TFF1013HN/N1,135 - NXP Semiconductors

1. General description

The TFF1013HN is an integrated downconverter for use in Low Noise Block (LNB)

convertors in a 10 .7 GHz to 12.75 GHz Ku band satellite receiver system.

2. Features and benefits

Low current consumption integrated pre-amplifier, mixer, buffer amplifier and

PLL synthesizer

Flat gain over frequency

Single 5 V supply pin

Low cost 25 MHz crystal

Crystal controlled LO frequency generation

Switched LO frequency (9.75 GHz and 10.6 GHz)

Low phase noise

Low spurious

Low external com p on e nt count

Alignment-free concept

ESD protection on all pins

3. Applications

Ku band LNB converters for digital satellite reception (DVB-S / DVB-S2)

4. Quick reference data

TFF1013HN

Integrated mixer oscillator PLL for satellite LNB

Rev. 1 — 11 September 2013 Product data sheet

Table 1. Quick reference data

VCC = 5 V; Tamb = 25



C; fLO = 9.75 GHz or 10.6 GHz; fxtal = 25 MHz; Z0 = 50



unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Unit

VCC supply voltage RF input and IF output AC coupled [1] 4.5 5 5.5 V

ICC supply current RF input and IF output AC coupled [1] -52- mA

NFSSB single sideband noise figure - 9 - dB

fi(RF) RF input frequency low band 10.7 - 11.7 GHz

high band 11.7 - 12.75 GHz

Gconv conversion gain measured at low band fIF = 1450 MHz and

high band fIF = 1625 MHz -33- dB

Product data sheet Rev. 1 — 11 September 2013 2 of 13

NXP Semiconductors TFF1013HN

Integrated mixer oscillator PLL for satellite LNB

[1] DC values.

[2] measurement 1: f1 = 1733 MHz; f2 = 1773 MHz; Pi = 46 dBm per carrier; IP3o measured at 1813 MHz

measurement 2: f1 = 1893 MHz; f2 = 1853 MHz; Pi = 46 dBm per carrier; IP3o measured at 1813 MHz

5. Ordering information

s11 input reflection coefficient fi(RF) = 10.7 GHz to 12.7 GHz - 10 - dB

s22 output reflection coefficient fo(IF) = 950 MHz to 2150 MHz; Z0=75-10 - dB

IP3ooutput third-order intercept point worst case value of the two measurements is

specified [2] -17- dBm

Table 1. Quick reference data …continued

VCC = 5 V; Tamb = 25



C; fLO = 9.75 GHz or 10.6 GHz; fxtal = 25 MHz; Z0 = 50



unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Unit

Table 2. Ordering information

Type number Package

Name Description Version

TFF1013HN DHVQFN16 plastic dual in-line compatible thermal enhanced ve ry thin quad flat

package; no leads;16 terminals; body 2.5  3.5  0. 85 mm SOT763-1

Product data sheet Rev. 1 — 11 September 2013 3 of 13

NXP Semiconductors TFF1013HN

Integrated mixer oscillator PLL for satellite LNB

6. Block diagram

7. Functional diagram

Fig 1. TFF1013HN block diagram

aaa-000007

13 IF_GND

RF_GND1

n.c.

RF_GND2

RF_GND3

GND1

n.c.

VREG

XO1

XO2

GND2

DIVIDER

PFD

CHARGE

PUMP

ON-CHIP

REGULATOR

internal

supplies

and bias

Fig 2. Functional diagram

PLL

XO2

XO1

VCC

9.75 GHz/10.6 GHz

aaa-00000

Product data sheet Rev. 1 — 11 September 2013 4 of 13

NXP Semiconductors TFF1013HN

Integrated mixer oscillator PLL for satellite LNB

8. Pinning information

8.1 Pinning

8.2 Pin description

[1] The distance between the outer edges of pin 2 and 3 is 740 m. This gives an optimum transition from a 1.1 mm wide, Z0 = 50  line on

RO4223 Printed-Circuit Board (PCB) material of 0.5 mm height to the TFF1013HN.

Fig 3. Pi n co nfi gura t io n

aaa-000009

n.c. HB

GND1 XO2

RF_GND2 XO1

RF GND2

n.c. IF

RF_GND1 IF_GND

VREG

RF_GND3

Transparent top view

710

611

512

413

314

215

terminal 1

index area

Table 3. Pin description

Symbol Pin Description

GND 0 ground (exposed die pad)

RF_GND3 1 RF ground. Connect this pin to the exposed die pad landing.

RF_GND1 2 RF ground. Connect this pin to the exposed die pad landing and the RF input CPW line.

n.c. 3 not connected. Connect to RF on PCB. [1]

RF 4 RF input.

RF_GND2 5 RF ground. Connect this pin to the exposed die pad landing and the RF input CPW line.

