Headset/Speaker EMI Filter
with ESD Protection
CM1416
©2010 SCILLC. All rights reserved. Publication Order Number:
April 2010 Rev. 2 CM1416/D
Features
Functionally and pin compatible with the
CSPEMI201A and CM1411
OptiGuard coated for improved reliability at
assembly
Two channels of EMI filtering for 8Ω speakers
Pi-style EMI filters in a capacitor-resistor-
capacitor (C-R-C) network
Greater than 30dB attenuation at 1GHz
±30kV ESD protection on each channel per
IEC 61000-4-2 Level 4, contact discharge
Extremely low lead inductance for optimum filter
and ESD performance
5-bump, 0.96mm X 1.33mm footprint Chip Scale
Package (CSP)
RoHS-compliant, lead-free finishing
Applications
Headset Speaker port in mobile handsets
I/O port protection for mobile handsets, notebook
computers, PDAs etc.
EMI filtering for data ports in cell phones, PDAs
or notebook computers.
Product Description
The CM1416 is an EMI filter array with ESD
protection, which integrates two Pi-filters (C-R-C).
The CM1416 has component values of 117pF-2Ω-
117pF. The parts include avalanche-type ESD diodes
on every pin, which provide a very high level of
protection for sensitive electronic components that
may be subjected to electrostatic discharge (ESD).
The ESD diodes safely dissipate ESD strikes of
±30kV, exceeding the maximum requirement of the
IEC 61000-4-2 international standard. Using the MIL-
STD-883 (Method 3015) specification for Human
Body Model (HBM) ESD, these devices protect for
contact discharges at greater than ±30kV.
This device is well suited for portable electronics (e.g.
mobile handsets, PDAs, notebook computers)
because of its small package and easy-to-use pin
assignments. In particular, the CM1416 is ideal for
filtering unwanted EMI-induced noise and providing
ESD protection for headset speaker port applications
in wireless handsets with 8Ω speakers.
The CM1416 incorporates OptiGuard coating which
results in improved reliability at assembly. The
CM1416 is available in a space saving, low profile
Chip Scale Package with RoHS-compliant, lead-free
finishing.
CM1416
Rev. 2 | Page 2 of 9 | www.onsemi.com
Block Diagram
CM1416
Rev. 2 | Page 3 of 9 | www.onsemi.com
PIN DESCRIPTIONS
PIN NAME DESCRIPTION
A1 FILTER1 EMI FIlter 1
A3 FILTER2 EMI FIlter 2
B2 GND Device Ground
C1 FILTER1 EMI FIlter 1
C3 FILTER2 EMI FIlter 2
Ordering Information
PART NUMBERING INFORMATION
Lead-free Finish
Pins Package Ordering Part Number1 Part Marking
5 CSP CM1416-03CP CJ
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.
Specifications
ABSOLUTE MAXIMUM RATINGS
PARAMETER RATING UNITS
Storage Temperature Range -65 to +150 °C
DC Power per Resistor (note 5) 100 mW
DC Package Power Rating (note 5) 500 mW
STANDARD OPERATING CONDITIONS
PARAMETER RATING UNITS
Operating Temperature Range -40 to +85 °C
CM1416
Rev. 2 | Page 4 of 9 | www.onsemi.com
ELECTRICAL OPERATING CHARACTERISTICS (SEE NOTE 1)
SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS
R R1 Resistance 2 Ω
CTOT Total Channel Capacitance At 2.5VDC, 1MHz,
30mVAC
187 234 281 pF
C1 C1 Capacitance At 2.5VDC, 1MHz,
30mVAC
93 117 140 pF
VDIODE Diode Standoff Voltage IDIODE = 10μA 6.0 V
ILEAK Diode Leakage Current VIN= 3.3V
(reverse bias voltage)
0.1 2 μA
VSIG Signal Clamp Voltage
Positive Clamp
Negative Clamp
ILOAD = 10mA
ILOAD = -10mA
6.4
-9.8
7.6
-7.6
9.8
-6.4
V
V
VESD In-system ESD Withstand Voltage
a) Human Body Model, MIL-STD-883,
Method 3015
b) Contact Discharge per IEC 61000-4-2
Level 4
Note 2
±30
±30
kV
kV
RDYN Dynamic Resistance
Positive
Negative
0.95
0.90
Ω
Ω
fC Cut-off frequency
ZSOURCE = 50Ω, ZLOAD = 50Ω
R = 2Ω, C = 117pF 21 MHz
Note 1: TA=25°C unless otherwise specified.
