1
®
FN3138.16
HIN232, HIN236, HIN237, HIN238,
HIN239, HIN240, HIN241
+5V Powered RS-232
Transmitters/Receivers
The HIN232-HIN241 family of RS-232 transmitters/receivers
interface circuits meet all ElA RS-232E and V.28 specifications,
and are particularly suited for those applications where ±12V is
not available. They require a single +5V power supply (except
HIN239) and feature onboard charge pump voltage converters
which generate +10V and -10V supplies from the 5V supply.
The family of devices offer a wide variety of RS-232
tr a ns m i t te r /r e c e iv e r co m bi n a t io n s to accommodate various
applications (see “Selection Table” on page 1).
The drivers feature true TTL/ CMOS input compatibility,
slew-rate-limited output, and 300Ω power-off source
impedance. The receivers can handle up to ±30V, and have
a 3kΩ to 7kΩ input impedance. The receivers also feature
hysteresis to greatly improve noise rejection.
Features
• Meets All RS-232E and V.28 Specifications
• Requires Only Single +5V Power Supply
- (+5V and +12V - HIN239)
• High Data Rate. . . . . . . . . . . . . . . . . . . . . . . . . . . 120kbps
• Onboard Voltage Doubler/Inverter
• Low Power Consumption
• Low Power Shutdown Function
• Three-State TTL/CMOS Receiver Outputs
• Multiple Drivers
- ±10V Output Swing for 5V lnput
-300Ω Power-Off Source Impedance
- Output Current Limiting
- TTL/CMOS Compatible
- 30V/µs Maximum Slew Rate
• Multiple Receivers
- ±30V Input Voltage Range
-3kΩ to 7kΩ Input Impedance
- 0.5V Hysteresis to Impr ove Noise Rejection
• Pb-free Available (RoHS compliant)
Applications
• Any System Requiring RS-232 Communication Ports
- Computer - Portable, Mainframe, Laptop
- Peripheral - Printers and Terminals
- Instrumentation
- Modems
Selection Table
PART
NUMBER POWER SUPPLY
VOLTAGE
NUMBER OF
RS-232
DRIVERS
NUMBER OF
RS-232
RECEIVERS EXTERNAL
COMPONENTS
LOW POWER
SHUTDOWN/TTL
THREE-STATE NUMBER OF
LEADS
HIN232 +5V 2 2 4 Capacitors No/No 16
HIN236 +5V 4 3 4 Capacitors Yes/Yes 24
HIN237 +5V 5 3 4 Capacitors No/No 24
HIN238 +5V 4 4 4 Capacitors No/No 24
HIN239 +5V and +7.5V to 13.2V 3 5 2 Capacitors No/Yes 24
HIN240 +5V 5 5 4 Capacitors Yes/Yes 44
HIN241 +5V 4 5 4 Capacitors Yes/Yes 28
Data Sheet September 26, 2008
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 |Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright © Intersil Americas Inc. 2004, 2005, 2008. All Rights Reserved.
All other trademarks mentioned are the property of their respective owners.
2FN3138.16
September 26, 2008
Pin Descriptions
PIN FUNCTION
VCC Power Supply Input 5V ±10%.
V+ Internally generated positive supply (+10V nominal), HIN239 requires +7.5V to +13.2V.
V- Internally generated negative supply (-10V nominal).
GND Ground lead. Connect to 0V.
C1+ External capacitor (+ terminal) is connected to this lead.
C1- External capacitor (- terminal) is conne cted to this lead.
C2+ External capacitor (+ terminal) is connected to this lead.
C2- External capacitor (- terminal) is conne cted to this lead.
TIN T ransmitter Input s. These leads accept TTL/CMOS le vels. An internal 400 kΩ pull-up resistor to VCC is connected to each le ad.
TOUT Transmitter Outputs. These are RS-232 levels (nominally ±10V).
RIN Receiver Inputs. These inputs accept RS-232 inp ut levels. An internal 5kΩ pull-down resistor to GND is connected to each input.
ROUT Receiver Outputs. These are TTL/CMOS levels.
EN Enable input. This is an active low input which enables the receiver outputs. With EN = 5V, the receiver outputs are placed
in a high impedance state.
SD Shutdown Input. With SD = 5V, the charge pump is disabled, the receiver outputs are in a high impedance state and the
transmitters are shut off.
NC No Connect. No connections are made to these leads.
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
3FN3138.16
September 26, 2008
Ordering Information
PART
NUMBER PART
MARKING TEMP. RANGE
(°C) PACKAGE PKG.
