signal is an output to external mem-

ory that is only asserted during external memory accesses. ADV

is driven high to specify that valid address inform ation is avail-

able on the address/data bus. The ADV signal i s held low during

the data transfer portion of the bus cycle, and is driven high

when the bus cycle completes. ADV is used by an external latch

to demultiplex the address from the address/data bu s. Setting

CCR.3 = 0 enables the ADV function of pin 62.

63 T DO INST High Instructi on Fetch. The INST signal indicates t he type of extern al

memory cycle being performed. The INST signal will be high

during instruction fetches, and will be low for data fetches.

Note: CCB bytes and Interrupt vectors are considered data.

64 TI BUSWIDTH --- Bus Wi dth. The BUSWIDTH pin dynamically modifies the

width of bus cycles. When a high logic value is supplied, the

bus width will be set to 16-bits wide. When a low logic level is

supplied, the bus width will be set to 8-bit s wide.

Setting CCR.1 = 1 enables the BUSWIDTH pin. Setting

CCR.1 = 0 disables the BUSWIDTH pin. As a result, the

UT80CRH196KDS will only perform 8-bit wide bus cycles.

65 TUO CLKOUT --- Clock Output. The CLKOUT signal is the output of the internal

clock. This signal has a 50% duty cycle, and runs at 1/2 the fre-

quency of the system clock input to XTAL1. Setting IOC3.1 = 0

will enable the CLKOUT output signal.

66 GND VSS3--- Digital circuit ground (0V). Recommended connection for sig-

nal integrity improvement. There are 4 other V SS pins, all of

which must be connected.

67 CI XTAL1 --- External oscillator or cloc k inpu t to the UT80 CRH196KDS.

The XTAL1 input is fed to the on-chip clock generator.

68 GND VSS --- Digital circuit ground (0V). There are 4 VSS pins, all of which

must be connected and one additional recomended VSS connec-

tion.

Table 10: 68-lead Flat Pack Pin Descriptions

QFP Pin# I/O Name Active Description

2.0 RADIATION HARDNESS

The UT80CRH196KDS incorporates special design and layout

features and is built on UTMC’s Commercial RadHardTM

silicon. The Commercial RadHardTM silicon is fabricated using

a minimally invasive process module, developed by UTMC, that

enhances the total dose radiation hardness of the field and gate

oxides while maintainin g current density and reliability. In

addition, for both greater transient radiation-hardness and latch-

up immunity, the UT80CRH196KDS is built on epitaxial

substrate wafers.

RADIATION HARDNESS DESIGN SPECIFICATIONS

Notes:

1. Worst case temperature TA = 25oC for Single Event Upset and 100oC for Single Event Latchup.

2. Adams 90% worst case envi ronment (geosynchronous).

3. Total effective error rate based on the combined error rates of both the register and SRAM elements in the device

WEIBULL PARAMETERS FOR ALL 1482 REGISTER ELEMENTS

WEIBULL PARAMETERS FOR ALL 8192 SRAM ELEMENTS

3.0 ABSOLUTE MAXIMUM RA TINGS 1 (Referenced to VSS)

Notes:

1. Stresses outside the listed absolute maximum ratings may cause permanent damage to the device. This is a stress rating only , and functional operatio n of the device

at these or any other conditions beyond limits indicated in the operational sections of this specification is not reco mm en ded. Exposure to absolute maximum rating

conditions for extended periods may affect device reliability.

2. These ratings are provided as design guidelines. They are not guaranteed by test or characterization.

3. Test per MIL-STD-883, Method 1012.

Total Dose 3.0E5 rads(Si)