GND1 6 Ground. Connect this pin to the exposed die pad landing and the RF input CPW line.

n.c. 7 not connected. Use this pin to route the ground layer on top of the PCB to the exposed die pad.

LF 8 Loop filter PLL. Connect loop filter between this pin and VREG (pin 9).

VREG 9 Regulated output voltage for PLL loop filter. Connect loop filter to this pin. Decouple against die pad via

pin 7.

HB 10 High band / low band selection. Connect this pin to the tone detector or to a logic signal.

XO2 11 Crystal connection 2. Connect crystal between this pin and XO1 (pin 12).

XO1 12 Crystal connection 1. Connect crystal between this pin and XO2 (pin 11).

GND2 13 Ground. Connect this pin to the exposed die pad landing.

IF 14 IF output

IF_GND 15 IF output ground. Connect this pin to the exposed die pad landing and the output transmission line ground.

VCC 16 Supply voltage

Product data sheet Rev. 1 — 11 September 2013 5 of 13

NXP Semiconductors TFF1013HN

Integrated mixer oscillator PLL for satellite LNB

9. Limiting values

10. Recommended operating conditions

[1] For a 10.678 GHz LO frequency, select high band and use a crystal with frequency 10.678 GHz / 424 = 25.183962 MHz.

11. Thermal characteristics

Table 4. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

VCC supply voltage 0.5 +6 V

VI(HB) input voltage on pin HB 0.5 +6 V

Tstg storage temperature 40 +125 C

Table 5. Operating conditions

Symbol Parameter Conditions Min Typ Max Unit

VCC supply voltage 4.5 5 5.5 V

VI(HB) input voltage on pin HB 0 - 5.5 V

Tamb ambient temperature 40 +25 +85 C

Z0characteristic impedance - 50 - 

fi(RF) RF input frequency low band 10.7 - 11.7 GHz

high band 11.7 - 12.75 GHz

fLO LO frequency low band - 9.75 - GHz

high band [1] -10.6- GHz

fo(IF) IF output frequency low band 0.95 - 1.95 GHz

high band 1.1 - 2.15 GHz

CL(xtal) crystal load capacitance - 10 - pF

ESR equivalent series resistance - - 40 

fxtal crystal frequency - 25 - MHz

Table 6. Thermal characteristics

Symbol Parameter Conditions Typ Unit

Rth(j-c) thermal resistance from junction to case 35 K/W

Product data sheet Rev. 1 — 11 September 2013 6 of 13

NXP Semiconductors TFF1013HN

Integrated mixer oscillator PLL for satellite LNB

12. Characteristics

[1] DC values

[2] measurement 1: f1 = 1733 MHz; f2 = 1773 MHz; Pi = 46 dBm per carrier; IP3o measured at 1813 MHz

measurement 2: f1 = 1893 MHz; f2 = 1853 MHz; Pi = 46 dBm per carrier; IP3o measured at 1813 MHz

Table 7. Characteristics

VCC = 5 V; Tamb = 25



C; fLO = 9.75 GHz or 10.6 GHz; fxtal = 25 MHz; Z0 = 50



unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Unit

ICC supply current RF input and IF output AC coupled [1] -52- mA

n(itg) integrated phase noise density integration offset frequency =

10kHzto13MHz;

loop bandwidth = crossover bandwidth

-1.5- RMS

NFSSB single sideband noise figure measured at low band fIF =1450MHz

and high band fIF = 1625 MHz -9- dB

Gconv conversion gain measured at low band fIF =1450MHz

and high band fIF = 1625 MHz -33- dB

Gconv conversion gain variation over whole IF band - 2.0 - dB

in every 36 MHz band - 0.5 - dB

s11 input reflection coefficient fi(RF) = 10.7 GHz to 12.7 GHz - 10 - dB

s22 output reflection coefficient f o(IF) = 950 MHz to 2150 MHz; Z0=75-10 - dB

IP3ooutput third-order intercept point worst case value of the two

measurements is specified [2] -17- dBm

PL(1dB) output power at 1 dB gain compression - 6 - dBm

VIL(HB) LOW-level input voltage on pin HB - - 0.8 V

VIH(HB) HIGH-level input voltage on pin HB 2.0 - - V

Rpd(HB) pull-down resistance on pin HB 80 110 140 k

Product data sheet Rev. 1 — 11 September 2013 7 of 13

NXP Semiconductors TFF1013HN

Integrated mixer oscillator PLL for satellite LNB

13. Application information

Fig 4. Application diag ra m of TFF 101 3HN

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Table 8. List of netnames

See Figure 4.