DWG. #
HIN232CB* 232CB 0 to +70 16 Ld SOIC M16.3
HIN232CBZ*
(Note) HIN232CBZ 0 to +70 16 Ld SOIC
(Pb-free) M16.3
HIN232CP HIN232CP 0 to +70 16 Ld PDIP E16.3
HIN232CPZ
(Note) HIN232CPZ 0 to +70 16 Ld PDIP**
(Pb-free) E16.3
HIN232IB* HIN232IB -40 to +85 16 Ld SOIC M16.3
HIN232IBZ*
(Note) HIN232IBZ -40 to +85 16 Ld SOIC
(Pb-free) M16.3
HIN232IP HIN232IP -40 to +85 16 Ld PDIP E16.3
HIN232IPZ
(Note) HIN232IPZ -40 to +85 16 Ld PDIP**
(Pb-free) E16.3
HIN236CB HIN236CB 0 to +70 24 Ld SOIC M24.3
HIN236CBZ
(Note) HIN236CBZ 0 to +70 24 Ld SOIC
(Pb-free) M24.3
HIN237CB* HIN237CB 0 to +70 24 Ld SOIC M24.3
HIN237CBZ*
(Note) HIN237CBZ 0 to +70 24 Ld SOIC
(Pb-free) M24.3
HIN238CB* HIN238CB 0 to +70 24 Ld SOIC M24.3
HIN238CBZ*(Note) HIN238CBZ 0 to +70 24 Ld SOIC
(Pb-free) M24.3
HIN238CP HIN238CP 0 to +70 24 Ld PDIP E24.3
HIN238IB HIN238IB -40 to +85 24 Ld SOIC M24.3
HIN238IBZ
(Note) HIN238IBZ -40 to +85 24 Ld SOIC
(Pb-free) M24.3
HIN239CB* HIN239CB 0 to +70 24 Ld SOIC M24.3
HIN239CBZ*
(Note) HIN239CBZ 0 to +70 24 Ld SOIC
(Pb-free) M24.3
HIN239CP HIN239CP 0 to +70 24 Ld PDIP E24.3
HIN239CPZ
(Note) HIN239CPZ 0 to +70 24 Ld PDIP**
(Pb-free) E24.3
HIN240CN HIN240CN 0 to +70 44 Ld MQFP Q44.10X10
HIN240CNZ*
(Note) HIN240CNZ 0 to +70 44 Ld MQFP
(Pb-free) Q44.10X10
HIN241CA HIN241CA 0 to +70 28 Ld SSOP M28.209
HIN241CAZ
(Note) HIN241CAZ 0 to +70 28 Ld SSOP
(Pb-free) M28.209
HIN241CB* HIN241CB 0 to +70 28 Ld SOIC M28.3
HIN241CBZ*
(Note) HIN241CBZ 0 to +70 28 Ld SOIC
(Pb-free) M28.3
HIN241IB HIN241IB -40 to +85 28 Ld SOIC M28.3
HIN241IBZ
(Note) HIN241IBZ -40 to +85 28 Ld SOIC
(Pb-free) M28.3
*Add “-T” suffix for tape and reel. Please refer to TB347 for details on reel specifications.
NOTE: These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100%
matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations).
Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J
STD-020.
**Pb-free PDIPs can be used for through hole wave solder processing only. They are not intended for use in Reflow solder processing applications.
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
4FN3138.16
September 26, 2008
Pinouts HIN232
(16 LD PDIP, SOIC)
TOP VIEW
HIN236
(24 LD SOIC)
TOP VIEW
14
15
16
9
13
12
11
10
1
2
3
4
5
7
6
8
C1+
V+
C1-
C2+
C2-
R2IN
T2OUT
VCC
T1OUT
R1IN
R1OUT
T1IN
T2IN
R2OUT
GND
V-
T3OUT
T1OUT
T2OUT
R1IN
R1OUT
T2IN
T1IN
GND
VCC
C1+
V+
C1-
T4OUT
R2OUT
SD
EN
T4IN
R3OUT
V-
C2-
C2+
R2IN
T3IN
R3IN
1
2
3
4
5
6
7
8
9
10
11
12
16
17
18
19
20
21
22
23
24
15
14
13
VCC
+5V
2
V+
16
T1OUT
T2OUT
T1IN
T2IN
T1
T2
11
10
14
7
+5V
400kΩ
+5V
400kΩ
R1OUT R1IN
R1
1312
5kΩ
R2OUT R2IN
R2
89
5kΩ
+10V TO -10V
VOLTAGE INVERTER NOTE 1
6
V-
C2+
C2-
+
NOTE 1
4
5
+5V TO 10V
VOLTAGE DOUBLER
C1+
C1-
+
NOTE 1
1
3
+NOTE 1
+
+
1µF
15
NOTE:
