NSPU5201, NSPU5221 Series ESD and Surge Protection Diode Low Clamping Voltage www.onsemi.com Features * Unidirectional High Voltage ESD and Surge Protection * Provides ESD Protection to IEC61000-4-2 Level 4: * * 30 kV Contact Discharge Small Package: 1.8 mm x 2.0 mm These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS Compliant UDFN6 CASE 517CS BLOCK DIAGRAM APPLICATION DIAGRAM Vcc (1,2) Cathode Anode MARKING DIAGRAM GND (6,8) DAP** 1 GND (5,7) XX M G XX = Specific Device Code M = Date Code G = Pb-Free Package ORDERING INFORMATION **Die Attach Pad on back of package (connect to ground) Device Package Shipping NSPU5201MUTBG UDFN6 (Pb-Free) 3000 / Tape & Reel NSPU5221MUTBG UDFN6 (Pb-Free) 3000 / Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. (c) Semiconductor Components Industries, LLC, 2017 May, 2018 - Rev. 0 1 Publication Order Number: NSPU5201/D NSPU5201, NSPU5221 Series PACKAGE / PINOUT DIAGRAMS Table 1. PIN DESCRIPTIONS 6-Lead, UDFN8 Package Pin Name 1 VCC Cathode 2 VCC Cathode 3 N/C No Connect 4 N/C No Connect 5 GND Anode 6 GND Anode 7 GND Anode 8 GND Anode Top View (Pins Down View) Description 6 5 XX M Pin 1 Marking 8 I Parameter IF IPP Maximum Reverse Peak Pulse Current VC Clamping Voltage @ IPP VBR IT QVBR 5 6-Lead UDFN Symbol IR 7 6 1 2 3 4 ELECTRICAL CHARACTERISTICS VRWM Bottom View (Pins Up View) 1 2 3 4 Working Peak Reverse Voltage VC VBR VRWM Maximum Reverse Leakage Current @ VRWM V IR VF IT Breakdown Voltage @ IT Test Current Maximum Temperature Coefficient of VBR IF Forward Current VF Forward Voltage @ IF IPP Uni-Directional Surge Protection SPECIFICATIONS Table 2. MAXIMUM RATINGS Parameter Rating Units Operating Temperature Range -55 to +125 C Storage Temperature Range -65 to +150 C Stresses at or above those listed in Maximum Ratings table may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Also, due to variations in test equipment, stresses shown above are averages. ELECTRICAL CHARACTERISTICS IPP (A) Breakdown Voltage Device Name NSPU5201 NSPU5221 Device Marking AZ A2 VRWM (V) IR @ VRWM A) Max Max Min Nom Max 20 1 21.7 22.7 23.7 20 1 22 2 VBR V 24 25 (8 x 20 ms) @ IT (mA) 26 1 1 VC @ IPP (8 x 20 ms) VC (V) IPP (A) Min Max 140 31.5 110 33 100 35 120 120 Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. www.onsemi.com 2 NSPU5201, NSPU5221 Series 40 35 35 30 30 Vpk @ Ipk (V) 40 25 20 15 25 20 15 10 10 5 5 0 0 0 20 40 80 60 100 120 140 160 0 20 40 Ipk (A) tr = rise time to peak value [8 ms] tf = decay time to half value [20 ms] Half Value 50 0 0 tr 80 100 120 140 160 Ipk (A) Peak Value 100 60 Figure 2. NSPU5221 Positive Clamping Voltage vs. Peak Pulse Current (tp = 8/20 s) Figure 1. NSPU5021 Positive Clamping Voltage vs. Peak Pulse Current (tp = 8/20 s) Ipp - PEAK PULSE CURRENT - %Ipp Vpk @ Ipk (V) TYPICAL CHARACTERISTICS tf TIME (ms) Figure 3. IEC61000-4-5 8/20 s Pulse Waveform www.onsemi.com 3 NSPU5201, NSPU5221 Series PACKAGE DIMENSIONS UDFN6, 1.8 x 2, 0.4P CASE 517CS ISSUE O D PIN ONE REFERENCE CC CC EE A B III III III EXPOSED Cu NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINALS AND IS MEASURED BETWEEN 0.15 AND 0.30mm FROM THE TERMINAL TIP. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. MOLD CMPD DETAIL B ALTERNATE CONSTRUCTION E 0.10 C 2X 0.10 C 2X L L TOP VIEW DIM A A1 A3 b D D2 E E2 e e1 e2 L L1 L1 DETAIL B A3 0.05 C DETAIL A ALTERNATE CONSTRUCTIONS A 6X 0.05 C NOTE 4 A1 C SIDE VIEW SEATING PLANE 0.10 C DETAIL A 2X e/2 RECOMMENDED MOUNTING FOOTPRINT* e D2 1 6X 4 1 2X 4 E2 b 0.07 C A B 0.05 C 0.95 NOTE 3 2X 6X L MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.125 REF 0.15 0.25 1.80 BSC 0.35 0.55 2.00 BSC 0.74 0.94 0.40 BSC 0.80 BSC 0.95 BSC 0.20 0.40 0.15 --- 0.40 PITCH 0.55 6X 0.48 0.10 C 6 5 e1/2 6 PACKAGE OUTLINE 5 2X 0.94 2.20 e2 e1 BOTTOM VIEW SUPPLEMENTAL BOTTOM VIEW 6X 0.25 0.40 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 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