SMSC USB2412 DATASHEET Revision 1.3 (12-27-11)
Datasheet
PRODUCT FEATURES
USB2412
2-Port USB 2.0 Hi-Speed
Hub Controller
General Description
The SMSC USB2412 hub is a low-power, single
transaction translator (STT) hub controller IC with two
downstream ports for embedded USB applications. The
SMSC hub controller supports low-speed, full-speed,
and hi-speed (if operating as a hi-speed hub)
downstream devices on all of the enabled downstream
ports.
Features
Fully integrated USB termination and pull-up/pull-
down resistors
Supports a single external 3.3 V supply source;
internal regulators provide 1.2 V internal core voltage
On-chip 24 MHz crystal driver or external 24 MHz
clock input
ESD protection up to 4 kilovolts on all USB pins
Supports self-powered operation
Contains a built-in default configuration; no external
configuration options or components are required
Downstream ports as optional non-removable ports
Supports compound devices on a port-by-port basis
28-pin QFN (5 x 5 mm) lead-free RoHS compliant
package
Supports the commercial temperature range:
0ºC to +70ºC
Highlights
High performance, low-power, small footprint hub
controller IC with two downstream ports
Fully compliant with the USB 2.0 Specification 1.
28QFN low pin count package
Optimized for minimal bill-of-materials and low cost
designs
Applications
Automobile/home audio systems
Cable/DSL modems
Embedded systems
Gaming consoles
HDD enclosures
IP telephony
KVM switches
LCD monitors and TVs
Multi-function USB peripherals
Mobile PC docking
PC motherboards
PC media drive bay
Portable hub boxes
Point-of-Sale (POS) systems
Printers and scanners
Server front panels
Set-top boxes, DVD players, DVR/PVR
Thin client terminals
Order Numbers:
This product meets the halogen maximum concentration values per IEC61249-2-21
For RoHS compliance and environmental information, please visit www.smsc.com/rohs
ORDER NUMBERS*
LEAD-FREE
ROHS COMPLIANT
PACKAGE PACKAGE SIZE REEL SIZE
USB2412-DZK 28-Pin QFN Lead-Free, RoHS
Compliant Package
(includes tape and reel option)
5 x 5 x 0.5 mm
-
USB2412-DZK-TR
2-Port USB 2.0 Hi-Speed Hub Controller
Datasheet
Revision 1.3 (12-27-11) 2 SMSC USB2412
DATASHEET
80 ARKAY DRIVE, HAUPPAUGE, NY 11788 (631) 435-6000 or 1 (800) 443-SEMI
Copyright © 2011 SMSC or its subsidiaries. All rights reserved.
Circuit diagrams and other information relating to SMSC products are included as a means of illustrating typical applications. Consequently, complete information sufficient for
construction purposes is not necessarily given. Although the information has been checked and is believed to be accurate, no responsibility is assumed for inaccuracies. SMSC
reserves the right to make changes to specifications and product descriptions at any time without notice. Contact your local SMSC sales office to obtain the latest specifications
before placing your product order. The provision of this information does not convey to the purchaser of the described semiconductor devices any licenses under any patent
rights or other intellectual property rights of SMSC or others. All sales are expressly conditional on your agreement to the terms and conditions of the most recently dated
version of SMSC's standard Terms of Sale Agreement dated before the date of your order (the "Terms of Sale Agreement"). The product may contain design defects or errors
known as anomalies which may cause the product's functions to deviate from published specifications. Anomaly sheets are available upon request. SMSC products are not
designed, intended, authorized or warranted for use in any life support or other application where product failure could cause or contribute to personal injury or severe property
damage. Any and all such uses without prior written approval of an Officer of SMSC and further testing and/or modification will be fully at the risk of the customer. Copies of
this document or other SMSC literature, as well as the Terms of Sale Agreement, may be obtained by visiting SMSC’s website at http://www.smsc.com. SMSC is a registered
trademark of Standard Microsystems Corporation (“SMSC”). Product names and company names are the trademarks of their respective holders.
