MTCH6301T-I/PT - Microchip Technology

 2012-2014 Microchip Technology Inc. DS40001663B-page 1

Description:

MTCH6301 is a turnkey projected capacitive controller

that allows easy integration of multi-touch and gestures

to create a rich user interface in your design. Through

a sophisticated combination of Self and Mutual

Capacitive scanning for both XY screens and touch

pads, the MTCH6301 allows designers to quickly and

easily integrate projected capacitive touch into their

application.

Applications:

• Human-Machine Interfaces with Configurable

Button, Keypad or Scrolling Functions

• Single-Finger Gesture-Based Interfaces to Swipe,

Scroll or Doubletap Controls

• Home Automation Control Panels

• Security Control Keypads

• Automotive Center Stack Controls

• Gaming Devices

• Remote Control Touch Pads

Touch Sensor Support:

• Up to 13RX x 18TX Channels

• Individual Channel Tuning for Optimal Sensitivity

• Works with Printed Circuit Board (PCB) Sensors,

Film, Glass and Flexible Printed Circuit (FPC)

Sensors

• Cover Layer Support:

- Plastic: up to 3 mm

- Glass: up to 5 mm

Touch Performance:

• > 100 Reports per Second Single Touch

• > 60 Reports per Second Dual Touch

• Up to 12-Bit Resolution Coordinate Reporting

Touch Features:

• Multi-touch (up to ten touches)

• Gesture Detection and Reporting

• Single and Dual Touch Drawing

• Self and Mutual Signal Acquisition

• Built-in Noise Detection and Filtering

Power Management:

• Configurable Sleep mode

• Integrated Power-on Reset and Brown-out Reset

• 200 µA Sleep Current (typical)

Communication Interface:

•I

2C™ (up to 400 kbps)

Operating Conditions:

• 2.4V to 3.6V, -40ºC to +105ºC

Package Types:

• 44-Lead TQFP

• 44-Lead QFN

MTCH6301

MTCH6301 Projected Capacitive Touch Controller

MTCH6301

DS40001663B-page 2  2012-2014 Microchip Technology Inc.

Table of Contents

1.0 System Block Diagram ................................................................................................................................................................. 3

2.0 Configuration and Setup............................................................................................................................................................... 3

3.0 Pin Diagram.................................................................................................................................................................................. 4

4.0 Pinout I/O Descriptions................................................................................................................................................................. 5

5.0 Layout........................................................................................................................................................................................... 6

6.0 Communication Protocol ............................................................................................................................................................ 12

7.0 Memory Map .............................................................................................................................................................................. 21

8.0 Special Features ........................................................................................................................................................................ 23

9.0 Electrical Characteristics ............................................................................................................................................................ 26

10.0 Ordering Information .................................................................................................................................................................. 30

11.0 Packaging Information................................................................................................................................................................ 31

The Microchip Web Site........................................................................................................................................................................ 38

Customer Change Notification Service................................................................................................................................................. 38

Customer Support................................................................................................................................................................................ 38

Worldwide Sales and Service............................................................................................................................................................... 40

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To determine if an errata sheet exists for a particular device, please check with one of the following:

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When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are

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Customer Notification System

 2012-2014 Microchip Technology Inc. DS40001663B-page 3

MTCH6301

1.0 SYSTEM BLOCK DIAGRAM

FIGURE 1-1: SYSTEM BLOCK DIAGRAM

2.0 CONFIGURATION AND SETUP

The MTCH6301 is preconfigured for a

12 Receiver (RX)/9 Transmitter (TX) touch sensor,

mapped as shown in Section 5.1 “Typical

Application Circuit”. While the device will work

out-of-the-box using this specific sensor configuration,

most applications will require additional configuration

and sensor tuning to determine the correct set of

parameters to be used in the final application.

Microchip provides a PC-based configuration tool for

this purpose, available in the mTouch™ Sensing

Solution Design Center (www.microchip.com/mtouch).

Use of this tool requires a PICkit™ Serial Analyzer

(updated with MTCH6301 support), as well as access

to the I2C communications bus of the MTCH6301

device.

Once the development process is complete, this

modified parameter set must either be written

permanently to the controller via NVRAM (see

Section 8.3 “Nonvolatile RAM (NVRAM)”), or

alternatively, it can be sent every time the system is

powered on. Both the PICkit Serial Analyzer and the

master I2C controller can be used for this purpose.

Touch Sensor

TX0..17

RX0..12

User Configuration Data

Noise Reduction / Filtering Engine

Gesture Engine

MultiTouch

Decode

I2CTM

Module

Signal Acquisition Controller

TX Drive

Sense

ADC

MTCH6301

Communications Engine

[Master Controller]

Touch Data

MICROCHIP

PICkitTM Serial

Analyzer

USB

Connection only for initial tuning or configuration

MTCH6301

DS40001663B-page 4  2012-2014 Microchip Technology Inc.

3.0 PIN DIAGRAM

FIGURE 3-1: 44-PIN TQFP, QFN(1,2)

Note 1: All RX/TX are remappable. Refer to Section 5.6 “Sensor Layout Configuration” for further

information.

2: The metal plate at the bottom of the device is not connected to any pins and it is recommended to

be connected to VSS externally.

MTCH6301

SDA

TX17

TX16

TX15

TX14

VSS

VCAP

INT

N/C

RX12

RX11

SCL

TX11

TX10

TX9

VDD

VSS

TX5

TX6

TX7

TX8

TX4

TX0

TX1

TX2

TX3

VSS

VDD

RX0

RX1

RX2

RX3

RX4

TX13

TX12

RX10

RX9

VSS

VDD

RESET

RX8

RX7

RX6

RX5

MTCH6301

 2012-2014 Microchip Technology Inc. DS40001663B-page 5

MTCH6301

4.0 PINOUT I/O DESCRIPTIONS

TABLE 4-1: PINOUT I/O DESCRIPTIONS

Pin Name Pin Number Pin Type Description

RESET 18 I/P Reset Device (active-low)

SCL 44 I Synchronous Serial Clock Input/Output for I2C™

SDA 1 I/O Synchronous Serial Data Input/Output for I2C™

INT 8 O Interrupt (from MTCH6301 to master) for I2C™

RX0 27* I/O

RX Sense (or TX Drive)

(*RX0/RX12 cannot be used for TX Drive)

RX1 26 I/O

RX2 25 I/O

RX3 24 I/O

RX4 23 I/O

RX5 22 I/O

RX6 21 I/O

RX7 20 I/O

RX8 19 I/O

RX9 15 I/O

RX10 14 I/O

RX11 11 I/O

RX12 10* I/O

TX0 33 O

TX Drive

TX1 32 O

TX2 31 O

TX3 30 O

TX4 34 O

TX5 38 O

TX6 37 O

TX7 36 O

TX8 35 O

TX9 41 O

TX10 42 O

TX11 43 O

TX12 13 O

TX13 12 O

TX14 5 O

TX15 4 O

TX16 3 O

TX17 2 O

N/C 9 N/C No Connect

VCAP 7 P CPU Logic Filter Capacitor Connection

VDD 17, 28, 40 P Positive Supply for Peripheral Logic and I/O Pins

VSS 6, 16, 29, 39 P Ground Reference for Logic and I/O Pins;

This pin must be connected at all times.

MTCH6301

DS40001663B-page 6  2012-2014 Microchip Technology Inc.

5.0 LAYOUT

5.1 Typical Application Circuit

The following schematic portrays a typical application

circuit, based on a 12RX/ 9TX touch sensor.

