BH1715FVC-TR - Rohm Semiconductor

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Ambient Light Sensor ICs

Digital 16bit Serial Output Type

Ambient Light Sensor IC

BH1715FVC

●Descriptions

BH1715FVC is an digital Ambient Light Sensor IC for I2C bus interface. BH1715FVC is the most suitable to obtain the ambient

light data for adjusting LCD and Keypad backlight power of Mobile phone. It is possible to detect wide range at High resolution.

(1 - 65535 lx).

●Features

1) I2C bus Interface (f / s Mode Support)

2) Spectral responsibility is approximately human eye response

3) Illuminance to Digital Converter

4) Wide range and High resolution. (1 – 65535 lx)

5) Low Current by power down function

6) 50Hz / 60Hz Light noise reject-function

7) 1.8V Logic input interface

8) No need any external parts

9) Light source dependency is little.

(ex. Incandescent Lamp. Fluorescent Lamp. Halogen Lamp. White LED. Sun Light)

10) It is possible to select 2 type of I2C slave-address.

11) Adjustable measurement result for influence of optical window

(It is possible to detect min. 0.23 lx, max. 100000 lx by using this function.)

12) Small measurement variation (+/- 15%)

●Applications

Mobile phone, LCD TV, NOTE PC, Portable game machine, Digital camera, Digital video camera, PDA,

LCD display

●Absolute Maximum Ratings

Parameter Symbol Ratings Units

Supply Voltage Vmax 4.5 V

Operating Temperature Topr -40～85 ℃

Storage Temperature Tstg -40～100 ℃

SDA Sink Current Imax 7 mA

Power Dissipation Pd 260※ mW

※ 70mm × 70mm × 1.6mm glass epoxy board. Derating in done at 3.47mW/℃ for operating above Ta=25℃.

●Operating Conditions

Parameter Symbol Ratings Units

Min. Typ. Max.

VCC Voltage Vcc 2.4 3.0 3.6 V

I2C Reference Voltage VDVI 1.65 － V

CC V

No.11046ECT06

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●Electrical Characteristics (VCC = 3.0V, DVI = 3.0V, Ta = 25℃, unless otherwise noted)

Parameter Symbol Limits Units Conditions

Min. Typ. Max.

Supply Current Icc1 － 120 190 µA Ev = 100 lx ※1

Powerdown Current Icc2 － 0.01 1.0 µA No input Light

Peak Wave Length λp － 560 － nm

Measurement Accuracy S/A 1.02 1.2 1.38 times

Sensor out / Actual lx

EV = 1000 lx ※1, ※2

Dark (0 lx) Sensor out S0 0 0 2 count H-Resolution Mode ※3

H-Resolution Mode Resolution rHR － 1 － lx

L-Resolution Mode Resolution rLR － 4 － lx

H-Resolution Mode Measurement Time tHR － 120 180 ms

L-Resolution Mode Measurement Time tLR － 16 24 ms

Incandescent

/ Fluorescent Sensor out ratio rIF － 1 － times EV = 1000 lx

ADDR Input ‘H’ Voltage VAH 0.7 * VCC －－ V

ADDR Input ‘L’ Voltage VAL －－ 0.3 * VCC V

DVI Input ‘L’ Voltage VDVL －－ 0.4 V

SCL, SDA Input ‘H’ Voltage 1 VIH1 0.7 * DVI －－ V DVI ≧ 1.8V

SCL, SDA Input ‘H’ Voltage 2 VIH2 1.26 －－ V 1.65V ≦ DVI ＜ 1.8V

SCL, SDA Input ‘L’ Voltage 1 VIL1 －－ 0.3 * DVI V DVI ≧ 1.8V

SCL, SDA Input ‘L’ Voltage 2 VIL2 －－ DVI-1.26 V 1.65V ≦ DVI ＜ 1.8V

SCL, SDA, ADDR Input ‘H’ Current IIH －－ 10 µA

SCL, SDA, ADDR Input ‘L’ Current IIL －－ 10 µA

I2C SCL Clock Frequency fSCL －－ 400 kHz

I2C Bus Free Time tBUF 1.3 －－ µs

I2C Hold Time (repeated)

START Condition tHDSTA 0.6 －－ µs

I2C Set up time for a Repeated

START Condition tSUSTA 0.6 －－ µs

I2C Set up time for a Repeated

STOP Condition tSUSTD 0.6 －－ µs

I2C Data Hold Time tHDDAT 0 － 0.9 µs

I2C Data Setup Time tSUDAT 100 －－ ns

I2C ‘L’ Period of the SCL Clock tLOW 1.3 －－ µs

I2C ‘H’ Period of the SCL Clock tHIGH 0.6 －－ µs

I2C SDA Output ‘L’ Voltage VOL 0 － 0.4 V IOL = 3 mA

※1 White LED is used as optical source.