Onset LET Threshold 25 MeV-cm2/mg

Neutron Fluence 1.0E14 n/cm2

Saturated Cross-Section (1Kx8) 6.0E-7 cm2/bit

Single Event Upset13.5048E-6 errors/device day2, 3

Single Event Latchup1LET > 128 MeV-cm2/mg

SHAPE

PARAMETER WIDTH

PARAMETER SATURATED

CROSS-SECTION ONSET

LET DEVICE

DEPTH FUNNEL

DEPTH

1.3 18.5 1.5E-7cm2/bit 48MeV-cm2/mg 0.8μm1.45μm

SHAPE

PARAMETER WIDTH

PARAMETER SATURATED

CROSS-SECTION ONSET

LET DEVICE

DEPTH FUNNEL

DEPTH

4 150 6.0E-7cm2/bit 25MeV-cm2/mg 0.5μm0.5μm

SYMBOL PARAMETER LIMITS UNITS

VDD DC Supply Voltage -0.3 to 6.0 V

VI/O2Voltage on Any Pin -0.3 to VDD+0.3V V

TSTG Storage Temperature -65 to +150 °C

TJMaximum Junction Temperature 175 °C

ΘJC Thermal Resistance, Junction-to-Case 32°C/W

II2DC Input Current ±10 mA

4.0 DC ELECTRICAL CHARACTERISTICS (Pre/Post-Radiation)*

(VDD = 5.0V ±10%) (TC = -55°C to +125°C for "C" screening and -40°C to +125°C for "W" screening)

SYMBOL PARAMETER CONDITION MINIMUM MAXIMUM UNIT

VIL Low-level Input Voltage

(except XTAL1, RESET)0.8 V

VIH High-level Input Voltage

(except XTAL1, RESET)2.2 V

VIH1 High-level Input Voltage

(XTAL1) .7VDD V

VIL1 Low-level Input Voltage

(XTAL1) .3VDD V

VT+ Positive Going Threshold

RESET .5VDD .7VDD V

VT- Negative Going Threshold

RESET .3VDD .5VDD V

VHTypical Range of Hysteresis6

RESET

.6 V

VOL Low-level Output Voltage

(CMOS load) IOL = 100μA60.25 V

(TTL load) IOL = 4.0mA

IOL = 8.0mA5

0.4

0.4 V

VOH High-level Output Voltage8

(CMOS load)

(Standard outputs) (TTL load) IOH = -100μA6

IOH = -4.0mA

IOH = -8.0mA5

VDD-.25

2.4

IOH1 High-level Output Current1

(Open drain outputs with pullups) VOH = VSS (see Note 6) -225 -20 μA

IIH Logical 1 Input Current2

(Test mode entry avoidance) VIN = VIH -225 -20 μA

ILI I/O Leakage Current, standard

inputs/outputs in Z state VIN = VSS or VDD Outputs in Z

VIN = VSS or VDD Inputs in Z

-10

-1 +10

+1 μA

μA

ILI1 I/O Leakage Current, with pullups3VIN = VSS -225 -20 μA

ILI2 I/O Leakage Current, with

pulldowns4VIN = VDD 20 225 μA

CIO Pin Capacitance6@ 1MHZ, 25°C15pF

ΑIDD Active Power Supply Current Clk@20MHz, typical program

flow 130 mA

QIDD Quiescent Power Supply Current Unloaded TMIN tο +25°C

Outputs +125°C

No Clock +25°C post-100krad

+25°C post-300krad

1000

14,000

μA

IDDPD Power Supply Current in Power

Down No Active I/O, Clk@20MHz

post-100krad

No Active I/O, Clk@20MHz

post-300krad

Notes:

* Post-radiation performance guaranteed at 25°C per MIL-STD-883.

1. Open-drain outp uts with pu llu ps inclu d e Port 1, P2 .6 and P2.7, and RESET.

2. Test modes are entered at the RESET rising edge by applying VIL to one or more of the following pins: TXD, RD, WR, HLDA. To avoid entering a test mode,

ensure that these pins remain above VIH at the rising edge of RESET.