FIGURE 5-1: TYPICAL APPLICATION CIRCUIT

5.2 Decoupling Capacitors

The use of decoupling capacitors on power supply

pins, such as VDD and VSS, is required (see

Figure 5-1). Consider the following criteria when using

decoupling capacitors:

1. Value and type of capacitor:

A value of 0.1 µF (100 nF), 10-20V is recommended.

The capacitor should be a low Equivalent Series

Resistance (low ESR) capacitor and have resonance

frequency in the range of 20 MHz and higher. It is

further recommended that ceramic capacitors be used.

2. Placement on the Printed Circuit Board:

The decoupling capacitors should be placed as close to

the pins as possible. It is recommended that the

capacitors be placed on the same side of the board as

the device. If layout space is constrained, the capacitor

can be placed on another layer on the PCB and

connected using a via. Please ensure that the trace

length from the pin to the capacitor is less than

one-quarter inch (6 mm) in length.

3. Handling high-frequency noise:

If the board is experiencing high-frequency noise,

upward of tens of MHz, add a second ceramic-type

capacitor in parallel to the above-described decoupling

capacitor. The value of the second capacitor can be in

the range of 0.01 µF to 0.001 µF. Place this second

capacitor next to the primary decoupling capacitor. In

high-speed circuit designs, consider implementing a

decade pair of capacitances as close to the power and

ground pins as possible (for example, 0.1 µF in parallel

with 0.001 µF).

4. Maximizing performance:

On the board layout from the power supply circuit, run

the power and return traces to the decoupling

capacitors first, and then to the device pins. This

ensures that the decoupling capacitors are first in the

power chain. It is equally important to keep the trace

length between the capacitor and the power pins to a

minimum, thereby reducing PCB track inductance.

Master I2CTM

Controller

MTCH6301

TX3

TX2

TX1

TX0

VSS

VDD

RX0

RX1

RX2

RX3

RX4

TX15

TX16

TX17

SDA

TX14

VSS

VCAP

INT

N/C

RX12

RX11

TX9

TX10

TX11

SCL

VDD

VSS

TX5

TX6

TX7

TX8

TX4

RX9

RX10

TX12

TX13

VSS

VDD

RESET

RX8

RX7

RX6

RX5

10 µF

20k O

0.1 µF

RX0 RX11

TX0 TX8

GPIO/INT

SCL

SDA

MICROCHIP

PICkitTM Serial

Analyzer

VDD

 2012-2014 Microchip Technology Inc. DS40001663B-page 7

MTCH6301

5.3 Bulk Capacitors

The use of a bulk capacitor is recommended to improve

power supply stability. Typical values range from 4.7 µF

to 47 µF. This capacitor should be located as close to

the device as possible.

5.4 Capacitor on Internal Voltage

Regulator (VCAP)

A low ESR (1 ohm) capacitor is required on the VCAP

pin, which is used to stabilize the internal voltage

regulator output. The VCAP pin must not be connected

to VDD and must have a CEFC capacitor with at least a

6V rating, connected to ground. The type can be

ceramic or tantalum.

5.5 Touch Sensor Design

Considerations

5.5.1 SENSOR PATTERNS AND PCB

LAYOUT

With regard to touch sensor patterns, please refer to

the mTouch Design Center (www.micro-

chip.com/mtouch) for additional information on design-

ing and laying out a touch sensor pattern, as well as

using the correct techniques for PCB trace routing.

5.5.2 PROTOTYPING DESIGNS

Due to their complexity, touch sensor designs typically

require a thorough debugging phase to ensure a

reliable product. If possible, it is suggested that flexible

prototyping hardware be created with this in mind. A

common example is providing external access to the

communication lines for quick test and tuning while

in-circuit. Microchip’s Projected Capacitive

Configuration Utility (PCU) and a configured PICkit

Serial Analyzer can assist with early prototype

development. See the online Microchip MTCH6301

device page for these and other support materials.

5.5.3 SENSOR OVERLAY MATERIAL

To prevent saturation of sensor levels, a minimum

0.5 mm plastic or glass overlay is required for proper

operation of the device, even during a prototyping

phase, even if this value is different than the final

design.

5.5.4 OPERATION WITH AN LCD

MTCH6301 has integrated algorithms to detect and

minimize the effects of noise, but proper care should

always be taken in selecting an LCD and support

components with a focus on reducing noise as much as

possible. Since the interaction between the touch

sensor and display is highly dependent upon the

physical arrangement of the components, proper

testing should always be executed with a fully

integrated device. Please reference your projected

capacitive touch screen manufacturer’s integration

guide for additional design considerations.

5.6 Sensor Layout Configuration

To properly configure a sensor from a physical layout

standpoint, the following registers must be correctly

set:

• RX Pin Map/TX Pin Map

• RX Scaling Coefficient/TX Scaling Coefficient

• Flip State

5.6.1 RX/TX PIN MAP

By default, the RX and TX pins are set as shown in the

Typical Application Circuit (see Section 5.1 “Typical

Application Circuit”). It is recommended to keep this

layout if possible. If a different layout or a different

amount of sensor channels is required, the RX and TX

pins are configured via the Pin Map register arrays. To

access these arrays, please reference Section 6.0

“Communication Protocol” and Section 7.0

“Memory Map”.

The RX and TX lines are configurable for the purpose

of making trace routing and board layout more

convenient. Please note that while RX pins can be

used as TX pins instead, a single pin cannot be used

as both an RX and a TX channel concurrently. The pin

maps are comprised of Pin Map ID numbers, which are

shown in Tab l e 5 -1.

Note: At no time should the device be expected

to respond correctly to a user touching a

bare PCB sensor.

MTCH6301

DS40001663B-page 8  2012-2014 Microchip Technology Inc.

5.6.2 RX/ TX SCALING COEFFICIENT

Scaling coefficient registers exist in RAM for each axis

(RX/TX) and must be modified in accordance with the

number of channels that are in use (see Table 5- 2).

See Section 7.0 “Memory Map” for the location of

these parameters.

TABLE 5-1: PIN MAP ID CHART

Pin Map ID

(RX)

Map ID

(TX)

RX0 8 —

RX1 7 26

RX2 6 25

RX3 5 12

RX4 4 11

RX5 3 10

RX6 2 9

RX7 1 1

RX8 0 0

RX9 9 24

RX10 10 23

RX11 11 22

RX12 12 —

TX0 —13

TX1 —6

TX2 —3

TX3 —2

TX4 —4

TX5 —30

TX6 —29

TX7 —28

TX8 —7

TX9 —14

TX10 —15

TX11 —16

TX12 —5

TX13 —8

TX14 —34

TX15 —33

TX16 —32

TX17 —31

TABLE 5-2: RX/TX SCALING

COEFFICIENTS

Number of

Channels RX/TX Scaling Coefficient

(Base 10) (Base 16)

3 21845 0x5555

4 16384 0x4000

5 13107 0x3333

6 10922 0x2AAA

7 9362 0x2492

8 8192 0x2000

9 7281 0x1C71

10 6553 0x1999

11 5957 0x1745

12 5461 0x1555

13 5041 0x13B1

14 4681 0x1249

15 4369 0x1111

16 4096 0x1000

17 3855 0x0F0F

18 3640 0x0E38

 2012-2014 Microchip Technology Inc. DS40001663B-page 9

MTCH6301

5.6.3 SENSOR ORIENTATION (FLIP

STATE)

Once the sensor layout is complete, the final output

orientation is configured using the Flip State register, as

shown in Register 5-1. The Flip State register can be

adjusted during operation to support applications

where rotation occurs during use. Possible flip state

configurations are detailed in Figure 5-2.

