SMM0207
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Thin Film MELF Resistors
SMM0207 thin film MELF resistors are the perfect choice for
most fields of modern professional electronics where
reliability and stability is of major concern at higher power
rating and higher operating voltage. The typical applications
in the fields of automotive, industrial and medical equipment
reflect the outstanding level of proven reliability.
FEATURES
• MELF resistor with high power rating
• AEC-Q200 qualified
• Advanced metal film technology
• Best in class pulse load capability
• Intrinsic sulfur resistance
• Material categorization:
for definitions of compliance please see
www.vishay.com/doc?99912
APPLICATIONS
• Automotive
• Telecommunication
• Industrial
• Medical equipment
Note
(1) Please refer to APPLICATION INFORMATION below
APPLICATION INFORMATION
When the resistor dissipates power, a temperature rise above the ambient temperature occurs, dependent on the thermal
resistance of the assembled resistor together with the printed circuit board. The rated dissipation applies only if the permitted
film temperature is not exceeded.
These resistors do not feature a limited lifetime when operated within the permissible limits. However, resistance value drift
increasing over operating time may result in exceeding a limit acceptable to the specific application, thereby establishing a
functional lifetime
TECHNICAL SPECIFICATIONS
DESCRIPTION SMM0207
DIN size 0207
Metric size code RC6123M
Resistance range 0.16 Ω to 10 MΩ
Resistance tolerance ± 5 %; ± 1 %; ± 0.5 %; ± 0.25 %; ± 0.1 %
Temperature coefficient ± 100 ppm/K; ± 50 ppm/K; ± 25 ppm/; ± 15 ppm/K
Rated dissipation P70 (1) 1.0 W
Operating voltage, Umax. ACRMS/DC 350 V
Permissible film temperature,
ϑ
F max. (1) 155 °C
Operating temperature range (1) -55 °C to 155 °C
Permissible voltage against ambient (insulation):
1 min; Uins 500 V
Failure rate: FITobserved ≤ 0.1 x 10-9/h
Zero-Ohm-Resistor: OMM0207 Rmax. = 10 mΩ; Imax. = 5 A
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Note
• The presented operation modes do not refer to different types of resistors, but actually show examples of different loads, that lead to
different film temperatures and different achievable load-life stability (drift) of the resistance value. A suitable low thermal resistance of the
circuit board assembly must be safeguarded in order to maintain the film temperature of the resistors within the specified limits. Please
consider the application note “Thermal Management in Surface-Mounted Resistor Applications” (www.vishay.com/doc?28844) for
information on the general nature of thermal resistance
Notes
(1) TCR ± 10 ppm/K and ± 5 ppm/K in resistance range 100 Ω to 100 kΩ on request
MAXIMUM RESISTANCE CHANGE AT RATED DISSIPATION
OPERATION MODE PRECISION STANDARD POWER
Rated dissipation, P70 SMM0207 0.125 W 0.4 W 1.0 W
Operating temperature range -10 °C to 85 °C -55 °C to 125 °C -55 °C to 155 °C
Permissible film temperature,
ϑ
F max. 85 °C 125 °C 155 °C
Max. resistance change at P70 for resistance
range, |ΔR/R| after:
SMM0207 100 Ω to 511 kΩ1 Ω to 1 MΩ1 Ω to 1 MΩ
1000 h ≤ 0.05 % ≤ 0.15 % ≤ 0.25 %
8000 h ≤ 0.1 % ≤ 0.3 % ≤ 0.5 %
225 000 h ≤ 0.25 % ≤ 1.0 % -
TEMPERATURE COEFFICIENT AND RESISTANCE RANGE
TYPE / SIZE TCR TOLERANCE RESISTANCE E-SERIES
SMM0207
± 100 ppm/K ± 5 % 0.16 Ω to 0.91 ΩE24
± 50 ppm/K
± 1 % 1 Ω to 10 MΩE24; E96
± 0.5 % 1 Ω to 2.21 MΩE24; E192
± 25 ppm/K
± 0.5 %
43 Ω to 1 MΩE24; E192± 0.25 %
± 0.1 %
± 15 ppm/K (1)
± 0.5 %
100 Ω to 511 kΩE24; E192± 0.25 %
± 0.1 %
Jumper; Imax. = 5 A ≤ 10 mΩ0 Ω-
PACKAGING
TYPE / SIZE CODE QUANTITY PACKAGING STYLE WIDTH PITCH PACKAGING
DIMENSIONS
SMM0207
OMM0207
BP 1500 Antistatic blister tape acc.
