PC713VxNSZX
Series
1. Recognized by UL1577 (Double protection isolation),
file No. E64380 (as model No. PC713V)
2. Approved by TÜV (VDE0884) (as an option) file No.
R-9151576 (as model No. PC713V)
3. Package resin : UL flammability grade (94V-0)
■ Features
■ Agency approvals/Compliance
1. Home appliances
2. Programmable controllers
3. Personal computer peripherals
■ Applications
DIP 6 pin Includes Base Terminal
Connection Photocoupler
1. 6 pin DIP package
2. Double transfer mold package (Ideal for Flow Solder-
ing)
3. With base terminal
4. High collector-emitter voltage (VCEO:80V(*))
5. High isolation voltage between input and output
(Viso(rms) : 5.0kV)
(*) Up to Date code "P7" (July 2002) VCEO : 35V.
■ Description
PC713VxNSZX Series contains an IRED optically
coupled to a phototransistor.
It is packaged in a 6 pin DIP, available in SMT gullw-
ing lead-form option.
Input-output isolation voltage(rms) is 5.0kV.
Collector-emitter voltage is 80V(*) and CTR is 50%
to 600% at input current of 5mA.
1Sheet No.: D2-A04301EN
Date Nov. 28. 2003
© SHARP Corporation
Notice The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
PC713VxNSZX Series
■ Internal Connection Diagram
Anode
Cathode
NC
Emitter
11
2
3
4
Collector
5
Base
6
2
6
5
3 4
2
Sheet No.: D2-A04301EN
■ Outline Dimensions (Unit : mm)
1. Through-Hole [ex. PC713VxNSZX] 2.
Through-Hole (VDE0884 option) [ex. PC713VxYSZX]
3. SMT Gullwing Lead-Form [ex. PC713VxNIPX]4. SMT Gullwing Lead-Form (VDE0884 option)
[ex. PC713VxYIPX]
7.12±0.5
θ
θ
θ : 0 to 13˚
7.62±0.3
Epoxy resin
6.5±0.5
0.6±0.2
1.2±0.3
1 2 3
6 5 4
0.5TYP.
2.9±0.5
0.5±0.1
2.54±0.25
3.25±0.5
3.5±0.5
Rank mark
PC713V
SHARP
mark
"S"
Date code
Anode
mark
7.12±0.3
θ
θ
θ : 0 to 13˚
7.62±0.3
Epoxy resin
6.5±0.5
0.6±0.2
1.2±0.3
1 2 3
6 5 4
0.5TYP.
2.9±0.5
0.5±0.1
2.54±0.25
3.25±0.5
3.5±0.5
Rank mark
4
VDE0884
Identification mark
Anode
mark
PC713V
SHARP
mark
"S"
Date code
7.12±0.5
7.62±0.3
Epoxy resin
Anode
mark
6.5±0.5
0.6±0.2 1.2±0.3
2.54±0.25
3.5±0.5
0.35±0.25
1.0+0.4
−0
1.0+0.4
−0
10.0+0
−0.5
0.26±0.1
1 2 3
6 5 4
Rank mark
PC713V
SHARP
mark
"S"
Date code
7.12±0.5
7.62±0.3
Epoxy resin
Rank mark
6.5±0.5
0.6±0.2 1.2±0.3
2.54±0.25
3.5±0.5
0.35±0.25
1.0+0.4
−0
1.0+0.4
−0
10.0+0
−0.5
0.26±0.1
4
VDE0884
Identification mark
Anode
mark
1 2 3
6 5 4
PC713V
SHARP
mark
"S"
Date code
PC713VxNSZX Series
Product mass : approx. 0.36g
Date code (2 digit)
A.D.
1990
1991
1992
1993
1994
1995
1996
1997
1998
1999
2000
2001
Mark
A
B
C
D
E
F
H
J
K
L
M
N
Mark
P
R
S
T
U
V
W
X
A
B
C
Mark
1
2
3
4
5
6
7
8
9
O
N
D
Month
January
February
March
April
May
June
July
August
September
October
November
December
A.D
2002
2003
2004
2005
2006
2007
2008
2009
2010
2011
2012
·
·
··
·
·
2nd digit
Month of production
1st digit
Year of production
3
repeats in a 20 year cycle
Sheet No.: D2-A04301EN
Rank mark
Refer to the Model Line-up
PC713VxNSZX Series
Country of origin
Japan
Sheet No.: D2-A04301EN
■ Electro-optical Characteristics
Parameter Conditions
Forward voltage
Terminal capacitance
Collector dark current
Transfer
charac-
teristics
Collector-base breakdown voltage
Emitter-base breakdown voltage
Current transfer ratio
Collector-emitter breakdown voltage
Collector-emitter saturation voltage
Isolation resistance
Floating capacitance
Cut-off frequency
MIN.