SMSC DISCLAIMS AND EXCLUDES ANY AND ALL WARRANTIES, INCLUDING WITHOUT LIMITATION ANY AND ALL IMPLIED WARRANTIES OF MERCHANTABILITY,
FITNESS FOR A PARTICULAR PURPOSE, TITLE, AND AGAINST INFRINGEMENT AND THE LIKE, AND ANY AND ALL WARRANTIES ARISING FROM ANY COURSE
OF DEALING OR USAGE OF TRADE. IN NO EVENT SHALL SMSC BE LIABLE FOR ANY DIRECT, INCIDENTAL, INDIRECT, SPECIAL, PUNITIVE, OR CONSEQUENTIAL
DAMAGES; OR FOR LOST DATA, PROFITS, SAVINGS OR REVENUES OF ANY KIND; REGARDLESS OF THE FORM OF ACTION, WHETHER BASED ON CONTRACT;
TORT; NEGLIGENCE OF SMSC OR OTHERS; STRICT LIABILITY; BREACH OF WARRANTY; OR OTHERWISE; WHETHER OR NOT ANY REMEDY OF BUYER IS HELD
TO HAVE FAILED OF ITS ESSENTIAL PURPOSE, AND WHETHER OR NOT SMSC HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.
Conventions
Within this manual, the following abbreviations and symbols are used to improve readability.
Example Description
BIT Name of a single bit within a field
FIELD.BIT Name of a single bit (BIT) in FIELD
x…y Range from x to y, inclusive
BITS[m:n] Groups of bits from m to n, inclusive
PIN Pin Name
zzzzb Binary number (value zzzz)
0xzzz Hexadecimal number (value zzz)
zzh Hexadecimal number (value zz)
rsvd Reserved memory location. Must write 0, read value indeterminate
code Instruction code, or API function or parameter
Section Name Section or Document name
x Don’t care
<Parameter> <> indicate a Parameter is optional or is only used under some conditions
{,Parameter} Braces indicate Parameter(s) that repeat one or more times
[Parameter] Brackets indicate a nested Parameter. This Parameter is not real and actually decodes
into one or more real parameters.
2-Port USB 2.0 Hi-Speed Hub Controller
Datasheet
SMSC USB2412 3 Revision 1.3 (12-27-11)
DATASHEET
2-Port USB 2.0 Hi-Speed Hub Controller
Datasheet
Revision 1.3 (12-27-11) 4 SMSC USB2412
DATASHEET
Table of Contents
Chapter 1 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Chapter 2 Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.1 Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.2 28-Pin Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.3 Pin Descriptions (Grouped by Function). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.4 Buffer Type Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
2.5 Strap Option Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Chapter 3 Internal Default Configuration. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
3.1 Hub Configuration. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
3.2 Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
3.2.1 External Hardware RESET_N . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
3.2.2 USB Bus Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Chapter 4 DC Parameters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
4.1 Maximum Guaranteed Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
4.2 Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
4.2.1 Pin Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
4.2.2 Package Thermal Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Chapter 5 AC Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
5.1 Oscillator/Crystal. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
5.2 External Clock. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
5.2.1 USB 2.0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Chapter 6 Package Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
6.1 Tape and Reel Specification. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
2-Port USB 2.0 Hi-Speed Hub Controller
Datasheet
SMSC USB2412 5 Revision 1.3 (12-27-11)
DATASHEET
List of Figures
Figure 1.1 USB2412 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Figure 2.1 USB2412 28-Pin QFN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Figure 2.2 Non-Removable Pin Strap Example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 2.3 LED Pin Strap Example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 3.1 Reset_N Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 4.1 Supply Rise Time Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 5.1 Typical Crystal Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Figure 5.2 Formula to Find the Value of C1 and C2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Figure 6.1 USB2412 28-Pin QFN Package Outline (5x5 mm Body, 0.5 Pitch, 3.1 ePad). . . . . . . . . . . . 22
