ASMT-QxBD-Axxxx
Super 0.5W Power PLCC-4 Surface Mount LED Indicator
Data Sheet
Description
The Super 0.5W Power PLCC-4 SMT LED is an extension of
Power PLCC-4 SMT LEDs. The package can be driven at high
current due to its superior package design. The product
is able to dissipate the heat more e ciently compared to
the Power PLCC-4 SMT LEDs. These LEDs produce higher
light output with better  ux performance compared to
the Power PLCC-4 SMT LED.
The Super 0.5W Power PLCC-4 SMT LEDs are designed for
higher reliability, better performance, and operate under
a wide range of environmental conditions. The perfor-
mance characteristics of these new mid-power LEDs make
them uniquely suitable for use in harsh conditions such as
in automotive applications, and in electronics signs and
signals.
To facilitate easy pick and place assembly, the LEDs are
packed in EIA-compliant tape and reel. Every reel is
shipped in single intensity and color bin (except for red),
to provide close uniformity.
Super 0.5W Power PLCC-4 SMT LED is available in red; red-
orange & amber colors.
Features
 Industry Standard PLCC 4 platform (3.2x2.8x1.9mm)
 High reliability package with enhanced silicone resin
encapsulation
 High intensity brightness with optimum  ux perfor-
mance using AllnGaP chip technologies
 Available in Red, red-orange & Amber colors
 High optical e ciency
 Available in 8mm carrier tape & 7 inch reel
 Low Thermal Resistance 60°C/W
 Super wide viewing angle at 120 degree
 Longer life time with minimum degradation due to
enhanced Silicone resin material
 JEDEC MSL 2
Applications
 Exterior automotive
– Turn signals
– Side repeaters
– CHSML
Rear combination lamp
– Side markers
Truck clearance lamp
 Electronic signs and signals
– Channel lettering
– Contour lighting
Indoor variable message sign
 O ce automation, home appliances, industrial
equipment
Front panel backlighting
Push button backlighting
– Display backlighting
CAUTION: ASMT-QxBD-Axxxx LEDs are Class 2 ESD sensitive. Please observe appropriate precautions
during handling and processing. Refer to Avago Application Note AN-1142 for additional details.
2
Package Drawing
3.6 ± 0.2
0.7
3.2 ± 0.2
2.8 ± 0.2
2.2 ± 0.2 1.9 ± 0.2 0.6 ± 0.3
AA
CC
0.79 ± 0.3
ANODE
MARKING
2.4
1.15 ± 0.2
0.41 (TYP.)
0.56 (TYP.)
0.97
Note:
1. All Dimensions in millimeters.
2. Lead Polarity as shown in Figure 13.
3. Terminal Finish: Ag plating
4. Encapsulation material: Silicone resin
Figure 1. Package Drawing
Table 1. Device Selection Guide
Color Part Number
Luminous Flux, V[1] (lm)
Dice Technology
Min. Flux
(lm)
Typ. Flux
(lm)
Max. Flux
(lm)
Test Current
(mA)
Amber ASMT-QABD-AEF0E 11.5 16.5 19.5 150 AlInGaP
Red Orange ASMT-QHBD-AFH0E 15.0 17.5 33.0 150 AlInGaP
Red ASMT-QRBD-AEF0E 11.5 16.5 19.5 150 AlInGaP
Notes:
1. V is the total luminous  ux output as measured with an integrating sphere at mono pulse condition.
2. Flux tolerance is ±12%
Part Numbering System
ASMT- Q X1 B D  A X2 X3 X4 X5
Packaging Option
Color Bin Selection
Max. Flux Bin Selection
Min. Flux Bin Selection
Color
A – Amber
H – Red Orange
R – Red
3
Table 2. Absolute Maximum Ratings (TA = 25°C)
Parameters ASMT-QxBD-Axxxx
DC Forward Current [1] 150 mA
Peak Forward Current [2] 300 mA
Power Dissipation 450 mW
Reverse Voltage, VR @ 100μA 5 V
Junction Temperature 125°C
Operating Temperature -40°C to +120°C
Storage Temperature -40°C to +120°C
Notes:
1. Derate Linearly as shown in Figure 6.
2. Duty Factor = 10%, Frequency = 1kHz
Table 3. Optical Characteristics (TJ = 25°C)
Color Part Number
Dice
Technology
Peak
Wavelength
PEAK (nm)
Dominant
Wavelength
D [1] (nm)
Viewing Angle
2½ [2]
(Degrees)
Luminous
E ciency e
(lm/W)
Total Flux /
Luminous
Intensity
V (lm) / IV (cd)
Typ. Typ. Typ. Typ. Typ.
Amber ASMT-QABD-Axx0E AlInGaP 596.2 593.1 120 44 2.5
Red Orange ASMT-QHBD-Axx0E AlInGaP 624.1 616.1 120 47 2.5
Red ASMT-QRBD-Axx0E AlInGaP 629.7 621.1 120 44 2.5
Notes:
1. The dominant wavelength, D, is derived from the CIE Chromaticity diagram and represents the color of the device.
2. ½ is the o -axis angle where the luminous intensity is ½ the peak intensity.