Figure 5-2 shows the flip state values for all possible

sensor orientations.

U-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0 R/W-1

— — — — — SWAP TXFLIP RXFLIP

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 7-3 Unimplemented: Read as ‘0’

bit 2 SWAP:

1 = RX axis horizontal; TX axis vertical

0 = RX axis vertical; TX axis horizontal

bit 1 TXFLIP:

1 = Invert the TX axis

0 = Do not invert the TX axis

bit 0 RXFLIP:

1 = Invert the RX axis

0 = Do not invert the RX axis

MTCH6301

DS40001663B-page 10  2012-2014 Microchip Technology Inc.

FIGURE 5-2: SENSOR ORIENTATION CHART

5.6.4 UNUSED RX/TX PINS

Unused RX/TX pins are driven to VSS automatically

and should be left as no connects.

SENSOR

RX0 RXn

TX0

TXn

SENSOR

RXn RX0

TX0

TXn

SENSOR

RX0 RXn

TXn

TX0

SENSOR

RXn RX0

TXn

TX0

SENSOR

TX0 TXn

SENSOR

TXn TX0

0, 0 4096, 0

4096, 40960, 4096

0, 0 4096, 0

4096, 40960, 4096

0, 0 4096, 0

4096, 40960, 4096

0, 0 4096, 0

4096, 40960, 4096

0, 0 4096, 0

4096, 40960, 4096

0, 0 4096, 0

4096, 40960, 4096

0, 0 4096, 0

4096, 40960, 4096

0, 0 4096, 0

4096, 40960, 4096

RX0

RXn

RX0

RXn

RX0

RXn

RX0

RXn

TX0 TXn

TXn TX0

SWAP

TXFLIP

RXFLIP

SWAP

TXFLIP

RXFLIP

SWAP

TXFLIP

RXFLIP

SWAP

TXFLIP

RXFLIP

SWAP

TXFLIP

RXFLIP

SWAP

TXFLIP

RXFLIP

SWAP

TXFLIP

RXFLIP

SWAP

TXFLIP

RXFLIP

Default Configuration

 2012-2014 Microchip Technology Inc. DS40001663B-page 11

MTCH6301

5.7 Example Custom Application

Layout

An example 4RX/11TX sensor is shown in Figure 5-3.

In addition to using a completely modified pin layout,

this example differs from the default configuration by

also having the TX axis along the bottom (X) and RX

axis along the side (Y). Note that some RX pins are

also used as TX lines in this example.

FIGURE 5-3: CUSTOM APPLICATION LAYOUT

The resulting scaling coefficient for the custom

application example is shown in Tab le 5-3 . The scaling

coefficients were derived using Ta bl e 5 - 2 .

Using Figure 5-2, the Flip State register should be set

to ‘0b110’ or 0x6.

Sensor Line MTCH6301 Pin Map ID

0TX10 15

1TX11 16

2TX17 31

3TX16 32

4TX15 33

5TX14 34

6RX11 22

7TX13 8

8TX12 5

9RX10 23

10 RX9 24

0RX5 3

1RX6 2

2RX7 1

3RX8 0

The Pin Map register array for this particular setup is set

as follows:

RX Pin Map: {3,2,1,0}

TX Pin Map: {15,16,31,32,33,34,22,8,5,23,24}

MTCH6301

TX3

TX2

TX1

TX0

VSS

VDD

RX0

RX1

RX2

RX3

RX4

TX15

TX16

TX17

SDA

TX14

VSS

VCAP

INT

N/C

RX12

RX11

TX9

TX10

TX11

SCL

VDD

VSS

TX5

TX6

TX7

TX8

TX4

RX9

RX10

TX12

TX13

VSS

VDD

RESET

RX8

RX7

RX6

RX5

RX0 RX3

TX0 TX10

SENSOR

TABLE 5-3: CUSTOM APPLICATION

SCALING VALUES

Axis Channels Scaling Coefficient

RX 4 16384

TX 11 5957

MTCH6301

DS40001663B-page 12  2012-2014 Microchip Technology Inc.

6.0 COMMUNICATION PROTOCOL

6.1 Overview

The MTCH6301 I2C protocol follows a serial streaming

format, not a register-based protocol. To achieve this,

the device will assert the INT pin whenever a new

packet of data is ready to be transmitted to the host.

This will happen under two conditions:

1. New touch or gesture data is available.

2. A command has been sent to the controller and

the response to this command is ready.

6.2 I2C™ Pin Specification

6.2.1 SERIAL DATA (SDA)

The Serial Data (SDA) signal is the data signal of the

device. The value on this pin is latched on the rising

edge of the SCL signal when the signal is an input. With

the exception of the Start (Restart) and Stop conditions,

the high or low state of the SDA pin can only change

when the clock signal on the SCL pin is low. During the

high period of the clock, the SDA pin’s value (high or

low) must be stable. Changes in the SDA pin’s value

while the SCL pin is HIGH will be interpreted as a Start

or a Stop condition.

6.2.2 SERIAL CLOCK (SCL)

The Serial Clock (SCL) signal is the clock input signal

of the device, generated by the host. The rising edge of

the SCL signal latches the value on the SDA pin.

MTCH6301 employs clock stretching and this should

be taken into account by the master controller. The

maximum speed at which MTCH6301 can operate is

400 kbps.

6.2.3 INTERRUPT (INT)

This pin is utilized by MTCH6301 to signal that data is

available and that the master controller should invoke

a master read. INT is an active-high pin and is held low

during all other activities.

6.2.4 DEVICE ADDRESSING

The MTCH6301 7-bit base address is 0x25 and is not

configurable by the user. Every transmission must be

prefixed with this address, as well as a bit signifying

whether the transmission is a master write (‘0’) or

master read (‘1’). After appending this Read/Write bit to

the base address, this first byte becomes either 0x4A

(write) or 0x4B (read).

Note: Note that initiating a read from the device

when INT is in a logic ‘0’ state will result in

an unpredictable response.

Note: If the device is not read within 25 ms of

asserting the INT pin, a timeout will occur

and data will no longer be available.

 2012-2014 Microchip Technology Inc. DS40001663B-page 13

MTCH6301

6.3 Generic Read/Write Protocol

6.3.1 MASTER READ WAVEFORM

FIGURE 6-1: MASTER READ WAVEFORM

6.3.2 MASTER WRITE WAVEFORM

FIGURE 6-2: MASTER WRITE WAVEFORM

Note 1: The first byte read from the device denotes the number of bytes to follow.

2: The last byte read from the device must be followed by a nACK (‘1’) from the host controller. All other bytes

should be followed with ACK (‘0’).

3: INT will be set low within 10 uS of a correct I2C™ address match.

4: All data (DATA0 – DATAn) must be read at once within a single I2C™ transaction, and Restart conditions

are not supported.

ACK PS ACK NACK

ACK

Stop

D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0

0x25 1[NUM_BYTES] [DATA0] [DATAn]

Start

INT

SCL

SDA

(DATA)

Note 1: If the device is sleeping, it will ACK the address byte, but will not ACK the first byte of the transmission

until it is awake. See Section 9. “Send Enable Touch command (0x00).” for details.

2: The first byte written to the controller denotes the number of bytes to follow.

