MT46V128M4BN-5BLIT:D - Micron Technology, Inc.

512Mb: x4, x8, x16 DDR SDRAM

Features

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Double Data Rate (DDR) SDRAM

MT46V128M4 – 32 Meg x 4 x 4 Banks

MT46V64M8 – 16 Meg x 8 x 4 Banks

MT46V32M16 – 8 Meg x 16 x 4 Banks

Features

•VDD = +2.5V ±0.2V, VDDQ = +2.5V ±0.2V

•V

DD = +2.6V ±0.1V, VDDQ = +2.6V ±0.1V (DDR400)

• Bidirectional data strobe (DQS) transmitted/

received with data, i.e., source-synchronous data

capture (x16 has two – one per byte)

• Internal, pipelined double-data-rate (DDR)

architecture; two data accesses per clock cycle

• Differential clock inputs (CK and CK#)

• Commands enter ed on each positive CK edge

• DQS edge-aligned with data for READs; center-

aligned with data for WRITEs

• DLL to align DQ and DQS transitions with CK

• Four internal banks for concurrent operation

• Data mask (DM) for masking write data

(x16 has two – one per by te)

• Programmable burst lengths: 2, 4, or 8

• Auto refresh and self refresh modes

• Longer-lead TSOP for improved reliability (OCPL)

• 2.5V I/O (SSTL_2 compatible)

• Concurrent auto precharge option is supported

•tRAS lockout supported (tRAP = tRCD)

Notes: 1. End of l if e.

Options Marking

• Configuration

–128 Meg x 4 (32 Meg x 4 x 4 banks) 128M4

–64 Meg x 8 (16 Meg x 8 x 4 banks) 64M8

–32 Meg x 16 (8 Meg x 16 x 4 banks) 32M16

• Plastic package

–66-pin TSOP TG

–66-pin TSOP (Pb-free) P

–60-ball FBGA (10mm x 12.5mm) FN

–60-ball FBGA (10mm x 12.5mm) (Pb-free) BN

• Timing – cycle ti me

–5ns @ CL = 3 (DDR400B) -5B

–6ns @ CL = 2.5 (DDR333) (FBGA only) -6

–6ns @ CL = 2.5 (DDR333) (TSOP only) -6T

–7.5ns @ CL = 2 (DDR266)1-75E

–7.5ns @ CL = 2 (DDR266A)1-75Z

–7.5ns @ CL = 2.5 (DDR266B)1-75

• Self refresh

–Standard None

–Low-power self refresh L

• Temperature rating

–Commercial (0°C to +70°C) None

–Industrial (–40°C to +85°C) IT

• Revision

–x4, x8 :D1

–x4, x8, x16 :F

Table 1: Key Timing Parameters

CL = CAS (READ) latency; data-out window is MIN clock rate with 50% duty cycle at CL = 2, CL = 2.5, or CL = 3

Speed

Grade

Clock Rate (MHz) Data-Out

Window Access

Window DQS–DQ

Skew

CL = 2 CL = 2.5 CL = 3

-5B 133 167 200 1.6ns ±0.70ns +0.40ns

-6 133 167 n/a 2.1ns ±0.70ns +0.40ns

6T 133 167 n/a 2.0ns ±0.70ns +0.45ns

-75E/-75Z 133 133 n/a 2.5ns ±0.75ns +0.50ns

-75 100 133 n/a 2.5ns ±0.75ns +0.50ns

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512Mb: x4, x8, x16 DDR SDRAM

Features

Notes: 1. The -5B device is backward compat ible with all slower speed grades. The voltage range of

-5B device operating at slower speed grades is Vdd = VddQ = 2.5V ± 0.2V.

Figure 1: 512Mb DDR SDRAM Part Numbers

FBGA Part Number System

Due to space limitations, FBGA-packaged components have an abbreviated part

marking that is differ ent from the part num ber. F or a quick conv ersion of an FBGA code,

see the FBGA Part Marking Decoder on Micron’s Web site: www.micron.com.

Table 2: Addressing

Parameter 128 Meg x 4 64 Meg x 8 32 Meg x 16

Configuration 32 Meg x 4 x 4 banks 16 Meg x 8 x 4 bank s 8 Meg x 16 x 4 banks

Refresh count 8K 8K 8K

Row address 8K (A0–A12) 8K (A0–A12) 8K (A0–A12)

Bank address 4 (BA0, BA1) 4 (BA0, BA1) 4 (BA0, BA1)

Column address 4K (A0–A9, A11, A12) 2K (A0-A9, A11) 1K (A0–A9)

Table 3: Speed Grade Compatibility

Marking PC3200 (3-3-3) PC2700 (2.5-3-3) PC2100 (2-2-2) PC2100 (2-3-3) PC2100 (2.5-3-3) PC1600 (2-2-2)

-5B1Yes Yes Yes Yes Yes Yes

-6 – Yes Yes Yes Yes Yes

-6T – Yes Yes Yes Yes Yes

-75E ––YesYesYesYes

-75Z –––YesYesYes

-75 ––––YesYes

-5B -6/-6T -75E -75Z -75 -75

Example Part Number:

MT46V32M16P-6T:F

Special Options

Standard

Low power

Speed Grade

tCK = 5ns, CL = 3

tCK = 6ns, CL = 2.5

tCK = 7.5ns, CL = 2

tCK = 7.5ns, CL = 2.5

-5B

-6

-6T

-75E

-75Z

-75

Operating Temp

Commercial

Industrial temp

Revision

x4, x8

x4, x8, x16

ConfigurationMT46V Package Speed

Revision

Sp.

Op. Temp.

Configuration

128 Meg x 4

64 Meg x 8

32 Meg x 16

128M4

64M8

32M16

Package

400-mil TSOP

400-mil TSOP (Pb-free)

10mm x 12.5mm FBGA

10mm x 12.5mm FBGA (Pb-free)

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512Mb: x4, x8, x16 DDR SDRAM

Table of Contents

State Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4

Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5

General Notes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5

Functional Block Diagrams. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6

Pin and Ball Assignments and Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8

Package Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12

Electrical Specifications – IDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14

Electrical Specifications – DC and AC. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17

Notes. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34

Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .42

DESELECT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .46

NO OPERATION (NOP). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .46

LOAD MODE REGISTER (LMR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .46

ACTIVE (ACT) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .47

READ. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .48

WRITE. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .49

PRECHARGE (PRE) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .50

BURST TERMINATE (BST). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .50

AUTO REFRESH (AR). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .50

SELF REFRESH . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .50

Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .51

INITIALIZATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .51

REGISTER DEFINITION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .54

ACTIVE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .58

READ. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .59

WRITE. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .71

PRECHARGE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .84

AUTO REFRESH . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .86

SELF REFRESH . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .87

Power-down (CKE Not Active) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .89

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512Mb: x4, x8, x16 DDR SDRAM

State Diagram

Figure 2: Simplified State Diagram

Note: This diagram represents operations within a single bank only and does not capture concur-

rent operations in other banks.

Power

applied

REFS

LMR REFA

REFSX

ACT

CKE LOW

CKEL

CKE HIGH

CKEH

PRE

Precharge

all banks

EMR

Self

refresh

Idle

all banks

precharged

Row

active Burst

stop

Read

Read A

Automatic sequence

Command sequence

Write

WRITE

Write A

WRITE A

Precharge

PREALL

Active

power-

down

Precharge

power-

down

Auto

refresh

PRE

WRITE A READ A

READ A

PRE

READ A

READ

READ BST

ACT = ACTIVE

BST = BURST TERMINATE

CKEH = Exit power-down

CKEL = Enter power-down

EMR = Extended mode register

LMR = LOAD MODE REGISTER

MR = Mode register

PRE = PRECHARGE

PREALL = PRECHARGE all banks

READ A = READ with auto precharge

REFA = AUTO REFRESH

REFS = Enter self refresh

REFSX = Exit self refresh

WRITE A = WRITE with auto precharge

PRE

LMR

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512Mb: x4, x8, x16 DDR SDRAM

Functional Description

The DDR SDRAM uses a double data rate architecture to achieve high-speed operation.

The double data rate architecture is essentially a 2n-prefetch architecture with an inter-

face designed to transfer two data words per clock cycle at the I/O pins. A single read or

write acce ss for th e DD R SD RA M effe c ti vel y cons is ts of a sing le 2 n-bit-wide, one-clock-

cycle data transfer at the internal DRAM core and two corresponding n-bit-wide, one-

half-clock-cycle data transfers at the I/O pins.

A bidirectional data strobe (DQS) is transmitted externally, along with data, for use in

data capture at the receiver. DQS is a strobe transmitted by the DDR SDRAM during

READs and by the memory controller during WRITEs. DQS is edge-aligned with data for

READs and center-aligned with data for WRITEs. The x16 offering has two data strobes,

one for the lower byte and one for the upper byte.

The DDR SDRAM operates from a differential clock (CK and CK#); the crossing of CK

going HIGH and CK# going LOW will be referred to as the positive edge of CK.

Commands (addre ss and control signals) are registered at every positive edge of CK.

Input data is regist ered on both edges of DQS, and output data is referenced to both

edges of DQS, as well as to both edges of CK.

Read and write accesses to the DDR SDRAM are burst oriented; accesse s start at a

selected location and continue for a pr ogramme d number of locations in a progr ammed

sequence . A ccesses be gin with the r egi strati on of an ACTIVE command, which may then

be followed by a READ or WRITE command. The address bits registered coincident with

the ACTIVE command are use d to select the bank and row to be accessed. The address

bits re gistere d coincident with the READ or WRITE command are used to select the bank

and the starting column location for the burst access.

The DDR SDRAM provides for programmable READ or WRITE burst lengths of 2, 4, or 8

locations. An auto precharge function may be enabled to provide a self-timed row

precharge that is initiated at the end of the burst access.

As with standard SDR SDRAMs, the pipelined, multibank architecture of DDR SDRAMs

allows for concurrent operation, thereby providing high effective bandwidth by hiding

row precharge and activation time.

An auto refresh mode is provided, along with a power-s a ving power-down mode. All

inputs are compatible with the JEDEC standard for SSTL_2. All full-drive option outputs

are SSTL_2, Class II compatible.

General Notes • The functionality and the timing specifications discussed in this data sheet are for the

DLL-enabled mode of operation.

• Throughout the data sheet, the various figures and text refer to DQs as “DQ.” The DQ

term is to be interpreted as any and all DQ collectively, unless specifically stated

otherwise. Additionally, the x16 is divided into two bytes, the lower byte and upper

byte. For the lower byte (DQ0–DQ7) DM refers to LDM and DQS refers to LDQS. For

the upper byte (DQ8–DQ15) DM refers to UDM and DQS refers to UDQS.

• Complete functionality is described throughout the document and any page or

diagram may have been simplified to convey a topic and may not be inclusiv e of all

requirements.

• A ny specific requirement takes precedence over a general statement.

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512Mb: x4, x8, x16 DDR SDRAM

Functional Block Diagrams

The 512Mb DDR SDRAM is a high-speed CMOS, dynamic random-access memory

containing 536,870,912 bits. It is internally configured as a 4-bank DRAM.

Figure 3: 128 Meg x 4 Functional Block Diagram

RAS#

CAS#

ROW-

ADDRESS

MUX

CS#

WE#

CK#

CONTROL

LOGIC

COLUMN-

ADDRESS

COUNTER/

LATCH

MODE REGISTERS

COMMAND

DECODE

A0–A12,

BA0, BA1

CKE

ADDRESS

2048

(x8)

16384

I/O GATING

DM MASK LOGIC

COLUMN

DECODER

BANK0

MEMORY

ARRAY

(8,192 x 2,048 x 8)

BANK0

ROW-

ADDRESS

LATCH

DECODER

8192

SENSE AMPLIFIERS

BANK

CONTROL

LOGIC

BANK1BANK2 BANK3

REFRESH

COUNTER

INPUT

REGISTERS

RCVRS

DATA

DQS

MASK

DATA

COL0

DRVRS

DLL

MUX

DQS

GENERATOR

READ

LATCH

WRITE

FIFO

DRIVERS

COL0

DQ0–DQ3

Out CK

DQS

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512Mb: x4, x8, x16 DDR SDRAM

Functional Block Diagrams

Figure 4: 64 Meg x 8 Functional Block Diagram

Figure 5: 32 Meg x 16 Functional Block Diagram

RAS#

CAS#

ROW-

ADDRESS

MUX

CS#

WE#

CK#

CONTROL

LOGIC

COLUMN-

ADDRESS

COUNTER/

LATCH

MODE REGISTERS

COMMAND

DECODE

A0–A12,

BA0, BA1

CKE

ADDRESS

1024

(x16)

16384

I/O GATING

DM MASK LOGIC

COLUMN

DECODER

BANK0

MEMORY

ARRAY

(8,192 x 1,024 x 16)

BANK0

ROW-

ADDRESS

LATCH

DECODER

8192

SENSE AMPLIFIERS

BANK

CONTROL

LOGIC

BANK1BANK2 BANK3

REFRESH

COUNTER

INPUT

REGISTERS

RCVRS

DATA

DQS

MASK

DATA

DRVRS

DLL

MUX

DQS

GENERATOR

READ

LATCH

WRITE

FIFO

DRIVERS

COL0

Out CK

DQ0–DQ7

DQS

RAS#

CAS#

ROW-

ADDRESS

MUX

CS#

WE#

CK#

CONTROL

LOGIC

COLUMN-

ADDRESS

COUNTER/

LATCH

MODE REGISTERS

COMMAND

DECODE

A0–A12,

BA0, BA1

CKE

ADDRESS

512

(x32)

16384

I/O GATING

DM MASK LOGIC

COLUMN

DECODER

BANK0

MEMORY

ARRAY

(8,192 x 512 x 32)

BANK0

ROW-

ADDRESS

LATCH

DECODER

8192

SENSE AMPLIFIERS

BANK

CONTROL

LOGIC

BANK1 BANK2 BANK3

REFRESH

COUNTER

INPUT

REGISTERS

RCVRS

Out

DATA

DQS

MASK

DATA

DRVRS

DLL

MUX

DQS

GENERATOR

16 16

DQ0–DQ15

LDQS, UDQS

READ

LATCH

WRITE

FIFO

DRIVERS

COL0

LDM, UDM

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512Mb: x4, x8, x16 DDR SDRAM

Pin and Ball Assignments and Descriptions

Figure 6: 66-Pin TSOP Pin Assignment (Top View)

x4 x16 x4x8x16

VSS

DQ15

VSSQ

DQ14

DQ13

VDDQ

DQ12

DQ11

VSSQ

DQ10

DQ9

VDDQ

DQ8

VSSQ

UDQS

DNU

VREF

VSS

UDM

CK#

CKE

A12

A11

VSS

DQ7

VSSQ

DQ6

VDDQ

DQ5

VSSQ

DQ4

VDDQ

VSSQ

DQS

DNU

VREF

VSS

CK#

CKE

A12

A11

VSS

VSSQ

DQ3

VDDQ

VSSQ

DQ2

VDDQ

VSSQ

DQS

DNU

VREF

VSS

CK#

CKE

A12

A11

VSS

VDD

DQ0

VDDQ

DQ1

DQ2

VSSQ

DQ3

DQ4

VDDQ

DQ5

DQ6

VSSQ

DQ7

VDDQ

LDQS

VDD

DNU

LDM

WE#

CAS#

RAS#

CS#

BA0

BA1

A10/AP

VDD

DQ0

VDDQ

DQ1

VSSQ

DQ2

VDDQ

DQ3

VSSQ

VDDQ

VDD

DNU

WE#

CAS#

RAS#

CS#

BA0

BA1

A10/AP

VDD

VDDQ

DQ0

VSSQ

VDDQ

DQ1

VSSQ

VDDQ

VDD

DNU

WE#

CAS#

RAS#

CS#

BA0

BA1

A10/AP

VDD

DQ14

DQ12

DQ10

DQ8

REF

DQ15

A12

A11

DQ13

DQ11

DQ9

UDQS

UDM

CK#

CKE

DQ2

DQ4

DQ6

LDQS

LDM

WE#

RAS#

BA1

DQ0

CAS#

CS#

BA0

A10

DQ1

DQ3

DQ5

DQ7

x16 (Top View)

REF

A12

A11

DQ3

DQ2

DQS

CK#

CKE

DQ0

DQ1

WE#

RAS#

BA1

CAS#

CS#

BA0

A10

x4 (Top View)

REF

DQ7

A12

A11

DQ6

DQ5

DQ4

DQS

CK#

CKE

DQ1

DQ2

DQ3

WE#

RAS#

BA1

DQ0

CAS#

CS#

BA0

A10

x8 (Top View)

123456789

DNU

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512Mb: x4, x8, x16 DDR SDRAM

Pin and Ball Assignments and Descriptions

Figure 7: 60-Ball FBGA Ball Assignment (Top View)

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512Mb: x4, x8, x16 DDR SDRAM

Pin and Ball Assignments and Descriptions

Table 4: Pin and Ball Descriptions

FBGA

Numbers TSOP

Numbers Symbol Type Description

K7, L8, L7,

M8, M2, L3,

L2, K3, K2,

J3, K8,

J2, H2

29, 30, 31,

32, 35, 36,

37, 38, 39,

40, 28

41, 42

A0, A1, A2,

A3, A4, A5,

A6, A7, A8,

A9, A10,

A11, A12

Input Addr ess inputs: Provide the row address for ACTIVE commands, and the

column address and auto precharge bit (A10) for READ/WRITE

commands, to select one location out of the memory array in the

respective bank. A10 sampled during a PRECHARGE command

determines whether the PRECHARGE applies to one bank (A10 LOW,

bank selected by BA0, BA1) or all banks (A10 HIGH). The address inputs

also provide the op-code during a LOAD MODE REGISTER command.

J8, J7 26, 27 BA0, BA1 Input Bank address inputs: BA0 and BA1 define to which bank an ACTIVE,

READ, WRITE, or PRECHARGE command is being applied. BA0 and BA1

also define which mode register (mode register or extended mode

G2, G3 45, 46 CK, CK# Input Clock: CK and CK# are differential clock inputs. Al l ad dress and cont ro l

input signals are sampled on the crossing of the positive edge of CK and

negative edge of CK#. Output data (DQ and DQS) is referenced to the

crossings of CK and CK#.

H3 44 CKE Input Clock enable : CKE HIGH activates and CKE LOW deactivates the internal

clock, input buffers, and output drivers. Taking CKE LOW provides

PRECHARGE POWER-DOWN and SELF REFRESH operati on s (all banks

idle), or ACTIVE POWER-DOWN (row ACTIVE in any bank). CKE is

synchronous for POWER-DOWN entry and exit, and for SELF REFRESH

entry. CKE is asynchronous for SELF RE FRE SH exit and for disa b ling the

outputs. CKE must be maintained HIGH throughout read and write

accesses. Input buffers (excluding CK, CK#, and CKE) are disabled during

POWER-DOWN. Input buffers (excluding CKE) are disabled during SELF

REFRESH. CKE is an SSTL_2 input but will detect an LVCMOS LOW level

after VDD is applied and until CKE is first brought HIGH, after which it

becomes a SSTL_2 input only.

H8 24 CS# Input Chip select: CS# enables (registered LOW) and disables (registered

HIGH) the command decoder. All commands are masked when CS# is

registered HIGH. CS# provides for external bank selection on systems with

multiple banks. CS# is considered part of the command code.

F7, F3 47

20,47 DM

LDM, UDM Input Input data mask: DM is an input mask signal for write data. Input data

is masked when DM is sampled HIGH along with that input data d uring a

write access. DM is sampled on both edges of DQS. Although DM pins are

input-only, the DM loading is designed to match that of DQ and DQS

pins. For the x16, LDM is DM for DQ0–DQ7 and UDM is DM for DQ8–

DQ15. Pin 20 is a NC on x4 and x8.

H7, G8,

G7 23, 22,

21 RAS#, CAS#,

WE# Input Command inputs: RAS#, CAS#, and WE# (along with CS#) define the

command being entered.

A8, B9, B7,

C9, C7, D9,

D7, E9, E1,

D3, D1, C3,

C1, B3, B1,

2, 4, 5,

7, 8, 10,

11, 13, 54,

56, 57, 59,

60, 62, 63,

DQ0–DQ2

DQ3–DQ5

DQ6–DQ8

DQ9–DQ11

DQ12–DQ14

DQ15

I/O Data input/output: Data bus for x16.

A8, B7, C7,

D7, D3, C3,

B3, A2

2, 5, 8,

11, 56, 59,

62, 65

DQ0–DQ2

DQ3–DQ5

DQ6, DQ7

I/O Data input/output: Data bus for x8.

B7, D7, D3,

B3 5, 11, 56,

62 DQ0–DQ2

DQ3 I/O Data input/output: Data bus for x4.

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512Mb: x4, x8, x16 DDR SDRAM

Pin and Ball Assignments and Descriptions

DQS

LDQS

UDQS

I/O Data strobe: Output with read data, input with write data. DQS is edge-

aligned with read data, centered in write data. It is used to capture data.