※2 Measurement Accuracy typical value is possible to change '1' by "Measurement result adjustment function".

※3 Use H-Resolution Mode if dark data (less than 10 lx) is need.

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●Reference Data

Fig.8 Light Source Dependency

( Fluorescent Light is set to '1' )

100

1000

10000

100000

1 10 100 1000 10000 100000

Illuminance [ lx ]

Measurement Result

Fig.4 Directional Characteristics 1 Fig.5 Directional Characteristics 2

Fig.6 Dark Response

蛍光灯白熱灯感度比

VCC vs. ICC@測定

中

受信指向角特性

0.2

0.4

0.6

0.8

1.2

-90 -60 -30 0 30 60 90

Angle [ deg ]

Ratio

0.2

0.4

0.6

0.8

1.2

-90 -60 -30 0 30 60 90

Angle [ deg ]

Ratio

-40 -10 20 50 80 110

Ta [ ℃ ]

Measurement Result

100

150

200

2 2.5 3 3.5 4

VCC [ V ]

ICC @ Measurement

00.511.52

Fluorescent

Light

Incandescent

Light

Halogen

Light

Kripton Light

Artifical Sun

Light

White LED

Ratio

H-Res. L-Res.

0 8 16 24 32 40 48 56 64

Illuminance [ lx ]

Measurement Result

H-Res.

L-Res.

H-Res.

1pin

0.2

0.4

0.6

0.8

1.2

400 500 600 700 800 900 1000 1100

Wavelength [ nm ]

Ratio

Fig.7 Measurement Result

Temperature Dependency

Fig.2 Illuminance –

Measurement Result 1

Fig.3 Illuminance –

Measurement Result 2

Fig.9 VCC – ICC

( During measurement )

Fig.10 VCC – ICC@0 Lx

( POWER DOWN )

Fig.1 Spectral Response

0.2

0.4

0.6

0.8

1.2

22.533.54

VCC [ V ]

Ratio

Fig.11 Measurement Result

VCC Dependency

0.2

0.4

0.6

0.8

1.2

1.5 2 2.5 3 3.5

DVI [ V ]

Ratio

Fig.12 Measurement Result

DVI Dependency

DVI=1.8V VCC=3V

0.01

0.1

-40 -20 0 20 40 60 80

Ta [ ℃ ]

ICC @ POWER DOWN [ uA ]

0.2

0.4

0.6

0.8

1.2

-40 -10 20 50 80 110

Ta [ ℃ ]

Ratio

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●Block Diagram

●Block Diagram Descriptions

●PD

Photo diode with approximately human eye response.

●AMP

Integration-OPAMP for converting from PD current to Voltage.

●ADC

AD converter for obtainment Digital 16bit data.

●Logic + I2C Interface

Ambient Light Calculation and I2C BUS Interface. It is including below register.

Data Register → This is for registration of Ambient Light Data. Initial Value is "0000_0000_0000_0000".

Measurement Time Register → This is for registration of measurement time. Initial Value is "0100_0101".

●OSC

Internal Oscillator (typ. 320kHz). It is CLK for internal logic.

●Measurement Procedure

* "Power On" Command is possible to omit.

SCL

SDA

GND ADDR

VCC DVI

Logic

I2C Interface

ADC

AMP

OSC

State Transition by I2C write-command.

Automatically State Transition

State is automatically changed to

Power Down mode.

Power supply

Power Down

Power On

Measurement Command

Initial state is Power Down mode after

VCC and DVI supply.

One Time Measurement Continuous Measurement

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●Instruction Set Architecture

Instruction Opecode Comments

Power Down 0000_0000 No active state.

Power On 0000_0001 Waiting for measurement command.

Reset 0000_0111

Reset Data register value. Reset command is not acceptable in

Power Down mode.

Continuously H-Resolution Mode 0001_0000 Start measurement at 1lx resolution.

Measurement Time is typically 120ms.

Continuously L-Resolution Mode 0001_0011 Start measurement at 4lx resolution.