Figure 6.2 Recommended Printed Circuit Board (PCB) Land Pattern . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Figure 6.3 28-Pin Package Tape Dimensions and Part Orientation (mm) . . . . . . . . . . . . . . . . . . . . . . . 24
Figure 6.4 28-Pin Package Tape Length and Part Quantity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Figure 6.5 Package Reel Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
2-Port USB 2.0 Hi-Speed Hub Controller
Datasheet
Revision 1.3 (12-27-11) 6 SMSC USB2412
DATASHEET
List of Tables
Table 2.1 USB2412 28-Pin Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Table 2.2 USB2412 Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Table 2.3 Buffer Type Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Table 3.1 Reset_N Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Table 4.1 DC Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Table 4.2 Pin Capacitance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Table 4.3 28-Pin QFN Package Thermal Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Table 5.1 Crystal Circuit Legend . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Table 6.1 Package Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
2-Port USB 2.0 Hi-Speed Hub Controller
Datasheet
SMSC USB2412 7 Revision 1.3 (12-27-11)
DATASHEET
Chapter 1 Block Diagram
Figure 1.1 USB2412 Block Diagram
To Upstream
VBUS
3.3 V
Upstream
PHY
Upstream
USB Data
Repeater Controller
Serial
Interface
Engine
Port
Controller
Bus-
Power
Detect/
Vbus Pulse
PHY#1
Transaction
Translator
USB Data
Downstream
USB Data
Downstream
3.3 V
PLL
24 MHz
Crystal
Routing & Port Re-Ordering Logic
Regulator
CRFILT
Regulator
PHY#2
2-Port USB 2.0 Hi-Speed Hub Controller
Datasheet
Revision 1.3 (12-27-11) 8 SMSC USB2412
DATASHEET
Chapter 2 Pin Descriptions
This chapter is organized by a set of pin configurations followed by a corresponding pin list organized
by function according to their associated interface. A detailed description list of each signal (named in
the pin list) is organized by function in Table 2.2, “USB2412 Pin Descriptions,” on page 10. Refer to
Table 2.3, “Buffer Type Descriptions,” on page 12 for a list of buffer types.
The “N” symbol in the signal name indicates that the active, or asserted, state occurs when the signal
is at a low voltage level. When “N” is not present after the signal name, the signal is asserted when it
is at the high voltage level.
The terms assertion and negation are used exclusively. This is done to avoid confusion when working
with a mixture of “active low” and “active high” signals. The term assert, or assertion, indicates that a
signal is active, independent of whether that level is represented by a high or low voltage. The term
negate, or negation, indicates that a signal is inactive.
2.1 Pin Configuration
Figure 2.1 USB2412 28-Pin QFN
Ground Pad
(must be connected to VSS)
SMSC
USB2412
(Top View QFN-28)
XTALOUT 23
XTALIN/CLKIN 24
USBDP_UP 22
PLLFILT 25
RBIAS 26
USBDM_DN1 28
VDD33 27
NC
1
USBDP_DN1
2
USBDM_DN2
3
USBDP_DN2
4
VDD33
5
TEST 6
PRTPWR1 7
14 VDD33
13 NON_REM1
12
VDD33
11
OCS_N2
10
PRTPWR2
9CRFILT
8OCS_N1
21 USBDM_UP
20 VDD33
19 SUSP_IND/NON_REM0
18 VBUS_DET
17 RESET_N
16 HS_IND
15 TEST1
Indicates pins on the bottom of the device.
2-Port USB 2.0 Hi-Speed Hub Controller
Datasheet
SMSC USB2412 9 Revision 1.3 (12-27-11)
DATASHEET
2.2 28-Pin Table
Table 2.1 USB2412 28-Pin Table
UPSTREAM USB 2.0 INTERFACES (3 PINS)
USBDP_UP USBDM_UP VBUS_DET
DOWNSTREAM 2-PORT USB 2.0 INTERFACES (9 PINS)
USBDP_DN1 USBDM_DN1 USBDP_DN2 USBDM_DN2
PRT_PWR1 PRT_PWR2 OCS_N1 OCS_N2
RBIAS
MISC (7 PINS)
RESET_N TEST XTALIN / CLKIN XTALOUT
NON_REM1 SUSP_IND / NON_REM0 HS_IND
POWER, GROUND, AND NO CONNECTS (9 PINS)
(5) VDD33 CRFILT PLLFILT VSS
NC
TOTAL 28
2-Port USB 2.0 Hi-Speed Hub Controller
Datasheet
Revision 1.3 (12-27-11) 10 SMSC USB2412
DATASHEET
2.3 Pin Descriptions (Grouped by Function)
Table 2.2 USB2412 Pin Descriptions
PIN
# SYMBOL
BUFFER
TYPE DESCRIPTION
UPSTREAM USB 2.0 INTERFACES
21
22
USBDM_UP
USBDP_UP
IO-U USB Bus Data: connect to the upstream USB bus data signals (host,
port, or upstream hub).