−
−
−
80
6
2.5
−
5×1010
−
−
−
−
TYP.
1.2
30
−
−
−
−
−
0.1
1×1011
0.6
80
4
3
MAX.
1.4
250
100
−
−
−
30
0.2
−
1.0
−
18
18
Unit
V
V
pF
nA
V
V
mA
V
Ω
pF
kHz
µs
µs
Symbol
VF
Ct
ICEO
BVCEO
BVCBO
BVEBO
IC
VCE (sat)
fC
tr
tf
RISO
Cf
Response time Rise time
Fall time
Input
Output
IF=20mA
V=0, f=1kHz
Reverse current −−10 µAIRVR=4V
Peak forward voltage −−3.0 VVFM IFM=0.5A
VCE=50V, IF=0
IC=0.1mA, IF=0
IC=0.1mA, IF=0
IE=10µA, IF=0
IF=5mA, VCE=5V
DC500V, 40 to 60%RH
V=0, f=1MHz
VCE=2V, IC=2mA, RL=100Ω
VCE=5V, IC=2mA, RL=100Ω −3dB
IF=20mA, IC=1mA
80
(Ta=25˚C)
*5
*5
*5 Up to Date code "P7" (July 2002) BVCEO≥35V and BVCBO≥35V.
■ Absolute Maximum Ratings (Ta=25˚C)
Parameter Symbol Unit
Input
Forward current mA
*1
*4
*4
Peak forward current A
Power dissipation
Reverse voltage
mW
V
Output
Collector-emitter voltage
V
Emitter-collector voltage
Collector-base voltage
Emitter-base voltage
V
V
V
Collector current mA
Collector power dissipation
mW
*2 Isolation voltage
Operating temperature
Total power dissipation
˚C
mW
Storage temperature ˚C
*3 Soldering temperature
IF
IFM
P
VR
VCEO
VECO
VCBO
VEBO
IC
PC
Viso (rms)
Topr
Ptot
Tstg
Tsol ˚C
*1 Pulse width≤100µs, Duty ratio : 0.001
*2 40 to 60%RH, AC for 1minute, f=60Hz
*3 For 10s
*4 Up to Date code "P7" (July 2002) VCEO : 35V, VCBO : 35V.
Rating
50
1
70
6
80
6
80
6
50
150
−25 to +100
170
−40 to +125
260
5kV
4
PC713VxNSZX Series
Sheet No.: D2-A04301EN
■ Model Line-up
Rank mark
with or with out
A
B
C
A or B
B or C
A, B or C
PC713V0NSZX
PC713V1NSZX
PC713V2NSZX
PC713V3NSZX
PC713V5NSZX
PC713V6NSZX
PC713V8NSZX
PC713V0YSZX
PC713V1YSZX
PC713V2YSZX
PC713V3YSZX
PC713V5YSZX
PC713V6YSZX
PC713V8YSZX
−−−−−− Approved
PC713V0NIZX
PC713V1NIZX
PC713V2NIZX
PC713V3NIZX
PC713V5NIZX
PC713V6NIZX
PC713V8NIZX
PC713V0YIZX
PC713V1YIZX
PC713V2YIZX
PC713V3YIZX
PC713V5YIZX
PC713V6YIZX
PC713V8YIZX
PC713V0NIPX
PC713V1NIPX
PC713V2NIPX
PC713V3NIPX
PC713V5NIPX
PC713V6NIPX
PC713V8NIPX
PC713V0YIPX
PC713V1YIPX
PC713V2YIPX
PC713V3YIPX
PC713V5YIPX
PC713V6YIPX
PC713V8YIPX
Lead Form
Package
Model No.
VDE0884
Sleeve Taping
Through-Hole
50pcs / sleeve 1 000pcs / reel
SMT Gullwing
−−−−−− Approved −−−−−− Approved
IC [mA]
(IF=5mA,
VCE=5V,
Ta=25˚C)
2.5 to 30.0
4.0 to 8.0
6.5 to 13.0
10.0 to 20.0
4.0 to 13.0
6.5 to 20.0
4.0 to 20.0
5
Please contact a local SHARP sales representative to inquire about production status and Lead-Free options.
PC713VxNSZX Series
Sheet No.: D2-A04301EN
0
30
0 100 125
40
50
60
20
10
Forward current IF (mA)
-25 25 50 75
Ambient temperature Ta (˚C)
Fig.1 Forward Current vs. Ambient
Temperature
Fig.2 Diode Power Dissipation vs. Ambient
Temperature
0
0 125
100
200
50
150
25 50 75 100
Collector power dissipation PC (mW)
Ambient temperature Ta (˚C)
−25
Fig.3 Collector Power Dissipation vs.