IEC 60286-3, Type 2a 12 mm 4 mm
Ø 180 mm/7"
BS 7500 Ø 330 mm/13"
SMM0207
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Note
• Products can be ordered using either the PART NUMBER or the PRODUCT DESCRIPTION
PART NUMBER AND PRODUCT DESCRIPTION
Part Number: SMM02070C5620FBS00
Part Number: OMM02070000000BS00
TYPE / SIZE VERSION TCR RESISTANCE TOLERANCE PACKAGING
SMM0207
OMM0207
0 = neutral E = ± 15 ppm/K
D = ± 25 ppm/K
C = ± 50 ppm/K
B = ± 100 ppm/K
0 = jumper
3 digit value
1 digit multiplier
0000 = Jumper
MULTIPLIER
7 = *10-3
8 = *10-2
9 = *10-1
0 = *100
1 = *101
2 = *102
3 = *103
4 = *104
5 = *105
B = ± 0.1 %
C = ± 0.25 %
D = ± 0.5 %
F = ± 1 %
J = ± 5 %
0 = jumper
BP
BS
Product Description: SMM0207 50 562R 1 % BS
Product Description: OMM0207 0R0 BS
SMM0207 50 562R 1 % BS
OMM0207 -0R0 -BS
TYPE / SIZE TCR RESISTANCE TOLERANCE PACKAGING
SMM0207
OMM0207
± 15 ppm/K
± 25 ppm/K
± 50 ppm/K
± 100 ppm/K
100R = 100 Ω
2M21 = 2.21 MΩ
0R0 = jumper
± 0.1 %
± 0.25 %
± 0.5 %
± 1 %
± 5 %
BP
BS
02MMS070C5620FBS00
02MMO070000000BS00
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DESCRIPTION
Production is strictly controlled and follows an extensive set
of instructions established for reproducibility. A
homogeneous film of metal alloy is deposited on a high
grade ceramic body (Al2O3) and conditioned to achieve the
desired temperature coefficient. Nickel plated steel
termination caps are firmly pressed on the metallized rods.
A special laser is used to achieve the target value by
smoothly cutting a helical groove in the resistive layer
without damaging the ceramics. The resistor elements are
covered by a protective coating designed for electrical,
mechanical and climatic protection. The terminations
receive a final pure tin on nickel plating. Four or six color
code bands designate the resistance value and tolerance in
accordance with IEC 60062 (1).
The result of the determined production is verified by an
extensive testing procedure performed on 100 % of the
individual resistors. This includes full screening for the
elimination of products with a potential risk of early field
failures (feasible for R ≥ 10 Ω) according to EN 140401-803,
2.1.2.2. Only accepted products are laid directly into the
blister tape in accordance with IEC 60286-3, Type 2a (1).
ASSEMBLY
The resistors are suitable for processing on automatic SMD
assembly systems. They are suitable for automatic
soldering using wave, reflow or vapor phase as shown in
IEC 61760-1 (1). The encapsulation is resistant to all
cleaning solvents commonly used in the electronics
industry, including alcohols, esters and aqueous solutions.
The suitability of conformal coatings, potting compounds
and their processes, if applied, shall be qualified by
appropriate means to ensure the long-term stability of the
whole system.
The resistors are completely lead (Pb)-free, the pure tin
plating provides compatibility with lead (Pb)-free and lead
containing soldering processes. Solderability is specified for
2 years after production or requalification, however,
excellent solderability is proven after extended storage in
excess of 10 years. The permitted storage time is 20 years.