Measurement Time is typically 16ms.

One Time H-Resolution Mode 0010_0000

Start measurement at 1lx resolution.

Measurement Time is typically 120ms.

It is automatically set to Power Down mode after measurement.

One Time L-Resolution Mode 0010_0011

Start measurement at 4lx resolution.

Measurement Time is typically 16ms.

It is automatically set to Power Down mode after measurement.

Change Measurement time

(High bit) 01000_MT[7,6,5] Change measurement time.

※ Please refer "adjust measurement result for influence of optical window."

Change Measurement time

(Low bit)

011_MT[4,3,2,1,

Change measurement time.

※ Please refer "adjust measurement result for influence of optical window."

※ Don't input the other opecode.

●Measurement mode explanation

Measurement Mode Measurement Time. Resolution

H-Resolution Mode Typ. 120ms. 1 Lx.

L-Resolution Mode Typ. 16ms. 4 Lx.

We recommend to use H-Resolution Mode.

Measurement time (integration time) of H-Resolution Mode is so long that some kind of noise(including in 50Hz / 60Hz noise)

is rejected. And H-Resolution Mode is 1 lx resolution so that it is suitable for darkness (less than 10 lx)

●Explanation of Asynchronous reset and Reset command "0000_0111"

1) Asynchronous reset

All registers are reset. It is necessary on power supply sequence. Please refer "Timing chart for VCC and DVI power

supply sequence" in this page. It is power down mode during DVI = 'L'.

2) Reset command

Reset command is for only reset Illuminance data register. (reset value is '0') It is not necessary even power supply

sequence. It is used for removing previous measurement result. This command is not working in power down mode, so

that please set the power on mode before input this command.

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●Timing chart for VCC and DVI power supply sequence

DVI is I2C bus reference voltage terminal. And it is also asynchrono reset terminal. It is necessary to set to 'L' after VCC is

supplied. In DVI 'L' term, internal state is set to Power Down mode.

1) Recommended Timing chart1 for VCC and DVI supply.

2) Timing chart2 for VCC and DVI supply.

(If DVI rises within 1us after VCC supply)

VCC

DVI

Reset Term ( more than 1µs )

VCC

DVI

Don't care state

ADDR, SDA, SCL is not stable if DVI 'L' term ( 1µs ) is not given by systems.

In this case, please connect the resisters ( approximately 100kOhm ) to ADDR without directly

connecting to VCC or GND,because it is 3 state buffer for Internal testing.

Reset Term ( more than 1µs )

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●Measurement sequence example from "Write instruction" to "Read measurement result"

ex1) Continuously H-resolution mode (ADDR = 'L')

① Send "Continuously H-resolution mode " instruction

ST 0100011 0 Ack 00010000 Ack SP

② Wait to complete 1st H-resolution mode measurement.(max. 180ms.)

③ Read measurement result.

ST 0100011 1 Ack High Byte [ 15:8 ] Ack

Low Byte [ 7:0 ] Ack SP

How to calculate when the data High Byte is "10000011" and Low Byte is "10010000"

15 + 29 + 28 + 27 + 24) / 1.2 ≒ 28067 [ lx ]

The result of continuously measurement mode is updated.(120ms.typ at H-resolution mode, 16ms.typ at L-resolution mode)

ex2) One time L-resolution mode (ADDR = 'H')

① Send "One time L-resolution mode " instruction

ST 1011100 0 Ack 00100011 Ack SP

② Wait to complete L-resolution mode measurement.(max. 24ms.)

③ Read measurement result

ST 1011100 1 Ack High Byte [ 15:8 ] Ack

Low Byte [ 7:0 ] Ack SP

How to calculate when the data High Byte is "00000001" and Low Byte is "00010000"

8 + 24) / 1.2 ≒ 227 [ lx ]

In one time measurement, Statement moves to power down mode after measurement completion. If updated result is

need then please resend measurement instruction.

from Master to Slave from Slave to Master

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●Application circuit example of DVI terminal

The DVI terminal is an asynchronous reset terminal. Please note that there is a possibility that IC doesn't operate normally if

the reset section is not installed after the start-up of VCC. (Please refer to the paragraph of "Timing chart for VCC and DVI

power supply sequence")

The description concerning SDA and the terminal SCL is omitted in this application circuit example. Please design the

application the standard of the I2C bus as it finishes being satisfactory. Moreover, the description concerning the terminal

ADDR is omitted. Please refer to the paragraph of "Timing chart for VCC and DVI power supply sequence" about the

terminal ADDR design.

ex 1) The control signal line such as CPU is connected.

ex 2) Reset IC is used.