3: Although it is not required all data be written in a single I2C™ transaction, it is recommended to reduce

the chance of a timeout occurring.

ACK PS ACKACK

Stop

D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0

0x25 0[NUM_BYTES] [DATA0] [DATAn]

Start

INT

SCL

SDA

(DATA)

ACK

MTCH6301

DS40001663B-page 14  2012-2014 Microchip Technology Inc.

6.3.3 TOUCH PACKET PROTOCOL

Fully-processed touch coordinates will be sent out as

they are processed by MTCH6301. Since it is a slave

device, the INT pin will be asserted whenever one of

these packets is ready for transmission, requiring the

master to initiate a Read command. In other words, no

Write command is necessary before reading one of

these packets.

FIGURE 6-3: EXAMPLE TOUCH PACKET WAVEFORM

Byte Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

D0 1TOUCHID<3:0> TCH (0)0PEN

D1 0X<6:0>

D2 000 X<11:7>

D3 0Y<6:0>

D4 000 Y<11:7>

TOUCHID: Touch ID (0-9)

PEN: Pen State

0 = Pen Up

1 = Pen Down

X: X Coordinate of touch

Y: Y Coordinate of touch

TCH: Always ‘0’; it denotes a touch packet (vs. gesture)

SCL

Start Stop

INT

DATA 0x050x4B 0x81 0x7D 0x05 0x010x6A

Touch ID0, Pen

Down

X: 765 Y: 234

0x4B 0x05 [D0] [D1] [D2] [D3] [D4]

 2012-2014 Microchip Technology Inc. DS40001663B-page 15

MTCH6301

6.4 Gesture Protocol

Similar to touch packets, the following packet is

transmitted whenever a gesture is performed on the

sensor. This feature can be enabled via the Comm

Packet CFG register (see Section 7.0 “Memory

Map”).

FIGURE 6-4: GESTURE PACKET WAVEFORM

Note 1: Gestures are not enabled by default.

2: For any hold gestures, packets are

continuously sent until the gesture is no

longer being held.

Byte Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

D0 1TOUCHID<3:0> GEST -10 0

D1 0GESTURE<6:0>

TOUCHID: Touch ID (0-9)

GESTURE: Gesture ID

0x10 Single Tap 0x11 Single Tap (hold)

0x20 Double Tap

0x31 Up Swipe 0x32 Up Swipe (hold)

0x41 Right Swipe 0x42 Right Swipe (hold)

0x51 Down Swipe 0x52 Down Swipe (hold)

0x61 Left Swipe 0x62 Left Swipe (hold)

GEST: Always ‘1’; it denotes a gesture packet (vs. touch)

0x4B 0x02 [D0] [D1]

SCL

Start Stop

INT

DATA 0x020x4B 0x84 0x61

Gesture from

ID1

Swipe Left

MTCH6301

DS40001663B-page 16  2012-2014 Microchip Technology Inc.

6.5 Command Protocol

Bidirectional communication protocol (for

reading/writing configuration data) is shown in

Figure 6-5.

FIGURE 6-5: COMMAND PROTOCOL

6.6 Full Command Set

A complete listing of MTCH6301 commands is shown

in Ta b l e 6 - 1 . Any commands which contain additional

data bytes, either sent or received, are shown

alongside an example data stream in the following

sections.

6.6.1 OVERVIEW

0x4A

0x4B NUM0

0x55 NUM CMD [D0] [Dn]...

0x55 NUM1RES [D0] [Dn]...CMD

I2CTM Data

INT

Command

(I2CTM Write)

Response

(I2CTM Read)

NUM: Number of bytes to follow (true for NUM, NUM0, NUM1).

CMD: Command sent/ responded to

RES: Status result of command:

0x00 = Success

0x80 = Parameter out of range

0xFE = Timeout (not enough bytes received)

0xFF = Unrecognized command

0xFD = Invalid parameter

0xFC = Missing or extra parameter

D0 - Dn:Data associated with command

TABLE 6-1: COMMAND SET

CMD ID Name Description

0x00 Enable Touch Enable Touch functionality

0x01 Disable Touch Disable Touch functionality

0x14 Scan Baseline Instruct controller to scan for new sensor baseline immediately

0x15 Write Register Write data to specified register

0x16 Read Register Read data from specified register

0x17 Write NVRAM Write all current register values to NVRAM

0x18 Software Sleep Instruct controller to enter Sleep mode

0x19 Erase NVRAM Erase the contents of the nonvolatile RAM section

0x1A Manufacturing Test Perform manufacturing tests on all sensor I/O channels

0x83 Device ID Retrieve device ID/version

 2012-2014 Microchip Technology Inc. DS40001663B-page 17

MTCH6301

6.6.2 WRITE REGISTER/ READ

It writes or reads to a single register. Please note that

all registers are volatile, and any modified data will be

lost on power-down. To store the current register

configuration permanently, the Write NVRAM

command should be used.

FIGURE 6-6: WRITE REGISTER COMMAND

FIGURE 6-7: READ REGISTER COMMAND

0x4A

0x4B 0x04

0x55 0x04 0x15 [D0] [D2][D1]

0x55 0x02 0x00 0x15

INT

Command

(I2CTM Write)

Response

(I2CTM Read)

D0 = Index Location

D1 = Offset Location

D2 = Value to Write to Specified Register

0x4A

0x4B 0x05

0x55 0x03 0x15 [D0] [D1]

0x55 0x03 0x16 [D2]

INT

Command

(I2CTM Write)

Response

(I2CTM Read)

0x00

D0 = Index Location

D1 = Offset Location

D2 = Read Value at Specified Register

MTCH6301

DS40001663B-page 18  2012-2014 Microchip Technology Inc.

6.6.3 MANUFACTURING TEST

This test performs the following checks on all mapped

sensor pins:

1. Short to VDD

2. Short to GND

3. Pin-to-pin short.

If an I/O error is discovered, bits for the pins in question

will be set in the TX Short Status and RX Short Status

registers.

Please note that:

1. The RX7/RX8 pins will always report an error.

2. If the sensor has more than 16 TX channels,

then channels 17 and 18 will never report an

error.

FIGURE 6-8: MANUFACTURING TEST

6.6.4 DEVICE ID

It allows the host to read the device ID.

FIGURE 6-9: DEVICE ID

0x4A

0x4B 0x05

0x55 0x01 0x1A

0x55 0x03 0x1A [D0]

INT

Command

(I2CTM Write)

Response

(I2CTM Read)

0x00

D0 = Result; 0 = success, 1 = I/O error

0X050X00 0X10 0X02

0x4A

0x4B 0x05

0x55 0x01 0x83

0x55 0x03 0x83

INT

Response

(I2CTM Read)

0x00

Command

(I2CTM Write)

 2012-2014 Microchip Technology Inc. DS40001663B-page 19

MTCH6301

6.6.5 TYPICAL I2C COMMAND

TRANSMISSION

Figure 6-10 depicts the master controller reading from

RAM location 0x01, to determine the number of RX

channels the controller is configured to use (0x0C or

12).

FIGURE 6-10: I2C™ COMMAND READ AND WRITE

6.7 Wake on I2C

The MTCH6301 is capable of waking up upon receiving

an I2C command from the host. Please note that since

wake-up time can take up to 350 µs, the controller must

resend any I2C bytes that were not acknowledged

(ACK) before continuing the transmission.

Since the controller will wake up upon a correct I2C

address match, it does not matter which command is

sent. For simplicity, the Enable Touch command is

recommended.