The immunity of the plating against tin whisker growth has
been proven under extensive testing.
MATERIALS
Vishay acknowledges the following systems for the
regulation of hazardous substances:
• IEC 62474, Material Declaration for Products of and for the
Electrotechnical Industry, with the list of declarable
substances given therein (2)
• The Global Automotive Declarable Substance List
(GADSL) (3)
• The REACH regulation (1907/2006/EC) and the related list
of substances with very high concern (SVHC) (4) for its
supply chain
The products do not contain any of the banned substances
as per IEC 62474, GADSL, or the SVHC list, see
www.vishay.com/how/leadfree.
Hence the products fully comply with the following
directives:
• 2000/53/EC End-of-Life Vehicle Directive (ELV) and
Annex II (ELV II)
• 2011/65/EU Restriction of the Use of Hazardous
Substances Directive (RoHS) with amendment
2015/863/EU
• 2012/19/EU Waste Electrical and Electronic Equipment
Directive (WEEE)
Vishay pursues the elimination of conflict minerals from its
supply chain, see the Conflict Minerals Policy at
www.vishay.com/doc?49037.
APPROVALS
The resistors are qualified according to AEC-Q200.
RELATED PRODUCTS
MELF resistors of other sizes are available:
• Thin Fim Micro-MELF Resistors SMM0102
(www.vishay.com/doc?20003)
• Thin Fim MELF Resistors SMM0204
(www.vishay.com/doc?20004)
Resistors are available with established reliability in
accordance with EN 140401-803 Version E. Please refer to
datasheet “MELF Resistors with Established Reliability”
(www.vishay.com/doc?28707).
MS1 .... ESCC high-reliability thin film MINI-MELF resistors
are the premium choice for design and manufacture of
equipment, where matured technology and proven reliability
are of utmost importance. They are regularly used in
communication and research satellites and fit equally well
into aircraft and military electronic systems.
Approval of the MS1 .... ESCC products is granted by the
European Space Components Coordination and registered
in the ESCC Qualified Parts List, REP005.
(www.vishay.com/doc?28790).
Notes
(1) The quoted IEC standards are also released as EN standards with the same number and identical contents
(2) The IEC 62474 list of declarable substances is maintained in a dedicated database, which is available at http://std.iec.ch/iec62474.
(3) The Global Automotive Declarable Substance List (GADSL) is maintained by the American Chemistry Council and available at www.gadsl.org
(4) The SVHC list is maintained by the European Chemical Agency (ECHA) and available at http://echa.europa.eu/candidate-list-table
SMM0207
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FUNCTIONAL PERFORMANCE
Derating - Precision Operation
160
°C
-50
50
0
W
100
70
85
Ambient Temparature amb
Power Dissipation P
ϑ
0
0.2
0.4
0.8
1.0
1.2
0.6
130
Derating - Standard Operation
160
°C
-50
50
0
W
100
70
Ambient Temparature amb
Power Dissipation P
ϑ
0
0.2
0.4
0.8
1.0
1.2
0.6
125
Derating - Power Operation
155
°C
-50
50
0
W
100
70
Ambient Temparature
amb
Power Dissipation P
ϑ
0
0.2
0.4
0.8
1.0
1.2
0.6
130
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FUNCTIONAL PERFORMANCE
Resistance Value in Ω
10 100 1K 10K 100K 1M 10M
60
100
Non-Linearity
70
80
90
11 0
120
Non-Linearity A3 in dB
Resistance Value in Ω
100 1K 10K 100K 1M 10M
0.01
1
Current Noise
0.05
0.1
0.5
5
10
Current Noise in µV/V
Resistance Va l ue in Ω
10R 100R 1K 10K 100K
10
100
Single Pulse High Voltage Overload Capability
1.2/50 acc. EN 60115-1, 4.27
1K
3K
T est Vo ltage in V
10R 100R 1K 10K 100K
10
100
1K
3K
Resistance Va l ue in Ω
Single Pulse High Voltage Overload Capability
10/700 acc. EN 60115-1, 4.27
T est Vo ltage in V
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W
100
10
1
0.1
10 s1 s100 ms
10 ms
1 ms100 µs10 µs1 µs
Pulse Duration ti
Single Pulse for R < 10 Ω
Maximum pulse load, single pulse; applicable if P 0 and n ≤ 1000 and U ≤ U
max.
