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Data Sheet
March 21, 2006
SW/SC001/003 Series DC-DC Power Module:
18-36Vdc & 36-75Vdc Input; 3.3-15Vdc Output; 1-3.5A Output Current
Tyco Electronics Power Systems 21
Through-Hole Lead-Free Soldering
Information
The RoHS-compliant through-hole products use the
SAC (Sn/Ag/Cu) Pb-free solder and RoHS-compliant
components. They are designed to be processed
through single or dual wave soldering machines. The
pins have an RoHS-compliant finish that is compatible
with both Pb and Pb-free wave soldering processes.
A maximum preheat rate of 3°C/s is suggested. The
wave preheat process should be such that the
temperature of the power module board is kept below
210°C. For Pb solder, the recommended pot
temperature is 260°C, while the Pb-free solder pot is
270°C max. Not all RoHS-compliant through-hole
products can be processed with paste-through-hole
Pb or Pb-free reflow process. If additional information
is needed, please consult with your Tyco Electronics
Power System representative for more details.
Surface Mount Information
Packaging Details
The surface mount versions of the SW/SC family
(suffix –SR) are supplied as standard in tape and reel.
Full details of this packaging will be provided in the
full revision of this data sheet.
Pick and Place
The SW/SC-SR series of DC-to-DC power converters
use an open-frame construction and are designed for
surface mount assembly within a fully automated
manufacturing process.
The SW/SC-SR series modules are designed to use
the main magnetic component surface to allow for
pick and place.
12.70
10.7
Ø6.5 NOZZLE.
Note: All dimensions in mm.
Figure 52. Pick and Place Location.
Z Plane Height
The ‘Z’ plane height of the pick and place location is
7.50mm nominal with an RSS tolerance of +/-0.25
mm.
Nozzle Recommendations
The module weight has been kept to a minimum by
using open frame construction. Even so, they have a
relatively large mass when compared with
conventional SMT components. Variables such as
nozzle size, tip style, vacuum pressure and placement
speed should be considered to optimize this process.
The minimum recommended nozzle diameter for
reliable operation is 5mm. The maximum nozzle outer
diameter, which will safely fit within the allowable
component spacing, is 6.5mm.
Oblong or oval nozzles up to 11 x 6 mm may also be
used within the space available.
For further information please contact your local Tyco
Electronics Power Systems Technical Sales
Representative.
Reflow Soldering Information
The SW/SC family of power modules is available
for either Through-Hole (TH) or Surface Mount
(SMT) soldering. These power modules are large
mass, low thermal resistance devices and typically
heat up slower than other SMT components. It is
recommended that the customer review data
sheets in order to customize the solder reflow
profile for each application board assembly.
The following instructions must be observed when
SMT soldering these units. Failure to observe
these instructions may result in the failure of or
cause damage to the modules, and can adversely
affect long-term reliability.
The surface mountable modules in the SW/SC
family use our SMT technology called “Column Pin”
(CP) connectors. Figure 53 shows the CP
connector before and after reflow soldering onto the
end-board assembly.
Power Module Board
Insulator
Solder Ball
End assembly PCB
Figure 53. Column Pin Connector Before and
After Reflow Soldering.