6.8 RESET Pin Behavior

The MTCH6301 can be reset by driving the RESET pin

low. When released, the device will assert the INT pin

until it has finished initialization routines. During this

time, any communication to the I2C address (0x25) will

result in a nACK.

FIGURE 6-11: INT BEHAVIOR AFTER

RESET

SDA

SCL

Start Stop

INT

DATA 554A 03 16 00 01

SDA

SCL

Start Stop

INT

DATA 054B 55 03 00 0C16

Master Write

Master Read

(Controller Response)

INT

RESET

tRST

80 ms < tRST < 100 ms

MTCH6301

DS40001663B-page 20  2012-2014 Microchip Technology Inc.

6.9 Recommended Start-up Sequence

For ease of use, it is recommended that all custom

parameters be stored in NVRAM at the time of

production (or on first power-on) for the lifetime of the

chip. Once this has been completed, the start-up

procedure for the rest of the product’s life should be as

follows:

1. Prepare I2C master/host controller; initialize any

components of the system that depend upon the

MTCH6301 output.

2. Set RESET low for > 5 µs.

3. Set RESET high.

4. Wait for low state on INT.

5. If desired, check for correct device operation by

using the Device ID command.

If the application is such that using the NVRAM to store

custom parameters isn’t possible, the following start-up

procedure is recommended:

1. Prepare I2C master/host controller; initialize any

components of the system that depend upon the

MTCH6301 output.

2. Set RESET low for > 5 µs.

3. Set RESET high.

4. Wait for low state on INT.

5. If desired, check for correct device operation by

using the Device ID command.

6. Send Disable Touch command (0x01).

7. Write all desired parameters to the device.

8. Send Scan Baseline command (0x14).

9. Send Enable Touch command (0x00).

Note: If the application is designed to use the

default parameters, the above start-up

procedure should be used.

 2012-2014 Microchip Technology Inc. DS40001663B-page 21

MTCH6301

7.0 MEMORY MAP

TABLE 7-1: MTCH6301 MEMORY MAP

Group Index

Byte

Offset

Byte Register Name Size

(Bytes) Description Data Range Default Value

General 0x00 0x01 RX Channels 1 Number of RX Sensor Channels 3-13 12

0x02 TX Channels 1 Number of TX Sensor Channels 3-18 9

0x04 RX Scaling <7:0> 2 RX Scaling Coefficient 3640-21845 5461

0x05 RX Scaling <15:8>

0x06 TX Scaling <7:0> 2 TX Scaling Coefficient 3640-21845 7281

0x07 TX Scaling <15:8>

Sensor Map 0x01 0x00-0x0C RX Pin Map 13 RX Pin Map Array 0-12 Section 5.6.1

“RX/TX Pin

Map”

0x02 0x00-0x12 TX Pin Map 18 TX Pin Map Array 0-34 Section 5.6.1

“RX/TX Pin

Map”

Self 0x10 0x00 Self Scan Time 1 Number of self readings to sum per electrode 1-30 5

0x01 Self Threshold 1 Threshold at which a touch may be present 10-150 40

Mutual 0x20 0x00 Mutual Scan Time 1 Number of mutual readings to sum per node 1-30 9

0x01 Mutual Threshold 1 Threshold at which a touch may be present 10-150 40

Decoding 0x30 0x00 Flip State 1 This determines the orientation of the sensor with respect to the

coordinate output

0b000-0b111 0b001

0x01 Number of Averages 1 Number of previous touch coordinates to average with current position

coordinate (smoothing filter)

1-16 8

0x04 Minimum Touch Distance 1 Minimum distance (interpolated coordinates) allowed between two touch

locations before suppressing the weaker touch.

0-255 150

0x05 Pen Down Timer 1 Number of successive sensor scans identifying a touch required prior to

transmitting touch data

0-10 3

0x06 Pen Up Timer 1 Number of successive sensor scans without detecting a touch prior to a

touch up packet being sent

0-10 3

0x07 Touch Suppression Value 1 The maximum number of touch points to transmit. Note that ten touch IDs

are still analyzed and tracked, just not reported; 0 = Disabled

0-10 0

MTCH6301

DS40001663B-page 22  2012-2014 Microchip Technology Inc.

Gestures 0x50 0x00 RX Swipe Length 1 Minimum swipe distance in the RX direction before gesture is recognized 10-255 160

0x01 TX Swipe Length 1 Minimum swipe distance in the TX direction before gesture is recognized 10-255 150

0x02 Swipe Boundary 1 The distance (in interpolated positions) a swipe can move, in the direction

opposite to the direction being swiped, before the gesture is canceled.

0-255 150

0x03 Swipe Hold Threshold 1 The maximum distance (in interpolated positions) a swipe-and-hold

gesture can move before the gesture is canceled

0-255 70

0x04 Swipe Time <7:0> 2 The maximum amount of time (in ms) the user has to perform a swipe

after initial pen down

0-65535 200

0x05 Swipe Time <15:8>

0x06 Tap Time <7:0> 2 The maximum amount of time (in ms) the user has to perform a click after

initial pen down

0-65535 500

0x07 Tap Time <15:8>

0x08 Tap Threshold 1 The maximum distance (in interpolated positions) a tap gesture can move

before it is no longer recognized as a tap

1-255 120

0x09 Minimum Swipe Velocity 1 The minimum velocity a swipe must maintain to be a swipe gesture.

Values below this will either cancel the gesture (if touch removed) or

move to the swipe-and-hold state (if touch is still present)

1-50 3

0x0A Double Tap Time <7:0> 2 The maximum amount of time allowed between the two taps of a double

tap (in ms)

50-1000 350

0x0B Double Tap Time <15:8>

0x0C Gesture Edge Keep-out 1 This value determines the width of a keep-out barrier around the edge of

the active touch area. This helps remove edge-effect issues.

0-255 128

Configuration 0xF0 0x00 SLP <7:0> 4 Duration (in ms) without touch activity before the controller enters Sleep

state

0-4,294,967,295 8000

0x01 SLP <15:8>

0x02 SLP <23:16>

0x03 SLP <31:24>

0x07 Touch Packet CFG 1 Touch Packet Configuration – Enabled: 0x81, Disabled: 0x01 0x81, 0x01 0x81

0x09 Gesture Packet CFG 1 Gesture Packet Configuration – Enabled: 0x81, Disabled: 0x01 0x81, 0x01 0x01

0x0A Status Packet CFG 1 Status Packet Configuration – Enabled: 0x81, Disabled: 0x01 0x81, 0x01 0x01

I/O Status 0xF1 0x02 TX Short Status <7:0> 2 Identifies which TX pins are shorted after using Manufacturing Test

command - read only

0x00-0xFF 0x00

0x03 TX Short Status <15:8>

0x06 RX Short Status <7:0> 2 Identifies which RX pins are shorted after using Manufacturing Test

command - read only

0x00-0xFF 0x00

0x07 RX Short Status <15:8>

TABLE 7-1: MTCH6301 MEMORY MAP (CONTINUED)

Group Index

Byte

Offset

Byte Register Name Size

(Bytes) Description Data Range Default Value

 2012-2014 Microchip Technology Inc. DS40001663B-page 23

MTCH6301

8.0 SPECIAL FEATURES

8.1 Gestures

Single-finger gestures are a fast and intuitive way to

navigate a feature-rich human-machine interface.

MTCH6301 supports 11 single finger gestures natively,

without requiring interaction from the master processor.