Note 2: ESD applied to input and output pins with respect to GND, one at a time.
CM1416
Rev. 2 | Page 5 of 9 | www.onsemi.com
Performance Information
Figure 1. Typical EMI FIlter Performance (0VDC, 50 Ohm Environment)
Figure 2. Typical Diode Capacitance VS. Input Voltage (normalized to 2.5VDC)
CM1416
Rev. 2 | Page 6 of 9 | www.onsemi.com
Application Information
PARAMETER VALUE
Pad Size on PCB 0.240mm
Pad Shape Round
Pad Definition Non-Solder Mask defined pads
Solder Mask Opening 0.290mm Round
Solder Stencil Thickness 0.125mm - 0.150mm
Solder Stencil Aperture Opening (laser cut, 5% tapered walls) 0.300mm Round
Solder Flux Ratio 50/50 by volume
Solder Paste Type No Clean
Pad Protective Finish OSP (Entek Cu Plus 106A)
Tolerance — Edge To Corner Ball +50μm
Solder Ball Side Coplanarity +20μm
Maximum Dwell Time Above Liquidous 60 seconds
Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder
Paste
260°C
Solder Mask Openi ng
0.290mm DIA.
Non-Solder Mask Defin ed Pad
0.240mm DIA.
Solder Stenci l Openi ng
0.300mm DIA.
Figure 5. Recommended No n-Solder Mask Defined Pad Illustration
Figure 6. Lead-free (SnAgCu) Solder Ball Reflow Profile
CM1416
Rev. 2 | Page 7 of 9 | www.onsemi.com
Mechanical Details
CSP Mechanical Specifications
The CM1416 is supplied in a custom Chip Scale Package (CSP). Dimensions are presented below.
PACKAGE DIMENSIONS
Package Custom CSP
Bumps 5
Millimeters Inches
Dim
Min Nom Max Min Nom Max
A1 0.955 1.000 1.045 0.0376 0.0394 0.0411
A2 1.325 1.370 1.415 0.0522 0.0539 0.0557
B1 0.495 0.500 0.505 0.0195 0.0197 0.0199
B2 0.245 0.250 0.255 0.0096 0.0098 0.0100
B3 0.430 0.435 0.440 0.0169 0.0171 0.0173
B4 0.430 0.435 0.440 0.0169 0.0171 0.0173
C1 0.200 0.250 0.300 0.0079 0.0098 0.0118
C2 0.200 0.250 0.300 0.0079 0.0098 0.0118
D1 0.575 0.644 0.714 0.0226 0.0254 0.0281
D2 0.368 0.419 0.470 0.0145 0.0165 0.0185
# per tape and
reel
3500 pieces
Controlling dimension: millimeters
Package Dimensions for
CM1416 Chip Scale Package
CM1416
Rev. 2 | Page 8 of 9 | www.onsemi.com
CSP Tape and Reel Specifications
PART NUMBER CHIP SIZE (mm)
POCKET SIZE (mm)
B0 X A0 X K0
TAPE WIDTH
W
REEL
DIAMETER
QTY PER
REEL P0 P
1
CM1416 1.33 x 0.96 x 0.644 1.42 x 1.07 x 0.74 8mm 178mm (7") 3500 4mm 4mm
Figure 5. Tape and Reel Mechanical Data
CM1416
Rev. 2 | Page 9 of 9 | www.onsemi.com
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