1. Either 0.1µF or 1µF capacitors may be used.
9
VCC
+5V TO 10V
VOLTAGE DOUBLER
+10V TO -10V
VOLTAGE INVERTER
T1OUT
T2OUT
T3OUT
T4OUT
T4IN
T1IN
T2IN
T3IN
T1
T2
T3
T4
+5V
+1µF
+1µF
+
1µF
7
6
2
3
18 1
19 24
10
12
11
15
V+
V-
C1+
C1-
C2+
C2-
+5V
400kΩ
+5V
400kΩ
+5V
400kΩ
+5V
400kΩ
+
1µF
13
14
R1OUT R1IN
R1
45
5kΩ
R2OUT R2IN
R2
2322
5kΩ
R3OUT R3IN
R3
1617
5kΩ
EN 20 21
SD
8
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
5FN3138.16
September 26, 2008
HIN237
(24 LD SOIC)
TOP VIEW
HIN238
(24 LD PDIP, SOIC)
TOP VIEW
Pinouts (Continued)
T3OUT
T1OUT
T2OUT
R1IN
R1OUT
T2IN
T1IN
GND
VCC
C1+
V+
C1-
T4OUT
R2OUT
T5IN
T5OUT
T4IN
R3OUT
V-
C2-
C2+
R2IN
T3IN
R3IN
1
2
3
4
5
6
7
8
9
10
11
12
16
17
18
19
20
21
22
23
24
15
14
13
T2OUT
T1OUT
R2IN
R2OUT
T1IN
R1OUT
R1IN
GND
VCC
C1+
V+
C1-
T3OUT
R3OUT
T4IN
T4OUT
T3IN
R4OUT
V-
C2-
C2+
R3IN
T2IN
R4IN
1
2
3
4
5
6
7
8
9
10
11
12
16
17
18
19
20
21
22
23
24
15
14
13
9
VCC
+5V TO 10V
VOLTAGE DOUBLER
+10V TO -10V
VOLTAGE INVERTER
T1OUT
T2OUT
T3OUT
T4OUT
T4IN
T1IN
T2IN
T3IN
T1
T2
T3
T4
+5V
+1µF
+1µF
+
1µF
7
6
2
3
18 1
19 24
10
12 11
15
V+
V-
C1+
C1-
C2+
C2-
+5V400kΩ
+5V400kΩ
+5V400kΩ
+5V400kΩ
+
1µF
13
14
R1OUT R1IN
R1
45
5kΩ
R2OUT R2IN
R2
2322
5kΩ
R3OUT R3IN
R3
1617
5kΩ
T5OUT
T5IN
T5
21 20
+5V400kΩ
8
9
VCC
+5V TO 10V
VOLTAGE DOUBLER
+10V TO -10V
VOLTAGE INVERTER
T1OUT
T2OUT
T3OUT
T4OUT
T4IN
T1IN
T2IN
T3IN
T1
T2
T3
T4
+5V
+1µF
+1µF
+
1µF
5
18
2
1
19 24
21 20
10
12 11
15
V+
V-
C1+
C1-
C2+
C2-
+5V400kΩ
+5V400kΩ
+5V400kΩ
+5V400kΩ
+
1µF
13
14
R1OUT R1IN
R1
76
5kΩ
R2OUT R2IN
R2
34
5kΩ
R3OUT R3IN
R3
2322
5kΩ
R4OUT R4IN
R4
1617
5kΩ
8
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
6FN3138.16
September 26, 2008
HIN239
(24 LD PDIP, SOIC)
TOP VIEW
HIN240
(44 LD MQFP)
TOP VIEW
Pinouts (Continued)
R1OUT
R1IN
GND
VCC
V+
C1+
C1-
V-
R5IN
R5OUT
R4OUT
R4IN
T1IN
R2OUT
R2IN
T2OUT
T1OUT
R3OUT
NC
EN
T3OUT
T2IN
R3IN
T3IN
1
2
3
4
5
6
7
8
9
10
11
12
16
17
18
19
20
21
22
23
24
15
14
13
NC
GND
NC
R2IN
NC
T2OUT
T1OUT
T3OUT
T4OUT
R3IN
R3OUT
T5IN
NC 1
2
3
4
5
6
7
8
9
10
11
12 13 14 15 16 17
28
27
26
25
24
23
2221201918
39 38 37 36 35 34
33
32
31
30
29
44 43 42 41 40
R4OUT
T4IN
T3IN
R5OUT
R5IN
NC
NC
SD
EN
T5OUT
R4IN
R2OUT
T2IN
T1IN
R1OUT
R1IN
VCC
NC
NC
NC
NC
NC
C1+
V+
C1-
C2+
C2-
V-
NC
NC
NC
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
7FN3138.16
September 26, 2008
HIN241
(28 SOIC, SSOP)
TOP VIEW
Pinouts (Continued)
4
VCC
+10V TO -10V
VOLTAGE INVERTER
T1OUT
T2OUT
T3OUT
T1IN
T2IN
T3IN
T1
T2
T3
+5V
+1µF
+
1µF
24
23
19
20
16 13
6
7
5
8
V+
C1+
C1-
+5V
400kΩ
+5V
400kΩ
+5V
400kΩ
R1OUT R1IN
R1
2
5kΩ
R2OUT R2IN
R2
2122
5kΩ
R3OUT R3IN
R3
1817
5kΩ
R4OUT R4IN
R4
1211
5kΩ
R5OUT R5IN
R5
910
5kΩ
EN 14
1
+7.5V TO +13.2V (NOTE)
V-
3
(NOTE)
NOTE: For V+ > 11V, use C1 ≤ 0.1µF.
