Chip EMI Filters
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
E
1
Product Code Type Circuit Nominal
CapacitanceValue
Form
X
2
C
3
C
4
E
5
T
6
1
7
0
8
3
9
U
10
Noise Filter Chip type T-circuit
EMI filter
The first two digits are
significant figures of
capacitance value and the
third one denotes the number
of zeros following.
Code
U
Packing
Embossed Carrier Taping
Ferrite core
Chip capacitor
Adhesive
Electrode
1.0±0.2
0.5±0.2 1.25±0.30
4.5±0.4
0.5±0.2
1.8±0.2
2.7±0.3
Size : 1807 inches
Mass (Weight) : 92.5 mg/pc.
■Construction ■Dimensions in mm (not to scale)
Chip EMI Filters
Type:EXCCET
■Features
● Rated current (2 A max.)
● Eight capacitance values in a wide range, related to
the noise frequency
● Suitable for narrow pitch insertion
● Suitable for applications requiring thin design
■Explanation of Part Numbers
■Recommended Applications
● Digital equipment such as PCs, word processors,
printers, HDD, PPC, and communication equipment.
● Digital audio and video equipment.
● AC adapters, and switching power supplies.
● Electronic musical instruments, and other digital
equipment.
Feb. 2006
Chip EMI Filters
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Measurement Circuit
~
촞
50 액
50 액
Sample
1M 10M 100M 1G
Frequency (Hz)
Attenuation(dB)
60
50
40
30
20
10
0
471 220
470
101
103
222 102
271
(W=12 mm)
t1
t2
Chip component
P1P2P0
Compartment
Sprocket hole
fD0
Tape running direction
E
F
W
B
A
T
f C
E
f D
f B
Wt
f A
fAfBfCfD
Dimensions
(mm) 180.0 0 60.0±1.0 13.0±0.5
21.0±0.8
Part Number
Rated
Voltage
(V DC)
(1)
Capacitance
(pF)
Tolerance
(%)
(2)
Characteristics
Rated
Current
(A DC)
DC
Resistance
(m액)
25 dB Attenuate
Frequency
(MHz)
15 dB Attenuate
Frequency
(MHz)
EXCCET220U 50 22 ±20 YB 2 50 max. 800 to 1000 600 to 1000
EXCCET470U 50 47 ±20 YB 2 50 max. 450 to 550 350 to 1000
EXCCET101U 50 100 ±20 YB 2 50 max. 300 to 450 200 to 900
EXCCET271U 50 270 ±20 YB 2 50 max. 200 to 300 80 to 700
EXCCET471U 50 470 ±20 YB 2 50 max. 100 to 220 50 to 700
EXCCET102U 50 1000 ±20 YB 2 50 max. 65 to 200 30 to 700
EXCCET222U 50 2200 ±20 YB 2 50 max. 35 to 180 15 to 700
EXCCET103U 50 10000 ±20 YB 2 50 max. 15 to 120 15 to 700
Part Number Kind of Taping Pitch (P1) Quantity
EXCCET첸첸첸UEmbossed Carrier Taping 4 mm 1000 pcs./reel
■Packaging Methods (Taping)
● Standard Quantity
● Taping Reel
● Embossed Carrier Taping
ABWFEP
1
Dimensions
(mm) 2.2±0.2 4.9±0.2 12.0±0.2
5.50±0.05 1.75±0.10
4.0±0.1
P2P0fD0t1t2
Dimensions
(mm) 2.0±0.1 4.0±0.1 1.5+0.1
0.35±0.05
3.5 max.
–3.0
EWT t
Dimensions
(mm) 2.0±0.5 13.0+0.5 16.5 max.
1.2±0.5
–1.0
0
(1) Please inquire to us about the particular capacitance value, on a range of 22 to 10000 pF.
(2) Characteristics YB: Maximum capacitance is ±10 % over the temperature range of –25 °C to +85 °C in reference to +20 °C.
■Attenuation Characteristics (Reference Data)
■Ratings
Feb. 2006
Chip EMI Filters
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
5.4
1.3 1.3
1.15
1.0
0.2
Copper foil
Resist
1.4
1.15
1.0
0.2
Copper foil
Resist
1.4
5.4
1.3 1.3
1.4
Resist
2.54
<Recommended reflow soldering temperature>
Temperature of terminals (°C)
Time (min.)
The limit of resistance
to reflow soldering heat
Temperature (°C)
Time (s)
Rising temperature I
Rising temperature II
Preheating
Main
heating
Gradual
cooling
270
260
250
240
230
220
210
200 700102030405060
■Recommended Land Pattern Design(mm)
● For Single Mounting ● For High Density Mounting
■Recommended Soldering Conditions
Recommendations and precautions are described below.
<Repair with hand soldering>
● Preheat with a blast of hot air or similar method. Use a soldering iron with a tip temperature of 350 °C or less. Solder
each electrode for 3 seconds or less.
● Never touch this product with the tip of a soldering iron.
Solder
Rising temperature I
Preheating
Rising temperature II
Main heating Gradual cooling
For soldering
(Sn-37Pb)
The normal time
for preheating
30 s to 60 s
140 °C to 160 °C
60 s to 120 s
Preheating to 200 °C
20 s to 40 s
235±10 °C
Peak
200 °C to 100 °C
1 °C to 4 °C/s
For lead-free
soldering
(Sn-3Ag-0.5Cu)
The normal time
for preheating
30 s to 60 s
150 °C to 170 °C
60 s to 120 s
Preheating to 210 °C
20 s to 40 s
250+10 °C
Peak
210 °C to 100 °C
1 °C to 4 °C/s
– 5
✽ Refl ow soldering shall be performed a maximum of two times.