;
for permissible resistance change ± (0.5 % R + 0.01 Ω)
Pulse Load
P
max.
SMM0207
W
100
10
1
0.1
10 s1 s100 ms
10 ms
1 ms100 µs10 µs1 µs
Continuous Pulse for R < 10 Ω
Pulse Duration ti
Continuous Pulse Load
P
max.
Maximum pulse load, continuous pulse; applicable if P ≤ P (ϑamb) and U ≤ Umax.;
for permissible resistance change ± (0.5 % R + 0.01 Ω)
SMM0207
W
1000
100
10
1
0.1
10 s1 s100 ms
10 ms
1 ms100 µs10 µs1 µs
Pulse Duration ti
Single Pulse for R ≥ 10 Ω
Maximum pulse load, single pulse; applicable if P 0 and n ≤ 1000 and U ≤ U
max.
;
for permissible resistance change ± (0.5 % R + 0.01 Ω)
Pulse Load
P
SMM0207
SMM0207
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W
1000
100
10
1
0.1
10 s1 s100 ms
10 ms
1 ms100 µs10 µs1 µs
Continuous Pulse for R ≥ 10 Ω
Pulse Duration ti
Maximum pulse load, continuous pulse; applicable if P ≤ P (ϑamb) and U ≤ Umax.;
for permissible resistance change ± (0.5 % R + 0.01 Ω)
Pulse Load
P
SMM0207
V
1000
Pulse Duration ti
Pulse Voltage
Maximum pulse voltage, single and continuous pulses; applicable if P ≤ Pmax.;
for permissible resistance change ± (0.5 % R + 0.01 Ω)
Pulse Voltage
U
max.
100
10 s1 s100 ms
10 ms
1 ms100 µs1 µs 10 µs
SMM0207
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TESTS AND REQUIREMENTS
All tests are carried out in accordance with the following
specifications:
EN 60115-1, generic specification
EN 60115-8 (successor of EN 140400), sectional
specification
EN 140401-803, detail specification
IEC 60068-2-xx, test methods
The parameters stated in the Test Procedures and
Requirements table are based on the required tests and
permitted limits of EN 140401-803. The table presents only
the most important tests, for the full test schedule refer to
the documents listed above. However, some additional
tests and a number of improvements against those
minimum requirements have been included.
The testing also covers most of the requirements specified
by EIA/ECA-703 and JIS-C-5201-1.
The tests are carried out under standard atmospheric
conditions in accordance with IEC 60068-1, 4.3, whereupon
the following values are applied:
Temperature: 15 °C to 35 °C
Relative humidity: 25 % to 75 %
Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar).
A climatic category LCT / UCT / 56 is applied, defined by the
lower category temperature (LCT), the upper category
temperature (UCT), and the duration of exposure in the
damp heat, steady state test (56 days).
The components are mounted for testing on printed circuit
boards in accordance with EN 60115-8, 2.4.2, unless
otherwise specified.