19
VCC
+5V TO 10V
VOLTAGE DOUBLER
+10V TO -10V
VOLTAGE INVERTER
T1OUT
T2OUT
T3OUT
T1IN
T2IN
T3IN
T1
T2
T3
+5V
+1µF
1µF
+
1µF
15
14
7
8
37 6
25
27
26
30
V+
V-
C1+
C1-
C2+
C2-
+5V
400kΩ
+5V
400kΩ
+5V
400kΩ
+
1µF
28
29
R1OUT R1IN
R1
17
5kΩ
R2OUT R2IN
R2
1013
5kΩ
R3OUT R3IN
R3
43
5kΩ
R4OUT R4IN
R4
4039
5kΩ
R5OUT R5IN
R5
3536
5kΩ
EN 42
16
T4OUT
T4IN
T4
38 5
+5V
400kΩ
T5OUT
T5IN
T5
241
+5V
400kΩ
SD
43
18
T3OUT
T1OUT
T2OUT
R2IN
R2OUT
T2IN
T1IN
R1OUT
R1IN
GND
VCC
C1+
V+
C1-
T4OUT
R3OUT
SD
EN
R4IN
T4IN
R5OUT
R5IN
V-
C2-
C2+
R3IN
R4OUT
T3IN
28
27
26
25
24
23
22
21
20
19
18
17
16
15
1
2
3
4
5
6
7
8
9
10
11
12
13
14
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
8FN3138.16
September 26, 2008
Pinouts (Continued)
11
VCC
+5V TO 10V
VOLTAGE DOUBLER
+10V TO -10V
VOLTAGE INVERTER
T1OUT
T2OUT
T3OUT
T1IN
T2IN
T3IN
T1
T2
T3
+5V
+1µF
+1µF
+
1µF
7
6
2
3
20 1
12
14
13
17
V+
V-
C1+
C1-
C2+
C2-
+5V
400kΩ
+5V
400kΩ
+5V
400kΩ
+
1µF
15
16
R1OUT R1IN
R1
9
5kΩ
R2OUT R2IN
R2
45
5kΩ
R3OUT R3IN
R3
2726
5kΩ
R4OUT R4IN
R4
2322
5kΩ
R5OUT R5IN
R5
1819
5kΩ
EN 24
8
T4OUT
T4IN
T4
21 28
+5V
400kΩ
SD
25
10
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
9FN3138.16
September 26, 2008
Absolute Maximum Ratings Thermal Information
VCC to Ground. . . . . . . . . . . . . . . . . . . . . . (GND -0.3V) < VCC < 6V
V+ to Ground (Note 2. . . . . . . . . . . . . . . . (VCC -0.3V) < V+ < 13.2V
V- to Ground. . . . . . . . . . . . . . . . . . . . . . . .-12V < V- < (GND +0.3V)
V+ to V- . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24V
Input Voltages
TIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V < VIN < (V+ +0.3V)
RIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±30V
Output Voltages
TOUT . . . . . . . . . . . . . . . . . . . .(V- -0.3V) < VTXOUT < (V+ +0.3V)
ROUT . . . . . . . . . . . . . . . . . (GND -0.3V) < VRXOUT < (V+ +0.3V)
Short Circuit Duration
TOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Continuous
ROUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Continuous
Operating Conditions
Temperature Range
HIN2xxcx . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to +70°C
HIN2xxIx. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to +85°C
Thermal Resistance (Typical, Note 3) θJC (°C/W)
16 Ld PDIP Package* 90
24 Ld PDIP Package . . . . . . . . . . . . . . . . . . . . . . . . 70
16 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . 100
24 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . 75
28 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . 70
28 Ld SSOP Package . . . . . . . . . . . . . . . . . . . . . . . 95
44 Ld MQFP Package . . . . . . . . . . . . . . . . . . . . . . . 80
Maximum Junction Temperature (Plastic Package) . . . . . . .+150°C
Maximum Storage Temperature Range. . . . . . . . . .-65°C to +150°C
Pb-free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
*Pb-free PDIPs can be used for through hole wave solder processing
only. They are not int ended for use in Reflow solder processing
applications.
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product relia bility and
result in failures not covered by warranty.
NOTE:
2. Only HIN239. For V+ > 11V, C1 must be ≤0.1µF.
3. θJA is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
Electrical Specifications Test Conditions: VCC = +5V ±10%, TA = Operating Temperature Range
PARAMETER TEST CONDITIONS MIN
(Note 5) TYP MAX
(Note 5) UNITS
SUPPLY CURRENTS
Power Supply Current, ICC No Load,
TA = +25°C HIN232 - 5 10 mA
HIN236-HIN238, HIN240-HIN241 - 7 15 mA
HIN239 - 0.4 1 mA
V+ Power Supply Current, ICC
No Load, TA = +25°C No Load,
TA = +25°C HIN239 - 5.0 15 mA
Shutdown Supply Current, ICC(SD) TA = +25°C - 1 10 µA
LOGIC AND TRANSMITTER INPUTS, RECEIVER OUTPUTS
Input Logic Low, VlL TIN, EN, Shutdown - - 0.8 V
Input Logic High, VlH TIN 2.0 - - V
EN, Shutdown 2.4 - - V
Transmitter Input Pull-up Current, IPTIN = 0V - 15 200 µA
TTL/CMOS Receiver Ou tput Voltage Low, VOL IOUT = 1.6mA - 0.1 0.4 V
TTL/CMOS Receiver Output V olt age High, VOH IOUT = -1.0mA 3.5 4.6 - V
RECEIVER INPUTS
RS-232 Input Voltage Range VIN -30 - +30 V
Receiver Input Impedance RIN VIN = ±3V 3.0 5.0 7.0 kΩ
Receiver Input Low Threshold, VlN (H-L) VCC = 5V, TA = +25°C 0.8 1.2 - V
Receiver Input High Threshold, VIN (L-H) VCC = 5V, TA = +25°C - 1.7 2.4 V
Receiver Input Hysteresis VHYST 0.2 0.5 1.0 V
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
10 FN3138.16
September 26, 2008
Detailed Description
The HIN232 thru HIN241 family of RS-232
transmitters/receivers are powered by a single +5V power
supply (except HIN239), feature low power consumption, and
meet all ElA RS-232C and V.28 specifications. The circuit is
divided into three sections: The charge pump, transmitter , and
receiver.
Charge Pump
An equivalent circuit of the charge pump is illustrated in
Figure 1. The charge pu mp cont ains two sections: the volt age
doubler and the volt age in verter. Each section is driven by a
two-phase, internally genera ted cl ock to generate +10V and
-10V. The nominal clock frequency is 16kHz. During phase
one of the clock, cap acitor C1 is cha rged to VCC. During
phase two, the voltage on C1 is added to VCC, producing a
signal across C3 equal to tw ice VCC. During phase one, C2 is
also charged to 2VCC, and then during phase two, it is
inverted with respect to ground to produce a signal across C4
equal to -2VCC. The charge pump accepts inpu t volta ges up
to 5.5V. The output impedance of the volt age do ubler section
(V+) is approximately 200Ω, and the o utput impedance of the
voltage inverter section (V-) is approximately 450Ω. A typical
application uses 1µF capacitors for C1-C4, however , the value
is not critical. Increasing the values of C1 and C2 will low er the
output impedance of the voltage doub ler and inverter,
increasing the values of the reservoir capa citors, C3 and C4,
lowers the ripple on the V+ and V- supplies.
