VSLB9530S
www.vishay.com Vishay Semiconductors
Rev. 1.1, 03-Sep-13 2Document Number: 82564
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Fig. 1 - Power Dissipation Limit vs. Ambient Temperature Fig. 2 - Forward Current Limit vs. Ambient Temperature
ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified)
PARAMETER TEST CONDITION SYMBOL VALUE UNIT
Reverse voltage VR5V
Forward current IF150 mA
Peak forward current tp/T = 0.5, tp = 100 μs IFM 300 mA
Surge forward current tp = 100 μs IFSM 1.5 A
Power dissipation PV232.5 mW
Junction temperature Tj100 °C
Operating temperature range Tamb - 40 to + 95 °C
Storage temperature range Tstg - 40 to + 100 °C
Soldering temperature t ≤ 5 s, 1.5 mm from body preheat
temperature 100 °C/30 s Tsd 260 °C
Thermal resistance junction/ambient RthJA 200 K/W
0 102030405060708090100
Tamb - Ambient Temperature (°C)
P
V
- Power Dissipation (mW)
RthJA = 200 K/W
0
50
100
150
200
250
0 102030405060708090100
Tamb - Ambient Temperature (°C)
I
F
- Forward Current (mA)
RthJA = 200 K/W
0
160
140
120
100
80
60
40
20
BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
PARAMETER TEST CONDITION SYMBOL MIN. TYP. MAX. UNIT
Forward voltage
IF = 100 mA, tp = 20 ms VF1.05 1.28 1.5 V
IF = 150 mA, tp = 20 ms VF1.31 1.55 V
IF = 1.5 A, tp = 100 μs VF1.9 V
Temperature coefficient of VFIF = 150 mA TKVF - 0.89 mV/K
Reverse current VR = 5 V IR10 μA
Junction capacitance VR = 0 V, f = 1 MHz, E = 0 mW/cm2CJ86 pF
Radiant intensity IF = 150 mA, tp = 20 ms Ie40 60 95 mW/sr
IF = 1.5 A, tp = 100 μs Ie520 mW/sr
Radiant power IF = 100 mA, tp = 20 ms φe40 mW
Temperature coefficient of φeIF = 150 mA TKφe- 0.42 %/K
Angle of half intensity, vertical ϕv± 18 deg
Angle of half intensity, horizontal ϕh± 36 deg
Peak wavelength IF = 30 mA λp940 nm
Spectral bandwidth IF = 30 mA Δλ 25 nm
Temperature coefficient of λpIF = 30 mA TKλp0.25 nm/K
Rise time IF = 100 mA, 20 % to 80 % tr15 ns
Fall time IF = 100 mA, 20 % to 80 % tf15 ns
Cut-off frequency IDC = 70 mA, IAC = 30 mA pp fc24 MHz