3. Inputs/outputs with pullup resistors include: RESET, Port 1, P2.0, P2.6, P2.7, WR, BHE, AD0-15, RD, ALE, CLKOUT.

4. Inputs/outputs will pulldown resistors include: NMI, HS0.0-HS0.3, P2.5, INST.

5. Applies to pins RESET, BHE, RD, CLKOUT.

6. Tested only at initial qualification and after any design or process changes which may affect this characteristic.

7. Not more than one output may be shorted at a time for maximum duration of one second.

8. For standard outputs not covere d by IOH1 spec.

IDDIDLE Power Supply Current in Idle Mode No Active I/O, Clk@20MHZ

+25oC, post -300Krad

62 mA

IDDRESET Power Supply Current in Reset CLK @20 MHz, RESET < VIL 76 mA

IOS Short Circuit output current (except

for pins listed in Note 5)6,7 VDD = 5.5V -100 100 mA

IOS1 Short Circuit output current5,6,7 VDD = 5.5V -200 200 mA

5.0 AC CHARACTERISTICS READ CYCLE (Post-Radiation)*

(VDD = 5.0V ±10%) (TC = -55°C to +125°C for "C" screening and -40°C to +125°C for "W" screening)

SYMBOL PARAMETER MINIMUM MAXIMUM UNIT

tAVYV5Address VALID to READY setup 2TOSC - 30 ns

tYLYH5Non-READY time No upper limit ns

tCLYX1,5 READY hold after CLKOUT low 0 2TOSC - 20 ns

tLLYX1,5 READY hold after ALE low TOSC 3TOSC - 20 ns

tAVGV5Address valid to BUSWIDTH setup 2TOSC - 30 ns

tCLGX5BUSWIDTH hold after CLKOUT low 0 ns

tAVDV2,5 Address valid to input data valid 3TOSC - 29 ns

tRLDV2RD Active to input data valid 5 (see Note 5) TOSC - 26 ns

tCLDV5CLKOUT low to input data valid 5 TOSC - 26 ns

tRHDZ5End of RD to input data float 0 TOSC -10 ns

tRXDX5Data hold after RD inactive 0 TOSC -10 ns

fOSC5Frequency on XTAL1 1 (see Note 7) 20 (see Note 6) Mhz

TOSC5XTAL1 period (1/fOSC) 50 (see Note 6) 1000 (see Note 7) ns

tXHCH XTA L 1 high to CLKOUT high or low 0 +25 ns

tCLCL6CLKOUT cycle time 2TOSC Typical ns

tCHCL5CLKOUT high period TOSC - 10 TOSC +10 ns

tCLLH CLKOUT falling edge to ALE rising -5 +15 ns

tLLCH5ALE falling edge to CLKOUT rising -10 +10 ns

tLHLH2, 6 ALE cycle time 4TOSC Typical ns

tLHLL5ALE high period TOSC - 10 TOSC +15 ns

tAVLL5Address and ADV_RD_WR setup to ALE falling

edge TOSC - 15 ns

tLLAX5Address and ADV_RD_WR hold after ALE

falling edge TOSC - 20 TOSC +5 ns

tLLRL ALE falling edge to RD falling edge TOSC - 5 TOSC +10 ns

tRLCL RD low to CLKOUT falling edge -5 +10 n s

tRLRH2RD low period TOSC - 5 ns

tRHLH3,5 RD rising edge to ALE rising edge TOSC-10 TOSC +10 ns

tRLAZ5RD low to address float -5 +5 ns

Note:

* Post-radiation performance guaranteed at 25°C per MIL-STD-883 Method 1019 to the highest total dose specificed for the respective device types.