Netname Description

GH Gate voltage of 1st stage LNA. Horizontal polarization

DH Drain voltage of 1st stage LNA. Horizontal polarization

GV Gate voltage of 1st stage LNA. Vertical polarization

DV Drain voltage of 1st stage LNA. Vertical polarization

G2 Gate voltage of 2nd stage LNA

D2 Drain voltage of 2nd stage LNA

HB High band oscillator supply control

LB Low band oscillator supply control

Product data sheet Rev. 1 — 11 September 2013 8 of 13

NXP Semiconductors TFF1013HN

Integrated mixer oscillator PLL for satellite LNB

Fig 5. LNB system block diagram with TFF1013HN

SUPPL Y AND

BAND/POLARIZATION SWITCHING 5 V

REGULATOR

RF gain

image

reject filter

horizontal

polarization

vertical

polarization

mixer lF gain

PLL

9.75 GHz/10.6 GHz

1st STAGE LNA

1st STAGE LNA 2nd STAGE LNA

aaa-000011

Product data sheet Rev. 1 — 11 September 2013 9 of 13

NXP Semiconductors TFF1013HN

Integrated mixer oscillator PLL for satellite LNB

14. Package outline

Fig 6. Package outline SOT763-1

terminal 1

index area

0.51

A1Eh

UNIT ye

0.2

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

mm 3.6

3.4

2.15

1.85

2.6

2.4 1.15

0.85

2.5

0.30

0.18

0.05

0.00 0.05 0.1

DIMENSIONS (mm are the original dimensions)

SOT763-1 MO-241 - - -- - -

0.5

0.3

0.1

0.05

0 2.5 5 mm

scale

SOT763-1

DHVQFN16: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads;

16 terminals; body 2.5 x 3.5 x 0.85 mm

A(1)

max.

AA1c

detail X

y1C

15 10

terminal 1

index area

E(1)

Note

1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.

D(1)

02-10-17

03-01-27

Product data sheet Rev. 1 — 11 September 2013 10 of 13

NXP Semiconductors TFF1013HN

Integrated mixer oscillator PLL for satellite LNB

15. Abbreviations

16. Revision history

Table 9. Abbreviations

Acronym Description

CPW CoPlanar Waveguide

DVB-S Digital Video Broadcasting by Satellite

DVB-S2 Digital Video Broadcasting - Satellite - Second generation

IF Intermediate Frequency

Ku band K-under band

LO Local Oscillator

PFD Phase Frequency Detector

pHEMT Pseudomorphic High Electron Mobil ity Transistor

PLL Phase-Locked Loop

VCO Voltage-Controlled Oscillator

V/T Voltage / Tone

XO Crystal Oscillator

Table 10. Revision history

Document ID Release date Data sheet status Change notice Supersedes

TFF1013HN v.1 20130911 Product data sheet - -

Product data sheet Rev. 1 — 11 September 2013 11 of 13

NXP Semiconductors TFF1013HN

Integrated mixer oscillator PLL for satellite LNB

17. Legal information

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[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term ‘short data sheet’ is explained in section “Definitions”.

[3] The product status of de vice(s) descr ibed in th is docume nt may have cha nged since this docume nt was publis hed and ma y dif fer in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

17.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

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use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and tit le. A short data sh eet is intended

for quick reference only and shou ld not be rel ied u pon to cont ain det ailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

office. In case of any inconsistency or conf lict with the short data sheet, the

full data sheet shall pre vail.

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Customers are responsible for the design and ope ration of their applications

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Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanent ly and irreversibly affect

the quality and reliability of the device.

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products are sold subject to the general terms and conditions of commercial

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Document status[1][2] Product status[3] Definition

Objective [short] data sheet Development This document contains data from the obj ective specification for product development.

Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specification.

Product [short] dat a sheet Production This document contains the product specification.

Product data sheet Rev. 1 — 11 September 2013 12 of 13

NXP Semiconductors TFF1013HN

Integrated mixer oscillator PLL for satellite LNB

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Quick reference data — The Quick reference data is an extract of the

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are the property of their respect i ve ow ners.

18. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

NXP Semiconductors TFF1013HN

Integrated mixer oscillator PLL for satellite LNB

For more information, please visit: http://www.nxp.co m

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 11 September 2013

Document identifier: TFF1013HN

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

19. Contents

1 General description. . . . . . . . . . . . . . . . . . . . . . 1

2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1

3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

4 Quick reference data . . . . . . . . . . . . . . . . . . . . . 1

5 Ordering information. . . . . . . . . . . . . . . . . . . . . 2

6 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3

7 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3

8 Pinning information. . . . . . . . . . . . . . . . . . . . . . 4

8.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

8.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4

9 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5

10 Recommended operating conditions. . . . . . . . 5

11 Thermal characteristics . . . . . . . . . . . . . . . . . . 5

12 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 6

13 Application information. . . . . . . . . . . . . . . . . . . 7

14 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9

15 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 10

16 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 10

17 Legal information. . . . . . . . . . . . . . . . . . . . . . . 11

17.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11

17.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

17.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 11

17.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 12

18 Contact information. . . . . . . . . . . . . . . . . . . . . 12

19 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13