For the x16, LDQS is DQS for DQ0–DQ7 and UDQS is DQS for DQ8–DQ15.

Pin 16 (E7) is NC on x4 and x8.

F8, M7, A7 1, 18, 33 VDD Supply Power supply: +2.5V ±0.2V. (+2.6V ±0.1V for DDR400).

B2, D2, C8,

E8, A9 3, 9, 15, 55,

61 VDDQSupply DQ power supply: +2.5V ±0.2V (+2.6V ±0.1V for DDR400). Isolated on

the die for improved noise immunity.

F1 49 VREF Supply SSTL_2 reference voltage.

A3, F2, M3 34, 48, 66 VSS Supply Ground.

A1, C2, E2,

B8, D8 6, 12, 52,

58, 64 VSSQSupply DQ ground: Isolated on the die for improved noise immunity.

– 14, 17, 25 ,

43, 53 NC – No connect for x16: These pins should be left unconnected.

B1, B9, C1,

C9, D1, D9,

E1, E7, E9,

4, 7, 10,

13, 14, 16,

17, 20, 25,

43, 53, 54,

57, 60, 63

NC – No connect for x8: These pins should be left unconnected.

B1, B9, C1,

C9, D1, D9,

E1, E7, E9,

4, 7, 10, 13,

14, 16, 17,

20, 25, 43,

53, 54, 57,

60, 63

NC – No connect for x4: These pins should be left unconnected.

A2, A8, C3,

C7 2, 8, 59, 65 NF – No function for x4: These pins should be left uncon nec ted .

F9 19, 50 DNU –Do not use: Must float to minimize noise on VREF.

Table 5: Rese rved NC Pin and Ball Descriptions

NC pins not listed may also be reserved for other uses; this table defines NC pins of importance

TSOP

Numbers Symbol Type Description

17 A13 Input Address input A13 for 1Gb devices.

Table 4: Pin and Ball Descriptions (continued)

FBGA

Numbers TSOP

Numbers Symbol Type Description

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512Mb: x4, x8, x16 DDR SDRAM

Package Dimensions

Figure 8: 66-Pin Plastic TSOP (400 mil)

Notes: 1. All dimensions are in millimeters.

2. Package width and length do not inclu de mold protrusio n; allowable mol d protru sio n is

0.25mm per side.

SEE DETAIL A

0.10

0.65 TYP 0.71

10.16 ±0.08

0.15

0.50 ±0.10

PIN #1 ID

DETAIL A

22.22 ± 0.08

0.32 ± .075 TYP

+0.03

–0.02

+0.10

–0.05

1.20 MAX 0.10

0.25

0.80 TYP

0.10 (2X)

GAGE PLANE

11.76 ±0.20

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512Mb: x4, x8, x16 DDR SDRAM

Package Dimensions

Figure 9: 60-Ball FBGA (10mm x 12.5mm)

Notes: 1. All dimensions are in millimeters.

2. Topside par t ma rking decoder can be found on Micron’s Web site.

BALL #1 ID

SOLDER BALL MATERIAL:

62% Sn, 36% Pb, 2% Ag OR

96.5% Sn, 3% Ag, 0.5% Cu

SOLDER BALL PAD: Ø .33

NON SOLDER MASK DEFINED

MOLD COMPOUND: EPOXY NOVOLAC

SUBSTRATE: PLASTIC LAMINATE

1.20 MAX

0.85 ±0.05

0.10 C C

SEATING PLANE

BALL A1 ID

BALL A1

.45

60X Ø

SOLDER BALL DIAMETER

REFERS TO POST REFLOW

CONDITION. THE PRE-REFLOW

DIAMETER IS Ø 0.40.

BALL A9

11.00

5.50 ±0.05

6.25 ±0.05

12.50 ±0.10

1.00

TYP

6.40

1.80

CTR

0.80 (TYP)

3.20 ±0.05 5.00 ±0.05

10.00 ±0.10

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512Mb: x4, x8, x16 DDR SDRAM

Electrical Specifications – I

Electrical Specifications – IDD

Table 6: IDD Specifications and Conditions (x4, x8)

VDDQ = +2.6V ±0.1V, VDD = +2.6V ±0.1V (-5B); VDDQ = +2.5V ±0.2V, VDD = +2.5V ±0.2V (-6, -6T, -75E, -75Z, -75);

0°C ≤ TA ≤ +70°C; Notes: 1–5, 11, 13, 15, 47; Notes appear on pages 28–33; See also Table 8 on page 16

Parameter/Condition Symbol -5B -6/6T -75E -75Z/-75 Units Notes

Operating one-bank active -precharge current:

tRC = tRC (MIN); tCK = tCK (MIN); DQ, DM, and DQS inputs

changing once per clock cycle; Address an d co ntrol inputs

changing once every two clock cycles

IDD0 155 130 130 115 mA 23, 48

Operating one-bank active-read-precharge current:

Burst = 4; tRC = tRC (MIN); tCK = tCK (MIN); IOUT = 0mA;

Address and control inputs changing once per cl ock cycle

IDD1 185 160 160 145 mA 23, 48

Precharge power-down standby current: All banks idle;

Power-down mode; tCK = tCK (MIN); CKE = (LOW) IDD2P 5 5 5 5 mA 24, 33

Idle standby current: CS# = HIGH; All banks are idle;

tCK = tCK (MIN); CKE = HIGH; Address and other control

inputs changing once per clock cycle; VIN = VREF for DQ, DQS,

and DM

IDD2F 55 45 45 40 mA 51

Active power-down standby current: One bank active;

Power-down mode; tCK = tCK (MIN); CKE = LOW IDD3P 45 35 35 30 mA 24, 33

Active standby current: CS# = HIGH; CKE = HIGH; One bank

active; tRC = tRAS (MAX); tCK = tCK (MIN); DQ, DM, and DQS

inputs changing twice per clock cycle; Address and other

control inputs chan gi ng once per clock cycle

IDD3N 60 50 50 45 mA 23

Operating burst read current: Burst = 2; Continuous burst

reads; One bank active; Address and contro l inp uts chang in g

once per clock cyc l e ; tCK = tCK (MIN); IOUT = 0mA

IDD4R 190 165 165 145 mA 23, 48

Operating burst write current: Burst = 2; Continuous burst

writes; One bank active; Address and contr ol inputs changing

once per clock cycle; tCK = tCK (MIN); DQ, DM, and DQS inputs

changing twice pe r clock cycle

IDD4W 195 175 155 135 mA 23

Auto refresh burst current: tRFC = tRFC (MIN) IDD5 345 290 290 280 mA 50

tRFC = 7.8µs IDD5A 11 10 10 10 mA 28, 50

Self refresh current: CKE ≤ 0.2V Standard IDD6555 5 mA 12

Low power (L) IDD6A 3 3 3 3 mA 12

Operating bank interleave read current: Fou r bank

interleaving READs (burst = 4) with auto precharge,

tRC = minimum tRC allowed; tCK = tCK (MIN); Address and

control inputs change only during active READ or WRITE

commands

IDD7 450 405 400 350 mA 23, 49

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512Mb: x4, x8, x16 DDR SDRAM

Electrical Specifications – I

Table 7: IDD Specifications and Conditions (x16)

VDDQ = +2.6V ±0.1V, VDD = +2.6V ±0.1V (-5B); VDDQ = +2.5V ±0.2V, VDD = +2.5V ±0.2V (-6, -6T, -75E, -75Z, -75);

0°C ≤ TA ≤ +70°C; Notes: 1–5, 11, 13, 15, 47; Notes appear on pages 28–33; See also Table 8 on page 16

Parameter/Condition Symbol -5B -6/6T -75E -75Z/-75 Units Notes

Operating one-bank active -precharge current:

tRC = tRC (MIN); tCK = tCK (MIN); DQ, DM, and DQS inputs

changing once per clock cycle; Address an d co ntrol inputs

changing once every two clock cycles

IDD0 155 130 130 115 mA 23, 48

Operating one-bank active-read-precharge current:

Burst = 4; tRC = tRC (MIN); tCK = tCK (MIN); IOUT = 0mA;

Address and control inputs changing once per cl ock cycle

IDD1 195 160 160 145 mA 23, 48

Precharge power-down standby current: All banks idle;

Power-down mode; tCK = tCK (MIN); CKE = (LOW) IDD2P 5 5 5 5 mA 24, 33

Idle standby current: CS# = HIGH; All banks are idle;

tCK = tCK (MIN); CKE = HIGH; Address and other control

inputs changing on ce per clock cycle; VIN = VREF for DQ, DQS,

and DM

IDD2F 55 45 45 40 mA 51

Active power-down standby current: One bank active;

Power-down mode; tCK = tCK (MIN); CKE = LOW IDD3P 45 35 35 30 mA 24, 33

Active standby current: CS# = HIGH; CKE = HIGH; One bank

active; tRC = tRAS (MAX); tCK = tCK (MIN); DQ, DM, and DQS

inputs changing twice per clock cycle; Address and other

control inputs chan gi ng once per clock cycle

IDD3N 60 50 50 45 mA 23

Operating burst read curren t: Burst = 2; Continuous

burst reads; One bank active; Address and control inputs

changing once per clock cycle; tCK = tCK (MIN); IOUT = 0mA

IDD4R 210 165 16 5 14 5 mA 23, 48

Operating burst write current: Burst = 2; Continuous burst

writes; One bank active; Address and control inputs changing

once per cloc k cycle; tCK = tCK (MIN); DQ, DM, and DQS inputs

changing twice pe r clock cycle

IDD4W 215 195 160 135 mA 23

Auto refresh burst current: tRFC = tRFC (MIN) IDD5 345 290 290 280 mA 50

tRFC = 7.8µs IDD5A 11 10 10 10 mA 28, 50

Self refresh current: CKE ≤ 0.2V Standard IDD6655 5 mA 12

Low power (L) IDD6A 4 3 3 3 mA 12

Operating bank interleave read current: Fou r bank

interleaving READs (burst = 4) with auto precharge,

tRC = minimum tRC allowed; tCK = tCK (MIN); Address and

control inputs change only during active READ or WRITE

commands

IDD7 480 405 400 350 mA 23, 49

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512Mb: x4, x8, x16 DDR SDRAM

Electrical Specifications – I

Table 8: IDD Test Cycle Times

Values reflect number of clock cycles for ea ch test

IDD Test Speed

Grade Clock Cycle

Time tRRD tRCD tRAS tRP tRC tRFC tREFI CL

IDD0-75/75Z 7.5ns n/a n/a 6 3 9 n/a n/a n/a

-75E 7.5ns n/a n/a 6 2 8 n/a n/a n/a

-6/-6T 6ns n/a n/a 7 3 10 n/a n/a n/a

-5B 5ns n/a n/a 8 3 11 n/a n/a n/a

IDD1-75 7.5ns n/a n/a 6 3 9 n/a n/a 2.5

-75Z 7.5ns n/a n/a 6 3 9 n/a n/a 2

-75E 7.5ns n/a n/a 6 2 8 n/a n/a 2

-6/-6T 6ns n/a n/a 7 3 10 n/a n/a 2.5

-5B 5ns n/a n/a n/a n/a n/a n/a n/a 3

IDD4R -75 7.5ns n/a n/a n/a n/a n/a n/a n/a 2.5

-75Z 7.5ns n/a n/a n/a n/a n/a n/a n/a 2

-75E 7.5ns n/a n/a n/a n/a n/a n/a n/a 2

-6/-6T 6ns n/a n/a n/a n/a n/a n/a n/a 2.5

-5B 5ns n/a n/a n/a n/a n/a n/a n/a 3

IDD4W -75 7.5ns n/a n/a n/a n/a n/a n/a n/a n/a

-75Z 7.5ns n/a n/a n/a n/a n/a n/a n/a n/a

-75E 7.5ns n/a n/a n/a n/a n/a n/a n/a n/a

-6/-6T 6ns n/a n/a n/a n/a n/a n/a n/a n/a

-5B 5ns n/a n/a n/a n/a n/a n/a n/a n/a

IDD5-75/75Z 7.5ns n/a n/a n/a n/a n/a 10 10 n/a

-75E 7.5ns n/a n/a n/a n/a n/a 9 9 n/a

-6/-6T 6ns n/a n/a n/a n/a n/a 12 12 n/a

-5B 5ns n/a n/a n/a n/a n/a 14 14 n/a

IDD5A -75/75Z 7.5ns n/a n/a n/a n/a n/a 10 1,029 n/a

-75E 7.5ns n/a n/a n/a n/a n/a 10 1,029 n/a

-6/-6T 6ns n/a n/a n/a n/a n/a 12 1,288 n/a

-5B 5ns n/a n/a n/a n/a n/a 14 1,546 n/a

IDD7-75 7.5ns 2 3 n/a 3 10 n/a n/a 2.5

-75Z 7.5ns 2 3 n/a 3 10 n/a n/a 2

-75E 7.5ns 2 3 n/a 2 8 n/a n/a 2

-6/-6T 6ns 2 3 n/a 3 10 n/a n/a 2.5

-5B 5ns 2 3 n/a 3 11 n/a n/a 3

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512Mb: x4, x8, x16 DDR SDRAM

Electrical Specifications – DC and AC

S tresses g reater than those listed in Table 9 may cause permanent damage to the device.

This is a stress rating only, and functional operation of the device at these or any other

conditions above those indicated in the operational sections of this spe c ifi cation is not

implied. Exposure to absolute maximum rating conditions for extended periods may

affect reli ability.

Table 9: Absolute Maximum Rating s

Parameter Min Max Units

VDD supply voltage relative to VSS –1V +3.6V V

VDDQ supply voltage relative to VSS –1V +3.6V V

VREF and inputs voltage relative to VSS –1V +3.6V V

I/O pins voltage relative to VSS –0.5V VDDQ + 0.5V V

Storage temperature (plastic) –55 +150 °C

Short circuit output cur r e nt –50mA

Table 10: DC Electrical Characteristics and Operating Conditions (-5B)

Notes: 1–5 and 17 apply to the entire table; Notes appear on page 34; VDDQ = +2.6V ±0.1V, VDD = +2.6V ±0.1V

Parameter/Condition Symbol Min Max Units Notes

Supply voltage VDD +2.5 +2.7 V 37, 42

I/O supply voltage VDDQ +2.5 +2.7 V 37, 42, 45

I/O reference voltage VREF 0.49 × VDDQ 0.51 × VDDQ V 7, 45

I/O termination voltage (system) VTT VREF - 0.04 VREF + 0.04 V 8, 45

Input high (logi c 1) vol tag e VIH(DC)VREF + 0.15 VDD + 0.3 V 29

Input low (logic 0) voltage VIL(DC)–0.3VREF - 0.15 V 29

Input leakage current:

Any input 0V ≤ VIN ≤ VDD, VREF pin 0V ≤ VIN ≤ 1.35V

(All other pins not under test = 0V)

II–2 +2 µA

Output leakage current:

(DQ are disabled; 0V ≤ VOUT ≤ VDDQ)IOZ –5 +5 µA

Full-drive option output

levels (x4, x8, x16): High current (VOUT =

VDDQ - 0.373V, minimum

VREF, minimum VTT)

IOH –16.8 – mA 38, 40

Low current (VOUT =

0.373V, maximum VREF,

maximum VTT)

IOL +16.8 – mA

Reduced-drive option

output levels (Design

Revision F and K only):

High current (VOUT =

VDDQ - 0.373V, minimum

VREF, minimum VTT)

IOHR –9 – mA 39, 40

Low current (VOUT =

0.763V, maximum VREF,

maximum VTT)

IOLR +9 – mA

Ambient operating

temperatures Commercial TA0+70°C

Industrial TA–40 +85 °C

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512Mb: x4, x8, x16 DDR SDRAM

Electrical Specifications – DC and AC

Table 11: DC Electrical Characteristics and Operating Conditions (-6, -6T, -75E, -75Z, -75)

Notes: 1–5, 17 apply to the entire table; Notes appear on page 34; VDDQ = +2.5V ±0.2V, VDD = +2.5V ±0.2V

Parameter/Condition Symbol Min Max Units Notes

Supply voltage VDD +2.3 +2.7 V 37, 42

I/O supply voltage VDDQ +2.3 +2.7 V 37, 42, 45

I/O reference voltage VREF 0.49 × VDDQ 0.51 × VDDQ V 7, 45

I/O termination voltage (system) VTT VREF - 0.04 VREF + 0.04 V 8, 45

Input high (logi c 1) vol tag e VIH(DC)VREF + 0.15 VDD + 0.3 V 29

Input low (logic 0) voltage VIL(DC)–0.3VREF - 0.15 V 29

Input leakage current:

Any input 0V ≤ VIN ≤ VDD, VREF pin 0V ≤ VIN ≤ 1.35V

(All other pins not under test = 0V)

II–2 +2 µA

Output leakage current:

(DQ are disabled; 0V ≤ VOUT ≤ VDDQ)IOZ –5 +5 µA

Full-drive option output

levels (x4, x8, x16): High current (VOUT =

VDDQ - 0.373V, minimum

VREF, minimum VTT)

IOH –16.8 – mA 38, 40

Low current (VOUT =

0.373V, maximum VREF,

maximum VTT)

IOL +16.8 – mA

Reduced-drive option

output levels (Design

Revision F and K only):

High current (VOUT =

VDDQ - 0.763V, minimum

VREF, minimum VTT)

IOHR –9 – mA 39, 40

Low current (VOUT =

0.763V, maximum VREF,

maximum VTT)

IOLR +9 – mA

Ambient operating

temperatures Commercial TA0+70°C

Industrial TA–40 +85 °C

Table 12: AC Input Operating Conditions

Notes: 1–5, 17 apply to the entire table; Notes appear on page 34;

0°C ≤ TA ≤ +70°C; VDDQ = +2.5V ±0.2V, VDD = +2.5V ±0.2V (VDDQ = +2.6V ±0.1V, VDD = +2.6V ±0.1V for -5B)

Parameter/Condition Symbol Min Max Units Notes

Input high (logi c 1) vol tag e VIH(AC)VREF + 0.310 – V 15, 29, 41

Input low (logic 0) voltage VIL(AC)–VREF - 0.310 V 15, 29, 41

I/O reference voltage VREF(AC) 0.49 × VDDQ 0.51 × VDDQV 7

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512Mb: x4, x8, x16 DDR SDRAM

Electrical Specifications – DC and AC

Figure 10: Input Voltage Waveform

Notes: 1. VOH (MIN) with test load is 1.927V.

2. VOL (MAX) with test load is 0.373V.

3. Numbers in diagram reflect nominal values utilizing circuit below for all devi ces oth er than

-5B.

0.940V

1.100V

1.200V

1.225V

1.250V

1.275V

1.300V

1.400V

1.560V

VIL(AC)

VIL(DC)

VREF - AC noise

VREF - DC error

VREF + DC error

VREF + AC noise

Receiver

tte

VIH(DC)

VIH(AC)

VOH (MIN) (1.670V1 for SSTL_2 termination)

VIN(AC) - provides margin

between VOL (MAX)

and VIL(AC)

VssQ

VDDQ (2.3V MIN)

VOL (MAX) (0.83V2 for SSTL_2

termination)

System noise margin (power/ground,

crosstalk, signal integrity attenuation)

Reference

point

25Ω

VTT

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512Mb: x4, x8, x16 DDR SDRAM

Electrical Specifications – DC and AC

Figure 11: SSTL_2 Clock Input

Notes: 1. CK or CK# may not be more positive than VDDQ + 0.3V or more negative than VSS - 0.3V.