1, For Reset IC of the Push-Pull type

2, For Reset IC of the Open drain output

ex 3) A different power supply is used.

※ Power supply of DVI must stand up later than power supply of VCC stand up, because it is necessary to secure reset section (1µs or more).

Micro

Controller

VCC

ADDR

SCL

SDA

0.1µF

DVI

GND

BH1715FVC

VCC

ADDR

SCL

SDA

0.1µF

DVI

GND

RESET

Reset IC( Push-Pull type )

BH1715FVC

0.1µF

VCC

ADDR

SCL

SDA

0.1µF

DVI

GND

Reset IC( Open drain type )

RESET

1kOhm

BH1715FVC

0.1µF

BH1715FVC

VCC

ADDR

SCL

SDA 0.1µF

DVI

GND

0.1µF

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ex 4) LPF using CR is inserted between VCC and DVI.

This method has the possibility that the Reset section of turning on the power supply can not satisfied. cannot be satisfied.

Please design the set considering the characteristic of the power supply enough.

◆ Notes when CR is inserted between VCC and DVI

※ Please note that there is a possibility that reset section (1µs) can not be satisfied because the power supply is turned on when the rise time of VCC is slow

※ When VCC is turned off, the DVI voltage becomes higher than VCC voltage but IC destruction is not occurred if recommended constant

(R1 = 1kOhm, C1 = 1µF) is used.

※ Please note that there is a possibility that Reset section (1µsec) cannot be satisfied if wait time is not enough long after turning off VCC.

(It is necessary to consider DVI voltage level after turning off VCC.)

◆ Example of designing set when CR (C = 1µF, R = 1kΩ) is inserted between VCC and DVI with VCC=2.8V

① The rise time to 0→2.4V of VCC must use the power supply of 100µs or less.

② Please wait 25ms or more after VCC turn off (VCC <= 0.05V), because it is necessary to secure reset section

(1µs or more).

R1 : 1kOhm

0.1µF C1 : 1µF

VCC

ADDR

GND

SCL

DVI

SDA

BH1715FVC

Reset Section : 1µs or more

t1 VCC

DVI

2.4V

0.4V

* Please do the application design to secure Reset section 1µs or more after the reclosing of the power supply.

Reset Section : 1µs or more

Rise time of

ower su

: 100

s or less

0.05V

Time to power supply reclosing : 25ms or more VCC

DVI

2.4V

0.4V

2.8V

*Please do the application design to secure Reset section 1µs or more after the reclosing of the power supply.

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Technical Note

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●I2C Bus Access

1) I2C Bus Interface Timing chart

Write measurement command and Read measurement result are done by I2C Bus interface. Please refer the formally

specification of I2C Bus interface, and follow the formally timing chart.

2) Slave Address

Slave Address is 2 types, it is determined by ADDR Terminal

ADDR = ‘H’ (ADDR ≧ 0.7VCC) →“1011100“

ADDR = 'L' (ADDR ≦ 0.3VCC) →“0100011“

3)Write Format

BH1715FVC is not able to accept plural command without stop condition. Please insert SP every 1 Opecode.

ST Slave Address R/W

0 Ack Opecode Ack SP

4)Read Format

ST Slave Address R/W

1 Ack High Byte [15:8]

215 214 213 212 211 210 29 28 Ack

Low Byte [7:0]

27 26 25 24 23 22 21 20 Ack SP

ex)

High Byte = "1000_0011"

Low Byte = "1001_0000"

(215 + 29 + 28 + 27 + 24) / 1.2 ≒ 28067 [ lx ]

* Please refer formality I2C bus specification of NXP semiconductors.

from Master to Slave from Slave to Master

tHD ; DAT

SDA

SCL

tHD ; STA

tLOW

tf tr

tSU ; STA

tSU

;

DAT tf

tSU;STO

tBUF

tHIGH

tHD ; STA

BH1715FVC

Technical Note

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●Adjust measurement result for influence of optical window. ( sensor sensitivity adjusting )

BH1715FVC is possible to change sensor sensitivity. And it is possible to cancel the optical window influence (difference with

/ without optical window) by using this function. Adjust is done by changing measurement time. For example, when

transmission rate of optical window is 50% ( measurement result becomes 0.5 times if optical window is set ), influence of

optical window is ignored by changing sensor sensitivity from default to 2 times

Sensor sensitivity is shift by changing the value of MTreg ( measurement time regisiter ). MTreg value has to set 2 times if

target of sensor sensitivity is 2 times. Measurement time is also set 2 times when MTreg value is changed from default to 2

times.

ex) Procedure for changing target sensor sensitivity to 2 times.