TEST PROCEDURES AND REQUIREMENTS
EN
60115-1
CLAUSE
IEC
60068-2 (1)
TEST
METHOD
TEST PROCEDURE REQUIREMENTS
PERMISSIBLE CHANGE (ΔR)
Stability for
product types:
STABILITY
CLASS 0.25
OR BETTER
STABILITY
CLASS 0.5
OR BETTER
STABILITY
CLASS 1
OR BETTER
STABILITY
CLASS 2
OR BETTER
SMM0207 < 1 Ω1 Ω to < 10 Ω10 Ω to < 1 MΩ> 1 MΩ
4.8 - Temperature
coefficient (1)
At (20 / -55 / 20) °C
and (20 / 125 / 20) °C ± 100 ppm/K, ± 50 ppm/K, ± 25 ppm/K; ±15 ppm/K
4.25.1 -
Endurance
at 70 °C:
precision
operation mode
U =
≤ Umax.;
1.5 h on; 0.5 h off;
70 °C; 1000 h
-
± (0.05 %
R+0.005Ω)-
70 °C; 8000 h ± (0.1 %
R+0.005Ω)
Endurance
at 70 °C:
standard
operation mode
U =
≤ Umax.;
1.5 h on; 0.5 h off;
70 °C; 1000 h ± (0.15 % R+0.01Ω)± (0.5 % R)
70 °C; 8000 h ± (0.3 % R+0.01Ω)± (1 % R)
Endurance
at 70 °C:
power
operation mode
U =
≤ Umax.;
1.5 h on; 0.5 h off;
70 °C; 1000 h ± (0.25 % R+0.01Ω)± (0.5 % R)
70 °C; 8000 h ± (0.5 % R+0.01Ω)± (1 % R)
4.25.3 -
Endurance at
upper category
temperature
125 °C; 1000 h ± (0.15 % R+0.01Ω)± (0.5 % R)
155 °C; 1000 h ± (0.3 % R+0.01Ω)± (1 % R)
4.24 78 (Cab) Damp heat,
steady state
(40± 2) °C;
56days;
(93 ± 3) %RH
± (0.25 % R+0.01Ω)± (1 % R)
P70 x R
P70 x R
P70 x R
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4.37 67 (Cy)
Damp heat,
steady state,
accelerated
(85 ± 2) °C
(85 ± 5) % RH
U = 0.3 x
≤ 100 V and
U = 0.3 x Umax.;
(the smaller
value is valid)
1000 h
± (0.5 % R+0.01Ω)± (2 % R)
- 1 (Ab) Cold -55 °C; 2000 h ± (0.1 % R+0.01Ω)
4.19 14 (Na)
Rapid
change of
temperature
30min at LCT and
30min at UCT;
LCT = -55 °C;
UCT = 125 °C;
1000 cycles
± (0.25 % R+0.01Ω)
LCT = -55 °C;
UCT = 155 °C;
1000 cycles
± (0.5 % R+0.01Ω)
4.13 -
Short time
overload:
standard
operation
mode U= 2.5 x
≤ 2 x Umax.; 5 s
± (0.03 % R+0.01Ω) ± (0.15 % R)
Short time
overload:
power
operation
mode
± (0.05 % R+0.01Ω) ± (0.15 % R)
4.27 -
Single pulse
high voltage
overload:
standard
operation
mode
Severity no. 4:
U= 10 x
≤ 2 x Umax.;
10 pulses
10 μs/700 μs
± (0.25 % R+0.01Ω)
Single pulse
high voltage
overload:
power
operation
mode
± (0.5 % R+0.01Ω)
4.39 -
Periodic
electric
overload:
standard
operation
mode U =
≤ 2 x Umax.;
0.1 s on; 2.5 s off;
1000 cycles
± (0.15 % R+0.01Ω)
Periodic
electric
overload:
power
operation
mode
± (0.3 % R+0.01Ω)
TEST PROCEDURES AND REQUIREMENTS
EN
60115-1
CLAUSE
IEC
60068-2 (1)
TEST
METHOD
TEST PROCEDURE REQUIREMENTS
PERMISSIBLE CHANGE (ΔR)
Stability for
product types:
STABILITY
CLASS 0.25
OR BETTER
STABILITY
CLASS 0.5
OR BETTER
STABILITY
CLASS 1
OR BETTER
STABILITY
CLASS 2
OR BETTER
SMM0207 < 1 Ω1 Ω to < 10 Ω10 Ω to < 1 MΩ> 1 MΩ
P70 x R
P70 x R
P70 x R
15 x P70 x R
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Note
(1) The quoted IEC standards are also released as EN standards with the same number and identical contents
4.22 6 (Fc) Vibration
Endurance
by sweeping;
10 Hz to 2000 Hz;
no resonance;
amplitude
≤ 1.5 mm or
≤ 200 m/s2;
7.5 h
± (0.05 % R+0.01Ω)
4.40 -
Electro Static
Discharge
(Human Body
Model)
IEC 61340-3-1 (1);
3 pos. + 3 neg.