During shutdown mode (HIN236, HIN240 and HIN241),
SHUTDOWN control line set to logic “1”, the charge pump is
turned off, V+ is pulled down to VCC, V - is pulled up to GND,
and the supply current is reduced to less than 10µA. The
transmitter outputs are disabled and the receiver outputs are
placed in the high impedance state.
TIMING CHARACTERISTICS
Baud Rate (1 Transmitter Switching) RL = 3kΩ120 - - kbps
Output Enable Time, tEN HIN236, HIN239, HIN240, HIN241 - 400 - ns
Output Disable Time, tDIS HIN236, HIN239, HIN240, HIN241 - 250 - ns
Propagation Delay, tPD RS-232 to TTL - 0.5 - µs
Instantaneous Slew Rate SR CL = 10pF, RL = 3kΩ, TA = +25°C (Note 4) - - 30 V/µs
Transition Region Slew Rate, SRTRL = 3kΩ, CL = 2500pF Measured from +3V to -3V
or -3V to +3V, 1 Transmitter Switching -3-V/µs
TRANSMITTER OUTPUTS
Output Voltage Swing, TOUT Transmitter Outputs, 3kΩ to Ground ±5 ±9 ±10 V
Output Resistance, TOUT VCC = V+ = V- = 0V, VOUT = ±2V 300 - - Ω
RS-232 Output Short Circuit Current, ISC TOUT shorted to GND - ±10 - mA
NOTE:
4. Limits established by characterization and are not production tested.
5. Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise specified. T emperature limits established by characterization
and are not production tested.
Electrical Specifications Test Conditions: VCC = +5V ±10%, TA = Operating Temperature Range (Continued)
PARAMETER TEST CONDITIONS MIN
(Note 5) TYP MAX
(Note 5) UNITS
+
-C1 +
-C3 +
-C2 +
-C4
S1 S2 S5 S6
S3 S4 S7 S8
VCC GND
RC
OSCILLATOR
VCC
GND
V+ = 2VCC
GND
V- = -(V+)
C1+
C1- C2-
C2+
VOLTAGE INVERTER
VOLTAGE DOUBLER
FIGURE 1. CHARGE PUMP
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
11 FN3138.16
September 26, 2008
Transmitters
The transmitters are TTL/CMOS compatible inverters which
translate the inputs to RS-232 outputs. The input logic threshold
is about 26% of VCC, or 1.3V for VCC = 5V. A logic 1 at the
input results in a voltage of between -5V and V- at the output,
and a logic 0 results in a voltage between +5V and (V+ -0.6V).
Each transmitter input has an internal 400kΩ pullup resistor so
any unused input can be left unconnected and its output
remains in its low state. The output voltage swing meets the
RS-232C specifications of ±5V minimum with the worst case
conditions of: all transmitters driving 3kΩ minimum load
impedance, VCC = 4.5V, and maximum allowable operating
temperature. The transmitters have an internally limited output
slew rate which is less than 30V/µs. The outputs are short
circuit protected and can be shorted to ground indefinitely . The
powered down output impedance is a minimum of 300Ω with
±2V applied to the outputs and VCC = 0V.
Receivers
The receiver inputs accept up to ±30V while presenting the
required 3kΩ to 7kΩ input impedance even if the power is off
(VCC = 0V). The receivers have a typical input threshold of
1.3V which is within the ±3V limits, known as the transition
region, of the RS-232 specifications. The receiver output is
0V to VCC. The output will be low whenever the input is
greater than 2.4V and high whenever the input is floating or
driven between +0.8V and -30V. The receivers feature 0.5V
hysteresis to improve noise rejection. The receiver Enable
line EN, when set to logic “1”, (HIN236, HIN239, HIN240 ,
and HIN241) disables the receiver outputs, placing them in
the high impedance mode. The receiver outputs are also
placed in the high impedance state when in shutdown mode.