Please change Mtreg from ”0100_0101” ( default ) to ”1000_1010” ( default * 2 ).

1) Changing High bit of Mtreg

ST Slave Address R/W

0 Ack 01000_100 Ack SP

2) Changing Low bit of Mtreg

ST Slave Address R/W

0 Ack 011_01010 Ack SP

3) Input Measurement Command.

ST Slave Address R/W

0 Ack 0001_0000 Ack SP

※This example is High Resolution mode, but it accepts the other measurement.

4) After about 240ms, measurement result is registered to Data Register.

(High Resolution mode is typically 120ms, but measurement time is set twice.)

The below table is seeing the changable range of MTreg.

Min. Typ. Max.

changable

range of MTreg

binary 0001_1111

( sensitivity : default * 0.45 )

0100_0101

default

1111_1110

( sensitivity : default * 3.68 )

decimal 31

( sensitivity : default * 0.45 )

default

254

( sensitivity : default * 3.68 )

It is possilbe to detect 0.23lx by using this function at H-resolution mode.

The below formula is to calculate illuminance per 1 count.

Illuminance per 1 count ( lx / count ) = 1 / 1.2 *( 69 / X )

1.2 : Measurement accuracy

69 : Default value of MTreg ( dec )

X : MTreg value

The below table is seeing the detail of resolution.

MTreg value lx / count

0001_1111 1.85

0100_0101 0.83

1111_1110 0.23

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●Terminal Description

Pin No. Terminal Name Equivalent Circuit Function

1 VCC Power Supply Terminal

2 ADDR

I2C Slave-address Terminal

ADDR = ‘H’ (ADDR ≧ 0.7VCC)

“1011100“

ADDR = 'L' (ADDR ≦ 0.3VCC)

“0100011“

ADDR Terminal is designed as 3 state buffer for

internal test. So that please take care of VCC and

DVI supply procedure.Please see P6.

3 GND GND Terminal

4 SDA

I2C bus Interface SDA Terminal

5 DVI

SDA, SCL Reference Voltage Terminal

And DVI Terminal is also asynchronous Reset for

internal registers.So that please set to 'L' (at least

1µs, DVI <= 0.4V) after VCC is supplied.

BH1715FVC is pulled down by 150kOhm while

DVI = 'L'.

6 SCL

I2C bus Interface SCL Terminal

※ These values are design-value, not guaranteed.

150kOhm

VCC

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WSOF6 ( Unit : mm )

Lot No.

Production

code

●Package Outlines

●About an optical design on the device

0.8 mm

1.3 mm

PD area ( 0.25 mm x 0.3 mm )

Please design the optical window so that

light can cover at least this area.

Min.0.4 mm

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Technical Note

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●The method of distinguishing 1pin

There is some method of distinguishing 1pin.

① Distinguishing by 1Pin wide-lead

② Distinguishing by die pattern

③ Distinguishing by taper part of 1-3pin side

② (by die pattern) is the easiest method to distinguish by naked eye.

①

②

③

Production code

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●Cautions on use

1) Absolute Maximum Ratings

An excess in the absolute maximum ratings, such as supply voltage (Vmax), temperature range of operating conditions

(Topr), etc., can break down devices, thus making impossible to identify breaking mode such as a short circuit or an open

circuit. If any special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take

physical safety measures including the use of fuses, etc.

2) GND voltage

Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state.

Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric

transient.

3) Short circuit between terminals and erroneous mounting

In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can

break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or between

the terminal and the power supply or the GND terminal, the ICs can break down.

4) Operation in strong electromagnetic field

Be noted that using ICs in the strong electromagnetic field can malfunction them.

5) Inspection with set PCB

On the inspection with the set PCB, if a capacitor is connected to a low-impedance IC terminal, the IC can suffer stress.

Therefore, be sure to discharge from the set PCB by each process. Furthermore, in order to mount or dismount the set

PCB to/from the jig for the inspection process, be sure to turn OFF the power supply and then mount the set PCB to the jig.