18 VBUS_DET I/O12 Detect Upstream VBUS Power: detects the state of upstream VBUS
power. The SMSC hub monitors VBUS_DET to determine when to
assert the internal D+ pull-up resistor which signals a connect event.
When designing a detachable hub, this pin should be connected to
VBUS on the upstream port via a 2 to 1 voltage divider.
For self-powered applications with a permanently attached host, this
pin must be connected to a dedicated host control output, or
connected to 3.3 V domain that powers the host.‘
According to Section 7.2.1 of the USB 2.0 Specification 1., a
downstream port can never provide power to its D+ or D- pull-up
resistors unless the upstream port’s VBUS is in the asserted (powered)
state.
VBUS_DET monitors the state of the upstream VBUS signal and will
not pull-up the D+ resistor if VBUS is not active. If VBUS goes from
an active to an inactive state (Not Powered), the hub will remove
power from the D+ pull-up resistor within 10 seconds.
DOWNSTREAM USB 2.0 INTERFACES
1
3
28
2
USBDP_DN1
USBDP_DN2
USBDM_DN1
USBDM_DN2
IO-U Hi-Speed USB Data: connect to the downstream USB peripheral
devices attached to the hub’s ports.
7
11
PRTPWR1
PRTPWR2
I/O12 USB Power Enable: enables power to USB peripheral devices that are
downstream, where the hub supports active high power controllers
only.
8
12
OCS_N1
OCS_N2
IPU Over-Current Sense: input from external current monitor indicating an
over-current condition. This pin contains an internal pull-up to the 3.3 V
supply.
26 RBIAS I-R USB Transceiver Bias: a 12.0 kΩ (+/- 1%) resistor is attached from
ground to this pin to set the transceiver’s internal bias settings.
MISC
13 NON_REM1 I/O Non-removable Port Strap Option: this pin is sampled (in conjunction
with SUSP_IND/NON_REM0) at RESET_N negation to determine if
ports [2:1] contain permanently attached (non-removable) devices:
NON_REM[1:0] = 00: all ports are removable
NON_REM[1:0] = 01: port 1 is non-removable
NON_REM[1:0] = 10 and 11: ports 1 and 2 are non-removable
See Section 2.5, "Strap Option Pins" for details.
2-Port USB 2.0 Hi-Speed Hub Controller
Datasheet
SMSC USB2412 11 Revision 1.3 (12-27-11)
DATASHEET
19 SUSP_IND / I/O Active/Suspend Status LED (suspend indicator): indicates the USB
hub state. See Section 2.5, "Strap Option Pins" for details.
NON_REM0 = 0: SUSP_IND is active high
NON_REM0 = 1: SUSP_IND is active low
negated = unconfigured, or configured and in USB suspend
asserted = hub is configured and is active (i.e., not in suspend)
NON_REM0 Non-removable Port Strap Option: this pin is sampled (in conjunction
with NON_REM1) at RESET_N negation to determine if ports [2:1]
contain permanently attached (non-removable) devices:
NON_REM[1:0] = 00: all ports are removable
NON_REM[1:0] = 01: port 1 is non-removable
NON_REM[1:0] = 10 and 11: ports 1 and 2 are non-removable
See Section 2.5, "Strap Option Pins" for details.
16 HS_IND I/O12 Hi-Speed Upstream Port Indicator
Note: An LED can be attached for visual indication. See Section
2.5, "Strap Option Pins" for details. When an LED is not used,
this pin requires a 50 kΩ or higher resistor to ground.
negated = the hub is connected at FS
asserted = the hub is connected at HS
24 XTALIN ICLKx 24 MHz Crystal Input: this pin connects to either one terminal of the
crystal or to an external 24 MHz clock when a crystal is not used.
CLKIN External Clock Input: this pin connects to either one terminal of the
crystal or to an external 24 MHz clock when a crystal is not used.
23 XTALOUT OCLKx 24 MHz Crystal Output: this is the other terminal of the crystal circuit
with 1.2 V p-p output and a weak (< 1mA) driving strength. When an
external clock source is used to drive XTALIN/CLKIN, leave this pin
unconnected, or use with appropriate caution.