Table 4. Electrical Characteristics (TJ = 25°C)
Part Number
Forward Voltage VF (Volts) @ IF = 150 mA Thermal Resistance
RJ-P (°C/W)Min. Typ. Max.
ASMT-QABD-AxxxE 2.05 2.30 2.95 60
ASMT-QHBD-AxxxE 2.05 2.50 2.95 60
ASMT-QRBD-AxxxE 2.05 2.50 2.95 60
4
Figure 2. Relative Intensity Vs. Wavelength Figure 3. Forward Current Vs. Forward Voltage.
Figure 4. Relative Intensity Vs. Forward Current Figure 5. Relative Intensity Vs. Temperature
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
380 430 480 530 580 630 680 730 780
WAVELENGTH - nm
RELATIVE INTENSITY
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
-50 -25 0 25 50 75 100
JUNCTION TEMPERATURE - °C
RELATIVE LUMINOUS INTENSITY
(NORMALIZED AT 25°C)
0
20
40
60
80
100
120
140
160
0 20 40 60 80 100 120 140
TEMPERATURE (°C)
CURRENT - mA
0
20
40
60
80
100
120
140
160
0 20 40 60 80 100 120 140
TEMPERATURE (°C)
CURRENT - mA
AlInGaP Amber
AlInGaP Red-Orange
AlInGaP Red
AlInGaP Red-Orange
& Red
AlInGaP Amber
RθJA = 110°C/W
RθJA = 130°C/W
RθJA = 100°C/W
RθJP = 60°C/W
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
0 50 100 150 200 250 300
DC FORWARD CURRENT - mA
RELATIVE LUMINOUS FLUX
(NORMALIZED AT 150 mA)
0
50
100
150
200
250
300
01234
FORWARD VOLTAGE - V
FORWARD CURRENT - mA
AlInGaP
Red-Orange
/ Red
AlInGaP
Amber
Figure 6a. Maximum Forward Current Vs. Ambient Temperature.
Derated based on TJMAX = 125°C, RJ-A=130°C/W, 110°C/W & 100°C/W.
Figure 6b. Maximum Forward Current Vs. Solder Point Temperature.
Derated based on TJMAX = 125°C, RJ-P =60°C/W.
5
0.00
0.10
0.20
0.30
0.40
1.00E-05 1.00E-03 1.00E-01 1.00E+01
tp - Time - (S)
CURRENT - A
590.0
595.0
600.0
605.0
610.0
615.0
620.0
625.0
0 50 100 150 200 250 300
FORWARD CURRENT - mA
DOMINANT WAVELENGTH - nm
-0.2
-0.1
0.0
0.1
0.2
0.3
0.4
-50 -25 0 25 50 75 100
TJ - JUNCTION TEMPERATURE - °C
FORWARD VOLTAGE SHIFT - V
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
-90 -60 -30 0 30 60 90
ANGULAR DISPLACEMENT - DEGREES
NORMALIZED INTENSITY
AlInGaP Red-Orange
AlInGaP Red
AlInGaP Amber
AlInGaP Amber &
Red-Orange
AlInGaP Red
D = t
p
T
t
p
I
F
T
0.00
0.10
0.20
0.30
0.40
1.00E-05 1.00E-04 1.00E-03 1.00E-02 1.00E-01 1.00E+00 1.00E+01 1.00E+02
tp - Time - (S)
CURRENT - A
D =
0.05
0.10
0.25
0.50
1
D = t
p
T
t
p
I
F
T
Figure 7a. Maximum Pulse Current vs. Ambient Temperature.
Derated based on TA = 25°C, RJ-A =110°C/W.
Figure 7b. Maximum Pulse Current vs. Ambient Temperature.
Derated based on TA = 85°C, RJ-A =110°C/W.
Figure 8. Dominant Wavelength Vs. Forward Current - AlInGaP Devices. Figure 9. Forward Voltage Shift Vs. Temperature.
Figure 10. Radiation Pattern
6
Figure 11. Recommended Pick and Place Nozzle Size
(Acc. to J-STD-020C)
217°C
200°C
60 - 120 SEC.
6°C/SEC. MAX.
3°C/SEC. MAX.
3°C/SEC. MAX.
150°C
255 - 260°C
100 SEC. MAX.
10 - 30 SEC.
TIME
TEMPERATURE
Figure 12. Recommended Pb-free Re ow Soldering Pro le
Note: For detail information on re ow soldering of Avago surface mount
LEDs, do refer to Avago Application Note AN 1060 Surface Mounting
SMT LED Indicator Components.
Figure 13. Recommended Soldering Pad Pattern
ANODE
MARKING
0.4
0.3
MINIMUM 55 mm2 OF ANODE PAD
FOR IMPROVED HEAT DISSIPATION
2.4
0.6
0.9 X 6
4.6
1.1
1.3 x 6
ANODE
MARKING
A
C
C C
A A
A A
SOLDER MASK
ANODE
CATHODE
CC
AA
ID
Note: Diameter "ID" should
be bigger than 2.3mm
7
200 mm MIN. FOR Ø180 REEL.