TOUT
V- < VTOUT < V+
300Ω
400kΩ
TXIN
GND < TXIN < VCC
V-
V+
VCC
FIGURE 2. TRANSMITTER
ROUT
GND < VROUT < VCC
5kΩ
RXIN
-30V < RXIN < +30V
GND
VCC
FIGURE 3. RECEIVER
TIN
VOL
VOL
tPLH
tPHL
AVERAGE PROPAGATION DELAY =tPHL + tPLH
2
OR
RIN
TOUT
OR
ROUT
FIGURE 4. PROPAGATION DELAY DEFINITION
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
12 FN3138.16
September 26, 2008
Typical Performance Curves
FIGURE 5. V - SUPPLY VOLTAGE vs VCC , V AR YING
CAPACITORS FIGURE 6. V+, V- OUTPUT VOLTAGE vs LOAD (HIN232)
12
10
8
6
4
2
0
3.5 4.0 4.5 6.0
VCC
V- SUPPLY VOLTAGE
5.0 5.5
3.0
0.10µF
0.47µF
1µF
35
|ILOAD| (mA)
V+ (VCC = 4.5V)
V- (VCC = 4.5V)
TA = +25°C
TRANSMITTER OUTPUTS
OPEN CIRCUIT
30252015105
0
SUPPLY VOLTAGE (|V|)
0
12
10
8
6
4
2
V+ (VCC = 5V)
V- (VCC = 5V)
Test Circuits (HIN232)
FIGURE 7. GENERAL TEST CIRCUIT FIGURE 8. POWER-OFF SOURCE RESIST ANCE
CONFIGURATION
14
15
16
9
13
12
11
10
1
2
3
4
5
7
6
8
C1+
V+
C1-
C2+
C2-
V-
R2IN
T2OUT
VCC
T1OUT
R1IN
R1OUT
T1IN
T2IN
R2OUT
GND
+4.5V TO
+5.5V INPUT
3kΩ
T1 OUTPUT
RS-232 ±30V INPUT
TTL/CMOS OUTPUT
TTL/CMOS INPUT
TTL/CMOS INPUT
TTL/CMOS OUTPUT
+
-
1µF
C3
+
-
1µF
C1
+
-
1µF
C2
+
-
1µF C4
3kΩ
OUTPUT
RS-232
±30V INPUT
T2
14
15
16
9
13
12
11
10
1
2
3
4
5
7
6
8
C1+
V+
C1-
C2+
C2-
V-
R2IN
T2OUT
VCC
T1OUT
R1IN
R1OUT
T1IN
T2IN
R2OUT
GND
T2OUT
T1OUT
VIN = ±2V A
ROUT = VIN/1
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
13 FN3138.16
September 26, 2008
Applications
The HIN2xx may be used for all RS-232 data terminal and
communication links. It is particularly useful in applications
where ±12V power supp l i es are not avail abl e for
conventional RS-232 interface circuits. The applications
presented represent typical interface configurations.
A simple duplex RS-232 port with CTS/RTS handshaking is
illustrated in Figure 9. Fixed output signals such as DTR
(data terminal ready) and DSRS (data signaling rate select)
is generated by driving them through a 5kΩ resistor
connected to V+.
In applications requiring four RS-232 inputs and outputs
(Figure 10), note that each circuit requires two charge pump
capacitors (C1 and C2) but can share common reservoir
capacitors (C3 and C4). The benefit of sharing commo n
reservoir capacitors is the elimination of two capacitors and
the reduction of the charge pump source impedance which
effectively increases the output swing of the transmitters.
-
+
-
+
-
+
DTR (20) DATA
TERMINAL READY
DSRS (24) DATA
SIGNALING RATE
RS-232
INPUTS AND OUTPUTS
TD (2) TRANSMIT DATA
RTS (4) REQUEST TO SEND
RD (3) RECEIVE DATA
CTS (5) CLEAR TO SEND
SIGNAL GROUND (7)15
8
13
7
14
16
-
+
6
R2 R1
T2
T1
9
12
10
11
4
5
3
1
HIN232
C1
1µF
C2
1µF
TD
RTS
RD
CTS
SELECT
+5V
INPUTS AND
OUTPUTS
TTL/CMOS
FIGURE 9. SIMPLE DUPLEX RS-232 PORT WITH CTS/RTS
HANDSHAKING
2
FIGURE 10. COMBINING TWO HIN232s FOR 4 PAIRS OF RS-232 INPUTS AND OUTPUTS
-
+
RS-232
INPUTS AND OUTPUTS
DTR (20) DATA TERMINAL READY
DSRS (24) DATA SIGNALING RATE SELECT
DCD (8) DATA CARRIER DETECT
R1 (22) RING INDICATOR
SIGNAL GROUND (7)15
8
13
7
14
2
-
+
4
R2 R1
T2
T1
9
12
10
11
3
1HIN232
C1
1µF
DTR
DSRS
DCD
R1
+5V
INPUTS AND
OUTPUTS
TTL/CMOS
-
+
-
+
TD (2) TRANSMIT DATA
RTS (4) REQUEST TO SEND
RD (3) RECEIVE DATA
CTS (5) CLEAR TO SEND
8
13
7
14
15
R2 R1
T2
T1
9
12
10
11
4
5
3
1
HIN232
C1
1µF C2
1µF
TD
RTS
RD
CTS
INPUTS AND
OUTPUTS
TTL/CMOS
-
+
5C2
1µF
16
C3
2µF
6
26
V- V+
-
+
C4
2µF
16
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
14 FN3138.16
September 26, 2008
Die Characteristics
SUBSTRATE POTENTIAL
V+
TRANSISTOR COUNT
238
Metallization Mask Layout HIN240
T3OUT
T1OUT
T2OUT
R2IN
R2OUT
T2IN
T1IN
R1OUT
R1IN
GND
VCC
C1+ V+ C1-
T4OUT R3OUT
EN
R4IN
T4IN
R5OUT
V-C2-C2+
R3IN
R4OUT
T3IN
R5IN
SHUTDOWN
T5OUT
T5IN
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
15 FN3138.16
September 26, 2008
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
Dual-In-Line Plastic Packages (PDIP)
NOTES:
1. Controlling Dimensions: INCH. In case of conflict between English and
Metric dimensions, the inch dimensions control.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication No. 95.
4. Dimensions A, A1 and L are measured with the package seated in JE-
DEC seating plane gauge GS-3.
5. D, D1, and E1 dimensions do not include mold flash or protrusions.
Mold flash or protrusions shall not exceed 0.010 inch (0.25mm).