Ambient Temperature
50˚C 25˚C
0˚C
0 0.5 1.0 1.5 2.0 2.5 3.0 3.5
10
100
1
Forward voltage VF (V)
Forward current IF (mA)
−25˚C
Ta=75˚C
Fig.6 Forward Current vs. Forward Voltage
Duty ratio
0.01
0.1
1
10
1
Peak forward current IFM (A)
10−310−210−1
Pulse width≤100µs
Ta=25˚C
Fig.5 Peak Forward Current vs. Duty Ratio
Fig.4 Total Power Dissipation vs. Ambient
Temperature
6
PC713VxNSZX Series
Total power dissipation Ptot (mW)
Ambient temperature Ta (˚C)
50
00255075100
−25
100
150
170
200
250
Diode power dissipation P (mW)
100
80
70
60
40
20
0025 5575100
−25
Ambient temperature Ta (˚C)
Sheet No.: D2-A04301EN
7
250−25 50 75
10−10
100
10−9
10−8
10−7
10−6
10−5
10−11
Ambient temperature Ta (˚C)
Collector dark current I
CEO
(A)
VCE=50V
RBE=∞
Fig.11 Collector Dark Current vs. Ambient
Temperature
Fig.12 Collector-base Dark Current vs.
Ambient Temperature
100
0
50
150
05075100−25 25
Ambient temperature Ta (˚C)
Relative current transfer ratio (%)
IF=5mA
VCE=5V
RBE=∞
Fig.9 Relative Current Transfer Ratio vs.
Ambient Temperature
0.02
0.04
0.06
0.08
0.10
0.12
0.14
020406080100
Ambient temperature Ta(˚C)
Collector-emitter saturation voltage VCE(sat) (V)
−25
IF=20mA
IC=1mA
RBE=∞
Fig.10 Collector - emitter Saturation Voltage
vs. Ambient Temperature
10−9
10−8
10−10
10−11
2505075100 125
Ambient temperature Ta (˚C)
Collector dark current ICBO (A)
VCB=50V
RBE=∞
PC713VxNSZX Series
0
200
1
40
80
120
160
180
140
100
60
20
10
Forward current IF (mA)
Current transfer ratio CTR (%)
RBE=∞
500kΩ
100kΩ
VCE=5V
Ta=25˚C
Fig.7 Current Transfer Ratio vs. Forward
Current
0
0
5
30
123456789
10
15
20
25
20mA
10mA
5mA
Collector current IC (mA)
Collector-emitter voltage VCE (V)
IF=30mA RBE=∞
Ta=25˚C
PC (MAX.)
Fig.8 Collector Current vs. Collector-
emitter Voltage
Sheet No.: D2-A04301EN
8
−20
0
1
−10
10010
Voltage gain Av (dB)
Frequency f (kHz)
RL=10kΩ1kΩ
100Ω
VCE=5V
IC=2mA
RBE=∞
Ta=25˚C
Fig.15 Frequency Response
Remarks : Please be aware that all data in the graph are just for reference and not for guarantee.
Fig.16 Test Circuit for Frequency Response
VCC
RL
Output
RD
VCE
Please refer to the conditions in Fig.15
PC713VxNSZX Series
0.1
1
0.1 1 10
10
100
Load resistance RL (kΩ)
Response time (µs)
td
ts
tf
tr
VCE=2V
IC=2mA
RBE=∞
Ta=25˚C
Fig.13 Response Time vs. Load Resistance Fig.14 Test Circuit for Response Time
90%
10%
Output
Input
RL
Input Output
VCE
Please refer to the conditions in Fig.13
VCC
RD
tdts
trtf
Sheet No.: D2-A04301EN
While operating at IF<1.0mA, CTR variation may increase.
Please make design considering this fact.
This product is not designed against irradiation and incorporates non-coherent IRED.
● Degradation
In general, the emission of the IRED used in photocouplers will degrade over time.
In the case of long term operation, please take the general IRED degradation (50% degradation over 5years)
into the design consideration.
● Recommended Foot Print (reference)
✩ For additional design assistance, please review our corresponding Optoelectronic Application Notes.
9
2.542.54
1.7
2.2
8.2
(Unit : mm)
● Design guide
■ Design Considerations
PC713VxNSZX Series
Sheet No.: D2-A04301EN
■ Manufacturing Guidelines
Reflow Soldering:
Reflow soldering should follow the temperature profile shown below.
Soldering should not exceed the curve of temperature profile and time.
Please don't solder more than twice.
● Soldering Method
Flow Soldering :
Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below
listed guidelines.
Flow soldering should be completed below 270˚C and within 10s.
Preheating is within the bounds of 100 to 150˚C and 30 to 80s.
Please don't solder more than twice.
Hand soldering
Hand soldering should be completed within 3s when the point of solder iron is below 400˚C.
