SEMiX®33c
Trench IGBT Modules
SEMiX 253GD176HDc
Preliminary Data
Features
!
Typical Applications
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$%
#
Remarks
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'(((
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')((
GD
Absolute Maximum Ratings )*+, #
Symbol Conditions Values Units
IGBT
'-((
. )* 0( + )*( '0( "
.12 ' 3(( "
4 5 )(
6, 7%1".78 9 : ;( <<< = '*( ')* +
", ' < ;(((
Inverse diode
.> )* 0( + );( '-( "
.>12 ' 3(( "
.>2 '( ? <? 6 )* + '*(( "
Characteristics )*+, #
Symbol Conditions min. typ. max. Units
IGBT
4 4 , . @ " *,) *,0 @,;
. 4 (, , 6 )* ')* + ' "
7 6 )* ')* + ' (,A ',) ','
4 '* , 6 )* ')* + @,- '(,3 0,3 ') B
. '*( ", 4 '* ,
6 )* ')* +,
) ),;* ),;* ),A
# # ') >
4 (, )* , ' 2C (,* >
(,; >
D )(
1E=E :, )* ')* + (,- ' B
#F ')(( , . '*( "
# F 4 5 '*
14 14 G, 6 ')* + '(( *( H
Inverse diode
> .> '*( "? 4 (?6 )* ')*
+,
',- ',- ',A ',A
7 6 )* ')* + ',' (,A ',3 ','
6 )* ')* + ; *,3 ; *,3 B
.112 .> '*( "? 6 )* ')* + "
I #F# "FJ J
4 ( H
Thermal characteristics
16: .4K (,') LFM
16:N . N# (,'- LFM
16:>N >MN LFM
1: # (,('; LFM
Temperature sensor
1)* )* + * 5*O PG
K)*F0* 1)1'QRK'F):'F'S ? RLS?K 3;)( L
Mechanical data
2F2 P 2* F 2@ 3F),* * F* 8
00)
SEMiX 253GD176HDc
1 01-03-2006 GES © by SEMIKRON
Fig. 1 Typ. output characteristic, inclusive RCC'+ EE' Fig. 2 Rated current vs. temperature IC= f (TC)
Fig. 3 Typ. turn-on /-off energy = f (IC) Fig. 4 Typ. turn-on /-off energy = f (RG)
Fig. 5 Typ. transfer characteristic Fig. 6 Typ. gate charge characteristic
SEMiX 253GD176HDc
2 01-03-2006 GES © by SEMIKRON
Fig. 7 Typ. switching times vs. ICFig. 8 Typ. switching times vs. gate resistor RG
Fig. 9 Transient thermal impedance of IGBT Fig. 10 Transient thermal impedance of FWD
Fig. 11 CAL diode forward characteristic Fig. 12 Typ. CAL diode peak reverse recovery current
SEMiX 253GD176HDc
3 01-03-2006 GES © by SEMIKRON
Fig. 13 Typ. CAL diode recovered charge
2T 33
4N 2T 33
This is an electrostatic discharge sensitive device (ESDS), international standard IEC 60747-1, Chapter IX.
This technical information specifies semiconductor devices but promises no characteristics. No warranty or guarantee
expressed or implied is made regarding delivery, performance or suitability.
SEMiX 253GD176HDc
4 01-03-2006 GES © by SEMIKRON