2. This provides a minimum of 1.1 5V to a maximum of 1.35V an d is al wa ys ha l f of VDDQ.

3. CK and CK# must cross in this region.

4. CK and CK# must meet at least VID(DC) MIN when static and is centered around VMP(DC).

5. CK and CK# must have a minimum 700mV peak-to-peak swing.

6. For AC operation, al l DC clock requirements must also be satisfied.

7. Numbers in diagram reflect nominal values for all device s other than -5B.

Table 13: Clock Input Operating Conditions

Notes: 1–5, 16, 17, 31 apply to the entire table; Notes appear on page 34;

0°C ≤ TA ≤ +70°C; VDDQ = +2.5V ±0.2V, VDD = +2.5V ±0.2V (VDDQ = +2.6V ±0.1V, VDD = +2.6V ±0.1V for -5B)

Parameter/Condition Symbol Min Max Units Notes

Clock input mi d-p oi nt voltage: CK and CK# VMP(DC) 1.15 1 .35 V 7, 10

Clock input vol tage level: CK and CK# VIN(DC)–0.3VDDQ + 0.3 V 7

Clock input differential voltage: CK and CK# VID(DC)0.36VDDQ + 0.6 V 7, 9

Clock input differential voltage: CK and CK# VID(AC)0.7VDDQ + 0.6 V 9

Clock input crossing point voltage: CK and CK# VIX(AC) 0.5 × VDDQ - 0.2 0.5 × VDDQ + 0.2 V 10

CK#

2.80V

Maximum clock level1

Minimum clock level1

–0.30V

1.25V

1.45V

1.05V V

(

X X

(

)2V

(

X X

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512Mb: x4, x8, x16 DDR SDRAM

Electrical Specifications – DC and AC

Table 14: Capacitance (x4, x8 TSOP)

Note: 14 applies to the entire table; Notes appear on page 34

Parameter Symbol Min Max Units Notes

Delta input/output capacitance: DQ0–DQ3 (x4), DQ0–DQ7 (x8) DCIO –0.50pF 25

Delta input cap a citance: Comman d and address DCI1–0.50pF 30

Delta input capacitance: CK, CK# DCI2–0.25pF 30

Input/outp ut ca paci tance: DQ, DQS, DM CIO 4.0 5.0 pF

Input capacitance: Command and address CI12.0 3.0 pF

Input capacitance: CK, CK# CI22.0 3.0 pF

Input capacitance: CKE CI32.0 3.0 pF

Table 15: Capacitance (x4, x8 FBGA)

Note: 14 applies to the entire table; Notes appear on page 34

Parameter Symbol Min Max Units Notes

Delta input/output capacitance: DQ, DQS, DM DCIO –0.50pF 25

Delta input cap a citance: Comman d and address DCI1–0.50pF 30

Delta input capacitance: CK, CK# DCI2–0.25pF 30

Input/outp ut ca paci tance: DQ, DQS, DM CIO 3.5 4.5 pF

Input capacitance: Command and address CI11.5 2.5 pF

Input capacitance: CK, CK# CI21.5 2.5 pF

Input capacitance: CKE CI31.5 2.5 pF

Table 16: Capacitance (x16 TSOP)

Note: 14 applies to the entire table; Notes appear on page 34

Parameter Symbol Min Max Units Notes

Delta input/output capacitance: DQ0–DQ7, LDQS, LDM DCIOL –0.50pF 25

Delta input/output capacitance: DQ8–DQ15, UDQS, UDM DCIOU –0.50pF 25

Delta input cap a citance: Comman d and address DCI1–0.50pF 30

Delta input capacitance: CK, CK# DCI2–0.25pF 30

Input/outp ut ca paci tan ce: DQ , LDQS, UDQS, LDM, UDM CIO 4.0 5.0 pF

Input capacitance: Command and address CI12.0 3.0 pF

Input capacitance: CK, CK# CI22.0 3.0 pF

Input capacitance: CKE CI32.0 3.0 pF

Table 17: Capacitance (x16 FBGA)

Note: 14 applies to the entire table; Notes appear on page 34

Parameter Symbol Min Max Units Notes

Delta input/output capacitance: DQ0–DQ7, LDQS, LDM DCIOL –0.50pF 25

Delta input/output capacitance: DQ8–DQ15, UDQS, UDM DCIOU –0.50pF 25

Delta input cap a citance: Comman d and address DCI1–0.50pF 30

Delta input capacitance: CK, CK# DCI2–0.25pF 30

Input/outp ut ca paci tan ce: DQ , LDQS, UDQS, LDM, UDM CIO 3.5 4.5 pF

Input capacitance: Command and address CI11.5 2.5 pF

Input capacitance: CK, CK# CI21.5 2.5 pF

Input capacitance: CKE CI31.5 2.5 pF

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512Mb: x4, x8, x16 DDR SDRAM

Electrical Specifications – DC and AC

Table 18: Electrical Characteristics and Recommended AC Operating Conditions (-5B)

Notes 1–6, 16–18, 34 apply to the entire table; Notes appear on page 34;

0°C ≤ TA ≤ +70°C; VDDQ = +2.6V ±0.1V, VDD = +2.6V ±0.1V

AC Characteristics -5B

Units NotesParameter Symbol Min Max

Access window of DQ from CK/CK# tAC –0.70 +0.70 ns

CK high-level width tCH 0.45 0.55 tCK 31

Clock cycle time CL = 3 tCK (3) 5 7.5 ns 52

CL = 2.5 tCK (2.5) 6 13 ns 46, 52

CL = 2 tCK (2) 7.5 13 ns 46, 52

CK low-level width tCL 0.45 0.55 tCK 31

DQ and DM input hold time relative to DQS tDH 0.40 – ns 27, 32

DQ and DM input pu lse width (for each input) tDIPW 1.75 – ns 32

Access window of DQS from CK/CK# tDQSCK –0.60 +0.60 ns

DQS input high pulse width tDQSH 0.35 – tCK

DQS input low pulse width tDQSL 0.35 – tCK

DQS–DQ skew, DQS to last DQ valid, per group, per access tDQSQ – 0.40 ns 26, 27

WRITE command to first DQS latching transition tDQSS 0.72 1.28 tCK

DQ and DM input setup time relative to DQS tDS 0.40 – ns 27, 32

DQS falling edge from CK rising – hold time tDSH 0.2 – tCK

DQS falling edge to CK rising – setup time tDSS 0.2 – tCK

Half-clock period tHP tCH,tCL – ns 35

Data-out High-Z window from CK/CK# tHZ – +0.70 ns 19, 43

Address and control input hold time (slew rate ≥0.5 V/n s) tIHF0.60 – ns 15

Address and control input pulse width (for each input) tIPW 2.2 – ns

Address and control input setup time (slew rate ≥0.5 V/ns) tISF0.60 – ns 15

Data-out Low-Z window from CK/CK# tLZ –0.70 – ns 19, 43

LOAD MODE REGISTER command cycle time tMRD 10 – ns

DQ–DQS hold, DQS to first DQ to go non-valid, per access tQH tHP -tQHS – ns 26, 27

Data hold skew factor tQHS – 0.50 ns

ACTIVE-to-READ with auto precharge command tRAP 15 – ns

ACTIVE-to-PRECHARGE command tRAS 40 70,000 ns 36

ACTIVE-to-ACTIVE/AUTO REFRESH command period tRC 55 – ns

ACTIVE-to-READ or WRITE delay tRCD 15 – ns

REFRESH-to-REFRESH command

interval 256Mb tREFC – 70.3 µs 24

AUTO REFRESH command period 256Mb tRFC 70 – ns 50

Average periodic refresh interval 256Mb tREFI – 7.8 µs 24

PRECHARGE command period tRP 15 – ns

DQS read preamble tRPRE 0.9 1.1 tCK 44

DQS read postamble tRPST 0.4 0.6 tCK 44

ACTIVE bank a to ACTIVE bank b command tRRD 10 – ns

Terminating voltage delay to VDD tVTD 0 – ns

DQS write preamble tWPRE 0.25 – tCK

DQS write preamble setup time tWPRES 0 – ns 21, 22

DQS write postamble tWPST 0.4 0.6 tCK 20

Write recovery time tWR 15 – ns

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512Mb: x4, x8, x16 DDR SDRAM

Electrical Specifications – DC and AC

Internal WRITE-to-READ command delay tWTR 2 – tCK

Exit SELF REFRESH-to-non-READ

command 256Mb tXSNR 70 – ns

Exit SELF REFRESH-to-READ command tXSRD 200 – tCK

Data valid output window n/a tQH - tDQSQ ns 26

Table 18: Electrical Characteristics and Recommended AC Operating Conditions (-5B) (continued)

Notes 1–6, 16–18, 34 apply to the entire table; Notes appear on page 34;

0°C ≤ TA ≤ +70°C; VDDQ = +2.6V ±0.1V, VDD = +2.6V ±0.1V

AC Characteristics -5B

Units NotesParameter Symbol Min Max

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512Mb: x4, x8, x16 DDR SDRAM

Electrical Specifications – DC and AC

Table 19: Electrical Characteristics and Recommended AC Operating Conditions (-6)

Notes: 1–6, 16–18, 34 apply to the entire table; Notes appear on page 34;

0°C ≤ TA ≤ +70°C; VDDQ = +2.5V ±0.2V, VDD = +2.5V ±0.2V

AC Characteristics -6 (FBGA)

Units NotesParameter Symbol Min Max

Access window of DQ from CK/CK# tAC –0.70 +0.70 ns

CK high-level width tCH 0.45 0.55 tCK 31

Clock cycle time CL = 2.5 tCK (2.5) 6 13 ns 46, 52

CL = 2 tCK (2) 7.5 13 ns 46, 52

CK low-level width tCL 0.45 0.55 tCK 31

DQ and DM input hold time relative to DQS tDH 0.45 – ns 27, 32

DQ and DM input pu lse width (for each input) tDIPW 1.75 – ns 32

Access window of DQS from CK/CK# tDQSCK –0.6 +0.6 ns

DQS input high pulse width tDQSH 0.35 – tCK

DQS input low pulse width tDQSL 0.35 – tCK

DQS–DQ skew, DQS to last DQ valid, per group, per access tDQSQ – 0.4 ns 26, 27

WRITE command to first DQS latching transition tDQSS 0.75 1.25 tCK

DQ and DM input setup time relative to DQS tDS 0.45 – ns 27, 32

DQS falling edge from CK rising - hold time tDSH 0.2 – tCK

DQS falling edge to CK rising - setup time tDSS 0.2 – tCK

Half-clock period tHP tCH,

tCL –ns35

Data-out High-Z window from CK/CK# tHZ – +0.7 ns 19, 43

Address and control input hold time (fast slew rate) tIHF0.75 – ns

Address and control input hold time (slow slew rate) tIHS0.8 – ns 15

Address and control input pulse width (for each input) tIPW 2.2 – ns

Address and control input setup time (fast slew rate) tISF0.75 – ns

Address and control input setup time (slow slew rate) tISS0.8 – ns 15

Data-out Low-Z window from CK/CK# tLZ –0.7 – ns 19, 43

LOAD MODE REGISTER command cycle time tMRD 12 – ns

DQ-DQS hold, DQS to first DQ to go non-valid, per access tQH tHP -tQHS – ns 26, 27

Data hold skew factor tQHS – 0.50 ns

ACTIVE-to-READ with auto precharge command tRAP 15 – ns

ACTIVE-to-PRECHARGE command tRAS 42 70,000 ns 36, 54

ACTIVE-to-ACTIVE/AUTO REFRESH command period tRC 60 – ns

ACTIVE-to-READ or WRITE delay tRCD 15 – ns

REFRESH-to-REFRESH command

interval 256Mb tREFC – 70.3 µs 24

Average periodic refresh interval 256Mb tREFI – 7.8 µs 24

AUTO REFRESH command period 256Mb tRFC 72 – ns 50

PRECHARGE command period tRP 15 – ns

DQS read preamble tRPRE 0.9 1.1 tCK 44

DQS read postamble tRPST 0.4 0.6 tCK 44

ACTIVE bank a to ACTIVE bank b command tRRD 12 – ns

Terminating voltage delay to VSS tVTD 0 – ns

DQS write preamble tWPRE 0.25 – tCK

DQS write preamble setup time tWPRES 0 – ns 21, 22

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512Mb: x4, x8, x16 DDR SDRAM

Electrical Specifications – DC and AC

DQS write postamble tWPST 0.4 0.6 tCK 20

Write recovery time tWR 15 – ns

Internal WRITE-to-READ command delay tWTR 1 – tCK

Exit SELF REFRESH-to-non-READ

command 256Mb tXSNR 75 – ns

Exit SELF REFRESH-to-READ command tXSRD 200 – tCK

Data valid output window n/a tQH - tDQSQ ns 26

Table 19: Electrical Characteristics and Recommended AC Operating Conditions (-6) (continued)

Notes: 1–6, 16–18, 34 apply to the entire table; Notes appear on page 34;

0°C ≤ TA ≤ +70°C; VDDQ = +2.5V ±0.2V, VDD = +2.5V ±0.2V

AC Characteristics -6 (FBGA)

Units NotesParameter Symbol Min Max

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512Mb: x4, x8, x16 DDR SDRAM

Electrical Specifications – DC and AC

Table 20: Electrical Characteristics and Recommended AC Operating Conditions (-6T)

Notes: 1–6, 16–18, 34 apply to the entire table; Notes appear on page 34;

0°C ≤ TA ≤ +70°C; VDDQ = +2.5V ±0.2V, VDD = +2.5V ±0.2V

AC Characteristics -6T (TSOP)

Units NotesParameter Symbol Min Max

Access window of DQ from CK/CK# tAC –0.70 +0.70 ns

CK high-level width tCH 0.45 0.55 tCK 31

Clock cycle time CL = 2.5 tCK (2.5) 6 13 ns 46, 52

CL = 2 tCK (2) 7.5 13 ns 46, 52

CK low-level width tCL 0.45 0.55 tCK 31

DQ and DM input hold time relative to DQS tDH 0.45 – ns 27, 32

DQ and DM input pu lse width (for each input) tDIPW 1.75 – ns 32

Access window of DQS from CK/CK# tDQSCK –0.6 +0.6 ns

DQS input high pulse width tDQSH 0.35 – tCK

DQS input low pulse width tDQSL 0.35 – tCK

DQS–DQ skew, DQS to last DQ valid, per group, per access tDQSQ – 0.45 ns 26, 27

WRITE command to first DQS latching transition tDQSS 0.75 1.25 tCK

DQ and DM input setup time relative to DQS tDS 0.45 – ns 27, 32

DQS falling edge from CK rising - hold time tDSH 0.2 – tCK

DQS falling edge to CK rising - setup time tDSS 0.2 – tCK

Half-clock period tHP tCH,

tCL –ns35

Data-out High-Z window from CK/CK# tHZ – +0.7 ns 19, 43

Address and control input hold time (fast slew rate) tIHF0.75 – ns

Address and control input hold time (slow slew rate) tIHS0.8 – ns 15

Address and control input pulse width (for each input) tIPW 2.2 – ns

Address and control input setup time (fast slew rate) tISF0.75 – ns

Address and control input setup time (slow slew rate) tISS0.8 – ns 15

Data-out Low-Z window from CK/CK# tLZ –0.7 – ns 19, 43

LOAD MODE REGISTER command cycle time tMRD 12 – ns

DQ-DQS hold, DQS to first DQ to go non-valid, per access tQH tHP -tQHS – ns 26, 27

Data hold skew factor tQHS – 0.55 ns

ACTIVE-to-READ with auto precharge command tRAP 15 – ns

ACTIVE-to-PRECHARGE command tRAS 42 70,000 ns 36, 54

ACTIVE-to-ACTIVE/AUTO REFRESH command period tRC 60 – ns

ACTIVE-to-READ or WRITE delay tRCD 15 – ns

REFRESH-to-REFRESH command

interval 256Mb tREFC – 70.3 µs 24

Average periodic refresh interval 256Mb tREFI – 7.8 µs 24

AUTO REFRESH command period 256Mb tRFC 72 – ns 50

PRECHARGE command period tRP 15 – ns

DQS read preamble tRPRE 0.9 1.1 tCK 44

DQS read postamble tRPST 0.4 0.6 tCK 44

ACTIVE bank a to ACTIVE bank b command tRRD 12 – ns

Terminating voltage delay to VSS tVTD 0 – ns

DQS write preamble tWPRE 0.25 – tCK

DQS write preamble setup time tWPRES 0 – ns 21, 22

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512Mb: x4, x8, x16 DDR SDRAM

Electrical Specifications – DC and AC

DQS write postamble tWPST 0.4 0.6 tCK 20

Write recovery time tWR 15 – ns

Internal WRITE-to-READ command delay tWTR 1 – tCK

Exit SELF REFRESH-to-non-READ

command 256Mb tXSNR 75 – ns

Exit SELF REFRESH-to-READ command tXSRD 200 – tCK

Data valid output window n/a tQH - tDQSQ ns 26

Table 20: Electrical Characteristics and Recommended AC Operating Conditions (-6T) (continued)

Notes: 1–6, 16–18, 34 apply to the entire table; Notes appear on page 34;

0°C ≤ TA ≤ +70°C; VDDQ = +2.5V ±0.2V, VDD = +2.5V ±0.2V

AC Characteristics -6T (TSOP)

Units NotesParameter Symbol Min Max

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512Mb: x4, x8, x16 DDR SDRAM

Electrical Specifications – DC and AC

Table 21: Electrical Characteristics and Recommended AC Operating Conditions (-75E)

Notes: 1–6, 16–18, 34 apply to the entire table; Notes appear on page 34;

0°C ≤ TA ≤ +70°C; VDDQ = +2.5V ±0.2V, VDD = +2.5V ±0.2V

AC Characteristics -75E

Units NotesParameter Symbol Min Max

Access window of DQ from CK/CK# tAC –0.75 +0.75 ns

CK high-level width tCH 0.45 0.55 tCK 31

Clock cycle time CL = 2.5 tCK (2.5) 7.5 13 ns 46, 52

CL = 2 tCK (2) 7.5 13 ns 46, 52

CK low-level width tCL 0.45 0.55 tCK 31

DQ and DM input hold time relative to DQS tDH 0.5 – ns 27, 32

DQ and DM input pu lse width (for each input) tDIPW 1.75 – ns 32

Access window of DQS from CK/CK# tDQSCK –0.75 +0.75 ns

DQS input high pulse width tDQSH 0.35 – tCK

DQS input low pulse width tDQSL 0.35 – tCK

DQS–DQ skew, DQS to last DQ valid, per group, per access tDQSQ – 0.5 ns 26, 27

WRITE command to first DQS latching transition tDQSS 0.75 1.25 tCK

DQ and DM input setup time relative to DQS tDS 0.5 – ns 27, 32

DQS falling edge from CK rising - hold time tDSH 0.2 – tCK

DQS falling edge to CK rising - setup time tDSS 0.2 – tCK

Half-clock period tHP tCH,

tCL –ns35

Data-out High-Z window from CK/CK# tHZ – +0.75 ns 19, 43

Address and control input hold time (fast slew rate) tIHF0.90 – ns

Address and control input hold time (slow slew rate) tIHS1–ns15

Address and control input pulse width (for each input) tIPW 2.2 – ns

Address and control input setup time (fast slew rate) tISF0.90 – ns

Address and control input setup time (slow slew rate) tISS1–ns15

Data-out Low-Z window from CK/CK# tLZ –0.75 – ns 19, 43

LOAD MODE REGISTER command cycle time tMRD 15 – ns

DQ-DQS hold, DQS to first DQ to go non-valid, per access tQH tHP -tQHS – ns 26, 27

Data hold skew factor tQHS – 0.75 ns

ACTIVE-to-READ with auto precharge command tRAP 15 – ns

ACTIVE-to-PRECHARGE command tRAS 40 120,000 ns 36, 54

ACTIVE-to-ACTIVE/AUTO REFRESH command period tRC 60 – ns

ACTIVE-to-READ or WRITE delay tRCD 15 – ns

REFRESH-to-REFRESH command

interval 256Mb tREFC – 70.3 µs 24

Average periodic refresh interval 256Mb tREFI – 7.8 µs 24

AUTO REFRESH command period 256Mb tRFC 75 – ns 50

PRECHARGE command period tRP 15 – ns

DQS read preamble tRPRE 0.9 1.1 tCK 44

DQS read postamble tRPST 0.4 0.6 tCK 44

ACTIVE bank a to ACTIVE bank b command tRRD 15 – ns

Terminating voltage delay to VSS tVTD 0 – ns

DQS write preamble tWPRE 0.25 – tCK

DQS write preamble setup time tWPRES 0 – ns 21, 22

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512Mb: x4, x8, x16 DDR SDRAM

Electrical Specifications – DC and AC

DQS write postamble tWPST 0.4 0.6 tCK 20

Write recovery time tWR 15 – ns

Internal WRITE-to-READ command delay tWTR 1 – tCK

Exit SELF REFRESH-to-non-READ

command 256Mb tXSNR 75 – ns

Exit SELF REFRESH-to-READ command tXSRD 200 – tCK

Data valid output window n/a tQH - tDQSQ ns 26

Table 21: Electrical Characteristics and Recommended AC Operating Conditions (-75E) (continued)

Notes: 1–6, 16–18, 34 apply to the entire table; Notes appear on page 34;

0°C ≤ TA ≤ +70°C; VDDQ = +2.5V ±0.2V, VDD = +2.5V ±0.2V

AC Characteristics -75E

Units NotesParameter Symbol Min Max

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512Mb: x4, x8, x16 DDR SDRAM

Electrical Specifications – DC and AC

Table 22: Electrical Characteristics and Recommended AC Operating Conditions (-75Z)

Notes: 1–6, 16–18, 34 apply to the entire table; Notes appear on page 34;