200 mm MIN. FOR Ø330 REEL.
TRAILER COMPONENT LEADER
480 mm MIN. FOR Ø180 REEL.
960 mm MIN. FOR Ø330 REEL.
C
A
USER FEED DIRECTION
Figure 14. Tape Leader and Trailer Dimensions
Figure 15. Tape Dimensions
Figure 16. Reeling Orientation
CATHODE SIDE
USER FEED DIRECTION
PRINTED LABEL
3.8 ± 0.1
2.29 ± 0.1
0.229 ± 0.01
ALL DIMENSIONS IN mm.
2 ± 0.054 ± 0.1 4 ± 0.1
3.05 ± 0.1
3.5 ± 0.05
8+0.3
–0.1
1.75 ± 0.1
Ø1.5 +0.1
–0
Ø1+0.1
–0
AA
CC
8
Handling Precaution
The encapsulation material of the product is made of
silicone for better reliability of the product. As silicone is
a soft material, please do not press on the silicone or poke
a sharp object onto the silicone. These might damage the
product and cause premature failure. During assembly
or handling, the unit should be held on the body only.
Please refer to Avago Application Note AN 5288 for detail
information.
Moisture Sensitivity
This product is quali ed as Moisture Sensitive Level 2 per
Jedec J-STD-020. Precautions when handling this moisture
sensitive product is important to ensure the reliability of
the product. Do refer to Avago Application Note AN5305
Handling of Moisture Sensitive Surface Mount Devices for
details.
A. Storage before use
Unopened moisture barrier bag (MBB) can be stored
at <40°C/90%RH for 12 months. If the actual shelf life
has exceeded 12 months and the humidity indicator
card (HIC) indicates that baking is not required, then
it is safe to re ow the LEDs per the original MSL
rating.
It is not recommended to open the (MBB) prior to
assembly (e.g. for IQC).
B. Control after opening the MBB
The humidity indicator card (HIC) shall be read
immediately upon opening of MBB.
The LEDs must be kept at <30°C/60%RH at all time
and all high temperature related process including
soldering, curing or rework need to be completed
within 1 year.
C. Control for un nished reel
For any unused LEDs, they need to be stored in
sealed MBB with desiccant or desiccator at <5%RH.
D. Control of assembled boards
If the PCB soldered with the LEDs is to be subjected to
other high temperature processes, the PCB need to
be stored in sealed MBB with desiccant or desiccator
at <5%RH to ensure no LEDs have exceeded their
oor life of 1 year.
E. Baking is required if:
“60%” HIC indicator is NOT Green.
The LEDs are exposed to condition of >30°C/60% RH
at any time.
The LEDs  oor life exceeded 1 year.
Recommended baking condition: 60±5°C for 20 hours.
Device Color (X1)
A Amber
H Red Orange
RRed
Flux Bin Select (X2X3)
Individual reel will contain parts from one bin only
X2Min Flux Bin
X3Max Flux Bin
Flux Bin Limits
Bin ID Min. (lm) Max. (lm)
0 3.30 4.30
A 4.30 5.50
B 5.50 7.00
C 7.00 9.00
D 9.00 11.50
E 11.50 15.00
F 15.00 19.50
G 19.50 25.50
H 25.50 33.00
J 33.00 43.00
K 43.00 56.00
L 56.00 73.00
Tolerance of each bin limit = ± 12%
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2011 Avago Technologies. All rights reserved.
AV02-1841EN - September 30, 2011
Color Bin Select (X4)
Individual reel will contain parts from one full bin only.
X4
0 Full Distribution
A 1 and 2 only
B 2 and 3 only
C 3 and 4 only
D 4 and 5 only
E 5 and 6 only
G 1, 2 and 3 only
H 2, 3 and 4 only
J 3, 4 and 5 only
K 4, 5 and 6 only
M 1, 2, 3 and 4 only
N 2, 3, 4 and 5 only
P 3, 4, 5 and 6 only
R 1, 2, 3, 4 and 5 only
S 2, 3, 4, 5 and 6 only
Z Special Color Bin
Color Bin Limits
Amber/Yellow Min. (nm) Max. (nm)
2 583.0 586.0
3 586.0 589.0
4 589.0 592.0
5 592.0 595.0
6 595.0 598.0
Red Orange Min. (nm) Max. (nm)
1 611.0 616.0
2 616.0 620.0
3 620.0 625.0
Red Min. (nm) Max. (nm)
Full Distribution 620.0 635.0
Tolerance of each bin limit = ±1nm
VF Binning
Bin Min. Max.
2B 2.05 2.20
2C 2.20 2.35
2D 2.35 2.50
2E 2.50 2.65
2F 2.65 2.80
2G 2.80 2.95
Tolerance of each bin = ±0.1V
Packaging Option (X5)
Option Test Current Package Type Reel Size
E 150mA Top Mount 7 Inch