● Please contact us for additional information when used in conditions other than those specifi ed.
● Please measure the temperature of the terminals and study every kind of solder and printed circuit board
for solderability before actual use.
Feb. 2006
Chip EMI Filters
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Safety Precautions
The following are precautions for individual products. Please also refer to the precautions common to EMI Filters,
Fuses, and Sensors(MR Elements) shown on page EX2 of this catalog.
1. Chip EMI Filters (hereafter called the fi lters) cannot be mounted on a printed circuit board by fl ow soldering.
Mount them by refl ow soldering.
2. Use rosin-based fl ux or halogen-free fl ux.
3. For cleaning, use an alcohol-based cleaning agent. Before using any other type, con sult with our sales person
in advance.
4. Do not apply shock to the fi lters or pinch them with a hard tool (e.g. pliers and tweezers). Otherwise, their bodies
may be chipped, affecting their performance. Excessive mechanical stress may damage the filters. Handle
with care.
5. Avoid applying static electricity to the fi lters.
6. The performance of the fi lters deteriorates in a circuit that is susceptible to surges or other abnormal voltages.
Carefully check the circuit operations before use.
7. Store the fi lters in a location with a temperature ranging from –5 °C to +40 °C and a relative humidity of 40 % to 60 %,
where there are no rapid changes in temperature or humidity.
8. Use the fi lters within a year after the date of the outgoing inspection indicated on the packages.
Feb. 2006
– EX2 –
Safety Precautions (Common precautions for EMI Filters, Fuses, and Sensors[MR Elements])
•When using our products, no matter what sort of equipment they might be used for, be sure to make a written
agreement on the specifi cations with us in advance. The design and specifi cations in this catalog are subject
to change without prior notice.
•Do not use the products beyond the specifi cations described in this catalog.
•This catalog explains the quality and performance of the products as individual components. Before use, check
and evaluate their operations when installed in your products.
•Install the following systems for a failsafe design to ensure safety if these products are to be used in equip ment
where a defect in these products may cause the loss of human life or other signifi cant dam age, such as damage to
vehicles (automobile, train, vessel), traffi c lights, medical equipment, aerospace equipment, electric heating
appliances, combustion/gas equipment, rotating equipment, and disaster/crime prevention equipment.
✽Systems equipped with a protection circuit and a protection device
✽Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a sin gle fault
(1) Precautions for use
•These products are designed and manufactured for general and standard use in general elec tron ic equipment
(e.g. AV equipment, home electric appliances, offi ce equipment, information and communication equipment)
•These products are not intended for use in the following special conditions. Before using the products,
carefully check the effects on their quality and performance, and determine whether or not they can be used.
1. In liquid, such as water, oil, chemicals, or organic solvent
2. In direct sunlight, outdoors, or in dust
3. In salty air or air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2
4. Electric Static Discharge (ESD) Environment
These components are sensitive to static electricity and can be damaged under static shock (ESD).
Please take measures to avoid any of these environments.
Smaller components are more sensitive to ESD environment.
5. Electromagnetic Environment
Avoid any environment where strong electromagnetic waves exist.
6. In an environment where these products cause dew condensation
7. Sealing or coating of these products or a printed circuit board on which these products are mounted, with
resin or other materials
•These products generate Joule heat when energized. Carefully position these products so that their heat will
not affect the other components.
•Carefully position these products so that their temperatures will not exceed the category temperature range due
to the effects of neighboring heat-generating components. Do not mount or place heat-generating components
or infl ammables, such as vinyl-coated wires, near these products (except Thermal Cutoffs).
•Note that non-cleaning solder, halogen-based highly active fl ux, or water-soluble fl ux may deteriorate the
performance or reliability of the products.
•Carefully select a fl ux cleaning agent for use after soldering. An unsuitable agent may deteriorate the performance
or reliability. In particular, when using water or a water-soluble cleaning agent, be careful not to leave water
residues. Otherwise, the insulation performance may be deteriorated.
(2) Precautions for storage
The performance of these products, including the solderability, is guaranteed for a year from the date of ar riv al
at your company, provided that they remain packed as they were when delivered and stored at a tem per a ture
of 5 °C to 35 °C and a relative humidity of 45 % to 85 %. (Micro Chip Fuses: Guaranteed for 6 months from the
date of arrival at your company)
The performance of EMI Filters is guaranteed for 6 months or a year from the out go ing inspection date indicated on
the packages, provided that they are stored at a temperature of -5 °C to +40 °C and a relative humidity of 40 %
to 60 %. Check the guarantee period in the specifi cations. The performance of Thermal Cut offs is guaranteed for a
year from the outgoing inspection date indicated on the packages, provided that they are stored at a temperature of
-10 °C to +40 °C and a relative humidity of 30 % to 75 %.
Even within the above guarantee periods, do not store these products in the following conditions. Otherwise,
their electrical performance and/or solderability may be deteriorated, and the packaging materials (e.g. taping
materials) may be deformed or deteriorated, resulting in mounting failures.
1. In salty air or in air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2
2. In direct sunlight
<Package markings>
Package markings include the product number, quantity, and country of origin.
In principle, the country of origin should be indicated in English.
Feb. 2006
