AXK7L, 8L
1
NARROW PITCH (0.4mm) CONNECTORS F4
AKCT1B57E ’03.9
http://www.nais-e.com/
New
NARR OW PITCH
(0.4mm)
CONNECTORS F4
NARROW-PITCH
CONNECTORS
FOR PC BOARD-TO-FPC
CONNECTION
Socket Header
Example of connection between
a board and an FPC
0.9mm
PCB
F4 connector
FPC Reinforcing
plate (including
the FPC)
Before mating
After mating
FEATURES
1. The lowest profile class among two-
piece connectors in the world (Mated
height: 0.9mm)
Achieved both a 0.4-mm pitch and an ultra
low profile of 0.9 mm high when mated,
contributing to further thickness reduction
of products.
2. Ultra low profile, but high contact
reliability
Our own bellows-type double contact
structure provides a high resistance to
twisting and shock, ensuring a high
contact reliability.
3. Improved mating strength between
the socket and header
The simple locking structures provided f or
the retention fittings and the contact
points improve the mating strength and
provide tactile feedback when locked.
4. Easy to design product circuits
1) An insulating wall provided for the
bottom surf ace of the connector prev ents
contact between the pattern on the PC
board and the metal pins, enabling
pattern wiring under the connector, and
thus contributing to the reduction in size of
PC boards.
2) The usage shown below further
enhances the flexibility of connector
positioning.
[Example of application of connection
between a board and an FPC]
5. Standard use of Ni barrier plating
The use of Ni barrier plating, which is
highly resistant against solder creeping,
on the socket terminals is standard.
Double contact
Locking structure of the retention fittings
Socket Header
[Socket]
Pattern wiring under the
connector is possible.
[Header]
PCB
1.5
FPC
F4P4
0.9
PRODUCT TYPES
Notes) 1. Regarding ordering units: During production: Please make orders in 1-reel units.
Samples for mounting confirmation: Available in units of 50 pieces. Please consult us.
Samples: Available. Please consult us.
2. The standard type comes with no positioning bosses. Connectors with positioning bosses are available for on-demand production.
For this type of connector, 9th digit of the part no. changes from 2 to 1. e.g. 20 contacts for sockets: AXK7L20217*
3. Please consult us regarding a different number of contacts.
Mated height No. of contacts Part No. Packing
Socket Header Inner carton (1-reel) Outer carton
0.9 mm
20 AXK7L20227* AXK8L20125*
Asterisk at the last digit
of the part No.:
J: 3,000 pieces
V: 3,000 pieces
Asterisk at the last digit
of the part No.:
J: 6,000 pieces (2 reels)
V: 15,000 pieces (5 reels)
22 AXK7L22227* AXK8L22125*
30 AXK7L30227* AXK8L30125*
40 AXK7L40227* AXK8L40125*
50 AXK7L50227* AXK8L50125*
60 AXK7L60227* AXK8L60125*
70 AXK7L70227* AXK8L70125*
80 AXK7L80227* AXK8L80125*
NEW
AXK7L, 8L
2
SPECIFICATIONS
1. Characteristics
2. Material and surface treatment
Item Specifications Conditions
Electrical
characteristics
Rated current 0.3A/terminal (Max. 5 A at total terminals)
Rated voltage 60V AC/DC
Breakdown voltage 150V AC for 1 min. Rated voltage is applied for one minutes and check for short circuit or
damage with a detection current of 1mA
Insulation resistance Min. 1,000M
(Initial) Using 250V DC megger (applied for 1 min.)
Contact resistance Max. 90m
Measured based on the HP4338B measurement method of JIS C 5402
Environmental
characteristics
Ambient temperature –55
°
C to +85
°
C No freezing at low temperatures
Soldering heat resistance Max. peak temperature of 245
°
C Infrared reflow soldering
300
°
C within 5 sec, 350
°
C within 3 sec. Soldering iron
Storage temperature –55
°
C to +85
°
C (Product only)
–40
°
C to +50
°
C (Emboss packing) No freezing at low temperatures
Thermal shock resistance
(header and socket mated)
5 cycles,
insulation resistance min. 100M
,
contact resistance max. 90m
Sequence
1. -55
°
C, 30 min.
2. 25
°
C, Max.5 min.
3. 85
°
C, 30 min.
4. 25
°
C, Max.5 min.
Humidity resistance
(header and socket mated)
120 hours,
insulation resistance min. 100M
,
contact resistance max. 90m
Temperature 40
±
2
°
C,
humidity 90 to 95% R.H.
Saltwater spray resistance
(header and socket mated)
24 hours,
insulation resistance min. 100M
,
contact resistance max. 90m
Temperature 35
±
2
°
C,
saltwater concentration 5
±
1%
H
2
S resistance
(header and socket mated) 48 hours,
contact resistance max. 90m
Temperature 40
±
2
°
C,
gas concentration 3
±
1 ppm, humidity 75 to 80% R.H.