0°C ≤ TA ≤ +70°C; VDDQ = +2.5V ±0.2V, VDD = +2.5V ±0.2V

AC Characteristics -75Z

Units NotesParameter Symbol Min Max

Access window of DQ from CK/CK# tAC –0.75 +0.75 ns

CK high-level width tCH 0.45 0.55 tCK 31

Clock cycle time CL = 2.5 tCK (2.5) 7.5 13 ns 46

CL = 2 tCK (2) 7.5 13 ns 46

CK low-level width tCL 0.45 0.55 tCK 31

DQ and DM input hold time relative to DQS tDH 0.5 – ns 27, 32

DQ and DM input pu lse width (for each input) tDIPW 1.75 – ns 32

Access window of DQS from CK/CK# tDQSCK –0.75 +0.75 ns

DQS input high pulse width tDQSH 0.35 – tCK

DQS input low pulse width tDQSL 0.35 – tCK

DQS–DQ skew, DQS to last DQ valid, per group, per access tDQSQ – 0.5 ns 26, 27

WRITE command-to-first DQS latching transition tDQSS 0.75 1.25 tCK

DQ and DM input setup time relative to DQS tDS 0.5 – ns 27, 32

DQS falling edge from CK rising – hold time tDSH 0.2 – tCK

DQS falling edge to CK rising – setup time tDSS 0.2 – tCK

Half-clock period tHP tCH,tCL – ns 35

Data-out High-Z window from CK/CK# tHZ – +0.75 ns 19, 43

Address and control input hold time (fast slew rate) tIHF0.90 – ns

Address and control input hold time (slow slew rate) tIHS1–ns15

Address and control input pulse width (for each input) tIPW 2.2 – ns

Address and control input setup time (fast slew rate) tISF0.90 – ns

Address and control input setup time (slow slew rate) tISS1–ns15

Data-out Low-Z window from CK/CK# tLZ –0.75 – ns 19, 43

LOAD MODE REGISTER command cycle time tMRD 15 – ns

DQ–DQS hold, DQS to first DQ to go non-valid, per access tQH tHP -tQHS – ns 26, 27

Data hold skew factor tQHS – 0.75 ns

ACTIVE-to-READ with auto precharge command tRAP 20 – ns

ACTIVE-to-PRECHARGE command tRAS 40 120,000 ns 36

ACTIVE-to-ACTIVE/AUTO REFRESH command period tRC 65 – ns

ACTIVE-to-READ or WRITE delay tRCD 20 – ns

REFRESH-to-REFRESH command

interval 256Mb tREFC – 70.3 µs 24

Average periodic refresh interval 256Mb tREFI – 7.8 µs 24

AUTO REFRESH command period 256Mb tRFC 75 – ns 50

PRECHARGE command period tRP 20 – ns

DQS read preamble tRPRE 0.9 1.1 tCK 44

DQS read postamble tRPST 0.4 0.6 tCK 44

ACTIVE bank a to ACTIVE bank b command tRRD 15 – ns

Terminating voltage delay to VDD tVTD 0 – ns

DQS write preamble tWPRE 0.25 – tCK

DQS write preamble setup time tWPRES 0 – ns 21, 22

DQS write postamble tWPST 0.4 0.6 tCK 20

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512Mb: x4, x8, x16 DDR SDRAM

Electrical Specifications – DC and AC

Write recovery time tWR 15 – ns

Internal WRITE-to-READ command delay tWTR 1 – tCK

Exit SELF REFRESH-to-non-READ

command 256Mb tXSNR 75 – ns

Exit SELF REFRESH-to-READ command tXSRD 200 – tCK

Data valid output window n/a tQH - tDQSQ ns 26

Table 22: Electrical Characteristics and Recommended AC Operating Conditions (-75Z) (continued)

Notes: 1–6, 16–18, 34 apply to the entire table; Notes appear on page 34;

0°C ≤ TA ≤ +70°C; VDDQ = +2.5V ±0.2V, VDD = +2.5V ±0.2V

AC Characteristics -75Z

Units NotesParameter Symbol Min Max

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512Mb: x4, x8, x16 DDR SDRAM

Electrical Specifications – DC and AC

Table 23: Electrical Characteristics and Recommended AC Operating Conditions (-75)

Notes: 1–6, 16–18, 34 apply to the entire table; Notes appear on page 34;

0°C ≤ TA ≤ +70°C; VDDQ = +2.5V ±0.2V, VDD = +2.5V ±0.2V

AC Characteristics -75

Units NotesParameter Symbol Min Max

Access window of DQ from CK/CK# tAC –0.75 +0.75 ns

CK high-level width tCH 0.45 0.55 tCK 31

Clock cycle time CL = 2.5 tCK (2.5) 7.5 13 ns 46

CL = 2 tCK (2) 10 13 ns 46

CK low-level width tCL 0.45 0.55 tCK 31

DQ and DM input hold time relative to DQS tDH 0.5 – ns 27, 32

DQ and DM input pu lse width (for each input) tDIPW 1.75 – ns 32

Access window of DQS from CK/CK# tDQSCK –0.75 +0.75 ns

DQS input high pulse width tDQSH 0.35 – tCK

DQS input low pulse width tDQSL 0.35 – tCK

DQS–DQ skew, DQS to last DQ valid, per group, per access tDQSQ – 0.5 ns 26, 27

WRITE command-to-first DQS latching transition tDQSS 0.75 1.25 tCK

DQ and DM input setup time relative to DQS tDS 0.5 – ns 27, 32

DQS falling edge from CK rising – hold time tDSH 0.2 – tCK

DQS falling edge to CK rising – setup time tDSS 0.2 – tCK

Half-clock period tHP tCH,tCL – ns 35

Data-out High-Z window from CK/CK# tHZ – +0.75 ns 19, 43

Address and control input hold time (fast slew rate) tIHF0.90 – ns

Address and control input hold time (slow slew rate) tIHS1–ns15

Address and control input pulse width (for each input) tIPW 2.2 – ns

Address and control input setup time (fast slew rate) tISF0.90 – ns

Address and control input setup time (slow slew rate) tISS1–ns15

Data-out Low-Z window from CK/CK# tLZ –0.75 – ns 19, 43

LOAD MODE REGISTER command cycle time tMRD 15 – ns

DQ–DQS hold, DQS to first DQ to go non-valid, per access tQH tHP -tQHS – ns 26, 27

Data hold skew factor tQHS – 0.75 ns

ACTIVE-to-READ with auto precharge command tRAP 20 – ns

ACTIVE-to-PRECHARGE command tRAS 40 120,000 ns 36

ACTIVE-to-ACTIVE/AUTO REFRESH command period tRC 65 – ns

ACTIVE-to-READ or WRITE delay tRCD 20 – ns

REFRESH-to-REFRESH command

interval 256Mb tREFC – 70.3 µs 24

Average periodic refresh interval 256Mb tREFI – 7.8 µs 24

AUTO REFRESH command period 256Mb tRFC 75 – ns 50

PRECHARGE command period tRP 20 – ns

DQS read preamble tRPRE 0.9 1.1 tCK 44

DQS read postamble tRPST 0.4 0.6 tCK 44

ACTIVE bank a to ACTIVE bank b command tRRD 15 – ns

Terminating voltage delay to VDD tVTD 0 – ns

DQS write preamble tWPRE 0.25 – tCK

DQS write preamble setup time tWPRES 0 – ns 21, 22

DQS write postamble tWPST 0.4 0.6 tCK 20

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Electrical Specifications – DC and AC

Write recovery time tWR 15 – ns

Internal WRITE-to-READ command delay tWTR 1 – tCK

Exit SELF REFRESH-to-non-READ

command 256Mb tXSNR 75 – ns

Exit SELF REFRESH-to-READ command tXSRD 200 – tCK

Data valid output window n/a tQH - tDQSQ ns 26

Table 24: Input Slew Rate Derating Values for Addresses and Commands

Note: 15 applies to the entire table; Notes appear on page 34;

0°C ≤ TA ≤ +70°C; VDDQ = +2.5V ±0.2V, VDD = +2.5V ±0.2V

Speed Slew Rate tIS tIH Units

-75Z/-75E 0.500 V/ns 1.00 1 ns

-75Z/-75E 0.400 V/ns 1.05 1 ns

-75Z/-75E 0.300 V/ns 1.10 1 ns

Table 25: Input Slew Rate Derating Values for DQ, DQS, and DM

Note: 32 applies to the entire table; Notes appear on page 34;

0°C ≤ TA ≤ +70°C; VDDQ = +2.5V ±0.2V, VDD = +2.5V ±0.2V

Speed Slew Rate tDS tDH Units

-75Z/-75E 0.500 V/ns 0.50 0.50 ns

-75Z/-75E 0.400 V/ns 0.55 0.55 ns

-75Z/-75E 0.300 V/ns 0.60 0.60 ns

Table 23: Electrical Characteristics and Recommended AC Operating Conditions (-75) (continued)

Notes: 1–6, 16–18, 34 apply to the entire table; Notes appear on page 34;

0°C ≤ TA ≤ +70°C; VDDQ = +2.5V ±0.2V, VDD = +2.5V ±0.2V

AC Characteristics -75

Units NotesParameter Symbol Min Max

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Electrical Specifications – DC and AC

Notes 1. All v o ltages referenced to VSS.

2. Tests for AC timing, IDD, and electrical AC and DC characteristics may be conducted

at nominal reference/supply voltage levels, but the related specifications and the

device operation are guaranteed for the full voltage range specified.

3. Outputs (except for IDD measurements) measured with equivalent load:

4. AC timing and IDD tests may use a VIL-to-VIH swing of up to 1.5V in the test environ-

ment, but input timing is still r efer enced to VREF (or to the crossing point for CK/CK#),

and parameter specifications are guaranteed for the specified AC input levels under

normal use conditions. The minimum slew rate for the input signals used to test the

device is 1 V/ns in th e range be twe e n VIL(AC) and VIH(AC).

5. The AC and DC input level specifications are as defined in the SSTL_2 standard (that

is, the receiver will effectively switch as a result of the signal crossing the AC input

level and will remain in that state as long as the signal does not ring back above

[below] the DC input LOW [HIGH] level).

6. All speed grades are not offered on all densities. Refer to page 1 for availability.

7. VREF is expected to equal VDDQ/2 of the transmitting device and to track variations in

the DC level of the same. Peak-to-peak noise (noncommon mode) on VREF may not

exceed ±2% of the DC value. Thus, from VDDQ/2, VREF is allowed ±25mV for DC error

and an additional ±25mV for AC noise . This measur ement is to be taken at the nearest

VREF bypass capacitor.

8. VTT is not applied directly to the device. VTT is a system supply for signal termination

resistors, it is expecte d to be se t equal to VREF, and it must track variations in the DC

level of VREF.

9. VID is the magnitude of the difference between the input level on CK and the input

level on CK#.

10. The value of VIX and VMP is expected to equal VDDQ/2 of the transmitting device and

must track variations in the DC level o f t he same.

11. IDD is dependent on output loading and cycle rates . Specified values are obtained

with minimum cycle times at CL = 3 for -5B; CL = 2.5, -6/-6T/-75; and CL = 2,

-75E/-75Z speeds with the outputs open.

12. Enables on-chip refresh and address counters.

13. IDD specifications are tested after the device is properly initialized and is averaged at

the defined cycle rate.

14. This parameter is sampled. VDD = +2.5V ±0.2V, VDDQ = +2.5V ±0.2V, VREF = VSS,

f = 100 MHz, TA = 25°C, VOUT(DC) = VDDQ/2, VOUT (peak-to-peak) = 0.2V. DM input is

grouped with I/O pins, reflecting the fact that they are matched in loading.

15. For slew rates less than 1 V/ns and greater than or equal to 0.5 V/ns. If the slew rate is

less than 0.5 V/ns, timing must be derated: tIS has an additional 50ps per each

100 mV/ns reduction in slew rate from the 500 mV/ns. tIH has 0ps added, that is, it

remai ns constant. If the slew rate ex ceeds 4.5 V/ns , functionality is uncertain. F or -5B ,

-6, and -6T, slew rates must be gr eater than or equal to 0.5 V/ns.

Output

(VOUT)Reference

point

50Ω

VTT

30pF

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Electrical Specifications – DC and AC

16. The CK/CK# input reference level (for timing referenced to CK/CK#) is the point at

which CK and CK# cross; the input reference level for signals other than CK/CK# is

VREF.

17. Inputs ar e not recognized as valid until VREF stabilizes . On ce i nitial ize d, inc luding self

refresh mode, VREF must be powered within specified range. Exception: during the

period before VREF stabilizes, CKE < 0.3 × VDD is recognized as LOW.

18. The output timing reference level, as measured at the timing reference point (indi-

cated in Note 3), is VTT.

19. tHZ and tLZ transitions occur in the same access time windows as data valid transi-

tions. These parameters are not referenced to a specific voltage level, but specify

when the device output is no longer driving (High-Z) or begins driving (Low-Z).

20. The intent of the “Don’t Care” state after completion of the postamble is the DQS-

driven signal should either be HIGH, LOW, or High-Z, and that any signal transition

within the input switch ing region must follow valid input requirements. That is, if

DQS transitions HIGH (above VIH[DC] MIN) then it must not transition L OW (below

VIH[DC] prior to tDQSH [MIN]).

21. This is not a device limit. The device will operate with a negative value, but system

performance could be degraded due to bus turnaround.

22. It is recommended that DQS be valid (HIGH or L OW) on or before the WRITE com-

mand. The case shown (DQS going from H igh-Z to logic LOW) applies when no

WRITEs were previously in progress on the bus. If a previous WRITE was in progress,

DQS could be HIGH during this time, depending on tDQSS.

23. MIN (tRC or tRFC) for IDD measurements is the smallest multiple of tCK that meets the

minimum absolute value for the respective parameter. tRAS (MAX) for IDD measure-

ments is the largest multiple of tCK that meets the maximum absolute value for tRAS.

24. The refresh period is 64ms. This equates to an average refresh rate of 7.8125µs

(15.625µs for 128Mb DDR). H owever, an AUTO REFRESH command must be asserted

at least once every 70.3µs (140.6µs for 128Mb DDR); burst refreshing or posting b y the

DRAM controller greater than 8 REFRESH cycles is not allowed.

25. The I/O capacitance per DQS and DQ byte/group will not differ by more than this

maximum amount for any given device.

26. The data valid window is derived b y achieving other specifications: tHP (tCK/2),

tDQSQ, and tQH (tQH = tHP - tQHS). The data valid window derates in direct pr opor-

tion to the clock duty cycle and a practical data valid window can be derived. The

clock is allowed a maximum duty cycle variation of 45/55, because functionality is

uncertain when operating beyond a 45/55 ratio. The data valid window derating

curves are provided in Figure 12 on page 36 for duty cycles ranging be tween 50/50

and 45/55.

27. Refer enced to each output group: x4 = DQS with DQ0–DQ3; x8 = DQS with DQ0–DQ7;

x16 = LDQS with DQ0–DQ7 and UDQS with DQ8–DQ15.

28. This limit is actually a nominal value and does not result in a fail value. CKE is HIGH

during the REFRESH command period (tRFC [MIN]), else CKE is LOW (that is, during

standby).

29. To maintain a valid level, the transitioni ng e dg e of the input mus t:

29a. Sustain a constant slew rate from the current AC level through to the target AC

level, VIL(AC) or VIH(AC).

29b. Reach at least the target AC level.

29c. After the AC target level is reached, continue to maintain at least the target DC

level, VIL(DC) or VIH(DC).

30. The input capacitance per pin group will not differ by more than this maximum

amount for any given device.

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Electrical Specifications – DC and AC

31. CK and CK# input slew rate must be ≥1 V/ns (≥2 V/ns if measured differentially).

Figure 12: Derating Data Valid Window (tQH – tDQSQ)

32. DQ and DM input slew r ates must not deviate from DQS b y mor e than 10%. If the DQ/

DM/DQS slew rate is less than 0.5 V/ns, timing must be derated: 50ps must be added

to tDS and tDH for each 100 mV/ns reduction in slew rate. For -5B, -6, and

-6T speed grades, the slew rate must be ≥0.5 V/ns. If the slew rate exceeds 4 V/ns,

functionality is uncertain.

33. VDD must not vary more than 4% if CKE is not active while any bank is active.

34. The clock is allowed up to ±150ps of jitter. Each timing parameter is allowed to vary by

the same amount.

35. tHP (MIN) is the lesser of tCL (MIN) and tCH (MIN) actually applied to the device CK

and CK# inputs, collectively, during bank active.

36. READs and WRITEs with auto pr echar ge ar e not all o wed to be issued until tRAS (MIN)

can be satisfied prior to the internal PRECHARGE command being issued.

37. Any positive glitch must be less than 1/3 of the clock cycle and not more than +400mV

or 2.9V (+300mV or 2.9V maximum for -5B), whichever is less. Any neg a tive glitch

must be less than 1/3 of the clock cycl e and not excee d either –300mV or 2.2V (2.4V for

-5B), whichever is more positive. The average cannot be belo w the +2.5V (2.6V for -5B)

minimum.

38. Normal output drive curves:

38a. The full driver pull-down current variation from MIN to MAX process; tempera-

ture and voltage will lie within the outer bounding lines of the V-I curve of

Figure 13 on page 37.

38b. The driver pull-down current variation, within nominal voltage and temperature

limits, is expected, but not guaranteed, to lie within the inner bounding lines of

the V-I curve of Figure 13 on page 37.

38c. The full driver pull-up current variation from MIN to MAX process; temperature

and voltage will lie within the outer bounding lines of the V -I curve of Figure 14 on

page 37.

3.0ns

2.5ns

2.0ns

1.5ns

1.0ns 50/50 49/51 48/53 46/54 47/53 45/55

-6T @ tCK = 7.5ns

-75E / -75 @ tCK = 7.5ns

-6 @ tCK = 6ns

-6T @ tCK = 6ns

-5B @ tCK = 5ns

1.48 1.45 1.43 1.40 1.38 1.35

2.75

2.60 2.56 2.53 2.45 2.41 2.38

2.68

2.35 2.31 2.28

2.13

2.20 2.16

2.43

2.10 2.07 2.04

1.89 1.86 1.83 1.80

1.98 1.95

2.00 1.97 1.94 1.91 1.88

1.73 1.70

1.82 1.79

1.58 1.55

Clock Dut

cle

Data Valid Window

2.71

2.46

1.53

2.64

2.39

1.92

1.76

1.85

1.60

1.50

2.49

2.50

2.24

2.01

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512Mb: x4, x8, x16 DDR SDRAM

Electrical Specifications – DC and AC

38d. The driver pull-up current variation within nominal limits of voltage and temper-

ature is expected, but not guaranteed, to lie within the inner bounding lines of the

V-I curve of Figure 14 on page 37.

38e. The full ratio variation of MAX to MIN pull-up and pull-down current should be

between 0.71 and 1.4 for drain-to-source voltages from 0.1V to 1.0V at the same

voltage and temperature.

38f. The full ratio variation of the nominal pull-up to pull-down current should be

unity ±10% for device drain-to-source voltages from 0.1V to 1.0V.

Figure 13: Full Drive Pull-Down Characteristics

Figure 14: Full Drive Pull-Up Characteristics

39. Reduced output drive curves:

39a. The full driver pull-down current variation from MIN to MAX process; tempera-

ture and voltage will lie within the outer bounding lines of the V-I curve of

Figure 15 on page 38.

39b. The driver pull-down current variation, within nominal voltage and temperature

limits, is expected, but not guaranteed, to lie within the inner bounding lines of

the V-I curve of Figure 15 on page 38.

39c. The full driver pull-up current variation from MIN to MAX process; temperature

and voltage will lie within the outer bounding lines of the V-I curve of Figure 16.

39d. The driver pull-up current variation, within nominal voltage and temperature

limits, is expected, but not guaranteed, to lie within the inner bounding lines of

the V-I curve of Figure 16 on page 38.

100

120

140

160

0.0 0.5 1.0 1.5 2.0 2.5

OUT

(mA)

OUT

(V)

-200

-180

-160

-140

-120

-100

-8 0

-6 0

-4 0

-2 0

0. 0 0 . 5 1. 0 1 . 5 2. 0 2 . 5

OUT

(mA)

Q - V

OUT

(V)

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512Mb: x4, x8, x16 DDR SDRAM

Electrical Specifications – DC and AC

39e. The full ratio variation of the MAX-to-MIN pull- up and pull-down current should

be between 0.71 and 1.4 for device drain-to-source voltages from 0.1V to 1.0V at

the same voltage and temperature.

39f. The full ratio variation of the nominal pull-up to pull-down current should be

unity ±10%, for device drain-to-source voltages from 0.1V to 1.0V.

Figure 15: Reduced Drive Pull-Down Characteristics

Figure 16: Reduced Drive Pull-Up Characteristics

40. The voltage levels used are derived from a minimum VDD level and the referenced test

load. In practice, the voltage levels obtained from a properly terminated bus will pro-

vide significantly different voltage values.

41. VIH overshoot: VIH (MAX) = VDDQ + 1.5V for a pulse width ≤ 3ns, and the pulse

width can not be greater than 1/3 of the cycle rate. VIL undershoot: VIL (MIN) = –1.5V

for a pulse width ≤ 3ns, and the pulse width can not be greater than 1/3 of the cycle

rate.