Please don't solder more than twice.
Other notices
Please test the soldering method in actual condition and make sure the soldering works fine, since the impact
on the junction between the device and PCB varies depending on the tooling and soldering conditions.
10
1234
300
200
100
00
(˚C)
Terminal : 260˚C peak
( package surface : 250˚C peak)
Preheat
150 to 180˚C, 120s or less
Reflow
220˚C or more, 60s or less
(min)
PC713VxNSZX Series
Sheet No.: D2-A04301EN
Solvent cleaning:
Solvent temperature should be 45˚C or below Immersion time should be 3minutes or less
Ultrasonic cleaning:
The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time,
size of PCB and mounting method of the device.
Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of
mass production.
Recommended solvent materials:
Ethyl alcohol, Methyl alcohol and Isopropyl alcohol
In case the other type of solvent materials are intended to be used, please make sure they work fine in ac-
tual using conditions since some materials may erode the packaging resin.
● Cleaning instructions
This product shall not contain the following materials.
And they are not used in the production process for this device.
Regulation substances:CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)
Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all.
● Presence of ODC
11
PC713VxNSZX Series
Sheet No.: D2-A04301EN
■ Package specification
12
12.0
6.7
5.8
10.8
520
±2
PC713VxNSZX Series
● Sleeve package
Package materials
Sleeve : HIPS (with anti-static material)
Stopper : Styrene-Elastomer
Package method
MAX. 50 pcs. of products shall be packaged in a sleeve.
Both ends shall be closed by tabbed and tabless stoppers.
The product shall be arranged in the sleeve with its anode mark on the tabless stopper side.
MAX. 20 sleeves in one case.
Sleeve outline dimensions
(Unit : mm)
Sheet No.: D2-A04301EN
13
● Tape and Reel package
Package materials
Carrier tape : A-PET (with anti-static material)
Cover tape : PET (three layer system)
Reel : PS
Carrier tape structure and Dimensions
F
K
EI
DJ
B
H
H
A
C
G
5˚MAX.
Dimensions List (Unit:mm)
A
16.0±0.3
B
7.5±0.1
C
1.75±0.1
D
12.0±0.1
E
2.0±0.1
H
10.4±0.1
I
0.4±0.05
J
4.2±0.1
K
7.8±0.1
F
4.0±0.1
G
φ1.5+0.1
−0
a
c
e
g
f
b
d
Dimensions List (Unit : mm)
a
330
b
17.5±1.5
c
100±1.0
d
13±0.5
e
23±1.0
f
2.0±0.5
g
2.0±0.5
Pull-out direction
[Packing : 1 000pcs/reel]
Reel structure and Dimensions
Direction of product insertion
PC713VxNSZX Series
PC713VxNSZX Series
· The circuit application examples in this publication are
provided to explain representative applications of
SHARP devices and are not intended to guarantee any
circuit design or license any intellectual property rights.
SHARP takes no responsibility for any problems rela-
ted to any intellectual property right of a third party re-
sulting from the use of SHARP's devices.
· Contact SHARP in order to obtain the latest device
specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the spec-
ifications, characteristics, data, materials, structure,
and other contents described herein at any time without
notice in order to improve design or reliability. Manufac-
turing locations are also subject to change without no-
tice.
· Observe the following points when using any devices
in this publication. SHARP takes no responsibility for
damage caused by improper use of the devices which
does not meet the conditions and absolute maximum
ratings to be used specified in the relevant specification
sheet nor meet the following conditions:
(i) The devices in this publication are designed for use
in general electronic equipment designs such as:
--- Personal computers
--- Office automation equipment
--- Telecommunication equipment [terminal]
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
(ii) Measures such as fail-safe function and redundant
design should be taken to ensure reliability and safety
when SHARP devices are used for or in connection
with equipment that requires higher reliability such as:
--- Transportation control and safety equipment (i.e.,
aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii) SHARP devices shall not be used for or in connec-
tion with equipment that requires an extremely high lev-
el of reliability and safety such as:
--- Space applications
--- Telecommunication equipment [trunk lines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g.,
scuba).
· If the SHARP devices listed in this publication fall with-
in the scope of strategic products described in the For-
eign Exchange and Foreign Trade Law of Japan, it is
necessary to obtain approval to export such SHARP de-
vices.
· This publication is the proprietary product of SHARP
and is copyrighted, with all rights reserved. Under the
copyright laws, no part of this publication may be repro-
duced or transmitted in any form or by any means, elec-
tronic or mechanical, for any purpose, in whole or in
part, without the express written permission of SHARP.
Express written permission is also required before any
use of this publication may be made by a third party.
· Contact and consult with a SHARP representative if
there are any questions about the contents of this pub-
lication.
14
Sheet No.: D2-A04301EN
■ Important Notices