Tuning may be required depending on the layout of the

sensor, the time duration and length of activation

required for your gesture-supported application. The

most common defaults are already preloaded and

should serve most applications. These parameters and

their descriptions are available in the “Gestures”

section of the memory map (see Section 7.0 “Memory

Map”).

If your application requires only gesture functionality,

and does not require touch coordinates, the touch

packet configuration byte (see Section 7.0 “Memory

Map”) can be used to turn off all touch coordinate data.

Note: Gestures are not enabled by default, and

must be enabled via the gesture packet

configuration byte in RAM (see

Section 7.0 “Memory Map”).

TABLE 8-1: GESTURE TYPES

Icon Gesture Type Icon Gesture Type

Tap (Click) Tap and Hold

Double Tap (Double Click)

Swipe Down Swipe Down and Hold

Swipe Up Swipe Up and Hold

Swipe Right Swipe Right and Hold

Swipe Left Swipe Left and Hold

MTCH6301

DS40001663B-page 24  2012-2014 Microchip Technology Inc.

8.2 Sleep

Sleep functionality is enabled by default, and follows

the behavior shown in Figure 8-1. This functionality can

be modified via the SLP register (see Section 7.0

“Memory Map”).

The SLP register is the time (in ms) without touch

activity before controller enters Sleep mode.

FIGURE 8-1: SLEEP FUNCTIONALITY

8.3 Nonvolatile RAM (NVRAM)

Permanent storage of parameters that have been

modified can be achieved using the internal NVRAM.

This NVRAM is not meant for continuous writing, as it

has a low write-cycle limit of 20,000.

Upon start-up, the NVRAM’s data (if present) is loaded

into the controller. If no data is available in the NVRAM,

the device defaults are loaded instead.

Please note that RAM parameters cannot be

individually written to the NVRAM. They are all written

with only one command. See the applicable command

within the command set for more details. (Section 6.6

“Full Command Set”)

No touch for

[SLP] ms?

[Normal Full Decode

of Sensor]

Transmit

Touch

Sleep for

 ms

Wake up;

Touch exists? Yes

Yes

Touch?

Yes

 2012-2014 Microchip Technology Inc. DS40001663B-page 25

MTCH6301

8.4 Touch Performance

Using default acquisition parameters, Figure 8-2

shows the relationship of single-touch report rate with

regard to sensor size.

FIGURE 8-2: REPORT RATE VS SENSOR SIZE

100

200

300

400

2x2

4x4

6x6

8x8

12x9

13x15

Report Rate (PPS) vs Sensor Size (Channels)

MTCH6301

DS40001663B-page 26  2012-2014 Microchip Technology Inc.

9.0 ELECTRICAL

CHARACTERISTICS

This section provides an overview of the MTCH6301

electrical characteristics. Additional information will be

provided in future revisions of this document as it

becomes available.

9.1 Absolute Maximum Ratings(†)

Ambient temperature under bias........................................................................................................ -40°C to +85°C

Storage temperature ........................................................................................................................ -65°C to +150°C

Voltage on pins with respect to VSS

on VDD pin ................................................................................................................................. -0.3V to +4.0V

on all other pins ............................................................................................................... 0.3V to (VDD + 0.3V)

Maximum current

out of VSS pin .......................................................................................................................................300 mA

into VDD pin(s) .....................................................................................................................................300 mA

sunk by all ports ..................................................................................................................................200 mA

sourced by all ports .............................................................................................................................200 mA

Maximum output current

sunk by any I/O pin ................................................................................................................................15 mA

sourced by any I/O pin ..........................................................................................................................15 mA

9.2 Standard Operating Conditions

The standard operating conditions for any device are defined as:

Operating Voltage: VDDMIN VDD VDDMAX

Operating Temperature: TA_MIN TA TA_MAX

VDD — Operating Supply Voltage(1)

MTCH6301

VDDMIN .................................................................................................................................... +2.4V

VDDMAX .................................................................................................................................... +3.6V

TA — Operating Ambient Temperature Range

Industrial Temperature

TA_MIN ...................................................................................................................................... -40°C

A_MAX .................................................................................................................................. +105°C

Note: This device is sensitive to ESD damage and must be handled appropriately. Failure to properly handle and

protect the device in an application may cause partial to complete failure of the device.

† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the

device. This is a stress rating only and functional operation of the device at those or any other conditions above those

indicated in the operation listings of this specification is not implied. Exposure above maximum rating conditions for

extended periods may affect device reliability.

Note 1: Maximum current rating requires even load distribution across I/O pins. Maximum current rating may be

limited by the device package power dissipation characterizations. See Tab l e 9 - 1 to calculate device

specifications.

 2012-2014 Microchip Technology Inc. DS40001663B-page 27

MTCH6301

9.3 DC Characteristics

TABLE 9-1: THERMAL OPERATING CONDITIONS

Symbol Rating Min. Typ. Max. Units

TJOperating Junction Temperature Range -40 — +125 ⁰C

TAOperating Ambient Temperature Range -40 — +85 ⁰C

Power Dissipation:

Internal Chip Power Dissipation:

PINT = VDD x (IDD-? IOH)

I/O Pin Power Dissipation:

PI/O = ? (({VDD - VOH} x IOH) + ? (VOLx IOL))

PINT + PI/OW

PDMAX Maximum Allowed Power Dissipation (TJ-TA)/θJA W

TABLE 9-2: THERMAL PACKAGING CHARACTERISTICS

Symbol Characteristics Typ. Max. Units

θJA Package Thermal Resistance, 44-pin QFN 32 — ⁰C/W

θJA Package Thermal Resistance, 44-pin TQFP 45 — ⁰C/W

TABLE 9-3: OPERATING VOLTAGE AND CURRENT

Symbol Characteristics Min. Typ. Max. Units Conditions

VDD Supply Voltage 2.3 — 3.6 V —

VBOR BOR Event on VDD transition high-to-low 2.0 — 2.3 V —

IDD Operating Current — 19 25 mA Note 1

ISLP Sleep Current — 200 245 µA Note 1, 2

Note 1: Parameter is characterized, but not tested.

2: Device configured with default parameters.

TABLE 9-4: PIN INPUT AND OUTPUT SPECIFICATIONS

Symbol Characteristic / Pins Min. Max. Units Conditions

VIL Input Low Voltage

RX, TX VSS 0.15 VDD V—

SDA, SCL VSS 0.3 VDD VNote 1

VIH Input High Voltage

RX, TX 0.65 VDD VDD VNote 1

SDA, SCL 0.65 VDD VDD VNote 1

VOL Output Low Voltage

INT, RX, TX VSS 0.4 V IOL  10 mA, VDD = 3.3V

SDA, SCL VSS 0.4 V IOL  10 mA, VDD = 3.3V(1,2)

VOH Output High Voltage

INT, RX, TX 2.4 VDD VIOH  10 mA, VDD = 3.3V

SDA, SCL — — V Note 2

VBOR Brown-out Event on VDD

Transition high-to-low

2.0 2.3 V Min. not tested

Note 1: Parameter is characterized, but not tested.

2: Open drain structure.

MTCH6301

DS40001663B-page 28  2012-2014 Microchip Technology Inc.

9.4 AC Characteristics and Timing Parameters

FIGURE 9-1: I2C™ BUS START/STOP BIT TIMING CHARACTERISTICS

FIGURE 9-2: I2C™ BUS DATA TIMING CHARACTERISTICS

TABLE 9-5: RESET TIMING

Symbol Characteristic Min. Typ. Max. Units Conditions

TPU Power-up Period — 400 — µs Notes 1, 2

TBOR Brown-out Pulse Width (Low) — 1 — µs Note 1

Note 1: Parameter is characterized, but not tested.