42. VDD and VDDQ must track each other.

43. tHZ (MAX) will prevail over tDQSCK (MAX) + tRPST (MAX) condition. tLZ (MIN) will

prevail over tDQSCK (MIN) + tRPRE (MAX) condition.

44. tRPST end point and tRPRE begin point are not referenced to a specific voltage level

but specify when the device output is no longer driving (tRPST) or begins driving

(tRPRE).

0 . 00 . 5 1 . 01 . 5

2.0 2.5

IOUT (mA)

VOUT (V)

-80

-70

-60

-50

-40

-30

-20

-10

0.0 0.5 1.0 1.5 2.0 2.5

OUT

(mA)

Q - V

OUT

(V)

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512Mb: x4, x8, x16 DDR SDRAM

Electrical Specifications – DC and AC

45. During initialization, VDDQ, VTT, and VREF must be equal to or less than VDD + 0.3V.

Alternatively, VTT may be 1.35V maximum during power -up , even if VDD/VDDQ ar e 0V,

provided a minimum of 42Ω of series resistance is used between the VTT supply and

the input pin.

46. The current Micron part operates below 83 MHz (slowest specified JEDEC operating

frequency). As such, future die may not reflect this option.

47. When an input signal is HIGH or LOW, it is defined as a steady state logic HIGH or

LOW.

48. Random address is changing; 50% of data is changing at every transfer.

49. Random address is changing; 100% of data is changing at every transfer.

50. CKE must be active (HIGH) during the entire time a REFRESH command is executed.

That is, from the time the AUTO REFRESH command is registered, CKE must be

active at each rising clock edge, until tRFC has been satisfied.

51. IDD2N spec ifies the DQ, DQS, and DM to be driven to a valid HIGH or LOW logic level.

IDD2Q is similar to IDD2F except IDD2Q specifies the address and control inputs to

remain stable. Although IDD2F, IDD2N, and IDD2Q are similar, IDD2F is “worst case.”

52. Whenever the operating frequency is altered, not including jitter, the DLL is required

to be reset followed by 200 clock cycles before any READ command.

53. This is the DC voltage supplied at the DRAM and is inclusive of all noise up to 20 MHz.

Any noise above 20 MHz at the DRAM generated from any source other than that of

the DRAM itself may not exceed the DC voltage range of 2.6V ±100mV.

54. The -6/-6T speed grades will operate with tRAS (MIN) = 40ns and

tRAS (MAX) = 120,000ns at any slower frequency.

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512Mb: x4, x8, x16 DDR SDRAM

Electrical Specifications – DC and AC

Table 26: Normal Output Drive Characteristics

Characteristics are specified under best, worst, and nominal process variation/conditions

Voltage

(V)

Pull-Down Current (mA) Pull-Up Current (mA)

Nominal

Low Nominal

High Min Max Nominal

Low Nominal

High Min Max

0.1 6.0 6.8 4.6 9.6 –6.1 –7.6 –4.6 –10.0

0.2 12.2 13.5 9.2 18.2 –12.2 –14.5 –9.2 –20.0

0.3 18.1 20.1 13.8 26.0 –18.1 –21.2 –13.8 –29.8

0.4 24.1 26.6 18.4 33.9 –24.0 –27.7 –18.4 –38.8

0.5 29.8 33.0 23.0 41.8 –29.8 –34.1 –23.0 –46.8

0.6 34.6 39.1 27.7 49.4 –34.3 –40.5 –27.7 –54.4

0.7 39.4 44.2 32.2 56.8 –38.1 –46.9 –32.2 –61.8

0.8 43.7 49.8 36.8 63.2 –41.1 –53.1 –36.0 –69.5

0.9 47.5 55.2 39.6 69.9 –43.8 –59.4 –38.2 –77.3

1.0 51.3 60.3 42.6 76.3 –46.0 –65.5 –38.7 –85.2

1.1 54.1 65.2 44.8 82.5 –47.8 –71.6 –39.0 –93.0

1.2 56.2 69.9 46.2 88.3 –49.2 –77.6 –39.2 –100.6

1.3 57.9 74.2 47.1 93.8 –50.0 –83.6 –39.4 –108.1

1.4 59.3 78.4 47.4 99.1 –50.5 –89.7 –39.6 –115.5

1.5 60.1 82.3 47.7 103.8 –50.7 –95.5 –39.9 –123.0

1.6 60.5 85.9 48.0 108.4 –51.0 –101.3 –40.1 –130.4

1.7 61.0 89.1 48.4 112.1 –51.1 –107.1 –40.2 –136.7

1.8 61.5 92.2 48.9 115.9 –51.3 –112.4 –40.3 –144.2

1.9 62.0 95.3 49.1 119.6 –51.5 –118.7 –40.4 –150.5

2.0 62.5 97.2 49.4 123.3 –51.6 –124.0 –40.5 –156.9

2.1 62.8 99.1 49.6 126.5 –51.8 –129.3 –40.6 –163.2

2.2 63.3 100.9 49.8 129.5 –52.0 –134.6 –40.7 –169.6

2.3 63.8 101.9 49.9 132.4 –52.2 –139.9 –40.8 –176.0

2.4 64.1 102.8 50.0 135.0 –52.3 –145.2 –40.9 –181.3

2.5 64.6 103.8 50.2 137.3 –52.5 –150.5 –41.0 –187.6

2.6 64.8 104.6 50.4 139.2 –52.7 –155.3 –41.1 –192.9

2.7 65.0 105.4 50.5 140.8 –52.8 –160.1 –41.2 –198.2

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Electrical Specifications – DC and AC

Table 27: Reduced Output Drive Characteristics

Characteristics are specified under best, worst, and nominal process variation/conditions

Voltage

(V)

Pull-Down Current (mA) Pull-Up Current (mA)

Nominal

Low Nominal

High Min Max Nominal

Low Nominal

High Min Max

0.1 3.4 3.8 2.6 5.0 –3.5 –4.3 –2.6 –5.0

0.2 6.9 7.6 5.2 9.9 –6.9 –7.8 –5.2 –9.9

0.3 10.3 11.4 7.8 14.6 –10.3 –12.0 –7.8 –14.6

0.4 13.6 15.1 10.4 19.2 –13.6 –15.7 –10.4 –19.2

0.5 16.9 18.7 13.0 23.6 –16.9 –19.3 –13.0 –23.6

0.6 19.9 22.1 15.7 28.0 –19.4 –22.9 –15.7 –28.0

0.7 22.3 25.0 18.2 32.2 –21.5 –26.5 –18.2 –32.2

0.8 24.7 28.2 20.8 35.8 –23.3 –30.1 –20.4 –35.8

0.9 26.9 31.3 22.4 39.5 –24.8 –33.6 –21.6 –39.5

1.0 29.0 34.1 24.1 43.2 –26.0 –37.1 –21.9 –43.2

1.1 30.6 36.9 25.4 46.7 –27.1 –40.3 –22.1 –46.7

1.2 31.8 39.5 26.2 50.0 –27.8 –43.1 –22.2 –50.0

1.3 32.8 42.0 26.6 53.1 –28.3 –45.8 –22.3 –53.1

1.4 33.5 44.4 26.8 56.1 –28.6 –48.4 –22.4 –56.1

1.5 34.0 46.6 27.0 58.7 –28.7 –50.7 –22.6 –58.7

1.6 34.3 48.6 27.2 61.4 –28.9 –52.9 –22.7 –61.4

1.7 34.5 50.5 27.4 63.5 –28.9 –55.0 –22.7 –63.5

1.8 34.8 52.2 27.7 65.6 –29.0 –56.8 –22.8 –65.6

1.9 35.1 53.9 27.8 67.7 –29.2 –58.7 –22.9 –67.7

2.0 35.4 55.0 28.0 69.8 –29.2 –60.0 –22.9 –69.8

2.1 35.6 56.1 28.1 71.6 –29.3 –61.2 –23.0 –71.6

2.2 35.8 57.1 28.2 73.3 –29.5 –62.4 –23.0 –73.3

2.3 36.1 57.7 28.3 74.9 –29.5 –63.1 –23.1 –74.9

2.4 36.3 58.2 28.3 76.4 –29.6 –63.8 –23.2 –76.4

2.5 36.5 58.7 28.4 77.7 –29.7 –64.4 –23.2 –77.7

2.6 36.7 59.2 28.5 78.8 –29.8 –65.1 –23.3 –78.8

2.7 36.8 59.6 28.6 79.7 –29.9 –65.8 –23.3 –79.7

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Commands

Commands Tables 28 and 29 provide a quick r eference of available commands . Two additional Truth

Tables—Table 30 on page 43 and Table 31 on page 44—provide current state/next state

information.

Notes: 1. DESELECT and NOP are functionally intercha ngeabl e.

2. BA0–BA1 provide bank address and A0–An (128Mb: n = 11; 256Mb and 512Mb: n = 12; 1Gb:

n = 13) provide row address.

3. BA0–BA1 provide bank address; A0–Ai provide column address, (where Ai is the most signif-

icant column address bit for a given density and configuration, see Table 2 on page 2) A10

HIGH enables the auto precharge feature (non persistent), and A10 LOW disables the auto

precharge feature.

4. Applies only to READ bursts with auto pre charg e di sable d; th is com mand is und efine d (an d

should not be used) for READ bursts with auto precharge enabled and for WRITE bursts.

5. A10 LOW: BA0–BA1 determine which bank is precharged. A10 HIGH: all banks are pre-

charged and BA0–BA1 are “Don’t Care.”

6. This command is AUTO REFRESH if CKE is HIGH; SELF REFRESH if CKE is LOW.

7. Internal refresh counter controls row addressing while in self refresh mode, all inputs and

I/Os are “Don’t Care” except for CKE.

8. BA0–BA1 select either the mode register or the extended mode register (BA0 = 0, BA1 = 0

select the mode register; BA0 = 1, BA1 = 0 select extended mode register; other combina-

tions of BA0–BA1 are reserved). A0–An provide the op-code to be written to the selected

mode register.

Table 28: Truth Ta ble 1 – Commands

CKE is HIGH for all commands shown except SELF REFRESH; All states and sequences not shown are illegal or

reserved

Function CS# RAS# CAS# WE# Address Notes

DESELECT HXXX X 1

NO OPERATION (NOP) LHHH X 1

ACTIVE (select bank and activate row) L L H H Bank/row 2

READ (select bank and column and start READ burst) L H L H Bank/col 3

WRITE (select bank and column and start WRITE burst) L H L L Bank/col 3

BURST TERMINATE LHHL X 4

PRECHARGE (deactivate row in bank or banks) L L H L Code 5

AUTO REFRESH or SELF REFRESH

(enter self refresh mode) LLLH X6, 7

LOAD MODE REGISTER LLLLOp-code8

Table 29: Truth Table 2 – DM Operation

Used to mask write data, provided coincident wit h the corresponding data

Name (Function) DM DQ

Write enable L Valid

Write inhibit H X

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512Mb: x4, x8, x16 DDR SDRAM

Commands

Notes: 1. This table applies when CKEn-1 was HIGH and CKEn is HIGH (see Table 33 on page 46) and

after tXSNR has been met (if the previous state was self refresh).

2. This table is bank-specific, except where noted (that is, the current state is for a specif ic

bank and the commands shown are thos e allowed to be issued to that bank when in that

state). Exceptions are covered in the notes below.

3. Current state definitions:

• Idle: The bank has been precharged, and tRP has been met.

• Row active: A row in the bank has been activated, and tRCD has been met. No data

bursts/accesses and no register accesses are in progress.

• Read: A READ burst has been initiated, with auto precharge disabled, and has no t yet

terminated or been terminated.

• Write: A WRITE burst has been initiated, with auto precharge disabled, and has not yet

terminated or been terminated.

4. The following states must not be interrupted by a command issued to the same bank. COM-

MAND INHIBIT or NOP commands, or allowable commands to the other bank should be

issued on any clock edge occurring during these states. Allowable commands to the other

bank are determined by its current state and Table 30 and according to Table 31 on

page 44.

• Precharging: Star ts with registration of a PREC H A RGE command an d ends when tRP is

met. Once tRP is met, the bank will be in the idle state.

• Row activating: Starts with registration of an ACTIVE command and ends when tRCD is

met. Once tRCD is met, the bank will be in the “row active” state.

• Read with auto prech ar ge enabled : Sta r ts with registration of a READ command with

auto precharge enabled an d ends when tRP has been met. Once tRP is met, the bank

will be in the idle state.

• Write with auto precharge enabled: Starts with registration of a WRITE command with

auto precharge enabled an d ends when tRP has been met. Once tRP is met, the bank

will be in the idle state.

5. The following states must not be interrupted by any executable command; COMMAND

INHIBIT or NOP commands must be applied on each positive clock edge during these states.

Table 30: Truth Ta ble 3 – Current State Bank n – Command to Bank n

Notes: 1–6 apply to the entire table; Notes appear below

Current State CS# RAS# CAS# WE# Command/Action Notes

Any HXXX

DESELECT (NOP/continue previous operation)

LHHH

NO OPERATIO N (NOP/conti nue previous operation)

Idle LLHH

ACTIVE (select and activate row)

LLLH

AUTO REFRESH 7

LLLL

LOAD MODE REGISTER 7

Row active LHLH

READ (select column and start READ burst) 10

LHLL

WRITE (select column and start WRITE burst) 10

LLHL

PRECHARGE (deactivate row in bank or banks) 8

Read

(auto precharge

disabled)

LHLH

READ (select column and start new READ burst) 10

LHLL

WRITE (select column and start WRITE burst) 10, 12

LLHL

PRECHARGE (truncate READ burst, start PRECHARGE) 8

LHHL

BURST TER MINATE 9

Write

(auto precharge

disabled)

LHLH

READ (select column and start READ burst) 10, 11

LHLL

WRITE (select column and start new WRITE burst) 10

LLHL

PRECHARGE (truncate WRITE burst, start

PRECHARGE) 8, 11

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512Mb: x4, x8, x16 DDR SDRAM

Commands

• Refreshing: Starts with registration of an AUTO REFRESH command and ends when tRFC

is met. Once tRFC is met, the DDR SDRAM will be in the all banks idle state.

• Accessing mode register: Starts with registration of an LMR comma nd and ends wh en

tMRD has been met. Once tMRD is met, the DDR SDRAM will be in the all banks id le

state.

• Precharging all: Starts with registration of a PRECHARGE ALL command and ends when

tRP is met. Once tRP is met, all banks will be in the idle state.

6. All states and sequences not shown are illegal or reserved.

7. Not bank-specific; requires that all banks are idle, and bursts are not in progress.

8. May or may not be bank-specific; if multiple banks are to be precharged, each must be in a

valid state for precharging.

9. Not bank-specific; BURST TERMINATE affects the most recent READ burst, re gardless of

bank.

10. READs or WRITEs listed in the Command/Actio n column include READs or WRITEs with auto

precharge enabled and READs or WRITEs with auto precharge disabled.

11. Requires appropriate DM masking.

12. A WRITE command may be applied after the completion of the READ burst; otherwise, a

BURST TERMINATE must be used to end the READ burst prior to asserting a WRITE com-

mand.

Table 31: Truth Table 4 – Current State Bank n – Command to Bank m

Notes: 1–6 apply to the entire table; Notes appear on page 44

Current State CS# RAS# CAS# WE# Command/Action Notes

Any H X X X DESELECT (NOP/c ontinue previous operation)

L H H H NO OPERATIO N (NOP/conti nue previous operation)

Idle XXXXAny command otherw ise allowed to bank m

Row activating, active,

or precharging L L H H ACTIVE (select and activate row)

L H L H READ (select column and start READ burst) 7

L H L L WRITE (select column and start WRITE burst) 7

L L H L PRECHARGE

Read (auto precharge

disabled) L L H H ACTIVE (select and activate row)

L H L H READ (select column and start new READ burst) 7

L H L L WRITE (select column and start WRITE burst) 7, 9

L L H L PRECHARGE

Write (auto precharge

disabled) L L H H ACTIVE (select and activate row)

L H L H READ (select column and start READ burst) 7, 8

L H L L WRITE (select column and start new WRITE burst) 7

L L H L PRECHARGE

Read (with auto-

precharge) L L H H ACTIVE (select and activate row)

L H L H READ (select column and start new READ burst) 7

L H L L WRITE (select column and start WRITE burst) 7, 9

L L H L PRECHARGE

Write (with auto-

precharge) L L H H ACTIVE (select and activate row)

L H L H READ (select column and start READ burst) 7

L H L L WRITE (select column and start new WRITE burst) 7

L L H L PRECHARGE

Notes: 1. This table applies when CKEn-1 was HIGH and CKEn is HIGH (see Table 33 on page 46) and

after tXSNR has been met (if the previous state was self refresh).

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512Mb: x4, x8, x16 DDR SDRAM

Commands

2. This table describes alternate bank operation, except where noted (that is, the current state

is for bank n, and the commands shown are those allowed to be issued to bank m, assuming

that bank m is in such a state that the given command is allowable). Exceptions are covered

in the notes below.

3. Current state definitions:

• Idle: The bank has been precharged, and tRP has been met.

• Row active: A row in the bank has been activated, and tRCD has been met. No data

bursts/accesses and no register accesses are in progress.

• Read: A READ burst has been initiated, with auto precharge disabled, and has no t yet

terminated or been terminated.

• Write: A WRITE burst has been initiated, with auto precharge disabled, and has not yet

terminated or been terminated.

• Read with auto precharge enabled: See note 3a below.

• Write with auto precharge enabled: See note 3a below.

a. The read with auto pr echarge enabled or write with auto precharge enabled states

can each be broken into two parts: the access period and the precharge period. For

read with auto precharge, the precharge period is defined as if the same burst was

executed with auto precharge disabled and then followed with the earliest possible

PRECHARGE command that still accesses all of the data in the burst. For write with

auto precharge, the precharge period begins when tWR ends, with tWR measured as

if auto precharge was disabled. The access period starts with registration of the com-

mand and ends where the precharge period (or tRP) beg ins. This device su pports

concurrent auto precharge such that when a read with auto precharge is enabled or

a write with auto precharge is enabled, any command to other banks is allowed, as

long as that command does not interrupt the read or write data transfer already in

process. In either case, all other related limitations apply (for example, contention

between read data and write data must be avoided).

b. The minimum delay from a READ or WRITE command with auto precharge enabled,

to a command to a different bank is summarized in Table 32.

4. AUTO REFRESH and LMR commands may only be issued when all banks are idle.

5. A BURST TERMINATE command cannot be issued to another bank; it ap plies to the bank

represented by the current state only.

6. All states and sequences not shown are illegal or reserved.

7. READs or WRITEs listed in the “Command/Action” column include READs or WRITEs with

auto precharge enabled and READs or WRITEs with auto precharge disabled.

8. Requires appropriate DM masking.

9. A WRITE command may be applied after the completion of the READ burst; otherwise, a

BURST TERMINATE must be used to end the READ burst prior to asserting a WRITE com-

mand.

Table 32: Command Delays

CLRU = CL rounded up to the next integer

From

Command To Command Minimum Delay

with Concurrent Auto Precharge

WRITE with auto

precharge READ or READ with auto precharge [1 + (BL/2)] × tCK + tWTR

WRITE or WRITE with auto precharge (BL/2) × tCK

PRECHARGE 1 tCK

ACTIVE 1 tCK

READ with auto

precharge READ or READ with aut o precharge (BL/2) × tCK

WRITE or WRITE with auto precharge [CLRU + (BL/2)] × tCK

PRECHARGE 1 tCK

ACTIVE 1 tCK

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512Mb: x4, x8, x16 DDR SDRAM

Commands

Notes: 1. CKEn is the logic state of CKE at clock edge n; CKEn-1 was the state of CKE at the previous

clock edge.

2. Current state is the state of the DDR SDRAM immediately prior to clock edge n.

3. COMMANDn is the command registered at clock edge n, and ACTIONn is a result of COM-

MANDn.

4. All states and sequences not shown are illegal or reserved.

5. CKE must not drop LOW during a column access. For a READ, this means CKE must stay

HIGH until after the read postamble time (tRPST); for a WRITE, CKE must stay HIGH until the

write recovery time (tWR) has been met.

6. Once initialized, including during self refresh mode, VREF must be powered within the spec-

ified range.

7. Upon exit of the self refresh mode, the DLL is automatically enabled. A minimum of 200

clock cycles is needed before applying a READ command for the DLL to lock. DESELECT or

NOP commands should be issued on any clock edges occurr ing during the tXSNR period.

DESELECT

The DESELECT function (CS# HIGH) prevents new commands from bein g executed by

the DDR SDRAM. The DDR SDRAM is effectivel y deselected. O per ations already in pr og-

ress are not affected.

NO OPERATION (NOP)

The NO OPERATION (NOP) command is used to instruct the selected DDR SDRAM to

perform a NOP (CS# is LOW with RAS#, CAS#, and WE# are HIGH). This prevents

unwanted commands from be ing registered during id le or wait states. Operations

already in progress are not affected.

