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AMCC Announces Comprehensive Solution Set For OC-768 Applications
AMCC's S76801/S76802 Mux/DeMux and S76804 PECOS framer/pointer processor/
digital wrapper/FEC device will provide a total 40G solution chipset with seamless
interfaces, providing customers with exceptional functionality and flexibility
SAN DIEGO, March 18, 2002 -- Applied Micro Circuits Corp. (AMCC) [NASDAQ:
AMCC], today announced the S76801 transmitter with Clock Synthesizer Unit (CSU), the
S76802 receiver with Clock and data Recovery Unit (CRU) and post amplifier (see
Figure 1) and Pecos (S76804PBI), a highly-integrated single-chip OC-768 SONET/SDH
interleaver/disinterleaver with 40G FEC/digital wrapper (see Figure 2). The S76801/
S76802 and Pecos devices demonstrate AMCC's continued ability to provide
outstanding flexibility, exceptional reliability and a high level of integration, while
simultaneously maximizing performance for the 40 Gbps marketplace. Building upon
AMCC's commitment to being a complete solution provider, the S76801 and S76802
chipset easily interfaces with the Pecos interleaver/disinterleaver as well as AMCC's
industry-leading S76800 transimpedance amplifier (TIA) and S76803 modulator driver
(see Figure 3.
The S76801 (16:1 Mux) and S76802 (1:16 DeMux) Silicon Germanium (SiGe) OC-768
devices are designed for SONET/SDH short and long-haul applications. The fully
integrated mux/demux chipset is offered in a compact, V-connectorized package that
simplifies system design and can easily operate over the STS-768 (39.813 Gbps) to STS-
768 with ITU-T G.709 Forward Error Correction (FEC) bit rates (43.018 Gbps).
"The mux/demux chipset provides a reliable and manufacturable SiGe solution, providing
customers with overall savings in cost, development time and real estate," said Oswin
Schreiber, senior product marketing manager at AMCC. "The introduction of the S76801/
S76802 and Pecos, along with AMCC's previously announced transimpedance and
modulator driver, offers customers, for the first time, a complete and glueless chipset for
OC-768 applications. We not only deliver affordable and reliable solutions with superior
bandwidth and functionality, we are enabling the next generation of high-performance
equipment for the world’s 40 Gbps telecommunications infrastructure."
Developed for Metro and long haul DWDM, optical switches and routers, Pecos allows
customers to experience seamless backplane interfaces to switch fabrics and other
framer products enabled by its 2.5G I/O and OC-48 interfaces on its low speed side.
Pecos's industry-first architecture includes on-chip support of 40G inverse muxing and
transparency, which enables customer's routers with OC-768 payloads to be transported
over existing 10G and 2.5G Lambda networks.
"Routers traditionally prefer to transport traffic over the fattest pipe possible and 768c 'fat
pipe' payloads will soon be the preference. By introducing Pecos, AMCC is addressing
the issues involved in getting these payloads across Metro and Transport networks,"
said Mark Donovan, senior product marketing manager at AMCC. "Pecos’s unique 40G
inverse muxing technology enables the conversion of 40G 768c payloads into either
AMCC: Company Information: What's New
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AMCC: Company Information: What's New
4x10G pseudo 192c or 16x2.5G pseudo 48c payloads so that the 768c signal can
transverse existing 10G and 2.5G Lambda networks. At the far end of the network,
Pecos can restore the signals back into the original 768c signal."
The S76801 performs all SONET/SDH serialization transmission and features a built-in,
parallel interface deskew capability, providing customers with a reliable interconnect to
Pecos. The S76802 performs all SONET/SDH deserialization and generates a parallel
interface 17th-bit, which is used to deskew on the receiving side of Pecos. For increased
flexibility and ease of board design, the chipset enables all low-speed signals to enter/
exit through a standard BGA interface. High-speed serialized signals are transmitted/
received to/from the optical module through the V-connector packaging. The chipset's
built-in test mode allows customers to generate a random 128-bit balanced pattern for
output as a serial 40 Gbps data stream, which enables customers to debug the serial
part of their system without the need to stimulate the parallel Mux inputs.
The Pecos supports synchronized 4 x OC-192 to OC-768 aggregation, OC-768/OC-768c
inverse multiplexing with deskew compensation up to 500 nano-seconds and duplex
768c Pointer Processing. The device also supports the interleaving/disinterleaving of 4 x
OC-192 or 16 x OC-48 signals into/out of an OC-768 or40G DW with FEC signal. Pecos
features 40G Transport Overhead (TOH) monitoring/generation and Drop/Insert and
includes SFI-5 interfaces on both sides of the device, enabling 40G performance
monitoring applications. Building upon AMCC's successful family of framers, Pecos
works in conjunction with GANGES, providing a channelized OC-768 path terminating
solution down to OC-12c signal payloads. The device's flexible architecture also
compliments AMCC's Mekong and Danube framers by providing an OC-768/OC-48/OC-
12/OC-3 framer/pointer processor solution.
Availability
Available in a connectorized 255 BGA package (CV), the S76801/S76802 chipset is
currently sampling to development partners. General availability is scheduled for Q3
2002. Packaged in a 728 PBGA and manufactured in 0.13m CMOS, Pecos (S76804PBI)
will begin sampling to development partners in Q2 2002 with general availability
scheduled for Q3 2002.
About AMCC
AMCC designs, develops, manufactures, and markets high-performance, high-
bandwidth silicon solutions empowering intelligent optical networks. AMCC utilizes a
combination of digital, mixed-signal and high-frequency analog design expertise coupled
with system-level knowledge and multiple silicon process technologies to offer integrated
circuit products that enable the transport of voice and data over fiber optic networks. The
company's system solution portfolio includes switch fabric, traffic management, network
processor, framer/mapper, PHY and PMD devices that address the high-performance
needs of the evolving intelligent optical network. AMCC's corporate headquarters and
wafer fabrication facilities are located in San Diego, California. Sales and engineering
offices are located throughout the world. For further information regarding AMCC, please
visit our Web site at http://www.amcc.com.
Forward Looking Statements
The statements contained in this press release that are not purely historical are forward-
looking statements within the meaning of Section 27A of the Securities Act of 1933 and
Section 21E of the Securities Exchange Act of 1934. Such forward-looking statements,
including statements relating to the products discussed in this press release are subject
to a number of risks and uncertainties, including the risk that the products would not be
successfully or timely, developed or manufactured or achieve market acceptance, risks
relating to general economic conditions, as well as the risks and uncertainties set forth in
the Company's Annual Report on Form 10-K for the year ended March 31, 2001, and in
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AMCC: Company Information: What's New
other filings of the Company with the Securities and Exchange Commission. As a result
of these risks and uncertainties, actual results may differ materially from these forward-
looking statements. The forward-looking statements contained in this news release are
made as of the date hereof and AMCC does not assume any obligation to update any
forward-looking statement.
###
Product photos, datasheets and application notes are available upon request. AMCC is a
registered trademark of Applied Micro Circuits Corporation.
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