Advanced Micro Devices
AMD Athlon™ X2
Dual-Core Processor
Product Data Sheet
Compatible with Existing 32-Bit Code Base
Including support for SSE, SSE2, SSE3, MMX™,
3DNow!™ technology and legacy x86 instructions
Runs existing operating systems and drivers
Local APIC on-chip
AMD64 Technology
AMD64 technology instruction set extensions
64-bit integer registers, 48-bit virtual addresses,
40-bit physical addresses
Eight additional 64-bit integer registers (16 total)
Eight additional 128-bit SSE/SSE2/SSE3 registers
(16 total)
Dual-Core Architecture
Discrete L1 and L2 cache structures for each core
HyperTransport™ Technology to I/O Devices
One 16-bit link supporting speeds up to 1 GHz (2000
MT/s) or 4 Gigabytes/s in each direction
64-Kbyte 2-Way Associative ECC-Protected
L1 Data Caches
Two 64-bit operations per cycle, 3-cycle latency
64-Kbyte 2-Way Associative Parity-Protected
L1 Instruction Caches
With advanced branch prediction
16-Way Associative ECC-Protected
L2 Caches
Exclusive cache architecture—storage in addition
to L1 caches
Up to 1 Mbyte per L2 cache
Machine Check Architecture
Includes hardware scrubbing of major
ECC-protected arrays
Power Management
Multiple low-power states including C1E
System Management Mode (SMM)
ACPI-compliant, including support for processor
performance states
Socket AM2 Specific Features
Refer to the Socket AM2 Processor Functional
Data Sheet, order# 31117, for functional and
mechanical details of socket AM2 processors.
Refer to the AMD NPT 0Fh Family Processor
Electrical Data Sheet, order# 31119, for
electrical details of socket AM2 processors.
Electrical Interfaces
HyperTransport™ technology: LVDS-like
differential, unidirectional
DDR2 SDRAM: SSTL_1.8 per JEDEC
specification
Clock, reset, and test signals also use DDR2
SDRAM-like electrical specifications
Packaging
Lidded micro PGA
31 x 31 grid array
1.27-mm pin pitch
Compliant with RoHS (EU Directive 2002/95/EC)
with lead used only in small amounts in specifically
exempted applications
Integrated Memory Controller
Low-latency, high-bandwidth
144-bit DDR2 SDRAM controller operating at up
to 400 MHz
Supports up to four unbuffered DIMMs
ECC checking with double-bit detect and single-bit
correct
43042Publication # 3.00Revision:
May 2007Issue Date:
2
43042 Rev. 3.00 May 2007
AMD Athlon™ X2 Dual-Core Product Data Sheet
Revision History
© 2007 Advanced Micro Devices, Inc. All rights reserved.
The contents of this document are provided in connection with Advanced Micro Devices, Inc.
(“AMD”) products. AMD makes no representations or warranties with respect to the accuracy
or completeness of the contents of this publication and reserves the right to make changes to
specifications and product descriptions at any time without notice. The information contained
herein may be of a preliminary or advance nature and is subject to change without notice. No
license, whether express, implied, arising by estoppel or otherwise, to any intellectual property
rights is granted by this publication. Except as set forth in AMD’s Standard Terms and
Conditions of Sale, AMD assumes no liability whatsoever, and disclaims any express or
implied warranty, relating to its products including, but not limited to, the implied warranty of
merchantability, fitness for a particular purpose, or infringement of any intellectual property
right.
AMD’s products are not designed, intended, authorized or warranted for use as components in
systems intended for surgical implant into the body, or in other applications intended to
support or sustain life, or in any other application in which the failure of AMD’s product could
create a situation where personal injury, death, or severe property or environmental damage
may occur. AMD reserves the right to discontinue or make changes to its products at any time
without notice.
Trademarks
AMD, the AMD Arrow logo, AMD Athlon and combinations thereof, and 3DNow! are trademarks of Advanced Micro Devices, Inc.
HyperTransport is a licensed trademark of the HyperTransport Technology Consortium.
MMX is a trademark of Intel Corporation.
Other product names used in this publication are for identification purposes only and may be trademarks of their respective companies.
Date Revision Description
May 2007 3.00 Initial public release.