LOAD MODE REGISTER (LMR)

The mode registers are loaded via inputs A0–An (see "REGISTER DEFINITION" on page

54). The LMR command can only be issued when all banks are idle, and a subsequent

executable command cannot be issued until tMRD is met.

Table 33: Truth Table 5 – CKE

Notes 1–6 apply to the entire table; Notes appear below

CKEn-1 CKEnCurrent State CommandnActionnNotes

L L Power-down X Maintain power-down

Self refresh X Maintain self refresh

L H Power-down DESELECT or NOP Exit power-down

Self refresh DESELECT or NOP Exit self refresh 7

H L All banks idle DESELECT or NOP Precharge power-down entry

Bank(s) active DESELECT or NOP Active power-down entry

All banks idle AUTO REFRESH Self refresh entry

H H See Table 28 on page 42

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512Mb: x4, x8, x16 DDR SDRAM

Commands

ACTIVE (ACT)

The ACTIVE command is used to open (or activate) a row in a particular bank for a

subsequent access, like a read or a write, as shown in Figure 17. The value on the BA0,

BA1 inputs selects the bank, and the address provided on inputs A0–An selects the row.

Figure 17: Activating a Specific Row in a Specific Bank

CS#

WE#

CAS#

RAS#

CKE

Address Row

HIGH

BA0, BA1 Bank

CK#

Don’t Care

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512Mb: x4, x8, x16 DDR SDRAM

Commands

READ

The READ command is used to initiate a burst read access to an active row, as shown in

Figure 18 on page 48. The value on the B A0, BA1 inputs selects the bank, and the address

pro vided on inputs A0–Ai (where Ai is the most significant column add ress bit for a given

density and con fig uration, see Table 2 on page 2) selects the starting column location.

Figure 18: READ Command

Note: EN AP = enable auto precharge; DIS AP = disable auto precharge.

CS#

WE#

CAS#

RAS#

CKE

Address

A10

BA0, BA1

HIGH

CK#

Don’t Care

Col

DIS AP

EN AP

Bank

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512Mb: x4, x8, x16 DDR SDRAM

Commands

WRITE

The WRITE command is used to initiate a burst write access to an active ro w as sho wn in

Figure 19. The value on the BA0, BA1 inputs selects the bank, and the address provided

on inputs A0–Ai (where Ai is the most significant column address bit for a given density

and configuration, see Table 2 on page 2) selects the st arting column location.

Figure 19: WRITE Command

Note: EN AP = enable auto precharge; and DIS AP = disable auto pr echarge.

CS#

WE#

CAS#

RAS#

CKE

A10

BA0, BA1

HIGH

CK#

Don’t Care

Address Col

EN AP

DIS AP

Bank

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512Mb: x4, x8, x16 DDR SDRAM

Commands

PRECHARGE (PRE)

The PRECHARGE command is used to deactivate the open row in a particular bank or

the open ro w in all b anks as sho wn in Figure 20. The value on the BA0, BA1 inputs sel ects

the bank, and the A10 input selects whether a single bank is precharged or whether all

banks are precharged.

Figure 20: PRECHARGE Command

Notes: 1. If A10 is HIGH, bank address becomes “Don’t Care.”

BURST TERMINATE (BST)

The BURST TERMINATE command is used to truncate READ bursts (with auto

precharge disabled). The most recently registered READ command pr ior to the BURST

TERMINATE command will be truncated, as shown in “Operations” on page 51. The

open page from which the READ burst was terminat ed remain s open.

AUTO REFRESH (AR)

AUTO REFRESH is used during normal operation of the DDR SDRAM and is analogous

to CAS#-before-RAS# (CBR) refresh in FPM/EDO DRAMs. This command is nonpersis-

tent, so it must be issued each time a refresh is required. All banks must be idle before an

AUTO REFRESH command is issued.

SELF REFRESH

The SELF REFRESH command can be used to retain data in the DDR SDRAM, even if the

rest of the system is powered down. The SELF REFRESH command is initiated like an

AUTO REFRESH command except CKE is disabled (LOW).

CS#

WE#

CAS#

RAS#

CKE

A10

BA0, BA1

HIGH

Address

CK#

Don’t Care

Bank1

All banks

One bank

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512Mb: x4, x8, x16 DDR SDRAM

Operations

INITIALIZATION

Prior to normal operation, DDR SDRAMs must be powered up and initialized in a

predefined manner. Operational procedures, other than those specified, may result in

undefined operation.

To ensure de vice operation, the DRAM must be initialized as des c ribed in the following

steps:

1. Simultaneously apply power to VDD and VDDQ.

2. Apply VREF and the n VTT power. VTT must be applied after VDDQ to avoid device latch-

up , whi ch may cause permanent damage to the devic e . Ex cept fo r CKE, i nputs are not

recognized as valid until after VREF is applied.

3. Assert and hold CKE at a LVCMOS logic LOW. Maintaining an LVCMOS LOW level on

CKE during power-up is re quired to ensure that the DQ and DQS outputs will be in

the High-Z state, where they will re main until driven in normal operation (by a read

access).

4. Prov id e stable clock sign als.

5. Wa it at least 200µs.

6. Bring CKE HIGH, and provide at least one NOP or DESELECT command. At this

point, the CKE input changes from a LVCMOS input to a SSTL_2 input only and will

remain a SSTL_2 input unless a power cycle occurs.

7. Perform a PRECHARGE ALL command.

8. Wait at least tRP time; during this time NOPs or DESELECT commands must be given.

9. Using the LMR command, program the extended mode regis te r (E0 = 0 to enable the

DLL and E1 = 0 for normal drive; or E1 = 1 for reduced drive and E2–En must be set to

0 [where n = most significant bit]).

10. Wait at least tMRD time; only NOPs or DESELECT commands are allowed.

11. Using the LMR command, program the mode register to set operating parameters

and to reset the DLL. At least 200 clock cycles are required between a DLL reset and

any READ command.

12. Wait at least tMRD time; only NOPs or DESELECT commands are allowed.

13. Issue a PRECHARGE ALL command.

14. Wait at least tRP time; only NOPs or DESELECT commands are allowed.

15. Issue an AUTO REFRESH command. This may be moved prior to step 13.

16. Wait at least tRFC time; only NOPs or DESELECT commands are allowed.

17. Issue an AUTO REFRESH command. This may be moved prior to step 13.

18. Wait at least tRFC time; only NOPs or DESELECT commands are allowed.

19. A lth o ugh not required by the Micron device, JEDEC requires an LMR command to

clear the DLL bit (set M8 = 0). If an LMR command is issued, the same operating

parameters should be utilized as in step 11.

20. Wait at least tMRD time; only NOPs or DESELECT commands are supported.

21. At this point the DRAM is ready for any valid command. At least 200 clock cycl es with

CKE HIGH are required between step 11 (DLL RESET) and any READ command.

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512Mb: x4, x8, x16 DDR SDRAM

Operations

Figure 21: INITIALIZATION Flow D iagram

VDD and VDDQ ramp

Apply VREF and VTT

CKE must be LVCMOS LOW

Apply stable CLOCKs

Bring CKE HIGH with a NOP command

Wait at least 200µs

PRECHARGE ALL

Assert NOP or DESELECT for tRP time

Configure extended mode register

Configure load mode register and reset DLL

Assert NOP or DESELECT for tMRD time

PRECHARGE ALL

Issue AUTO REFRESH command

Assert NOP or DESELECT for tRFC time

Optional LMR command to clear DLL bit

Assert NOP or DESELECT for tMRD time

DRAM is ready for any valid command

Step

Assert NOP or DESELECT commands for tRFC

Issue AUTO REFRESH command

Assert NOP or DESELECT for tRP time

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512Mb: x4, x8, x16 DDR SDRAM

Operations

Figure 22: INITIALIZATION Timi ng Diagram

Notes: 1. VTT is not applied directly to the device; however, tVTD ≥ 0 to avoid device latch-up. VDDQ,

VTT, and V REF ≤ VDD + 0.3V. Alternatively, VTT may be 1.35V maximum during po wer-up,

even if VDD/VDDQ are 0V, provided a minimum of 42Ω of series resistance is used between

the VTT supply and th e in pu t pin. Once initi al ized, VREF must always be powered within the

specified range.

2. Although not required by the Mic ron device, JEDEC specifies issuing another LMR command

(A8 = 0) prior to activating any bank. If another LMR command is issued, the same, previ-

ously issued operating parameters must be used.

3. The two AUTO REFRESH commands at Td0 and Te0 may be applied following the LMR com-

mand at Ta0.

4. tMRD is required before any command can be applied (during MRD time only NOPs or

DESELECTs are allowed), and 200 cycles of CK are required before a READ command can be

issued.

5. While programming th e op erating para meters, reset the DLL with A8 = 1.

tVTD1

CKE LVCMOS

LOW level

BA0, BA1

200 cycles of CK4

Load extended

mode register Load mode

register5

tMRD tMRD tRP tRFC tRFC

tIS

Power-up: V

and CK stable

T = 200µs

High-Z

tIH

DQS High-Z

Address RA

A10 All banks

CK#

tCH tCL

tCK

REF

Command LMRNOP PRELMR AR AR ACT2

tIS tIH

BA0 = 1

BA1 = 0

tIS tIH tIS tIH

BA0 = 0

BA1 = 0

tIS tIH

()()

()(

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Code Code

tIS tIH

Code Code3

PRE

All banks

tIS tIH

T0 T1 Ta0 Tb0 Tc0 Td0 Te0 Tf0

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Don’t Care

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Indicates A Break in

Time Scale

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512Mb: x4, x8, x16 DDR SDRAM

Operations

Mode Register

The mode register is used to define the specific DDR SDRAM mode of operation. This

definition includes the selection of a burst length, a burst type, a CAS latency, and an

operating mode, as shown in Figure 23. The mode register is programm ed via the LMR

command (with BA0 = 0 and BA1 = 0 ) and will retain the stored information until it is

programmed again or until the device loses power (except for bit A8, which is self-

clearing).

Repr og r ammi ng the mode r e gister wil l not alter the contents of the memory, provi ded it

is performed correctly. The mode register must be loaded (reloaded) when all banks are

idle and no bursts are in progress, and the controller m ust wai t the specifi ed tim e before

initiating the subsequent operation. Violating either of these requirements will result in

unspecified operation.

Mode register bits A0–A2 specify the burst length, A3 specifies the type of burst (sequen-

tial or interleaved), A4–A6 specify the CAS latency, and A7–An specify the operating

mode.

Figure 23: Mode Register Definition

Notes: 1. n is the most significant row address bit from Table 2 on page 2.

Burst Type

Sequential

Interleaved

CAS Latency

Reserved

3 (-5B only)

Reserved

2.5

Reserved

Burst lengthCAS Latency BT0

A9 A7 A6 A5 A4 A3A8 A2 A1 A0

Mode register

(Mx)

Address bus

9765438210

Operating mode

. . .AnBA0BA1

. . .

n + 1

n + 2

Operating Mode

Normal operation

Normal operation/reset DLL

All other states reserved

–

. . .

–

M6–M0

Valid

–

Burst Length

Reserved

Mn + 1

Mode Register Definition

Base mode register

Extended mode register

Reserved

Mn + 2

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512Mb: x4, x8, x16 DDR SDRAM

Operations

Burst Length (BL)

Read and write accesses to the DDR SDRAM are burst oriented, with the burst length

being programm able for both READ and WRITE bursts, as shown in Figure 23 on

page 54. The burst length determines the maximum number of column locations that

can be accessed for a given READ or WRITE command. BL = 2, BL = 4, or BL = 8 locations

are available for both the sequential and the interleaved burst types. Reserved states

should not be used, as unknown operation or incompatibility with future versions may

result.

When a READ or WRITE comm and is issu ed , a block of col u m n s eq ual to the bu rst

length is effectively se lected. All accesses for that burst take place within this block—

meaning that the burst will wrap within the block if a boundary is reached. The block is

uniquely selected by A1–Ai when BL = 2, by A2–Ai when BL = 4, and by A3–Ai when

BL = 8 (where Ai is the most significant column address bit for a given configuration).

The remai ning (least significant) addr ess bit(s) i s (are ) used to select t he starting location

within the block. For example: for BL = 8, A3–Ai select the eight-data-element bl ock; A0–

A2 select the first access within the block.

Burst Type

Accesse s within a given b urst may be progr ammed to be eithe r sequential or interleaved;

this is referred to as the burst typ e and is selected via bit M3.

The ordering of accesses within a burst is determined b y the burst lengt h, the burst t ype ,

and the starting column address, as shown in Table 34.

Table 34: Burst Definition

Burst Length Starting Column Address

Order of Accesses Within a Burst

Type = Sequential Type = Interleaved

2––A0 ––

––0 0-1 0-1

––1 1-0 1-0

4–A1 A0 ––

– 0 0 0-1-2-3 0-1-2-3

– 0 1 1-2-3-0 1-0-3-2

– 1 0 2-3-0-1 2-3-0-1

– 1 1 3-0-1-2 3-2-1-0

8A2 A1 A0 ––

0 0 0 0-1-2-3-4-5-6-7 0-1-2-3-4-5-6-7

0 0 1 1-2-3-4-5-6-7-0 1-0-3-2-5-4-7-6

0 1 0 2-3-4-5-6-7-0-1 2-3-0-1-6-7-4-5

0 1 1 3-4-5-6-7-0-1-2 3-2-1-0-7-6-5-4

1 0 0 4-5-6-7-0-1-2-3 4-5-6-7-0-1-2-3

1 0 1 5-6-7-0-1-2-3-4 5-4-7-6-1-0-3-2

1 1 0 6-7-0-1-2-3-4-5 6-7-4-5-2-3-0-1

1 1 1 7-0-1-2-3-4-5-6 7-6-5-4-3-2-1-0

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512Mb: x4, x8, x16 DDR SDRAM

Operations

CAS Latency (CL)

The CL is the delay, in clock cycles, between the registration of a READ command and

the availability of the first bit of output data. The latency can be set to 2, 2.5, or 3 (-5B

only) clocks, as shown in Figure 24. Reserved states should not be used, as unknown

operation or incompatibilit y with future versions may result.

If a READ command is registered at clock edge n, and the latency is m clocks, the data

will be available nomina ll y co i nci dent with clock edge n + m. Table 35 on page 57 indi-

cates the operating frequencies at which each CL setting can be used.

Figure 24: CAS Latency

Note: BL = 4 in the cases shown; shown with nominal tAC, tDQSCK, and tDQSQ.

CK#

Command

DQS

CL = 2

READ NOP NOP NOP

CK#

Command

DQS

CL = 2.5

T0 T1 T2 T2n T3 T3n

Don’t CareTransitioning Data

READ NOP NOP NOP

CK#

Command

DQS

CL = 3

T0 T1 T2 T3 T3n

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512Mb: x4, x8, x16 DDR SDRAM

Operations

Operating Mode

The normal operating mode is selected by issuing an LMR command with bits A7–An

each set to zero and bits A0–A6 set to the desired values. A DLL reset is initiated by

issuing an LMR command with bits A7 and A9–An each set to zero, bit A8 set to one, and

bits A0–A6 set to the desired values. Although not requir ed by the Micron device , JEDEC

specifications recommend that an LMR command resetting the DLL should always be

followed by an LMR command selecting normal operating mode.

All other combinations of values for A7–An are reserved for future use and/or test

modes . Test modes and reserved states should not be used, as unknown operation or

incompatibility with future versions may result.

Extended Mode Register

The extended mode register controls functions beyond those controlled by the mode

r egister; these additional fu nctions ar e DLL enable/disable and output drive strength.

These functions are controlled via the bits shown in Figure 25 on page 58. The extended

mode reg ister is progra mmed via the LMR command to the mode r egister (with BA0 = 1

and BA1 = 0) and will retain the stored information until it is programmed again or until

the device loses power. The enabling of the DLL should always be follo w ed by an LMR

command to the mode register (BA0/BA1 = 0) to reset the DLL. The extended mode

controller must wait the specified time before initiating any subsequent operation.

Violating ei the r requirement could result in an unspecified operatio n.

Output Drive Strength

The normal drive strength for all outputs is specified to be SSTL_2, Class II. The Design

Revision F and K devices support a programmable option for re duced drive. This option

is intended for the support of the ligh te r load and/or point-to-point envi ronm ents. The

selection of the reduced drive strength will alter the DQ and DQS pins from SSTL_2,

Class II drive strength to a reduced drive strength, which is approximately 54% of the

SSTL_2, Class II drive strength.

DLL Enable/Disable

When the part is running without the DLL enabled, device functionality may be altered.

The DLL must be enabled for normal operation. DLL enable is required during power-

up initialization and upon returning to normal operation after having disabled the DLL

for the purpose of debug or evaluati on (when the devi ce exits sel f refresh mod e, the DLL

is enabled automatically). Anytime the DLL is enabled, 200 clock cycles with CKE HIGH

must occur befor e a READ command can be issued.

Table 35: CAS Latency

Speed

Allowable Operating Clock Frequency (MHz)

CL = 2 CL = 2.5 CL = 3

-5B 75 ≤ f ≤ 133 75 ≤ f ≤ 167 133 ≤ f ≤ 200

-6/-6T 75 ≤ f ≤ 133 75 ≤ f ≤ 167 –

-75E 75 ≤ f ≤ 133 75 ≤ f ≤ 133 –

-75Z 75 ≤ f ≤ 133 75 ≤ f ≤ 133 –

-75 75 ≤ f ≤ 100 75 ≤ f ≤ 133 –

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512Mb: x4, x8, x16 DDR SDRAM

Operations

Figure 25: Extended Mode Register Definition

Notes: 1. n is the most significant row address bit from Table 2 on page 2.

2. The reduced drive strength option is available on ly on Design Revisio n F and K.

3. The QFC# option is not supported.

ACTIVE

After a row is opened with an ACTIVE command, a READ or WRITE command may be

issued to that row, subject to the tRCD specification. tRCD (MIN) should be divided by

the clock period and rounded up to the next whole number to determine the earlie st

clock edge after the ACTIVE command on which a READ or WRITE command can be

entered. For example, a tRCD specification of 20ns with a 133 MHz clock (7.5ns period)

results in 2.7 clocks rounded to 3. This is reflected in Figure 26 on page 59, which covers

any case wher e 2 < tR CD (MIN)/tCK ≤ 3 (Figure 26 also sho ws the same c ase for tRRD; the

same procedure is used to convert other specification limits from time units to clock

cycles).

A row remains active (or open) for accesses until a PRECHARGE command is issued to

that bank. A PRECHARGE command must be issued before opening a different row in

the same bank.

A subsequent ACTIVE command to a differ ent row in the same bank can only be issued

after the previous active row has been “closed” (precharged). The minimum time

interval between successive ACTIVE commands to the same bank is defined by tRC.

A subsequent ACTIVE command to another bank can be issued while the first bank is

being accessed, which resul ts in a r eduction of total r o w-access o verhead. The minimum

time interval between successive ACTIVE commands to differ ent banks is defined by

tRRD.

Operating Mode

Reserved

–

E1, E0

Valid

–

DLL

Enable

Disable

A9 A7 A6 A5 A4 A3A8 A2 A1 A0

Extended mode

Address bus

976543821

Drive Strength

Normal

Reduced

E12

Operating Mode

. . .AnBA1 BA0

. . .n1

n + 1n + 2

–

. . .

–

E23

–

Mn + 1

Mode Register Definition

Base mode register

Extended mode register

Reserved

Mn + 2

DLL

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512Mb: x4, x8, x16 DDR SDRAM

Operations

Figure 26: Example: Meeting tRCD (tRRD) MIN When 2 < tRCD (tRRD) MIN/tCK ≤ 3

READ

During the READ command, the value on input A10 determines whether or not auto

precharge is used. If auto precharge is selected, the row being accessed will be

precharged at the end of the READ burst; if auto precharge is not selected, the row will

remain open for subsequent accesses.

Note: For the READ com mands used in the fol lowing illustrations, auto precharge is dis -

abled.

During READ bursts, the valid data-out element from the starting column address will

be available following the CL after the READ command. Each subsequent data-out

element will be v a lid nominally at the next positiv e or negative clock edge (that is, at the

next crossing of CK and CK#). Figure 27 on page 61 shows the general timing for each

possible CL setting. DQS is driven by the DDR SDRAM along with output data. The

initial LOW state on DQS is known as the read preamble; the LOW state coincident with

the last data-out element is known as the read postamble.

Upon completion of a burst, assuming no other commands have been initia ted, the DQ

will go High-Z. Detailed explanations of tDQSQ (valid data-out skew), tQH (data-out

window hold), and the valid data window are depicted in Figure 35 on page 69 and

Figure 36 on page 70. Detailed explanations of tDQSCK (DQS transition skew to CK) and

tAC (data-out transition skew to CK) are depicted in Figure 37 on page 71.