After the completion of the inspection, be sure to turn OFF the power supply and then dismount it from the jig. In addition,

for protection against static electricity, establish a ground for the assembly process and pay thorough attention to the

transportation and the storage of the set PCB.

6) Input terminals

In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the

parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the

input terminal. Therefore, pay thorough attention not to handle the input terminals; such as to apply to the input terminals a

voltage lower than the GND respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage to

the input terminals when no power supply voltage is applied to the IC. In addition, even if the power supply voltage is

applied, apply to the input terminals a voltage lower than the power supply voltage or within the guaranteed value of

electrical characteristics.

7) Thermal design

Perform thermal design in which there are adequate margins by taking into account the power dissipation (Pd) in actual

states of use.

8) Treatment of package

Dusts or scratch on the photo detector may affect the optical characteristics. Please handle it with care.

9) Rush current

When power is first supplied to the CMOS IC, it is possible that the internal logic may be unstable and rush current may

flow instantaneously. Therefore, give special consideration to power coupling capacitance, power wiring, width of GND

wiring, and routing of connections.

10) The exposed central pad on the back side of the package

There is an exposed central pad on the back side of the package. But please do it non connection. (Don't solder, and

don't do electrical connection) Please mount by Footprint dimensions described in the Jisso Information for WSOF6. This

pad is GND level, therefore there is a possibility that LSI malfunctions and heavy-current is generated.

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Technical Note

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●Ordering part number

B H 1 7 1 5 F V C - T R

Part No. Part No.

1715

Package

FVC: WSOF6

Packaging and forming specification

TR: Embossed tape and reel

(WSOF6)

Direction of feed

Reel

∗

Order quantity needs to be multiple of the minimum quantity.

Embossed carrier tapeTape

Quantity

Direction

of feed

The direction is the 1pin of product is at the upper right when you hold

reel on the left hand and you pull out the tape on the right hand

3000pcs

()

1pin

(Unit : mm)

WSOF6

0.08

0.08 S

654

456

(MAX1.8 include BURR)

(MAX2.8 include BURR)

2.6±0.1

0.3

1.6±0.1

3.0±0.1

0.75MAX

0.5 0.22±0.05

(0.45)

(0.15)

0.145±0.05

(1.5)

(1.2)

1PIN MARK

R1120

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consent of ROHM Co.,Ltd.

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The content specied herein is for the purpose of introducing ROHM's products (hereinafter

"Products"). If you wish to use any such Product, please be sure to refer to the specications,

which can be obtained from ROHM upon request.

Examples of application circuits, circuit constants and any other information contained herein

illustrate the standard usage and operations of the Products. The peripheral conditions must

be taken into account when designing circuits for mass production.

Great care was taken in ensuring the accuracy of the information specied in this document.

However, should you incur any damage arising from any inaccuracy or misprint of such

information, ROHM shall bear no responsibility for such damage.

The technical information specied herein is intended only to show the typical functions of and

examples of application circuits for the Products. ROHM does not grant you, explicitly or

implicitly, any license to use or exercise intellectual property or other rights held by ROHM and

other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the

use of such technical information.

The Products specied in this document are intended to be used with general-use electronic

equipment or devices (such as audio visual equipment, ofce-automation equipment, commu-

nication devices, electronic appliances and amusement devices).

The Products specied in this document are not designed to be radiation tolerant.

While ROHM always makes efforts to enhance the quality and reliability of its Products, a

Product may fail or malfunction for a variety of reasons.

Please be sure to implement in your equipment using the Products safety measures to guard

against the possibility of physical injury, re or any other damage caused in the event of the

failure of any Product, such as derating, redundancy, re control and fail-safe designs. ROHM

shall bear no responsibility whatsoever for your use of any Product outside of the prescribed

scope or not in accordance with the instruction manual.

The Products are not designed or manufactured to be used with any equipment, device or

system which requires an extremely high level of reliability the failure or malfunction of which

may result in a direct threat to human life or create a risk of human injury (such as a medical

instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuel-

controller or other safety device). ROHM shall bear no responsibility in any way for use of any

of the Products for the above special purposes. If a Product is intended to be used for any

such special purpose, please contact a ROHM sales representative before purchasing.

If you intend to export or ship overseas any Product or technology specied herein that may

be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to

obtain a license or permit under the Law.