2: Power-up period is for core operation to begin and it does not reflect response time to a touch.

 2012-2014 Microchip Technology Inc. DS40001663B-page 29

MTCH6301

TABLE 9-6: I2C™ BUS DATA TIMING REQUIREMENTS

Parameter

Number Symbol Characteristic Min. Max. Units Conditions

IS1 TLO:SCL Clock Low Time 100 kHz mode 4.7 — µs —

400 kHz mode 1.3 — µs

IS2 THI:SCL Clock High Time 100 kHz mode 4.0 — µs —

400 kHz mode 0.6 — µs

IS3 TF:SCL SDA and SCL

Fall Time

100 kHz mode — 300 ns —

400 kHz mode 20+0.1 CB300 ns

IS4 TR:SCL SDA and SCL

Rise Time

100 kHz mode — 1000 ns —

400 kHz mode 20+0.1 CB300 ns

IS5 TSU:DAT Data Input Setup

Time

100 kHz mode 250 — ns —

400 kHz mode 100 — ns

IS6 THD:DAT Data Input Hold

Time

100 kHz mode 0 — ns —

400 kHz mode 0 0.9 µs

IS7 TSU:STA Start Condition

Setup Time

100 kHz mode 4700 — ns Only relevant for repeated

Start condition

400 kHz mode 600 — ns

IS8 THD:STA Start Condition

Hold Time

100 kHz mode 4000 — ns After this period, the first

clock pulse is generated

400 kHz mode 600 — ns

IS9 TSU:STO Stop Condition

Setup Time

100 kHz mode 4000 — ns —

400 kHz mode 600 — ns

IS10 THD:STO Stop Condition

Hold Time

100 kHz mode 4000 — ns —

400 kHz mode 600 — ns

IS11 T

AA:SCL Output Valid from

Clock

100 kHz mode 0 3500 ns —

400 kHz mode 0 1000 ns

IS12 TBF:SDA Bus Free Time 100 kHz mode 4.7 — µs Time bus must be free before

new transmission can start

400 kHz mode 1.3 — µs

—C

BSCL, SDC Capacitive Loading — 400 pF Note 1

Note 1: Parameter is characterized, but not tested.

MTCH6301

DS40001663B-page 30  2012-2014 Microchip Technology Inc.

10.0 ORDERING INFORMATION

TABLE 10-1: ORDERING INFORMATION

Part Number Pin Package Packing

MTCH6301-I/PT 44 TQFP 10x10x1mm Tray

MTCH6301-I/ML 44 QFN 8x8x0.9mm Tube

MTCH6301T-I/PT 44 TQFP 10x10x1mm T/R

MTCH6301T-I/ML 44 QFN 8x8x0.9mm T/R

 2012-2014 Microchip Technology Inc. DS40001663B-page 31

MTCH6301

11.0 PACKAGING INFORMATION

11.1 Package Marking Information

Legend: XX...X Customer-specific information

Y Year code (last digit of calendar year)

YY Year code (last 2 digits of calendar year)

WW Week code (week of January 1 is week ‘01’)

NNN Alphanumeric traceability code

Pb-free JEDEC® designator for Matte Tin (Sn)

*This package is Pb-free. The Pb-free JEDEC designator ( )

can be found on the outer packaging for this package.

Note: In the event the full Microchip part number cannot be marked on one line, it will

be carried over to the next line, thus limiting the number of available

characters for customer-specific information.

44-Lead QFN (8x8x0.9 mm) Example

XXXXXXXXXXX

YYWWNNN

XXXXXXXXXXX

PIN 1 PIN 1

44-Lead TQFP (10x10x1 mm) Example

XXXXXXXXXX

YYWWNNN

XXXXXXXXXX

MTCH6301

-I/ML

1403017

MTCH6301

-I/PT

1403017

MTCH6301

DS40001663B-page 32  2012-2014 Microchip Technology Inc.

11.2 Package Details

 2012-2014 Microchip Technology Inc. DS40001663B-page 33

MTCH6301

DS40001663B-page 34  2012-2014 Microchip Technology Inc.

 2012-2014 Microchip Technology Inc. DS40001663B-page 35

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MTCH6301

DS40001663B-page 36  2012-2014 Microchip Technology Inc.

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

 2012-2014 Microchip Technology Inc. DS40001663B-page 37

MTCH6301

APPENDIX A: DATA SHEET

REVISION HISTORY

Revision A (2012)

Initial release of the document.

Revision B (03/2014)

Updated the Device Overview page; Added Chapter 4;

Updated Chapters 1 through 9 and Chapter 11; Other

minor corrections.

MTCH6301

DS40001663B-page 38  2012-2014 Microchip Technology Inc.

THE MICROCHIP WEB SITE

Microchip provides online support via our WWW site at

www.microchip.com. This web site is used as a means

to make files and information easily available to

customers. Accessible by using your favorite Internet

browser, the web site contains the following

information:

•Product Support – Data sheets and errata,

application notes and sample programs, design

resources, user’s guides and hardware support

documents, latest software releases and archived

software

•General Technical Support – Frequently Asked

Questions (FAQ), technical support requests,

online discussion groups, Microchip consultant

program member listing

•Business of Microchip – Product selector and

ordering guides, latest Microchip press releases,

listing of seminars and events, listings of

Microchip sales offices, distributors and factory

representatives

CUSTOMER CHANGE NOTIFICATION

SERVICE

Microchip’s customer notification service helps keep

customers current on Microchip products. Subscribers

will receive e-mail notification whenever there are

changes, updates, revisions or errata related to a

specified product family or development tool of interest.

To register, access the Microchip web site at

www.microchip.com. Under “Support”, click on

“Customer Change Notification” and follow the

registration instructions.

CUSTOMER SUPPORT

Users of Microchip products can receive assistance

through several channels:

• Distributor or Representative

• Local Sales Office

• Field Application Engineer (FAE)

• Technical Support

Customers should contact their distributor,

representative or Field Application Engineer (FAE) for

support. Local sales offices are also available to help

customers. A listing of sales offices and locations is

included in the back of this document.

Technical support is available through the web site

at: http://microchip.com/support

 2012-2014 Microchip Technology Inc. DS40001663B-page 39

Information contained in this publication regarding device

applications and the like is provided only for your convenience

and may be superseded by updates. It is your responsibility to

ensure that your application meets with your specifications.

MICROCHIP MAKES NO REPRESENTATIONS OR

WARRANTIES OF ANY KIND WHETHER EXPRESS OR

IMPLIED, WRITTEN OR ORAL, STATUTORY OR

OTHERWISE, RELATED TO THE INFORMATION,

INCLUDING BUT NOT LIMITED TO ITS CONDITION,

QUALITY, PERFORMANCE, MERCHANTABILITY OR

FITNESS FOR PURPOSE. Microchip disclaims all liability

arising from this information and its use. Use of Microchip

devices in life support and/or safety applications is entirely at

the buyer’s risk, and the buyer agrees to defend, indemnify and

hold harmless Microchip from any and all damages, claims,

suits, or expenses resulting from such use. No licenses are

conveyed, implicitly or otherwise, under any Microchip

intellectual property rights.

Trademarks

The Microchip name and logo, the Microchip logo, dsPIC,

FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,

PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash

and UNI/O are registered trademarks of Microchip Technology

Incorporated in the U.S.A. and other countries.

FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,

MTP, SEEVAL and The Embedded Control Solutions

Company are registered trademarks of Microchip Technology

Incorporated in the U.S.A.

Silicon Storage Technology is a registered trademark of

Microchip Technology Inc. in other countries.

Analog-for-the-Digital Age, Application Maestro, BodyCom,

chipKIT, chipKIT logo, CodeGuard, dsPICDEM,

dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,

ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial

Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB

Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code

Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,

PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O,

Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA

and Z-Scale are trademarks of Microchip Technology

Incorporated in the U.S.A. and other countries.

SQTP is a service mark of Microchip Technology Incorporated

in the U.S.A.

GestIC and ULPP are registered trademarks of Microchip

Technology Germany II GmbH & Co. KG, a subsidiary of

Microchip Technology Inc., in other countries.

All other trademarks mentioned herein are property of their

respective companies.

Printed on recycled paper.

ISBN: 978-1-63276-011-1

Note the following details of the code protection feature on Microchip devices:

• Microchip products meet the specification contained in their particular Microchip Data Sheet.

• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the

intended manner and under normal conditions.

• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our

knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data

Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

• Microchip is willing to work with the customer who is concerned about the integrity of their code.

• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not

mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our

products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts

allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Microchip received ISO/TS-16949:2009 certification for its worldwide

headquarters, design and wafer fabrication facilities in Chandler and

Tempe, Arizona; Gresham, Oregon and design centers in California

and India. The Company’s quality system processes and procedures

are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping

devices, Serial EEPROMs, microperipherals, nonvolatile memory and

analog products. In addition, Microchip’s quality system for the design

and manufacture of development systems is ISO 9001:2000 certified.

QUALITY MANAGEMENT S

YSTEM

CERTIFIED BY DNV

== ISO/TS 16949 ==

DS40001663B-page 40  2012-2014 Microchip Technology Inc.

AMERICAS

Corporate Office

2355 West Chandler Blvd.

Chandler, AZ 85224-6199

Tel: 480-792-7200

Fax: 480-792-7277

Technical Support:

http://www.microchip.com/

support

Web Address:

www.microchip.com

Atlanta

Duluth, GA

Tel: 678-957-9614

Fax: 678-957-1455

Austin, TX

Tel: 512-257-3370

Boston

Westborough, MA

Tel: 774-760-0087

Fax: 774-760-0088

Chicago

Itasca, IL

Tel: 630-285-0071

Fax: 630-285-0075

Cleveland

Independence, OH

Tel: 216-447-0464

Fax: 216-447-0643

Dallas

Addison, TX

Tel: 972-818-7423

Fax: 972-818-2924

Detroit

Novi, MI

Tel: 248-848-4000

Houston, TX

Tel: 281-894-5983

Indianapolis

Noblesville, IN

Tel: 317-773-8323

Fax: 317-773-5453

Los Angeles

Mission Viejo, CA

Tel: 949-462-9523

Fax: 949-462-9608

New York, NY

Tel: 631-435-6000

San Jose, CA

Tel: 408-735-9110

Canada - Toronto

Tel: 905-673-0699

Fax: 905-673-6509

ASIA/PACIFIC

Asia Pacific Office

Suites 3707-14, 37th Floor

Tower 6, The Gateway

Harbour City, Kowloon

Hong Kong

Tel: 852-2401-1200

Fax: 852-2401-3431

Australia - Sydney

Tel: 61-2-9868-6733

Fax: 61-2-9868-6755

China - Beijing

Tel: 86-10-8569-7000

Fax: 86-10-8528-2104

China - Chengdu

Tel: 86-28-8665-5511

Fax: 86-28-8665-7889

China - Chongqing

Tel: 86-23-8980-9588

Fax: 86-23-8980-9500

China - Hangzhou

Tel: 86-571-8792-8115

Fax: 86-571-8792-8116

China - Hong Kong SAR

Tel: 852-2943-5100

Fax: 852-2401-3431

China - Nanjing

Tel: 86-25-8473-2460

Fax: 86-25-8473-2470

China - Qingdao

Tel: 86-532-8502-7355

Fax: 86-532-8502-7205

China - Shanghai

Tel: 86-21-5407-5533

Fax: 86-21-5407-5066

China - Shenyang

Tel: 86-24-2334-2829

Fax: 86-24-2334-2393

China - Shenzhen

Tel: 86-755-8864-2200

Fax: 86-755-8203-1760

China - Wuhan

Tel: 86-27-5980-5300

Fax: 86-27-5980-5118

China - Xian

Tel: 86-29-8833-7252

Fax: 86-29-8833-7256

China - Xiamen

Tel: 86-592-2388138

Fax: 86-592-2388130

China - Zhuhai

Tel: 86-756-3210040

Fax: 86-756-3210049

ASIA/PACIFIC

India - Bangalore

Tel: 91-80-3090-4444

Fax: 91-80-3090-4123

India - New Delhi

Tel: 91-11-4160-8631

Fax: 91-11-4160-8632

India - Pune

Tel: 91-20-3019-1500

Japan - Osaka

Tel: 81-6-6152-7160

Fax: 81-6-6152-9310

Japan - Tokyo

Tel: 81-3-6880- 3770

Fax: 81-3-6880-3771

Korea - Daegu

Tel: 82-53-744-4301

Fax: 82-53-744-4302

Korea - Seoul

Tel: 82-2-554-7200

Fax: 82-2-558-5932 or

82-2-558-5934

Malaysia - Kuala Lumpur

Tel: 60-3-6201-9857

Fax: 60-3-6201-9859

Malaysia - Penang

Tel: 60-4-227-8870

Fax: 60-4-227-4068

Philippines - Manila

Tel: 63-2-634-9065

Fax: 63-2-634-9069

Singapore

Tel: 65-6334-8870

Fax: 65-6334-8850

Taiwan - Hsin Chu

Tel: 886-3-5778-366

Fax: 886-3-5770-955

Taiwan - Kaohsiung

Tel: 886-7-213-7830

Taiwan - Taipei

Tel: 886-2-2508-8600

Fax: 886-2-2508-0102

Thailand - Bangkok

Tel: 66-2-694-1351

Fax: 66-2-694-1350

EUROPE

Austria - Wels

Tel: 43-7242-2244-39

Fax: 43-7242-2244-393

Denmark - Copenhagen

Tel: 45-4450-2828

Fax: 45-4485-2829

France - Paris

Tel: 33-1-69-53-63-20

Fax: 33-1-69-30-90-79

Germany - Dusseldorf

Tel: 49-2129-3766400

Germany - Munich

Tel: 49-89-627-144-0

Fax: 49-89-627-144-44

Germany - Pforzheim

Tel: 49-7231-424750

Italy - Milan

Tel: 39-0331-742611

Fax: 39-0331-466781

Italy - Venice

Tel: 39-049-7625286

Netherlands - Drunen

Tel: 31-416-690399

Fax: 31-416-690340

Poland - Warsaw

Tel: 48-22-3325737

Spain - Madrid

Tel: 34-91-708-08-90

Fax: 34-91-708-08-91

Sweden - Stockholm

Tel: 46-8-5090-4654

UK - Wokingham

Tel: 44-118-921-5800

Fax: 44-118-921-5820

Worldwide Sales and Service

03/13/14

Mouser Electronics

Authorized Distributor

Click to View Pricing, Inventory, Delivery & Lifecycle Information:

Microchip:

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