6 TEST IPD Treat as a no connect pin or connect to ground. No trace or signal
should be routed or attached to this pin.
17 RESET_N IS RESET Input: the system can reset the chip by driving this input low,
where the minimum active low pulse is 1 μs.
POWER, GROUND, and NO CONNECTS
9 CRFILT VDD Core Regulator Filter Capacitor: this pin can have up to 0.1 μF
low-ESR capacitor to VSS, or be left unconnected.
4
10
14
20
27
VDD33 3.3 V Power
25 PLLFILT PLL Regulator Filter Capacitor: this pin can have up to 0.1 μF low-ESR
capacitor to VSS, or be left unconnected.
15 TEST1 This pin must be connected to VSS.
Table 2.2 USB2412 Pin Descriptions (continued)
PIN
# SYMBOL
BUFFER
TYPE DESCRIPTION
2-Port USB 2.0 Hi-Speed Hub Controller
Datasheet
Revision 1.3 (12-27-11) 12 SMSC USB2412
DATASHEET
2.4 Buffer Type Descriptions
2.5 Strap Option Pins
The NON_REM[1:0] strap option pins can be enabled using the internal default configuration. The
driver type of each strap pin is I/O (no internal pull-up or pull-down for the input function). Figure 2.2
shows an example of Strap High and Strap Low configurations, where Strap High sets the strap option
to a 1 and Strap Low sets the strap option value to 0. To use an external LED indicator, the options
outlined in Figure 2.3 should be implemented.
Figure 2.2 Non-Removable Pin Strap Example
29 ePAD Ground Pad/ePad: this pin must be connected to VSS for the device
and must be tied to ground with multiple vias
5 NC No Connect: no signal or trace should be routed or attached to these
pins.
Table 2.3 Buffer Type Descriptions
BUFFER DESCRIPTION
I/O Input/Output
IPD Input with internal weak pull-down resistor
IPU Input with internal weak pull-up resistor
IS Input with Schmitt trigger
I/O12 Input/Output buffer with 12 mA sink and 12 mA source
ICLKx XTAL clock input
OCLKx XTAL clock output
I-R RBIAS
I/O-U Analog Input/Output defined in USB specification
Table 2.2 USB2412 Pin Descriptions (continued)
PIN
# SYMBOL
BUFFER
TYPE DESCRIPTION
HUB
Strap Pin Primary Function/
Strap High
+V
HUB
Strap Pin Primary Function/
Strap Low
GND
50 kΩ
50 kΩ
2-Port USB 2.0 Hi-Speed Hub Controller
Datasheet
SMSC USB2412 13 Revision 1.3 (12-27-11)
DATASHEET
Figure 2.3 LED Pin Strap Example
HUB
Strap Pin
LED/
Strap High
HUB
Strap Pin
LED/
Strap Low
50
kΩ
50
kΩ
2-Port USB 2.0 Hi-Speed Hub Controller
Datasheet
Revision 1.3 (12-27-11) 14 SMSC USB2412
DATASHEET
Chapter 3 Internal Default Configuration
SMSC’s USB 2.0 hub is fully compliant with the USB Specification1.. Refer to Chapter 10 (Hub
Specification) for general details regarding hub operation and functionality.
The hub provides one Transaction Translator (TT) that is shared by both downstream ports (defined
as Single-TT configuration). The TT contains 4 non-periodic buffers.
3.1 Hub Configuration
The USB2412 only supports internal defaults with the exception of the non-removable strap option
(using NON_REM[1:0]). The hub internal default settings are as follows:
Internal Default Configuration without over-rides
Strap options enabled
Self-powered operation enabled
Individual power switching
Individual over-current sensing
3.2 Reset
There are two different resets that the hub experiences. One is a hardware reset via RESET_N and
the second is a USB Bus Reset.
3.2.1 External Hardware RESET_N
A valid hardware reset is defined as assertion of RESET_N for a minimum of 1 μs after all power
supplies are within operating range. While reset is asserted, the hub (and its associated external
circuitry) consumes less than 500 μA of current from the upstream USB power source.