6. E and are measured with the leads constrained to be perpendic-
ular to datum .
7. eB and eC are measured at the lead tips with the leads unconstrained.
eC must be zero or greater.
8. B1 maximum dimensions do not include dambar protrusions. Dambar
protrusions shall not exceed 0.010 inch (0.25mm).
9. N is the maximum number of terminal positions.
10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3,
E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm).
eA
-C-
C
L
E
eA
C
eB
eC
-B-
E1
INDEX 12 3 N/2
N
AREA
SEATING
BASE
PLANE
PLANE
-C-
D1
B1 Be
D
D1
A
A2
L
A1
-A-
0.010 (0.25) C AMBS
E16.3 (JEDEC MS-001-BB ISSUE D)
16 LEAD DUAL-IN-LINE PLASTIC PACKAGE
SYMBOL
INCHES MILLIMETERS
NOTESMIN MAX MIN MAX
A-0.210 -5.33 4
A1 0.015 -0.39 -4
A2 0.115 0.195 2.93 4.95 -
B0.014 0.022 0.356 0.558 -
B1 0.045 0.070 1.15 1.77 8, 10
C0.008 0.014 0.204 0.355 -
D0.735 0.775 18.66 19.68 5
D1 0.005 -0.13 -5
E0.300 0.325 7.62 8.25 6
E1 0.240 0.280 6.10 7.11 5
e 0.100 BSC 2.54 BSC -
eA0.300 BSC 7.62 BSC 6
eB-0.430 -10.92 7
L0.115 0.150 2.93 3.81 4
N16 169
Rev. 0 12/93
16 FN3138.16
September 26, 2008
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
Dual-In-Line Plastic Packages (PDIP)
NOTES:
1. Controlling Dimensions: INCH. In case of conflict between English and
Metric dimensions, the inch dimensions control.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication No. 95.
4. Dimensions A, A1 and L are measured with the package seated in
JEDEC seating plane gauge GS-3.
5. D, D1, and E1 dimensions do not include mold flash or protrusions.
Mold flash or protrusions shall not exceed 0.010 inch (0.25mm).
6. E and are measured with the leads constrained to be perpendic-
ular to datum .
7. eB and eC are measured at the lead tips with the leads unconstrained.
eC must be zero or greater.
8. B1 maximum dimensions do not include dambar protrusions. Dambar
protrusions shall not exceed 0.010 inch (0.25mm).
9. N is the maximum number of terminal positions.
10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3,
E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm).
eA
-C-
C
L
E
eA
C
eB
eC
-B-
E1
INDEX 12 3 N/2
N
AREA
SEATING
BASE
PLANE
PLANE
-C-
D1
B1 Be
D
D1
A
A2
L
A1
-A-
0.010 (0.25) C AMBS
E24.3 (JEDEC MS-001-AF ISSUE D)
24 LEAD NARROW BODY DUAL-IN-LINE PLASTIC
PACKAGE
SYMBOL
INCHES MILLIMETERS
NOTESMIN MAX MIN MAX
A-0.210 -5.33 4
A1 0.015 -0.39 -4
A2 0.115 0.195 2.93 4.95 -
B0.014 0.022 0.356 0.558 -
B1 0.045 0.070 1.15 1.77 8
C0.008 0.014 0.204 0.355 -
D1.230 1.280 31.24 32.51 5
D1 0.005 -0.13 -5
E0.300 0.325 7.62 8.25 6
E1 0.240 0.280 6.10 7.11 5
e 0.100 BSC 2.54 BSC -
eA0.300 BSC 7.62 BSC 6
eB-0.430 -10.92 7
L0.115 0.150 2.93 3.81 4
N24 249
Rev. 0 12/93
17 FN3138.16
September 26, 2008
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
Small Outline Plastic Packages (SOIC)
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Interlead
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above
the seating plane, shall not exceed a maximum value of 0.61mm (0.024
inch)
10. Controlling dimension: MILLIMETER. Converted inch dimensions are
not necessarily exact.
INDEX
AREA E
D
N
123
-B-
0.25(0.010) C AMBS
e
-A-
L
B
M
-C-
A1
A
SEATING PLANE
0.10(0.004)
h x 45°
C
H0.25(0.010) BM M
α
M16.3 (JEDEC MS-013-AA ISSUE C)
16 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
INCHES MILLIMETERS
NOTESMIN MAX MIN MAX
A 0.0926 0.1043 2.35 2.65 -
A1 0.0040 0.0118 0.10 0.30 -
B 0.013 0.0200 0.33 0.51 9
C 0.0091 0.0125 0.23 0.32 -
D 0.3977 0.4133 10.10 10.50 3
E 0.2914 0.2992 7.40 7.60 4
e 0.050 BSC 1.27 BSC -
H 0.394 0.419 10.00 10.65 -
h 0.010 0.029 0.25 0.75 5
L 0.016 0.050 0.40 1.27 6
N16 167
α0° 8° 0° 8° -
Rev. 1 6/05
18 FN3138.16
September 26, 2008
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
Small Outline Plastic Packages (SOIC)
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm
(0.006 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Inter-
lead flash and protrusions shall not exceed 0.25mm (0.010 inch) per
side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch)
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact.