1. If max exceeded, additional wait state occurs.

2. If wait states are used, add 2 TOSC *N, where N = number of wait states.

3. Assuming back-to-back bus cycles.

4. 8-bit only

5. Tested only at initial qualification, and after any design or process changes which may affect this characteristic.

6. These specs are verified using functional vectors (strobed) only.

7. Low speed tests performed at 5MHz. 1MHz operation is guaranteed by design.

tLLWL5ALE falling edge to WR falling edge TOSC - 10 TOSC +10 ns

tCLWL CLKOUT lo w to WR falling edge -5 +10 ns

tQVWH2Data stable to WR rising edge TOSC - 10 TOSC +10 ns

tCHWH5CLKOUT high to WR rising edge -10 +15 ns

tWLWH2,5 WR low period TOSC - 10 ns

tWHQX5Data hold after WR rising edge TOSC - 10 TOSC +10 ns

tWHLH3,5 WR rising edge to ALE ri sing edge TOSC - 10 TOSC +10 ns

tWHBX5BHE, INST after WR rising edg e TOSC - 10 TOSC +10 ns

tWHAX4,5 AD8-15 HOLD after WR rising TOSC - 25 ns

tRHBX5BHE, INST after RD rising edge TOSC - 10 TOSC +10 ns

tRHAX4,5 AD8-15 HOLD after RD rising TOSC - 25 ns

tAVENV5Address valid to EDACEN valid 2TOSC -30 ns

tLHENX5EDACEN hold after ALE high 0 ns

tAVEV2,5 Address valid to EDAC input vali d 3TOSC -29 ns

tRXEX5EDAC hold after RD inactive 0 TOSC -10 ns

tEVWH2,5 EDAC output stable to WR rising TOSC -10 TOSC +10 ns

tWHEX5EDAC output hold after WR rising TOSC -10 TOSC +10 ns

XTAL1

CLKOUT

READ

BUS

WRITE

BUS

BHE, INST

AD8-15

tLLCH

tCLCL

tXHCH tCHCL

tRLCL

ALE

tLHLH

tLHLL tLLRL tRHLH

tRLRH

tRLDV

tLLAX

tAVLL

tRLAZ

tRHDZ

TOSC

Figure 4. System Bus Timings

ADDRESS OUT DATA

tAVDV

tLLWL tWLWH

tWHLH

tWHQX

tQVWH

ADDRESS OUT DATA OUT ADDRESS

ADDRESS OUT

VALID

tWHBX, tRHBX

tCLDV

tRXDX

tCLWL

tCLLH

tCHWH

tWHAX, tRHAX

ECB(4:0)

READ CYCLE

ECB(4:0)

WRITE CYCLE

tAVEV VALID

tRXEX

VALID

tWHEX

tEVWH

ECB5/ADV_RD_WR

READ CYCLE

ECB5/ADV_RD_WR

WRITE CYCLE

tAVLL tLLAX

tAVEV

ECB5 VALID

tRXEX

ECB5 VALID

tAVLL tLLAX tEVWH tWHEX

XTAL1

CLKOUT

ALE

READY

READ

BUS

WRITE

BUS

ADDRESS OUT

ADDRESS DATA OUT ADDRESS

DATA

tRLRH + 2TOSC

tWLWH +2TOSC

TOSC

tCHCL

tRLDV+ 2TOSC

tAVYV

tQVWH + 2TOSC

tAVDV+ 2TOSC

tXHCH

tCLCL

tLHLH + 2TOSC

tCLLH tLLYX

max

tCLYX

max

tLLYX

min

tCLYX

min

tYLYH

Figure 5. READY Timing (One Wait State)

Figure 6. BUSWIDTH and EDACEN Timings

CLKOUT

ALE

BUSWIDTH

BUS

tCLGX

XTAL1

VALID

tAVGV

ADDRESS OUT DATA

EDACEN

tAVENV

VALID

tLHENX

6.0 XTAL1 CLOCK DRIVE TIMING CHARACTERISTICS

Note:

1. Tested only at initial qualification, and after any design or process changes which may affect this characteristic.

2. Supplied as a design limit, but not guaranteed or tested.

Figure 7. External Clock Drive Timing Waveforms

SYMBOL PARAMETER MINIMUM MAXIMUM UNIT

fOSC Oscillator Frequency 1(note 1) 20 MHz

TOSC Oscillator Period 50 1000(note 1)ns

tOSCH High Time 17(note 1)ns

tOSCL Low Time 17(note 1) ns

tOSCR Rise Time 10(note 2) ns

tOSCF Fall Time 10(note 2)ns

tOSCH

TOSC

tOSCF

tOSCR

0.7 VDD 0.7 VDD

0.3VDD

tOSCL

0.7 VDD

Note:

1.Tested only at initial qualification, and after any design or process changes which may affect this characteristic.

7.0 HOLD/HLDA Timings

Note:

1.Tested only at initial qualification, and after any design or process changes which may affect this characteristic.