discharges;
4 kV
± (0.5 % R+0.05Ω)
4.17 58 (Td) Solderability
Solder bath method;
SnPb40;
non-activated flux
(215± 3)°C;
(3± 0.3)s
Good tinning (≥ 95 % covered); no visible damage
Solder bath method;
SnAg3Cu0.5
or SnAg3.5;
non-activated flux;
(235± 3)°C;
(2± 0.2)s
Good tinning (≥ 95 % covered); no visible damage
4.18 58 (Td) Resistance to
soldering heat
Solder bath method;
(260± 5)°C;
(10± 1)s
± (0.1 % R+0.01Ω) ± (0.05 % R+0.01Ω)
Reflow method 2
(IR/forced gas
convection);
(260 ± 5) °C;
(10 ± 1) s
± (0.05 % R+0.01Ω) ± (0.02 % R+0.01Ω)
4.29 45 (XA)
Component
solvent
resistance
Isopropyl alcohol;
50 °C;
method 2
No visible damage
4.30 45 (XA)
Solvent
resistance
of marking
Isopropyl alcohol;
50 °C;
method 1,
toothbrush
Marking visible, no visible damage
4.32 21 (Ue3)Shear
(adhesion) 45 N No visible damage
4.33 21 (Ue1)Substrate
bending
Depth 2 mm,
3 times
No visible damage, no open circuit in bent position
± (0.05 % R+0.01Ω)
4.7 - Voltage proof URMS =Uins; 60 s No flashover or breakdown
4.35 - Flammability
IEC 60695-11-5 (1);
needle flame test;
10 s
No burning after 30 s
TEST PROCEDURES AND REQUIREMENTS
EN
60115-1
CLAUSE
IEC
60068-2 (1)
TEST
METHOD
TEST PROCEDURE REQUIREMENTS
PERMISSIBLE CHANGE (ΔR)
Stability for
product types:
STABILITY
CLASS 0.25
OR BETTER
STABILITY
CLASS 0.5
OR BETTER
STABILITY
CLASS 1
OR BETTER
STABILITY
CLASS 2
OR BETTER
SMM0207 < 1 Ω1 Ω to < 10 Ω10 Ω to < 1 MΩ> 1 MΩ
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DIMENSIONS
Notes
•Color code marking is applied according to IEC 60062 (1) in four (E24 series) or six bands (E96 series). Each color band appears as a single
solid line, voids are permissible if at least 2/3 of the band is visible from each radial angle of view. The last color band represents the TCR for
resistors with TCR ≤ 50 ppm/K and nominal tolerance ≤ 1 %
• Zero ohm jumper are marked with one centered black band
PATTERN STYLES FOR MELF RESISTORS
Notes
• The given solder pad dimensions reflect the considerations for board design and assembly as outlined e.g. in standards IEC 61188-5-x (1),
or in publication IPC-7351
(1) The quoted IEC standards are also released as EN standards with the same number and identical contents
DIMENSIONS AND MASS
TYPE / SIZE L
(mm)
D
(mm)
L1 min.
(mm)
D1
(mm)
K
(mm)
MASS
(mg)
SMM0207
OMM0207 5.8 + 0 / - 0.3 2.2 ± 0.2 2.6 D + 0 / - 0.2 1.25 ± 0.2 77
RECOMMENDED SOLDER PAD DIMENSIONS
TYPE / SIZE
WAVE SOLDERING REFLOW SOLDERING
G
(mm)
Y
(mm)
X
(mm)
Z
(mm)
G
(mm)
Y
(mm)
X
(mm)
Z
(mm)
SMM0207
OMM0207 2.4 2.3 2.6 7.0 2.6 2.0 2.4 6.6
L
1
K
D
1
D
L
GX
Y
Z
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Revision: 01-Jan-2019 1Document Number: 91000
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