Data from any READ burst may be concatenated or truncated with data from a subse-

quent READ command. In either case , a continuous flo w of data can be maintained. The

first data element from the new burst follows either the last element of a completed

burst or the last desired data element of a longer burst which is bein g truncated. The

new READ command should be issued x cycl es afte r the firs t RE AD com mand, where x

equals the number of desired data element pairs (pairs are requir ed by the 2n-prefetch

architectur e). This is shown in Figure 28 on page 62. A READ command can be initiated

on any clock cycle following a previous READ command. Nonconsecutive read data is

illustrated in Figure 29 on page 63. Full-speed random read accesses within a page (or

pages) can be performed, as shown in Figure 30 on page 64.

Command

BA0, BA1

ACTACT

NOP

tRRD tRCD

CK#

Bank xBank y

Address Row Row

NOP

RD/WR

NOP

Bank y

Col

NOP

T0 T1 T2 T3 T4 T5 T6T7

Don’t Care

NOP

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512Mb: x4, x8, x16 DDR SDRAM

Operations

Data from any READ burst may be truncated with a BURST TERMINATE command, as

shown in Figure 31 on page 65. The BURST TERMINATE latency is equal to the CL, that

is, the BURST TERMINATE command should be issued x cy cles after the READ

command where x equals the number of desired data element pairs (pairs are require d

by the 2n-prefetch arch itecture).

Data from any READ burst must be completed or truncated before a subsequent WRITE

command can be issued. If truncation is necessary, the BURST TERMINATE command

must be used, as shown in Figure 32 on page 66. The tDQSS (NOM) case is shown; the

tDQSS (MAX) case has a longer bus idle time. (tDQSS [MIN] and tDQSS [MAX] are

defined in the section on WRITEs.) A READ burst may be followed by, or truncated with,

a PRECHARGE command to the same bank provided that auto precharge was not acti-

vated.

The PRECHARGE command should be issued x cycles after the READ command, where

x equals the number of desir ed data element pairs (pairs are r equired by the 2n-prefetch

architectur e). This is shown in Figure 33 on page 67. Following the PRECHARGE

command, a subsequent command to the same bank cannot be issued until both tRAS

and tRP hav e been met. Part of the ro w pr echar ge time is hidden during the access of the

last data elements.

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512Mb: x4, x8, x16 DDR SDRAM

Operations

Figure 27: READ Burst

Notes: 1. DO n = data-out from column n.

2. BL = 4.

3. Three subsequent elements of data-out appear in the programmed order following DO n.

4. Shown with nominal tAC, tDQSCK, and tDQSQ.

READ NOP NOP NOP NOP NOP

CL = 2

CL = 2.5

T0 T1 T2 T3T2n T3n T4 T5

READ NOP NOP NOP NOP NOP

CL = 3

T0 T1 T2 T3 T4nT3n T4 T5

Bank a,

Col n

Bank a,

Col n

Bank a,

Col n

Command

Address

DQS

CK#

Command

Address

DQS

CK#

Command

Address

DQS

CK#

Transitioning Data Don’t Care

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512Mb: x4, x8, x16 DDR SDRAM

Operations

Figure 28: Consecutive READ Bursts

Notes: 1. DO n (or b) = data-out from column n (or column b).

2. BL = 4 or BL = 8 (if BL = 4, the bursts are concatenated; if BL = 8, the second burst interrupts

the first).

3. Three subsequent elements of data-out appear in the programmed order following DO n.

4. Three (or seven) subsequent elements of data-out appear in the programmed order follow-

ing DO b.

5. Shown with nominal tAC, tDQSCK, and tDQSQ.

6. Example applies only when READ commands are issued to same device.

READ NOP READ NOP NOP NOP

CL = 2

CL = 2.5

nDO

T0 T1 T2 T3T2n T3n T4 T5T4n T5n

READ NOP READ NOP NOP NOP

CL = 3

nDO

T0 T1 T2 T3 T3n T4 T5T4n T5n

Bank,

Col nBank,

Col b

Bank,

Col nBank,

Col b

Bank,

Col nBank,

Col b

Command

Address

DQS

CK#

Command

Address

DQS

CK#

Command

Address

DQS

CK#

Transitioning Data Don’t Care

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512Mb: x4, x8, x16 DDR SDRAM

Operations

Figure 29: Nonconsecutive READ Bursts

Notes: 1. DO n (or b) = data-out from column n (or column b).

2. BL = 4 or BL = 8 (if BL = 4, the bursts are concatenated; if BL = 8, the second burst interrupts

the first).

3. Three subsequent elements of data-out appear in the programmed order following DO n.

4. Three (or seven) subsequent elements of data-out appear in the programmed order follow-

ing DO b.

5. Shown with nominal tAC, tDQSCK, and tDQSQ.

READ NOP NOP NOP NOP NOPREAD

CL = 2

CL = 2.5

T0 T1 T2 T3T2n T3n T4 T5 T5n T6

READ NOP NOP NOP NOP NOPREAD

T0 T1 T2 T3T2n T3n T4 T5 T5n T6

nDO

CL = 3

READ NOP NOP NOP NOP NOPREAD

T0 T1 T2 T3 T3n T4 T5 T6

nDO

T4n

Bank,

Col nBank,

Col b

Bank,

Col nBank,

Col b

Bank,

Col nBank,

Col b

Command

Address

DQS

CK#

Command

Address

DQS

CK#

Command

Address

DQS

CK#

Transitioning Data Don’t Care

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512Mb: x4, x8, x16 DDR SDRAM

Operations

Figure 30: Random READ Accesses

Notes: 1. DO n (or x or b or g) = data-out from column n (or column x or column b or column g).

2. BL = 2, BL = 4, or BL = 8 (if BL = 4 or BL = 8, the following burst interrupts the previous).

3. n', x', b', or g' indicate the next data-out following DO n, DO x, DO b, or DO g, respectively.

4. READs are to an active row in any bank.

5. Shown with nominal tAC, tDQSCK, and tDQSQ.

READ READ READ NOP NOPREAD

CL = 2

CL = 2.5

nDO

x' DO

n' DO

xDO

nDO

n' DO

xDO

T0 T1 T2 T3T2n T3n T4 T5T4n T5n

READ READ READ NOP NOPREAD

T0 T1 T2 T3T2n T3n T4 T5T4n T5n

CL = 3

nDO

n' DO

xDO

READ READ READ NOP NOPREAD

T0 T1 T2 T3 T3n T4 T5T4n T5n

Bank,

Col nBank,

Col b

Bank,

Col xBank,

Col g

Bank,

Col nBank,

Col b

Bank,

Col xBank,

Col g

Bank,

Col nBank,

Col b

Bank,

Col xBank,

Col g

Command

Address

DQS

CK#

Command

Address

DQS

CK#

Command

Address

DQS

CK#

Transitioning Data Don’t Care

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512Mb: x4, x8, x16 DDR SDRAM

Operations

Figure 31: Terminating a READ Burst

Notes: 1. Page remains open.

2. DO n = data-out from column n.

3. BL = 4.

4. Subsequent element of data-out appears i n the programmed or der following DO n.

5. Shown with nominal tAC, tDQSCK, and tDQSQ.

READ NOP NOP NOP NOP

Bank a,

Col n

READ NOP NOP NOP NOP

Bank a,

Col n

CL = 2

CL = 2.5

T0 T1 T2 T3T2n T4 T5

READ NOP NOP NOP NOP

Bank a,

Col n

CL = 3

T0 T1 T2 T3 T3n T4 T5

BST1

Command

Address

DQS

CK#

Command

Address

DQS

CK#

Command

Address

DQS

CK#

Transitioning Data Don’t Care

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512Mb: x4, x8, x16 DDR SDRAM

Operations

Figure 32: READ-to-WRITE

Notes: 1. Page remains open.

2. DO n = data-out from column n; DI b = data-in from column b.

3. BL = 4 (applies for burst s of 8 as well; if BL = 2, the BURST command shown can be NOP).

4. One subsequent element of data-out appears in the programmed order following DO n.

5. Data-in elements are applied following DI b in the programmed order.

6. Shown with nominal tAC, tDQSCK, and tDQSQ.

READ BST1NOP NOP NOP

Bank,

Col n

WRITE

Bank,

Col b

T0 T1 T2 T3T2n T4 T5T4n T5n

(NOM)

DQSS

READ BST1NOP WRITE NOP

Bank a,

Col n

NOP

T0 T1 T2 T3 T3n T4 T5 T5n

(NOM)

DQSS

READ NOP NOP

Bank,

Col n

WRITE

Bank,

Col b

T0 T1 T2 T3T2n T4 T5 T5n

(NOM)

DQSS

NOP

CL = 2.5

CL = 2

T3n

CL = 3

BST1

Command

Address

DQS

CK#

Command

Address

DQS

CK#

Command

Address

DQS

CK#

Transitioning Data Don’t Care

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512Mb: x4, x8, x16 DDR SDRAM

Operations

Figure 33: READ-to-PRECHARGE

Notes: 1. Provided tRAS (MIN) is met, a READ command with auto precharge enabled would cause a

precharge to be performed at x number of clock cycles after the READ command, where

x = BL/2.

2. DO n = data-out from column n.

3. BL = 4 or an interrupted burst of 8.

4. Three subsequent elements of data-out appear in the programmed order following DO n.

5. Shown with nominal tAC, tDQSCK, and tDQSQ.

6. READ-to-PRECHARGE equals two clocks, which allows two data pairs of data-out; it is also

assumed that tRAS (MIN) is met.

7. An ACTIVE command to the same bank is only allowed if tRC (MIN) is met.

READ NOP PRE NOP NOP ACT

Bank a,

Col nBank a,

(a or all)Bank a,

Row

READ NOP PRE NOP NOP ACT

Bank a,

Col n

CL = 2 tRP

tRP

CL = 2.5

T0 T1 T2 T3T2n T3n T4 T5

Bank a,

(a or all)Bank a,

Row

READ NOP PRE NOP NOP ACT

Bank a,

Col n

tRP

CL = 3

T0 T1 T2 T3 T4nT3n T4 T5

Bank a,

(a or all)Bank a,

Row

Command

Address

DQS

CK#

Command

Address

DQS

CK#

Command

Address

DQS

CK#

Transitioning Data Don’t Care

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512Mb: x4, x8, x16 DDR SDRAM

Operations

Figure 34: Bank READ – Without Auto Precharge

Notes: 1. NOP commands are shown for ease of illustration; other commands may be valid at these

times.

2. BL = 4.

3. The PRECHARGE command can onl y be applied at T5 if tRAS (MIN) is met.

4. Disable auto precharge.

5. “Don’t Care” if A10 is HIGH at T5.

6. DO n (or b) = data-out from column n (or column b); subseque nt elements ar e pr ovided in

the programmed order.

7. Refer to Figure 35 on page 69, Figure 36 on page 70, and Figure 37 on page 71 for detailed

DQS and DQ timing.

CK#

CKE

A10

BA0, BA1

tCK tCH tCL

tIS

tIH

tIS

tIH

tIS tIH

tRCD

tRC

tRP

CL = 2

T0 T1 T2 T3 T4 T5 T5n T6nT6 T7 T8

DQS

Case 1: tAC

(

MIN)

and tDQSCK

(

MIN)

Case 2: tAC

(

MAX)

and tDQSCK

(

MAX)

DQS

RPRE

tRPRE

tRPST

DQSCK

(

MIN)

(

MIN)

(

MIN)

(

MIN)

(

MAX)

(

MAX)

ACT

Col n

Bank xBank x

ACT

Bank x

DQSCK (MAX)

NOP1NOP1NOP1NOP1NOP1

READ2PRE3

Bank x5

tRAS3

Row

Command

Address

Transitioning Data Don’t Care

All banks

One bank

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512Mb: x4, x8, x16 DDR SDRAM

Operations

Figure 35: x4, x8 Data Output Timing – tDQSQ, tQH, and Data Valid Window

Notes: 1. tHP is the lesser of tCL or tCH clock transition collectively when a bank is active.

2. tDQSQ is derive d at each DQS clock edge, is not cumulative over time, begins with DQS

transition, and ends w ith the last valid DQ transition.

3. DQ transitioning after DQS transition define the tDQSQ window . DQS transitions at T2 and

T2n are an “early DQS”; at T3, a “nominal DQS”; and at T3n, a “late DQS”.

4. For a x4, only two DQ apply.

5. tQH is derived from tHP: tQH = tHP - tQHS.

6. The data valid window is derived for each DQS transitions and is defined as tQH - tDQSQ.

DQ (last data valid)

DQ4

DQS3

DQ (last data valid)

DQ (first data no longer valid)

All DQ and DQS collectively6

Earliest signal transition

Latest signal transition

T2n

T3n

CK#

T1 T2 T3 T4T2n T3n

tQH5

tHP

tQH5tQH5

tHP

tQH5

tDQSQ

Data

valid

window

Data

valid

window

Data

valid

window

Data

valid

window

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Operations

Figure 36: x16 Data Output Timing – tDQSQ, tQH, and Data Valid Window

Notes: 1. tHP is the lesser of tCL or tCH clock transition collectively when a bank is active.

2. tDQSQ is derive d at each DQS clock edge, is not cumulative over time, begins with DQS

transition, and ends w ith the last valid DQ transition.

3. DQ transitioning after DQS transition define the tDQSQ window. LDQS defines the lower

byte, and UDQS defines the upper byte.

4. DQ0, DQ1, DQ2, DQ3, DQ4, DQ5, DQ6, or DQ7.

5. tQH is derived from tHP: tQH = tHP - tQHS.

6. The data valid window is derived for each DQS transition and is tQH - tDQSQ.

7. DQ8, DQ9, DQ10, D11, DQ12, DQ13, DQ14, or DQ15.

DQ (last data valid)4

DQ4

LDQS3

DQ (last data valid)4

DQ (first data no longer valid)4

DQ0–DQ7 and LDQS collectively6

T2n

T3n

CK#

T1 T2 T3 T4T2n T3n

tQH5tQH5

tDQSQ

Data valid

window Data valid

window

DQ (last data valid)7

DQ7

UDQS3

DQ (last data valid)7

DQ (first data no longer valid)7

DQ8–DQ15 and UDQS collectively6

T2n

T3n

tQH5tQH5tQH5tQH5

tDQSQ2tDQSQ2tDQSQ2

tDQSQ2

tHP

tQH5

Data valid

window

Data valid

window Data valid

window

Upper byte

Lower byte

Data valid

window

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Operations

Figure 37: Data Output Timing – tAC and tDQSCK

Notes: 1. READ command with CL = 2 issued at T0.

2. tDQSCK is the DQS output window relative to CK and is the “long term” component of the

DQS skew.

3. DQ transitioning after DQS transition define the tDQSQ window.

4. All DQ must transition by tDQSQ after DQS transitions, regardle ss of tAC.

5. tAC is the DQ output window relative to CK and is the “long term” component of DQ skew.

6. tLZ (MIN) and tAC (MIN) are the first valid signal transitions.

7. tHZ (MAX) and tAC (MAX) are the latest valid signal transitions.

WRITE

During a WRITE command, the value on input A10 determines whether or not auto

precharge is used. If auto precharge is selected, the row being accessed will be

precharged at the end of the WRITE burst (after tWR time); if auto precharge is not

selected, the row will remain open for subsequent accesses.

Input data appearing on the DQ is written to the memory array subject to the DM input

logic level appearing coincident with the data. If a given DM s ignal is regi ster ed LOW, the

corresponding data will be written to memory. If the DM signal is registered HIGH, the

corresponding data inputs will be ignored, and a WRITE will not be executed to that

byte/column location.

Note: For the WRITE commands used in the following illustrations, auto precharge is dis-

abled.

During WRITE bursts, the first valid data-in element will be registered on the first rising

edge of DQS following the WRITE command, and subsequent data elements will be

registered on successive edges of DQS. The LOW state on DQS between the WRITE

command and the first rising edge is known as the write preamble; the LOW state on

DQS following the last data-in element is known as the write postamble.

The time betwe en the WRIT E command and the first corresponding rising edge of DQS

(tDQSS) is specified with a relatively wide range (from 75% to 125% of one clock cycle).

All of the WRITE diagrams show the nominal case, and where the two extr eme cases

(that is, tDQSS [MIN] and tDQSS [MAX]) might not be intuitive; they have also been

included. Figure 38 on page 73 sho ws the nominal case and the extr emes of tDQSS for BL

= 4. Upon completion of a burst, assuming n o other commands have been initiated, the

DQ will remain High-Z and any additional input data will be ignored.

CK#

DQS or LDQS/UDQS3

T1 T2 T3 T4 T5

T2n T3n T4n T5n T6

tRPST

tLZ (MIN)

tDQSCK2 (MAX)

tDQSCK2 (MIN) tDQSCK2 (MAX)

tDQSCK2 (MIN)

tHZ (MAX)

All DQ values collectively4

tAC5

(MIN) tAC5

(MAX)

tLZ (MIN) tHZ (MAX)

T2n T3n T4n T5n

T2n

T3n

T4n

T5n

T2 T3 T4 T5

DQ (last data valid)

DQ (first data valid)

T01

tRPRE

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Operations

Data for any WRITE burst may be concatenated with or truncated with a subsequent

WRITE command. In either case, a continuous flow of input data can be maintained.

The new WRITE command can be issued on any positive edge of clock following the

previous WRITE command. The first data element from the new burst is applied after

either the last element of a completed burst or the last desired data element of a longer

burst which is being truncated. The new WRITE command should be issued x cycl es

after the first WRITE command, where x equals the number of desired data element

pairs (pairs are required by the 2n-prefetch architecture).

Figure 39 on page 74 shows concatenated bursts of 4. An example of nonconsecutive

WRITEs is shown in Figure 40 on page 75. Full-speed r a ndom write accesses within a

page or pages can be performed as shown in Figure 41 on page 75.

Data for any WRITE burst may be followed by a subsequent READ command. To follow a

WRITE without truncating the WRITE burst, tWTR should be met, as shown in Figure 42

on page 76.

Data for any WRITE burst may be truncated b y a subsequent READ command, as shown

in Figure 43 on page 77.

Note that only the data-in pairs that are register ed prior to the tWTR pe rio d are writt en

to the internal array, and any subsequent data-in should be masked with DM, as shown

in Figure 44 on page 78.

Data for any WRITE burst may be followed by a subsequent PRECHARGE command. To

follow a WRITE without truncating the WRITE burst, tWR should be met, as shown in

Figure 45 on page 79.

Data for any WRITE burst may be truncated by a subsequent PRECHARGE command, as

shown in Figure 46 on page 80 and Figure 47 on page 81. Only the data-in pairs regis-

tered prior to the tWR per io d are written to the internal array; any subsequent data-in

should be masked with DM, as shown in Figures 46 and 47. After the PRECHARGE

command, a subsequent command to the same bank cannot be issued until tRP is met.

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Operations

Figure 38: WRITE Burst

Notes: 1. DI b = data-in for column b.

2. Three subsequent elements of data-in are applied in the programmed order following DI b.

3. An uninterrupted burst of 4 is shown.

4. A10 is LOW with the WRITE command (auto precharge is disabled).

DQS

tDQSS (MAX)

tDQSS (NOM)

tDQSS (MIN)

tDQSS

CK#

Command WRITE NOP NOP

Address Bank a,

Col b

NOP

T0 T1 T2 T3T2n

DQS tDQSS

DQS

DQ DI

Don’t CareTransitioning Data

tDQSS

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Operations

Figure 39: Consecutive WRITE-to-WRITE

Notes: 1. DI b (or n) = data-in from column b (or column n).

2. Three subsequent elements of data-in are applied in the programmed order following DI b.

3. Three subsequent elements of data-in are applied in the programmed order following DI n.

4. An uninterrupted burst of 4 is shown.

5. Each WRITE command may be to any bank.

Address

tDQSS (NOM)

CK#

Command WRITE NOP WRITE NOP NOP

Bank,

Col b

NOP

Bank,

Col n

T0 T1 T2 T3T2n T4 T5T4nT3nT1n

DQS

Don’t CareTransitioning Data

tDQSS

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Operations

Figure 40: Nonconsecutive WRITE-to-WRITE

Notes: 1. DI b (or n) = data-in from column b (or column n).

2. Three subsequent elements of data-in are applied in the programmed order following DI b.

3. Three subsequent elements of data-in are applied in the programmed order following DI n.

4. An uninterrupted burst of 4 is shown.

5. Each WRITE command may be to any bank.

Figure 41: Random WRITE Cycles

Notes: 1. DI b (or x or n or a or g) = data-in from column b (or co lumn x, or column n, or column a, or

column g).

2. b', x', n', a' or g' indicate the next data-in following DO b, DO x, DO n, DO a, or DO g,

respectively.