Table 11. DC Specifications in Hold1

DESCRIPTION MIN MAX CONDITIONS

Pullups on ADV, RD, WR, WRL, BHE, ALE 24.4K275K VDD =5.5V, VIN = VSS

Pulldown on INST 24.4K275K VDD =5.5V, VIN = VDD

SYMBOL PARAMETER MINIMUM MAXIMUM UNIT

tHVCH1HOLD Setup 25 ns

tCLHAL1CLKOUT low to HLDA low -15 15 ns

tCLBRL1CLKOUT low to BREQ low -15 15 ns

tHALAZ1HLDA low to address float 10 ns

tHALBZ1HLDA low to BHE, INST, RD, WR

driven weakly 15 ns

tCLHAH1CLKOUT low to HLDA high -15 15 ns

tCLBRH

1CLKOUT low to BREQ high -15 15 ns

tHAHAX1HLDA high to address no longer float -15 ns

tHAHBV1HLDA high to BHE, INST, RD, WR valid -10 ns

CLKOUT

HOLD

HLDA

BREQ

BUS

ALE/ADV

BHE, INST

RD, WR

tHVCH tHVCH

tCLHAL tCLHAH

tCLBRL tCLBRH

tHAHAX

tHALAZ

tHALBZ tHAHBV

Weakly Driven Inactive

Weakly Driven High

Figure 8. DC Specifications In Hold

UT80CRH196KDS

XTAL1

External Clock

Input

Figure 9. External Clock Connections

VDD

0.0V 1.4V 1.4V

TEST POINTS

AC Testing inputs are driven at VDD for a Logic “1” and 0.0V for a Logic “0”. Timing measure-

ments are made at 1.4V.

Figure 10. AC Testing Input, Output Waveforms

VLOAD

For timing purposes a port pin is no longer floating when it changes to a voltage outside the ref-

erence points shown and begins to float when it changes to a voltage inside the reference points

shown. IOL = 4mA, IOH = -4mA.

VOL + 0.5V

VOH - 0.5V

VOL + 0.5V

VOH - 0.5V

TIMING REFERENCE

POINTS

Figure 11. Float Waveforms

Table 12. Serial Port Timing

SYMBOL PARAMETER MINIMUM MAXIMUM UNIT

tXLXL2Serial port clock period (BRR > 8002H) 6 TOSC typical ns

tXLXH1Serial port clock falling edge to rising edge

(BRR > 8002H) 4 TOSC -50 4 TOSC +50 ns

tXLXL2Serial port clock period (BRR = 8001H) 4 TOSC typical ns

tXLXH1Serial port clock falling edge to rising edge

(BRR = 8001H) 2 TOSC -50 2 TOSC +50 ns

tQVXH

1Output data valid to clock rising edge 2 TOSC -50 ns

tXHQX

1Output data hold after clock rising edge 2 TOSC -50 ns

tXHQV

1Next output data valid after clock rising edge 2 TOSC +50 ns

tDVXH

1Input data setup to clock rising edge TOSC +50 ns

tXHDX

1Input data hold after clock rising edge 0ns

tXHQZ1Last clock rising to output float 2 TOSC -10 2 TOSC +10 ns

TXD

RXD (OUT)

RXD (IN)

0 1 2 3 4 5 6 7

TXLXL

tQVXH tXHQV tXHQX

tDVXH

tXHDX

tXLXH

tXHQZ

Figure 12. Serial Port Waveform - Shift Register Mode

0 1 2 3 54

Note:

1.Tested only at initial qualification, and after any design or process changes which may affect this characteristic.

2. These specs are verified using functional vectors (strobed) only.

APPENDIX A

Difference Between Industry Standard and UT80CRH196KDS

1.0 DIFFERENCES TO INDUSTRY

STANDARD 80C196KD

1.1 Analog to Digital Converter

The Analog to Digital Converter will not be implemented in the

UT80CRH196KDS.

1.3 Clocking

The XTAL2 output is not used and the UT80CRH196KDS

expects the input on the XTAL 1 to be a valid digital clock

signal. The clock should be stable before reset is removed or

Power Down mode is exited. In Power Down mode, a small

number of gates will be clocked by the XTAL1 input. The

UT80CRH196KDS XTAL2 has been replaced with a VSS pin.

1.4 CCB Read after Reset

The CCB fetch after Reset will be a normal fetch as if the chosen

bus width is selectable based on the BUSWIDTH input.

