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©2009-2011 by RF Monolithics, Inc. XTC7004 - 12/12/11
Electrical Characteristics
Characteristic Sym Notes Minimum Typical Maximum Units
Nominal Frequency FO16.367667 MHz
Frequency Tolerance after Reflow ±2 ppm maximum @ 25 ±3 °C
Storage Temperature Range in Tape and Reel -40 +85 °C
Operating Temperature Range -30 +85 °C
Power Supply Voltage VDD 2.70 2.85 3.00 V
Output Voltage with 10 pF || 10 K Load 0.8 VP-P
Output Waveform Clipped Sinewave
Power Supply Current IDD 2.0 mA
Frequency Stability versus:
Temperature, -30 to 85 °C ±0.5 ppm
Load Variation, 10 pF || 10 K±10% ±0.2 ppm
Supply Voltage, 2.85 V ±5% ±0.2 ppm
Frequency Slope, one measurement every 2 °C ±0.05 ppm
Short Term Stability (STS) 0.8 ppb
Static Temperature Hysteresis ±0.6 ppm
Start Up Time, 90% of Final RF level in VP-P 2.0 ms
Harmonics -7.0 dBc
SSB Phase Noise @ 1 kHz Carrier Offset -130 dBc/Hz
Aging @ 25 °C ±1.0 ppm
Stanard Shipping Quantity on 180 mm (7”) Reel 1000 units
Lid Symbolization (in addition to Lot and/or Date Codes) Line1: 7004 Line2: YWWS
• Temperature Compensated Crystal Oscillator
• Miniature 3.2 x 2.5 mm SMD Package
• Excellent Frequency Stability
• Low Phase Noise
• Complies with Directive 2002/95/EC (RoHS)
16.367667 MHz
TCXO
XTC7004
CAUTION: Electrostatic Sensitive Device. Observe precautions for handling.
Notes:
1. The design, manufacturing process, and specifications of this device are subject to change without notice.
2 >
Pin Connections
Connection Terminals
Ground 1
Ground 2
TCXO Output 3
VDD 4
4-Terminal SMD Case
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©2009-2011 by RF Monolithics, Inc. XTC7004 - 12/12/11
V
D D
1 0 n F
O u t p u t
T e m p e r a t u r e
C o m p e n s a t e d
C r y s t a l
O s c i l l a t o r
1
2 3
4
A
B
C
D
E
FG
H
I
1 2
34
1
2
3 4
J
K
LM
12
34
4-Terminal Surface-Mount Seam Weld Case
3.2 x 2.5 mm Nominal Footprint
Case and PCB Land Dimensions
Case Materials
Dimension mm Inches
Min Nom Max Min Nom Max
A3.00 3.20 3.40 0.118 0.126 0.134
B2.30 2.50 2.70 0.091 0.098 0.106
C- - 1.20 - - 0.047
D- 3.08 - - 0.121 -
E- 1.80 - - 0.071 -
F- 2.38 - - 0.094 -
G- 1.00 - - 0.039 -
H- 0.60 - - 0.024 -
I- 0.65 - - 0.026 -
J- 3.60 - - 0.142 -
K- 1.60 - - 0.063 -
L- 2.90 - - 0.114 -
M- 0.80 - - 0.031 -
Materials
Solder Pad
Plating 0.3 to 1.0 µm Gold over 1.27 to 8.89 µm Nickel
Lid Plating 2.0 to 3.0 µm Nickel
Body Al2O3 Ceramic
Pb Free
TCXO Application Circuit
PCB Land Pattern
(Top View)
Top
Side Bottom
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©2009-2011 by RF Monolithics, Inc. XTC7004 - 12/12/11
0
5 0
1 0 0
1 5 0
2 0 0
2 5 0
3 0 0
0 6 0 1 2 0 1 8 0 2 4 0 3 0 0 3 6 0
T e m p e r a t u r e ( d e g C )
R a m p u p P r e h e a t R e f l o w C o o l D o w n
T i m e ( s e c o n d s )
M a x i m u m p e a k t e m p e r a t u r e : 2 6 0 OC
Typical Solder Reflow Profile
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©2009-2011 by RF Monolithics, Inc. XTC7004 - 12/12/11
Reel Dimensions
Tape Dimensions
mm A0 B0 W F E P0 P1 P2 D1 DK0 t
Dimension 2.80 3.71 8.00 3.50 1.75 4.00 4.00 2.00 1.50 1.00 1.75 0.25
Tolerance ±0.10 ±0.10 +0.30/-0.10 ±0.05 ±0.10 ±0.10 ±0.10 ±0.05 +0.10/-0.00 +0.25/-0.00 ±0.10 ±0.02
mm A B C D E F G H T1 T2 T3
Dimension 180 60 13.0 2.0 9.1 2.9 4.9 3.9 9.0 11.4 1.2
Tolerance ±1.0 +1.0/-0.0 ±0.2 ±0.5 ±0.5 ±0.5 ±0.5 ±0.5 ±0.3 ±1.0 ±0.1
