
175
Detector Slide Push Rotary Power
Dual-in-line
Package Type
Soldering time
Example of Reflow Soldering Condition
1. Heating method: Double heating method with infrared heater.
2.
Temperature measurement: Thermocouple φ 0.1 to 0.2 CA(K)or CC(T)at soldering portion(copper foil surface).
A heat resisting tape should be used for fixed measurement.
3. Temperature profile
300
200
100
A max.
B
C
Time (s)
20 max.
E max.
Pre-heating
D max.
F
Room
temperature
Temperature (˚C )
1. The condition mentioned above is the temperature on the mounting surface of a PC board. There are cases where the PC board's
temperature greatly differs from that of the switch, depending on the PC board's material, size, thickness, etc. The above-stated
conditions shall also apply to switch surface temperatures.
2.
Soldering conditions differ depending on reflow soldering machines. Prior verification of soldering condition is highly recommended.
Notes
SSGM
F(s)Series(Reflow type)
250 240 ---- ----
15 0 18 0
A(℃)
3s max. B(℃) C(℃) D(s) E(s)
Dip soldering
Soldering temperature Duration of immersionPreheating temperature Preheating time
350±5℃
12 0 ℃ ma x . 90s max.
5s max.
270±5℃ 10 ±1s m a x .
Soldering temperature
Items
Reference for Hand Soldering Condition
Reference for Dip Soldering Condition
(For insertion terminal types)
Dual In-line Package Type Switches / Soldering Conditions