Systems with an 8-bit wide interface should tie BUSWIDTH to

ground. Systems that use BUSWIDTH should perform a normal

decode based on the memory configuration of the system. The

Industry Standard 80C196KD treats the CCB fetch as an 8-bit

fetch (driving the upper 8-bits with address 20H) regardless of

the state of BUSWIDTH.

1.5 Internal Program Memory

The UT80CRH196KDS does not have internal program

memory, and pin 2 (EA) will be ignored for choosing between

internal and external program reads. The user may tie this pin

to ground for compatibility reasons, unless EDAC is enabled.

1.6 Ports 3 and 4

Since the UT80CRH196KDS will not have internal program

memory, Ports 3 and 4 will always be used as the multiplexed

Address and Data bus. Therefore, these ports will not be

configured as I/O ports, and the bidirectional port function of

these pins will not be implemented. The pins will only be

configured as Address and bidirectional data pins.

1.7 Built in EDAC

The UT80CRH196KDS incorporates a built in Error Detection

and Correction circuit for external memory reads and writes.

The EDAC can be controlled from an external pin. The external

pin (Pin 37) can be used to enable or disable this feature

interactively. Therefore, different regions of external memory

can be assigned to have EDAC as necessary. Additionally, the

EDAC check bits will be passed through Port 0, which varies

from the industry standard version where Port 0 is an input only

port. You can control the interrupt behavior of the EDAC engine

by setting bits 6 and 5 of the EDAC Control and Status Register

(EDAC_CS). Additionally, reading bit 4 of the EDAC_CS

allows you to determine if a double bit error occurred, and

reading bits 3 through 0 of the EDAC_CS Register tells you

how many single bit errors have been corrected. The EDAC_CS

1.8 Instruction Queue

The instruction queue is eight bytes deep instead of four. The

instruction queue also interfaces to the CPU through a 16-bit

bus. This configuration will speed up the operation of the

UT80CRH196KDS.

1.9 WDT and Prescalar

The WDT can now be disabled through the software. The

disable feature should allow the user flexibility in using the

Watch Dog Timer. The WDT also now has a prescalar which

can slow down the counter by a factor of 20 to 27. The prescalar

will give the user extra time between clears of the WDT. The

WDT prescaler (WDT_SCALE) is located at location 0Dh of

HWindow 1.

1.10 Interrupt Priority Levels

An additional level of priority encoding is available to the user.

Every standard interrupt can be programed to a higher level of

priority. All interrupts in the higher priority will maintain their

relative priority, but low priority interrupts can then be

programmed for a higher interrupt priority if necessary. The

interrupt priority register is 16-bits wide, and maps to the

standard interrupts in the same fashion as the INT_MASK and

INT_MASK1 registers. The high byte of the Interrupt Priority

low byte (INT_PRI(lo)) is located at 0Ah of HWindow 1.

1.11 Faster Multiply and Divide

The multiplier and divider have been optimized to perform their

operations in fewer state times than in the current version.

1.12 Instructions State Time Reduction

The CPU has been streamlined for faster execution where

possible. Examples include 1 state reduction for WORD

immediate instructions, 1 state reductions for long indexed

instructions, and state reductions for the BMOV instructions.

1.13 STACK_PNTR implemented as Special Function

The STACK_PNTR has been implemented as a true Special

Function Register instead of in the RAM to allow for quicker

pushes and pops. If the stack is not used, the SFR can be used

for general purpose data storage.

1.14 Timer3

An additional 16-bit timer/counter has been implemented as a

general purpose timer that can be used if Timer1 and Timer 2

are being dedicated to other functional uses. The current value

of Timer3 can be found in locations 0Fh (high byte), and 0Eh

(low byte) of HWindow 1.

1.15 Input/Output Pullup/Pulldown Currents

Leakage currents may not meet the industry standard specs due

to differently sized weak pullups/pulldowns, during Quasi-

Bidirectional and reset/powerdown modes. Refer to specs for

ILI1

and ILI2.

1.16 Power-down exit

Pin 37 will not be used to exit power-down mode. Since a digital

clock is supplied, no connection between this Vpp pin and the

power-down circuitry exists.

