BFR193F NPN Silicon RF Transistor * For low noise, high-gain amplifiers up to 2 GHz * For linear broadband amplifiers 2 3 1 * fT = 8 GHz, NFmin = 1 dB at 900 MHz * Pb-free (RoHS compliant) and halogen-free (WEEE compliant) product ESD (Electrostatic discharge) sensitive device, observe handling precaution! Type BFR193F Marking RCs Pin Configuration 1=B 2=E 3=C Package TSFP-3 Maximum Ratings at TA = 25 C, unless otherwise specified Parameter Symbol Value Unit Collector-emitter voltage VCEO 12 Collector-emitter voltage VCES 20 Collector-base voltage VCBO 20 Emitter-base voltage VEBO 2 Collector current IC 80 Base current IB 10 Total power dissipation1) Ptot 580 mW Junction temperature TJ 150 C Ambient temperature TA -55 ... 150 Storage temperature TStg -55 ... 150 V mA TS 72C Thermal Resistance Parameter Symbol Value Unit Junction - soldering point2) RthJS 135 K/W 1T S is measured on the collector lead at the soldering point to the pcb 2For calculation of R thJA please refer to Application Note AN077 (Thermal Resistance Calculation) 1 2012-07-03 BFR193F Electrical Characteristics at T A = 25C, unless otherwise specified Symbol Parameter Values Unit min. typ. max. 12 - - V ICES - - 100 A ICBO - - 100 nA IEBO - - 1 A hFE 70 100 140 DC Characteristics Collector-emitter breakdown voltage V(BR)CEO IC = 1 mA, I B = 0 Collector-emitter cutoff current VCE = 20 V, VBE = 0 Collector-base cutoff current VCB = 10 V, IE = 0 Emitter-base cutoff current VEB = 1 V, IC = 0 DC current gain - IC = 30 mA, VCE = 8 V, pulse measured 2 2012-07-03 BFR193F Electrical Characteristics at TA = 25C, unless otherwise specified Symbol Values Parameter Unit min. typ. max. fT 6 8 - GHz Ccb - 0.63 1 pF Cce - 0.25 - Ceb - 2.25 - AC Characteristics (verified by random sampling) Transition frequency IC = 50 mA, VCE = 8 V, f = 500 MHz Collector-base capacitance VCB = 10 V, f = 1 MHz, VBE = 0, emitter grounded Collector emitter capacitance VCE = 10 V, f = 1 MHz, VBE = 0, base grounded Emitter-base capacitance VEB = 0.5 V, f = 1 MHz, VCB = 0 , collector grounded Minimum noise figure dB NFmin IC = 10 mA, VCE = 8 V, ZS = ZSopt , f = 900 MHz - 1 - f = 1.8 GHz - 1.6 - Gms - 12.5 - dB Gma - 19 - dB Power gain, maximum stable1) IC = 30 mA, VCE = 8 V, ZS = ZSopt, ZL = ZLopt , f = 900 MHz Power gain, maximum available1) IC = 30 mA, VCE = 8 V, ZS = ZSopt , ZL = ZLopt , f = 1.8 GHz |S21e|2 Transducer gain dB IC = 30 mA, VCE = 8 V, ZS =ZL =50, f = 900 MHz - 14.5 - f = 1.8 GHz - 8.5 - IP3 - 29 - P-1dB - 14.5 - Third order intercept point at output2) dBm VCE = 8 V, IC = 30 mA, f = 900 MHz, ZS = ZL = 50 1dB compression point at output3) IC = 30 mA, VCE = 8 V, ZS = ZL = 50 , f = 900 MHz 1/2), G ma = |S21 / S12| (k-(k-1) ms = |S21 / S12| 1G 2IP3 value depends on termination of all intermodulation frequency components. Termination used for this measurement is 50 from 0.1 MHz to 6 GHz 3DC current at no input power 3 2012-07-03 Package TSFP-3 BFR193F Package Outline 0.2 0.05 0.55 0.04 1 1.2 0.05 0.2 0.05 3 2 0.2 0.05 10 MAX. 0.8 0.05 1.2 0.05 0.15 0.05 0.4 0.05 0.4 0.05 Foot Print 1.05 0.45 0.4 0.4 0.4 Marking Layout (Example) Manufacturer BCR847BF Type code Pin 1 Standard Packing Reel o180 mm = 3.000 Pieces/Reel Reel o330 mm = 10.000 Pieces/Reel 4 0.2 1.2 1.5 8 0.3 Pin 1 0.7 1.35 4 2012-07-03 BFR193F Edition 2009-11-16 Published by Infineon Technologies AG 81726 Munich, Germany 2009 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (<www.infineon.com>). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 5 2012-07-03