Assertion of RESET_N causes the following:
1. All downstream ports are disabled, and PRTPWR power to downstream devices is removed.
2. The PHYs are disabled, and the differential pairs will be in a high-impedance state.
3. All transactions immediately terminate; no states are saved.
4. All internal registers return to the default state (in most cases, 00h).
5. The external crystal oscillator is halted.
6. The PLL is halted.
7. The hub is “operational” 500 μs after RESET_N is negated.
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3.2.1.1 RESET_N
Figure 3.1 Reset_N Timing
Note: All power supplies must have reached the operating levels mandated in Chapter 4, DC
Parameters, prior to (or coincident with) the assertion of RESET_N.
3.2.2 USB Bus Reset
In response to the upstream port signaling a reset to the hub, the hub does the following:
1. Sets default address to 0.
2. Sets configuration to unconfigured.
3. Negates PRTPWR[2:1] to all downstream ports.
4. Clears all TT buffers.
5. Moves device from suspended to active (if suspended).
6. Complies with Section 11.10 of the USB 2.0 Specification for behavior after completion of the reset
sequence. The host then configures the hub and the hub’s downstream port devices in accordance
with the specification.
Note: The hub does not propagate the upstream USB reset to downstream devices.
Table 3.1 Reset_N Timing
NAME DESCRIPTION MIN TYP MAX UNITS
t1 RESET_N asserted 1 μsec
t2 Strap setup time 16.7 nsec
t3 Strap hold time 16.7 1400 nsec
t4 Hub outputs driven to inactive logic states 1.5 2 μsec
t5 USB attach (See Note) 100 msec
t6 Host acknowledges attach and signals USB reset 100 msec
t7 USB idle undefined msec
t8 Completion time for requests (with or without data
stage)
5 msec
t1
t4
t5 t6 t7 t8
Valid Driven by Hub if strap is an output
RESET_N
VSS
NON_REM[1:0]
VSS
Hardware
reset asserted
Read
NON_REM[1:0]
p
Outputs to
inactive levels
USB
Upstream
USB Reset
recovery Idle
Start completion
request response
t2
t3
Don’t Care Don’t Care
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Chapter 4 DC Parameters
4.1 Maximum Guaranteed Ratings
Note 4.1 Refer to JEDEC Specification J-STD-020D 5..
Note 4.2 Stresses above the specified parameters could cause permanent damage to the device.
This is a stress rating only and functional operation of the device at any condition above
those indicated in the operation sections of this specification is not implied.
Note 4.3 When powering this device from laboratory or system power supplies, it is important that
the absolute maximum ratings not be exceeded or device failure can result. Some power
supplies exhibit voltage spikes on their outputs when the AC power is switched on or off.
In addition, voltage transients on the AC power line may appear on the DC output. When
this possibility exists, it is suggested that a clamp circuit be used.
4.2 Operating Conditions
PARAMETER SYMBOL MIN MAX UNITS
Storage Temperature TSTOR -55 150 °C
Lead Temperature °C
3.3 V supply voltage VDD33
PLLFILT
CRFILT
4.6 V
Voltage on any I/O pin -0.5 5.5 V
Voltage on XTALIN -0.5 4.0 V
Voltage on XTALOUT -0.5 2.5 V
PARAMETER SYMBOL MIN MAX UNITS COMMENTS
Operating
Temperature
TA0 70 °C Ambient temperature in still air.
3.3 V supply voltage VDD33 3.0 3.6 V
3.3 V supply rise
time
tRT 0 400 μs See Figure 4.1
Voltage on any I/O
pin
-0.3 5.5 V If any 3.3 V supply voltage drops
below 3.0 V, then the MAX becomes:
(3.3 V supply voltage) + 0.5
Voltage on XTALIN -0.3 VDD33 V
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Figure 4.1 Supply Rise Time Model
Table 4.1 DC Electrical Characteristics
PARAMETER SYMBOL MIN TYP MAX UNITS COMMENTS
I, IS Type Input Buffer
Low Input Level
High Input Level
Input Leakage
Hysteresis (‘IS’ Only)
VILI
VIHI
IIL
VHYSI
2.0
-10
250
0.8
+10
350
V
V
μA
mV
TTL Levels
VIN = 0 to VDD33
Input Buffer with Pull-Up (IPU)
Low Input Level
High Input Level
Low Input Leakage
High Input Leakage
VILI
VIHI
IILL
IIHL
2.0
+35
-10
0.8
+90
+10
V
V
μA
μA
TTL Levels
VIN = 0
VIN = VDD33
Input Buffer with Pull-Down (IPD)
Low Input Level
High Input Level
Low Input Leakage
High Input Leakage
VILI
VIHI
IILL
IIHL
2.0
+10
-35
0.8
-10
-90
V
V
μA
μA
TTL Levels
VIN = 0
VIN = VDD33
ICLK Input Buffer
Low Input Level
High Input Level
Input Leakage
VILCK
VIHCK
IIL
1.4
-10
0.5
+10
V
V
μA
VIN = 0 to VDD33
t10%
10%
90%
Voltage tRT
t90% Time
100%
3.3 V
VSS
VDD33
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Note 4.4 Output leakage is measured with the current pins in high impedance.