1.17 Test Mode Entry

Test mode entry will be via four pins: WR, RD, ALE and HLDA

instead of PWM0.

1.18 Power-on Reset

The UT80CRH196KDS will not guarantee the 16-state "pulse

stretching" function of a Reset_n pulse applied at power-up. The

user must hold Reset_n low until the power and clocks stabilize

plus 16-state times, or provide a high to low transition after the

power and clocks have stabilized.

1.19 Pullup/Pulldown states

The INST pin will be driven to a weak low during Reset. The

ALE signal will be driven to a weak high during Bus Hold.

1.20 Modifying the INT_PEND registers

Two operand rd-modify-wr instructions should be used to

modify the INT_PEND registers. Three operand rd-modify-wr

instructions may lose an incoming interrupt.

1.21 Serial Port Synchronous Mode

The last clock rising edge to output float time (TXHQZ) is made

consistent with the output data hold (TXHQX) time of 2 TOSC +/

-50nsec. This is longer than the industry standard of 1 TOSC max.

1.22 Industry Standard Register Indirect with Auto Incre-

ment

The industry standard increments the auto-incremented regis-

ter after determining the external address instead of at the end

of the instruction completion. The UT80CRH196KDS per-

forms the auto-increment function at the end of the instruction

processing. Please reference the example below that shows the

processing difference between the UT80CRH196KDS and the

industry standard:

ST R0, [R0]+

assume R0 holds the value 1000h before the instruction is exe-

cuted.

1.23 AC Timing Differences

There are some AC timing differences between the

UT80CRH196KDS and the industry standard 80C196KD.

Most changes resulted in loosened timing specifications. How-

ever, the tRHDZ and tRXDX timing specifications were tight-

ened by 5ns. If you have been designing to the industry

standard timing specifications, it is important to recognize

these two shortened timing specifications.

NOTE: Please visit the UTMC website at www.utmc.com to

obtain the latest data sheet updates, application notes, software

examples, advisories and erratas for the UT80CRH196KDS.

1.24 T2UP-DN Input Signal

Port 2.6 has an alternate function of T2UP-DN enabled by

IOC2.1. The industry standard device appears to allow writes

into Port 2.6 to directly affect the pin state when in the T2UP-

DN mode. (This would allow software control of the T2 direc-

tion, but requires ensuring a one (QBD pullup) is written to

Port 2.6 if the pin is driven externally). The

UT80CRH196KDS device is designed to disable the Port 2.6

output when T2UP-DN is enabled. This protects the P2.6/

T2UP-DN pin from contention with an externally driven sig-

nal, independent of the value written into Port 2.

1.25 NEG 8000h Instruction Operation

The UT80CRH196KDS and the industry standard 80C196KD

set the N-Flag differently when executing the NEG 8000h

instruction. NEG represents the MCS-96 opcode to negate a

defined operand (8000h). When the UT80CRH196KDS exe-

cutes the NEG 8000h instruction, the result becomes 8000h

with both the N-Flag and the V-Flag set. The industry standard

80C196KD, however, executes the NEG 8000h instruction

with a result of 8000h and only the V-Flag set.

1.26 Reserved Opcode EEH

The industry standard 80C196KD using the MCS-96 ISA

declares the opcode EEH as a reserved opcode and does not

guarantee the generation of the Unimplemented Opcode Inter-

rupt. The UT80CRH196KDS, on the other hand, generates the

Unimplemented Opcode Interrupt when the EEH opcode is

executed.

PROCESSING FLOW FOR THE ST R0, [R0]+

INSTRUCTION

UT80CRH196KDS Industry Standard

Address = [R0]; 1000h Address = [R0]; 1000h

R0 ---> Address R0 = R0+1; 1001h

R0 = R0+1; 1001h R0 ---> Address

* The contents in address

1000h are 1000h * The contents in address

1000h are 1001h

PROCESSING FLOW FOR THE ST R0, [R0]+

INSTRUCTION

UT80CRH196KDS Industry Standard

1.27 Advanced Read/Write Signal (ADV_RD_WR)

The UT80CRH196KDS provides an early indication of an

external memory cycle direction being a read or write. This

signal is output on pin 2. See Table 10 and Figure 4 for

description of operation.

