PLED Open LED Protectors
Revision: 09/25/15
©2015 Littelfuse, Inc.
Specifications are subject to change without notice.
PLED Series
PLED Series
Soldering Parameters
Reflow Condition Pb – Free assembly
Pre Heat
- Temperature Min (Ts(min))150°C
- Temperature Max (Ts(max))200°C
- Time (min to max) (ts)60 – 180 secs
Average ramp up rate (Liquidus Temp
(TL) to peak 3°C/second max
TS(max) to TL - Ramp-up Rate 3°C/second max
Reflow - Temperature (TL) (Liquidus) 217°C
- Temperature (tL)60 – 150 seconds
Peak Temperature (TP)260+0/-5 °C
Time within 5°C of actual peak
Temperature (tp)30 seconds
Ramp-down Rate 6°C/second max
Time 25°C to peak Temperature (TP)8 minutes max
Do not exceed 260°C
Physical Specifications
Environmental Specifications
High Temperature
Voltage Blocking
MIL-STD-750: Method 1040, Condition A
80% min VDRM (VAC-peak), 150°C,
504 hours
Temperature Cycling
MIL-STD-750: Method 1051
-65°C to 150°C, 15-minute dwell,
100 cycles
Biased Temperature &
Humidity
EIA/JEDEC: JESD22-A101
52VDC, 85°C, 85%RH, 1008 hours
High Temperature
Storage
MIL-STD-750: Method 1031
150°C, 1008 hours
Low Temperature
Storage -65°C, 1008 hours
Thermal Shock
MIL-STD-750: Method 1056
0°C to 100°C, 5-minute dwell,
10-second transfer, 10 cycles
Resistance to
Solder Heat
MIL-STD-750: Method 2031
260°C, 10 seconds
Terminal Material Copper Alloy
Terminal Finish 100% Matte Tin Plated
Body Material UL recognized epoxy meeting ammability
classification 94V-0