Note 4.5 See USB 2.0 Specification 1. for USB DC electrical characteristics.
O12, I/O12 &I/OSD12 Type Buffer
Low Output Level
High Output Level
Output Leakage
Hysteresis (‘SD’ pad only)
VOL
VOH
IOL
VHYSC
2.4
-10
250
0.4
+10
350
V
V
μA
mV
IOL = 12 mA @ VDD33
= 3.3 V
IOH = -12 mA @ VDD33
= 3.3 V
VIN = 0 to VDD33
(Note 4.1)
Supply Current Unconfigured
Hi-Speed Host
ICCINTHS 40 45 mA
Supply Current Unconfigured
Full-Speed Host
ICCINTFS 35 40 mA
Supply Current Configured
Hi-Speed Host, 1 downstream port
IHCH1 60 65 mA
Supply Current Configured
Hi-Speed Host, each additional
downstream port
1 port
base
+
25 mA
1 port
base
+
25 mA
mA
Supply Current Configured
Full-Speed Host, 1 downstream port
IFCC1 45 50 mA There is no additional
current for additional
ports.
Supply Current Configured
Full-Speed Host, each additional
downstream port
1 port
base
+
8 mA
1 port
base
+
8 mA
mA
Supply Current Suspend ICSBY 475 1000 μA All supplies combined
Supply Current Reset ICRST 550 1100 μA All supplies combined
Table 4.1 DC Electrical Characteristics (continued)
PARAMETER SYMBOL MIN TYP MAX UNITS COMMENTS
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4.2.1 Pin Capacitance
4.2.2 Package Thermal Specifications
Thermal parameters are measured or estimated for devices with the exposed pad soldered to thermal
vias in a multilayer 2S2P PCB per JESD51. Thermal resistance is measured from the die to the
ambient air.
Table 4.2 Pin Capacitance
LIMITS
PARAMETER SYMBOL MIN TYP MAX UNIT TEST CONDITION
Clock Input
Capacitance
CXTAL 6 pF All pins except USB pins and the pins
under the test tied to AC ground.
Input Capacitance CIN 6 pF Capacitance TA = 25°C
fc = 1 MHz
VDD33 = 3.3 V
Output Capacitance COUT 6 pF The maximum capacitance values
include the full length of the pin pad. See
the Y dimension in Figure 6.2.
Table 4.3 28-Pin QFN Package Thermal Parameters
PARAMETER
VELOCITY
(meters/sec) SYMBOL VALUE UNIT
Thermal Resistance 0
ΘJA
40.3
°C/W
135.2
Junction-to-Top-of-Package 0
ΨJT
0.5
°C/W
10.6
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Chapter 5 AC Specifications
5.1 Oscillator/Crystal
Parallel Resonant, Fundamental Mode, 24 MHz ±350 ppm.
Figure 5.1 Typical Crystal Circuit
Table 5.1 Crystal Circuit Legend
Figure 5.2 Formula to Find the Value of C1 and C2
Note 5.1 C0 is usually included (subtracted by the crystal manufacturer) in the specification for CL
and should be set to 0 for use in the calculation of the capacitance formulas in Figure 5.2,
"Formula to Find the Value of C1 and C2". However, the PCB itself may present a parasitic
capacitance between XTALIN and XTALOUT. For an accurate calculation of C1 and C2,
take the parasitic capacitance between traces XTALIN and XTALOUT into account.