1.28 Byte-Wide Reads of the HSI_Time SFR

In order to ensure that the next HSI event is loaded from the

FIFO into the HSI holding register, the HSI_TIME special

function register must be read as a 16-bit word. Byte-wide

reads of the HSI_TIME register will not result in successful

loading of the HSI holding register.

1.29 HOLD Must Be Synchronized with CLKOUT

The DMA arbiter must synchronize the HOLD signal with the

CLKOUT on the UT80CRH196KDS. The timing diagram in

Figure 8 eludes to the synchronicity of the HOLD signal, but

does not clearly identify the outcome if the HOLD signal does

not satisfy the timing parameter tHVCH. If the HOLD setup

time is violated on the industry standard 80CRH196KDS, it

will require one additional CLKOUT cycle before it recog-

nizes the state change of HOLD. Violating the HOLD setup

time on the UT80CRH196KDS will result in a metastable

condition and the UT80CRG196KDS’s reaction is undefined.

8.0 PACKAGE

Notes:

1. All package finishes are per MIL-PRF-38535.

2. Letter designations are for cross-reference to MIL-STD-1835.

3. All leads increase max. limit by 0.003 measured at the

center of the flat, when lead finish A (solder) is applied.

4. ID mark: Configuration is optional.

5. Lettering is not subject to marking criteria.

6. Total weight is approx. 8.0 grams.

7. All dimensions are in inches.

Figure 14. 68-lead Quad Flatpack

ORDERING INFORMATION

UT80CRH196KDS 16-Bit Microcontroller: SMD

Lead Finish:

(A) = Solder

(X) = Optional

Case Outline:

(X) = 68-lead top brazed flatpack

Class Designator:

(Q) = Class Q

(V) = Class V

Device Type (Note 4)

(01) = 20 Mhz, 16-bit microcontroller (-55oC to +125oC) TID dose rate = 50 to 300

rads(Si)(sec)

(02) = 20 Mhz, 16-bit microcontr oller, Extended Industrial Temp ( -40 oC to +125oC)

(03) = 20 Mhz, 16-bit microcontroller (-55oC to +125oC) TID dose rate = 1

rads(Si)(sec)

(04) = 20 Mhz, 16-bit microcontr oller, Extended Industrial Temp ( -40 oC to +125oC)

TID dose rate = 1 rads(Si)(sec)

Drawing Number: 02523

Total Dose:

(R) = 1E5 rads(Si)

(F) = 3E5 rads(Si)

Federal Stock Class Designator: No options

5962 * 02523 ** * * *

Notes:

1. Lead finish (A, C, or X) must be specified.

2. If an “X” is specified when ordering, part number will match the lead finish and will be either “A” (solder) or “C” (gold).

3. Total dose radiation must be specified when ordering. QML V is not available without radiation testing.

4. Device ty pes 01 and 0 2 can only be o rdered with the "R" total dose designator. Device types 03 and 04 can only be ordered with the "R" or "F" total

dose designator.

UT80CRH196KDS Microcontroller

UT80CRH196KDS - * * *

Notes:

1. Lead finish (A,C, or X) must be specified.

2. If an “X” is specified when ordering, then the part number will match the lead finish and will be either “A” (solder) or “C” (gold).

3. Military Temperature Range flow per UTMC Manufacturing Flows Document. Devices are tested -55C, room temp, and 125C. Radiation is neither

tested nor guaranteed.

4. Prototype flow per UTMC Manufacturing Flows Document Tested at 25C only. Lead finish is gold only. Radiation is neither tested nor guaranteed.

5. Extended Industrial Temper ature Range Flow per UTMC Manufacturing Flows Document. Devices are tested at -40oC, room temp, and +125oC.

Radiation is neither tested nor guaranteed.

Lead Finish: (Notes 1, 2)

(A) = Solder

(X) = Optional

Screening:(Notes 3, 4, 5)

(P) = Prototype

(W) = Extended Industrial Temp (-40oC to +125oC)

Package Type:

(W) = 68-lead top brazed Flatpack

UTMC Core Part Number