INDEX
AREA E
D
N
123
-B-
0.25(0.010) C AMBS
e
-A-
L
B
M
-C-
A1
A
SEATING PLANE
0.10(0.004)
h x 45°
C
H0.25(0.010) BM M
α
M24.3 (JEDEC MS-013-AD ISSUE C)
24 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
INCHES MILLIMETERS
NOTESMIN MAX MIN MAX
A 0.0926 0.1043 2.35 2.65 -
A1 0.0040 0.0118 0.10 0.30 -
B 0.013 0.020 0.33 0.51 9
C 0.0091 0.0125 0.23 0.32 -
D 0.5985 0.6141 15.20 15.60 3
E 0.2914 0.2992 7.40 7.60 4
e 0.05 BSC 1.27 BSC -
H 0.394 0.419 10.00 10.65 -
h 0.010 0.029 0.25 0.75 5
L 0.016 0.050 0.40 1.27 6
N24 247
α0° 8° 0° 8° -
Rev. 1 4/06
19 FN3138.16
September 26, 2008
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
Small Outline Plastic Packages (SOIC)
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2
of Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.15mm (0.006 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. In-
terlead flash and protrusions shall not exceed 0.25mm (0.010
inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual
index feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch)
10. Controlling dimension: MILLIMETER. Converted inch dimen-
sions are not necessarily exact.
INDEX
AREA E
D
N
123
-B-
0.25(0.010) C AMBS
e
-A-
L
B
M
-C-
A1
A
SEATING PLANE
0.10(0.004)
h x 45o
C
H
µ
0.25(0.010) BM M
α
M28.3 (JEDEC MS-013-AE ISSUE C)
28 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
INCHES MILLIMETERS
NOTESMIN MAX MIN MAX
A0.0926 0.1043 2.35 2.65 -
A1 0.0040 0.0118 0.10 0.30 -
B0.013 0.0200 0.33 0.51 9
C0.0091 0.0125 0.23 0.32 -
D0.6969 0.7125 17.70 18.10 3
E0.2914 0.2992 7.40 7.60 4
e 0.05 BSC 1.27 BSC -
H0.394 0.419 10.00 10.65 -
h0.01 0.029 0.25 0.75 5
L0.016 0.050 0.40 1.27 6
N28 287
α0o8o0o8o-
Rev. 0 12/93
20 FN3138.16
September 26, 2008
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
Shrink Small Outline Plastic Packages (SSOP)
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2
of Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs. Mold flash, protrusion and ga te burrs shall not exceed
0.20mm (0.0078 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions.
Interlead flash and protrusions shall not exceed 0.20mm (0.0078
inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual
index feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “B” does not include dambar protrusion. Allowable
dambar protrusion shall be 0.13mm (0.005 inch) total in excess of
“B” dimension at maximum material condition.
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact.
INDEX
AREA E
D
N
123
-B-
0.25(0.010) C AMBS
e
-A-
L
B
M
-C-
A1
A
SEATING PLANE
0.10(0.004) C
H0.25(0.010) BM M
α
0.25
0.010
GAUGE
PLANE
A2
M28.209 (JEDEC MO-150-AH ISSUE B)
28 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
INCHES MILLIMETERS
NOTESMIN MAX MIN MAX
A - 0.078 - 2.00 -
A1 0.002 - 0.05 - -
A2 0.065 0.072 1.65 1.85 -
B 0.009 0.014 0.22 0.38 9
C 0.004 0.009 0.09 0.25 -
D 0.390 0.413 9.90 10.50 3
E 0.197 0.220 5.00 5.60 4
e 0.026 BSC 0.65 BSC -
H 0.292 0.322 7.40 8.20 -
L 0.022 0.037 0.55 0.95 6
N28 287
α0° 8° 0° 8° -
Rev. 2 6/05
21
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FN3138.16
September 26, 2008
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
Metric Plastic Quad Flatpack Packages (MQFP)
D
D1
EE1
-A-
PIN 1
A2 A1
A
12o-16o
12o-16o
0o-7o
0.40
0.016 MIN
L
0o MIN
PLANE
b
0.005/0.009
0.13/0.23
WITH PLATING
BASE METAL
SEATING
0.005/0.007
0.13/0.17
b1
-B-
e
0.008
0.20 A-B SD SCM
0.076
0.003
-C-
-D-
-H-
Q44.10x10 (JEDEC MS-022AB ISSUE B)
44 LEAD METRIC PLASTIC QUAD FLATPACK PACKAGE
SYMBOL
INCHES MILLIMETERS
NOTESMIN MAX MIN MAX
A-0.096 -2.45 -
A1 0.004 0.010 0.10 0.25 -
A2 0.077 0.083 1.95 2.10 -
b0.012 0.018 0.30 0.45 6
b1 0.012 0.016 0.30 0.40 -
D0.515 0.524 13.08 13.32 3
D1 0.389 0.399 9.88 10.12 4, 5
E0.516 0.523 13.10 13.30 3
E1 0.390 0.398 9.90 10.10 4, 5
L0.029 0.040 0.73 1.03 -
N44 447
e 0.032 BSC 0.80 BSC -
Rev. 2 4/99
NOTES:
1. Controlling dimension: MILLIMETER. Converted inch
dimensions are not necessarily exact.
2. All dimensions and tolerances per ANSI Y14.5M-1982.
3. Dimensions D and E to be determined at seating plane .
4. Dimensions D1 and E1 to be determined at datum plane
.
5. Dimensions D1 and E1 do not include mold protrusion.
Allowable protrusion is 0.25mm (0.010 inch) per side.
6. Dimension b does not include dambar protrusion. Allowable
dambar protrusion shall be 0.08mm (0.003 inch) total.
7. “N” is the number of terminal positions.
-C-
-H-