Note 5.2 Each of these capacitance values is typically approximately 18 pF.
SYMBOL DESCRIPTION IN ACCORDANCE WITH
C0Crystal shunt capacitance Crystal manufacturer’s specification (See Note 5.1)
CLCrystal load capacitance
CBTotal board or trace capacitance OEM board design
CSStray capacitance SMSC IC and OEM board design
CXTAL XTAL pin input capacitance SMSC IC
C1Load capacitors installed on OEM
board Calculated values based on Figure 5.2, "Formula to Find the
Value of C1 and C2" (See Note 5.2)
C2
C1
C2
CL1 M
Crystal
XTALOUT
(CS2 = CB2 + CXTAL2 )
XTALIN
(CS1 = CB1 + CXTAL1 )
C0
C1 = 2 x (CL C0) – CS1
C2 = 2 x (CL C0) – CS2
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5.2 External Clock
50% Duty cycle ±10%, 24 MHz ±350 ppm, Jitter <100 ps rms.
The external clock is recommended to conform to the signaling level designated in the JESD76-2
specification on 1.2 V CMOS Logic. XTALOUT should be treated as a no connect.
5.2.1 USB 2.0
The SMSC hub conforms to all voltage, power, and timing characteristics and specifications as set
forth in the USB 2.0 Specification 1. See the USB Specification for more information.
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Chapter 6 Package Outline
Figure 6.1 USB2412 28-Pin QFN Package Outline (5x5 mm Body, 0.5 Pitch, 3.1 ePad)
Notes:
1. All dimensions are in millimeters.
2. Position tolerance of each terminal and exposed pad is ±0.05 mm at maximum material condition. Instances of dimension “b”
apply to plated terminals and is measured between 0.15 and 0.33 mm from the terminal tip.
3. Details of terminal #1 identifier are optional. However, they must be located within the area indicated.
4. Coplanarity zone applies to exposed pad and terminals.
Table 6.1 Package Parameters
MIN NOMINAL MAX NOTE REMARKS
A 0.80 0.85 1.00 - Overall Package Height
A1 0 0.02 0.05 - Standoff
A2 0.60 - 0.80 - Mold Cap Thickness
D/E 4.90 5.00 5.10 - X/Y Overall Body Size
D1/E1 4.55 4.75 4.95 - X/Y Mold Cap Size
D2/E2 3.00 3.10 3.20 - X/Y Exposed Pad Size
L 0.30 0.40 0.50 - Terminal Length
b 0.18 0.25 0.30 2 Terminal Width
K 0.45 0.55 - - Terminal to ePad Clearance
e 0.50 BSC - Terminal Pitch
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Figure 6.2 Recommended Printed Circuit Board (PCB) Land Pattern
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6.1 Tape and Reel Specification
Figure 6.3 28-Pin Package Tape Dimensions and Part Orientation (mm)
Figure 6.4 28-Pin Package Tape Length and Part Quantity
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Figure 6.5 Package Reel Specifications
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Appendix A (Acronyms)
I2C®:Inter-Integrated Circuit1
OCS: Over-Current Sense
PCB: Printed Circuit Board
PHY: Physical Layer
PLL: Phase-Locked Loop
QFN: Quad Flat No Leads
RoHS: Restriction of Hazardous Substances Directive
SCL: Serial Clock
SIE: Serial Interface Engine
SMBus: System Management Bus
TT: Transaction Translator
1.I2C is a registered trademark of Philips Corporation.
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Appendix B References
1. Universal Serial Bus Specification, Version 2.0, April 27, 2000 (12/7/2000 and 5/28/2002 Errata)
USB Implementers Forum, Inc. http://www.usb.org
2. I2C-Bus Specification Version 1.1
NXP (formerly a division of Philips). http://www.nxp.com
3. System Management Bus Specification, version 1.0
SMBus. http://smbus.org/specs/
4. MicroChip 24AA02/24LC02B (Revision C)
Microchip Technology Inc. http://www.microchip.com/
5. JEDEC Specifications: JESD76-2 (June 2001) and J-STD-020D.1 (March 2008)
JEDEC Global Standards for the Microelectronics Industry.
http://www.jedec.org/standards-documents