3. Programmed BL = 2, BL = 4, or BL = 8 in cases shown.

4. Each WRITE command may be to any bank.

Command WRITE NOP NOP NOP NOP

Address Bank,

Col b

WRITE

Bank,

Col n

T0 T1 T2 T3T2n T4 T5T4nT1n T5n

DQS

tDQSS (NOM) tDQSS

Don’t CareTransitioning Data

CK#

tDQSS (NOM)

CK#

Command WRITE WRITE WRITE WRITE NOP

Address Bank,

Col bBank,

Col xBank,

Col nBank,

Col g

WRITE

Bank,

Col a

T0 T1 T2 T3T2n T4 T5T4nT1n T3n T5n

DQS

bDI

b'DI

xDI

x'DI

nDI

n'DI

aDI

a'DI

gDI

Don’t CareTransitioning Data

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Operations

Figure 42: WRITE-to-READ – Uninterrupting

Notes: 1. DI b = data-in for column b; DO n = data-out for column n.

2. Three subsequent elements of data-in are applied in the programmed order following DI b.

3. An uninterrupted burst of 4 is shown.

4. tWTR is referenced from the first positive CK edge after the last data-in pair.

5. The READ and WRITE commands are to the same device. However, the READ and WRITE

commands may be to different devices, in which case tWTR is not required, and the READ

command could be applied earlier.

6. A10 is LOW with the WRITE command (auto precharge is disabled).

tDQSS (NOM)

CK#

Command WRITE NOP NOP READ NOP NOP

Address Bank a,

Col bBank a,

Col n

NOP

T0 T1 T2 T3T2n T4 T5T1n T6 T6n

tWTR

CL = 2

DQS

bDO

tDQSS

tDQSS (MIN) CL = 2

DQS

bDO

tDQSS

tDQSS (MAX) CL = 2

DQS

bDO

tDQSS

Don’t CareTransitioning Data

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Operations

Figure 43: WRITE-to-READ – Interrupting

Notes: 1. DI b = data-in for column b; DO n = data-out for column n.

2. An interrupted burst of 4 is shown; two data eleme nts are written.

3. One subsequent element of data-in is applied in the programmed order following DI b.

4. tWTR is referenced from the first positive CK edge after the last data-in pair.

5. A10 is LOW with the WRITE command (auto precharge is disabled).

6. DQS is required at T2 and T2n (nominal case) to register DM.

7. If the burst of 8 is used, DM and DQS are required at T3 and T3n because the READ com-

mand will not mask these two data ele ments.

tDQSS (NOM)

CK#

Command WRITE NOP NOP NOP NOP NOP

Address Bank a,

Col bBank a,

Col n

READ

T0 T1 T2 T3T2n T4 T5 T5nT1n T6 T6n

tWTR

CL = 2

DQS

bDO

tDQSS (MIN) CL = 2

DQS

tDQSS (MAX) CL = 2

DQS

bDO

Don’t CareTransitioning Data

tDQSS

T3n

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Operations

Figure 44: WRITE-to-READ – Odd Number of Data, Interrupting

Notes: 1. DI b = data-in for column b; DO n = data-out for column n.

2. An interrupted burst of 4 is shown; one data element is written.

3. tWTR is refere n ced from the fir st positive CK edge after the last desired data-in pair (not

the last two data elements).

4. A10 is LOW with the WRITE command (auto precharge is disabled).

5. DQS is required at T1n, T2, and T2n (nominal case) to register DM.

6. If the burst of 8 is used, DM and DQS are required at T3–T3n because the READ command

will not mask these data elements.

tDQSS (NOM)

CK#

Command WRITE NOP NOP NOP NOP NOP

Address Bank a,

Col bBank a,

Col n

READ

T0 T1 T2 T3T2n T4 T5T1n T6 T6nT5n

tWTR

CL = 2

DQS

bDO

tDQSS (MIN) CL = 2

DQS

bDO

tDQSS (MAX) CL = 2

DQS

bDO

Don’t CareTransitioning Data

tDQSS

T3n

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Operations

Figure 45: WRITE-to-PRECHARGE – Uninterrupting

Notes: 1. DI b = data-in for column b.

2. Three subsequent elements of data-in are applied in the programmed order following DI b.

3. An uninterrupted burst of 4 is shown.

4. tWR is referenced from the first positive CK edge after the last data-in pair.

5. The PRECHARGE and WRITE commands are to the same device. However, the PRECHARGE

and WRITE commands may be to different devices, in which case tWR is not required, and

the PRECHARGE command could be applied earlier.

6. A10 is LOW with the WRITE command (auto precharge is disabled).

tDQSS (NOM)

CK#

Command WRITE NOP NOP NOP NOP

Address Bank a,

Col bBank,

(a or all)

NOP

T0 T1 T2 T3T2n T4 T5T1n T6

tWR tRP

DQS

tDQSS (MIN)

DQS

tDQSS (MAX)

DQS

Don’t CareTransitioning Data

tDQSS

PRE

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Operations

Figure 46: WRITE-to-PRECHARGE – Interrupting

Notes: 1. DI b = data-in for column b.

2. Subsequent element of data-in is applied in the programmed order following DI b.

3. An interrupted burst of 8 is shown; two data eleme nts are written.

4. tWR is referenced from the first positive CK edge after the last data-in pair.

5. A10 is LOW with the WRITE command (auto precharge is disabled).

6. DQS is required at T4 and T4n (nominal case) to register DM.

7. If the burst of 4 is used, DQS and DM are not required at T3, T3n, T4, and T4n.

tDQSS

tDQSS (NOM)

CK#

Command WRITE NOP NOP NOP NOP

Address Bank a,

Col bBank,

(a or all)

NOP

T0 T1 T2 T3T2n T4 T5T1n T6

tWR tRP

DQS

tDQSS

tDQSS (MIN)

DQS

tDQSS

tDQSS (MAX)

DQS

Don’t CareTransitioning Data

T3n T4n

PRE

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Operations

Figure 47: WRITE-to-PRECHARGE – Odd Number of Data, Interrupting

Notes: 1. DI b = data-in for column b.

2. An interrupted burst of 8 is shown; one data element is written.

3. tWR is referenced from the first positive CK edge after the last data-in pair.

4. A10 is LOW with the WRITE command (auto precharge is disabled).

5. DQS is required at T4 and T4n (nominal case) to register DM.

6. If the burst of 4 is used, DQS and DM are not required at T3, T3n, T4, and T4n.

tDQSS

tDQSS (NOM)

CK#

Command WRITE NOP NOP NOP NOP

Address Bank a,

Col bBank,

(a or all)

NOP

T0 T1 T2 T3T2n T4 T5T1n T6

tWR tRP

DQS

tDQSS

tDQSS (MIN)

DQS

tDQSS

tDQSS (MAX)

DQS

Don’t CareTransitioning Data

T3n T4n

PRE

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Operations

Figure 48: Bank WRITE – Without Auto Precharge

Notes: 1. NOP commands are shown for ease of illustration; other commands may be valid at these

times.

2. BL = 4.

3. Disable auto precharge.

4. “Don’t Care” if A10 is HIGH at T8.

5. DI b = data-in from column b; subsequent elements are provided in the programmed order.

6. See Figure 50 on page 84 for detailed DQ timing.

Command NOP1NOP1NOP1NOP1NOP1NOP1

WRITE2

Bank x4

DQ5

Address

Row

CK#

CKE

A10

BA0, BA1

tCK tCH tCL

tIS

tIH

tIS

tIH

tIS tIH

tRCD

tRAS tRP

tWR

T0 T1 T2 T3 T4 T5 T5n T6 T7 T8T4n

ACT

Col n

One bank

All banks

Bank x

PRE

Bank x

tDQSL tDQSH tWPST

DQS

tDS tDH

tDQSS (NOM)

tWPRE

tWPRES

Don’t CareTransitioning Data

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Operations

Figure 49: WRITE – DM Operation

Notes: 1. NOP commands are shown for ease of illustration; other commands may be valid at these

times.

2. BL = 4.

3. Disable auto precharge.

4. “Don’t Care” if A10 is HIGH at T8.

5. DI b = data-in from column b; subsequent elements are provided in the programmed order.

6. See Figure 50 on page 84 for detailed DQ timing.

Command NOP1NOP1NOP1NOP1NOP1NOP1

Bank x4

DQ5

WRITE2

Address Row

Row

CK#

CKE

A10

BA0, BA1

tCK tCH tCL

tIS

tIH

tIS

tIH

tIS tIH

tRCD

tRAS tRP

tWR

T0 T1 T2 T3 T4 T5 T5n T6 T7 T8T4n

ACT

Col n

One bank

All banks

Bank x

PRE

Bank x

tDQSL tDQSH tWPST

DQS

tDS tDH

Don’t CareTransitioning Data

tDQSS (NOM)

tWPRES tWPRE

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Operations

Figure 50: Data Input Timing

Notes: 1. WRITE command issued at T0.

2. tDSH (MIN) generally oc curs during tDQSS (MIN).

3. tDSS (MIN) gener a lly occurs during tDQSS (MAX).

4. For x16, LDQS controls the lower byte and UDQS controls the upper byte.

5. DI b = data-in from column b.

PRECHARGE

The bank(s) will be available for a subsequent row access a specified time (tRP) after the

PRECHAR GE command is issued, except in the case of concurrent auto precharge. With

concurrent auto precharge, a READ or WRITE command to a different bank is allowed as

long as it does not interrupt the data transfer in the current bank and does not violate

any other timing parameters. I nput A10 determines whether one or all banks are to be

precharged, and in the case where only one bank is to be precharged, inputs BA0, BA1

select the bank. When all banks are to be precharged, BA0, BA1 are treated as “Don’t

Care.” Once a bank has been precharged, it is in the idle state and must be activated

prior to any READ or WRITE commands being issued to that bank. A PRECHARGE

command will be treated as a NOP if there is no open row in that bank (idle state), or if

the previously open row is already in the process of precharging.

Auto Precharge

Auto precharge is a feature which performs the same individual-bank pr echarge func-

tion described above, but with out requiring an ex pl ic it c ommand. This is accom pli s h ed

by using A10 to enable auto precharge in conjunction with a specific READ or WRITE

command. A precharge of the bank/ row that is addressed with the READ or WRITE

command is automatically performed upon completion of the READ or WRITE burst.

Auto precharge is either enabled or disabled for each indivi dual READ or WRITE

command. This device supports concurrent auto precharge if the command to the other

bank does not interrupt the data transfer to the current bank.

Auto precharge ens ures that the precharge is initiated at the earliest valid stage within a

burst. This “earliest valid stage” is determined as if an explicit PRECHARGE command

was issued at the earliest possible time, without violating tRAS (MIN), as described for

each burst type in “Operations” on page 51. The user must not issue another command

to the same bank until the precharge time (tRP) is completed.

T01

tDSH2tDSH2

tDSS3tDSS3

DQS

tDQSS

tDQSH tWPST

tDH

tDS

tDQSL

CK# T1 T1n T2 T2n T3

Don’t CareTransitioning Data

tWPRE

tWPRES

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512Mb: x4, x8, x16 DDR SDRAM

Operations

Figure 51: Bank READ – with Auto Precharge

Notes: 1. NOP commands are shown for ease of illustration; other commands may be valid at these

times.

2. BL = 4.

3. The READ command can only be applied at T3 if tRAP is satisfied at T3.

4. Enable auto precharge.

5. tRP starts only after tRAS has been satisfied.

6. DO n = data-out from column n; subsequent elements are provided in the programmed

order.

7. Refer to Figure 35 on page 69, Figure 36 on page 70, and Figure 37 on page 71 for detailed

DQS and DQ timing.

NOP1NOP1NOP1NOP1NOP1NOP1

tRCD, tRAP3

DQ6

Command

tRP5

Address

tLZ (MIN)

Row

CK#

CKE

A10

BA0, BA1

tCKtCHtCL

tIS

tIH

tIS

tIH

ISIH

tRC

CL = 2

T0 T1 T2 T3 T4 T5 T5n T6nT6T7 T8

DQS

Case 1: tAC (MIN) and tDQSCK (MIN)

Case 2: tAC (MAX) and tDQSCK (MAX)

DQS

tRPRE

tRPRE tRPST

tDQSCK (MIN)

tDQSCK (MAX)

tAC (MIN)

tLZ (MIN)

tHZ (MAX)

tAC (MAX)

ACT

Col n

Bank xBank x

ACT

Bank x

tRAS

Don’t CareTransitioning Data

tRPST

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Operations

Figure 52: Bank WRITE – with Auto Precharge

Notes: 1. NOP commands are shown for ease of illustration; other commands may be valid at these

times.

2. BL = 4.

3. Enable auto precharge.

4. DI n = data-out from column n; subsequent elements are provided in the programmed

order.

5. See Figure 50 on page 84 for detailed DQ timing.

AUTO REFRESH

During au to refresh, the addressing is generated by the internal refresh controller. This

makes the address bits a “Don’t Care” during an AUTO REFRESH command. The DDR

SDRAM requires AUTO REFRESH cycles at an average interval of tREFI (MAX).

To allow for improved efficiency in scheduling and switching between tasks, some fle xi-

bility in the absolute refresh interval is provided. A maximum of eight AUTO REFRESH

commands can be posted to any giv en DDR SDRAM, meaning that the maximum abso-

lute interval betw een any AUTO REFRESH command and the next AUTO REFRESH

command is 9 × tREFI(= tREFC). JEDEC specifications only support 8 × tREFI; Micron

specifications exceed the JEDEC requirement by one clock. This maximum absolute

interval is to allow future support for DLL updates, internal to the DDR SDRAM, to be

restricted to AUTO REFRESH cycles, without allowing excessive drift in tAC betwe en

updates.

Command NOP1NOP1NOP1NOP1NOP1NOP1NOP1

WRITE2

DQ4

Address Row

Row

CK#

CKE

A10

BA0, BA1

tCK tCH tCL

tIS

tIH

tIS

tIH

tIS tIH

tRCD

tRAS tRP

tWR

T0 T1 T2 T3 T4 T5 T5n T6 T7 T8T4n

ACT

Col n

Bank xBank x

tDQSL tDQSH tWPST

DQS

tDS tDH

tDQSS (NOM)

Don’t CareTransitioning Data

tWPRES tWPRE

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512Mb: x4, x8, x16 DDR SDRAM

Operations

Although not a JEDEC r eq uirement, to provide for future functionality feat ures, CKE

must be active (HIGH) during the AUT O REFRESH period. The AUTO REFRESH period

begins when the AUTO REFRESH command is registered and ends tRFC later.

Figure 53: Auto Refresh Mode

Notes: 1. NOP commands are shown for ease of illustration; other valid commands may be possible at

these times. CKE must be active during clock-positive transitions.

2. NOP or COMMAND INHIBIT are the only commands allowed until after tRFC time; CKE must

be active during clock-positive transitions.

3. The second AUTO REFRESH is not required and is only shown as an exampl e of two bac k-to -

back AUTO REFRESH commands.

4. “Don’t Care” if A10 is HIGH at this point; A10 must be HIGH if more than one bank is active

(that is, must precharge all active banks).

5. DM, DQ, and DQS signals are all “Don’t Care”/High-Z for t he operations shown.

SELF REFRESH

When in the self refresh mode, the DDR SDRAM retains data without external clocking.

The DLL is automatically disabled upon entering SELF REFRESH and is automatically

enabled upon exiting SELF REFRESH (a DLL reset and 200 clock cycles must then occur

before a READ command can be issued). Input signals except CKE are “Don’t Care”

during SELF REFRESH. VREF voltage is also required for the full duration of SELF

REFRESH.

The procedure for exiting SELF REFRESH requires a sequence of commands. First, CK

and CK# must be stable prior to CKE going back HIGH. Once CKE is HIGH, the DDR

SDRAM must have NOP comm ands issued for tXSNR because time is required for the

completion of any internal refresh in progress. A simple algorithm for meeting both

refresh and DLL requirements is to apply NOPs for tXSRD time, then a DLL RESET (via

CK#

CommandNOP1

ValidValid

NOP1NOP1

PRE

CKE

Address

A10

BA0, BA1

Bank(s)4

AR NOP1,2 AR3NOP1,2 ACTNOP1

One bank

All banks

DQ5

DM5

DQS5

tRFC

tRP tRFC

T0 T1 T2 T3 T4 Ta0 Tb0

Ta1 Tb1Tb2

Don’t Care

()()

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512Mb: x4, x8, x16 DDR SDRAM

Operations

the extended mode register) and NOPs for 200 additional clock cycles before applying a

READ. Any command other than a READ can be performed tXSNR (MIN) after the DLL

reset. NOP or DESELECT commands must be issued during the tXSNR (MIN) time.

Figure 54: Self Refresh Mode

Notes: 1. Clock must be stable until after the SELF REFRESH command has been registered. A change

in clock frequency is allowed before Ta0, provided it is within the specified tCK limits.

Regardless, the clock must be stable before exiting self refresh mode—that is, the clock

must be cycling within specifications by Ta0.

2. NOPs are interchangeable with DESELECT commands.

3. AUTO REFRESH is not required at this point but is highly recommended.

4. Device must be in the all banks idle state prior to entering self refresh mode.

5. tXSNR is required before any non-READ command can be applied; that is only NOP or DESE-

LECT commands are allowed until Tb1.

6. tXSRD (200 cycles of a valid clock with CKE = HIGH) is required before any READ command

can be applied.

7. As a general rule, any time self refresh mode is exited, the DRAM may not re-enter the self

refresh mode until all rows have been refreshed via the AUTO REFRESH command at the

distributed refresh rate, tREFI, or faster. However, the self refresh mode may be re-entered

anytime after exiting if each of the following conditions is met:

7a. The DRAM had been in the self refresh mode for a minimum of 200ms prior to exiting.

7b. tXSNR and tXSRD are not violated.

7c. At least two AUTO REFRESH commands are performed during each tREFI interval while

the DRAM remains out of self refresh mode.

8. If the clock frequency is changed during self refresh mode, a DLL reset is required upon exit.

9. Once the device is initialized, VREF must always be powered within specified range.

CK1

CK#

Command2NOP AR

Address

CKE

DQS

NOP

tRP4

tCHtCLtCK

tIS

tIH

tIStIH tIS

Enter self refresh mode7Exit self refresh mode7

T0 T11Ta1

Don’t Care

Ta01

tXSRD6

()()

NOP Valid3Valid

()()

tXSNR5

()()

Ta2 Tb1Tb2Tc1

ValidValid

Valid

tIStIH ()()

()()

Valid

()()

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512Mb: x4, x8, x16 DDR SDRAM

Operations

Power-down (CKE Not Active)

Unlike SD R SDRAMs, DDR SDRAMs require CKE to be active at all times an access is in

progress, from the issuing of a READ or WRITE command, until completion of the

access. Thus a clock suspend is not supported. For READs, an access complet ion is

defined when the read postamble is satisfied; for WRITEs, when the write recovery time

(tWR) is satisfied.

Pow er-down, as shown in Figure 55 on page 90, is entered when CKE is registered LOW

and all criteria in Table 33 on page 46 ar e met. If power-down occurs when all banks are

idle, this mode is referred to as precharge power-down; if power-down occurs when a

ro w is active in any bank, this mode is referred to as active power-down. Entering power-

down deactivates the input and output buffers, excluding CK, CK#, and CKE. For

maximum po wer savings, the DLL is frozen during pr echarge po wer -do wn mode. Exiting

power-down requires the device to be at the same voltage and frequency as when it

entered power-down. However, power-down duration is limite d by the refresh require-

ments of the device (tREFC).

While in power-down, CKE LOW and a stable clock signal must be maintained at the

inputs of the DDR SDRAM, while all other input signals are “ Don’t Care.” The power-

down state is synchronously exited when CKE is registered HIGH (in conjunction with a

NOP or DESELECT command). A valid executable command may be applied one clock

cycle later.

8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-3900

www.micron.com/productsupport Customer Comment Line: 800-932-4992

Micron and the Micron logo are trademarks of Micron Technology, Inc.All other trademarks are the property of their respective owners.

This data sheet contains minimum and maximum limits specified over the power supply and temperature range set forth herein. Although

considered final, these specifications are subject to change, as further product development and data characterization sometimes occur.

512Mb: x4, x8, x16 DDR SDRAM

Operations

PDF: 09005aef80a1d9d4/Source: 09005aef82a95a3a Micron Technology, Inc., reserves the right to change products or specifica tions without notice.

Figure 55: Power-Down Mode

Notes: 1. Once initialized, VREF must always be powered with in the specifie d range.

2. If this command is a PRECHARGE (or if the device is already in the idle state), then the

power-down mode shown is precharge power-down. If this command is an ACTIVE (or if at

least one row is already active), then the power-down mode shown is active power-down.

3. No column accesses are allowed to be in progress at the time power-down is entered.

CK#

CommandValid2NOP

Address

CKE

DQS

Valid

tCK tCHtCL

tIS

tIH

tIS

tIS tIH

tIH tIS

Enter 3

power-down

mode

Exit

power-down

mode

tREFC

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T0 T1 Ta0 Ta1 Ta2 T2

NOP

Don’t Care

(

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ValidValid