Lifetime
characteristics Insertion and removal life 50 times Repeated insertion and removal speed of max. 200 times/hours
Unit weight 40 contacts; Socket: 0.05g Header: 0.03g
Part name Material Surface treatment
Molded portion LCP resin (UL94V-0)
Contact/Post Copper alloy Contact portion: Au plating over Ni
Terminal portion: Au plating over Ni (Except for front edge of terminal)
Retention fitting portion: Sn plating over Ni (Socket: except for front edge of the terminal)
+0
–3
+10
–5
+3
–0
+10
–5
DIMENSIONS
• Socket (Mated height 0.9 mm)
5.00
0.87
5.00
0.40±0.05
0.15±0.03
Retention solder tab
A
C±0.15
B±0.1
Suction 0.80
0.08
(Contact and
retention fitting)
This surface
C 0.15
Terminal coplanarity
0.40±0.05
4.40
0.10±0.03
Dimension table (mm)
Dimensions
No. of
contacts
A B C D
20 6.4 3.6 5.0 6.4
22 6.8 4.0 5.4 6.8
30 8.4 5.6 7.0 8.4
40 10.4 7.6 9.0 10.4
50 12.4 9.6 11.0 12.4
60 14.4 11.6 13.0 14.4
70 16.4 13.6 15.0 16.4
80 18.4 15.6 17.0 18.4
mm General tolerance:
±
0.2
• Header (Mated height: 0.9 mm)
3.36
4.10
R0.15
0.63
(Post and
retention fitting)
Terminal coplanarity
0.08
0.08±0.03
0.40±0.05
R0.15
B
Retention solder tab
0.15±0.03
Suction 2.30
A
C±0.1
1.20±0.05
Dimension table (mm)
Dimensions
No. of
contacts
A B C D
20 6.0 5.74 3.6 6.4
22 6.4 6.14 4.0 6.8
30 8.0 7.74 5.6 8.4
40 10.0 9.74 7.6 10.4
50 12.0 11.74 9.6 12.4
60 14.0 13.74 11.6 14.4
70 16.0 15.74 13.6 16.4
80 18.0 17.74 15.6 18.4
AXK7L, 8L
3
• Socket and header are mated
Header
0.90±0.15
Socket
EMBOSSED TAPE AND REEL DIMENSIONS CHART
1. Socket
• Tape dimensions
1) A dimensions: 24mm 2) A dimensions: 32mm 2) A dimensions: 16mm
1.5 dia.
+0.1
0
(A±0.3)(C)
8.0
(4.0)
(2.0)
(1.75)
Pull-out direction
1.5 dia.
+0.1
0
(4.0)
8.0 (2.0)
(B) (C)
(A±0.3)
(1.75)
Narrow pitch connector
165° to 180°
Top cover tape
Emboss carrier tape
Narrow pitch connector
165° to 180°
1.5 dia.
+0.1
0
(A±0.3)
(4.0)
8.0 (2.0)
(C)
(1.75) Top cover tape
Pull-out direction
Emboss carrier tape
Dimension table (mm)
Dimensions
No. of
contacts
A B C D
Max.24 16.0 7.5 16.4
26 to 70 24.0 11.5 24.4
80 32.0 28.4 14.2 32.4
2. Header
• Tape dimensions
1) A dimensions: 24mm 2) A dimensions: 32mm 2) A dimensions: 16mm
Pull-out direction
(4.0)
8.0
1.5 dia.
+0.1
0
(2.0)
(C)
(1.75)
(A±0.3)
1.5 dia.
+0.1
0
8.0
(4.0)
(2.0)
(1.75)
(C)
(B)
165° to 180°
Top cover tape
Emboss carrier tape
Narrow pitch connector
(A±0.3)
(C) (1.75)
(4.0)
(2.0)
8.0
165° to 180°
Pull-out direction
Emboss carrier tape
Narrow pitch connector
1.5 dia.
+0.1
0
(A±0.3) Top cover tape
Dimension table (mm)
Dimensions
No. of
contacts
A B C D
Max.24 16.0 7.5 16.4
26 to 70 24.0 11.5 24.4
80 32.0 28.4 14.2 32.4
• Reel dimensions
Label
Taping reel
(D+2
0)
Cavity
370 dia.
Emboss carrier tape
Top cover tape
AXK7L, 8L
4
AKCT1B57E 200309-3YT
Please contact ..........
Specifications are subject to change without notice. Printed in Japan.
Automation Controls Company
KHead Office: 1048, Kadoma, Kadoma-shi, Osaka 571-8686, Japan
KTelephone: Japan (81) Osaka (06) 6908-1050
KFacsimile: Japan (81) Osaka (06) 6908-5781
http://www.nais-e.com/
COPYRIGHT © 2003 All Rights Reserved
Matsushita Electric W orks, Ltd.
These materials are printed on ECF pulp.
These materials are printed with earth-friendly vegetable-based (soybean oil) ink.
NOTES
1. Removal by pulling up from an end
causes the entire connector removal
force to concentrate on the retention
fittings and end terminals. Therefore,
please lift and remove from the side.
Doing so will also prevent cracking of
the soldered parts.
2. PC Boards and Recommended Metal
Mask Patterns
Connectors are mounted with high
density, with a pitch interval of 0.4 to 0.5
mm. It is therefore necessary to make
sure that the right levels of solder are
used, in order to reduce solder bridge and
other issues. The figures to the right are
recommended metal mask patterns.
Please use them as a reference.
• Socket
Recommended PC board pattern
(Mount pad arrangement pattern)
Recommended metal mask pattern
Metal mask thickness: 150
µ
m
(Terminal portion opening area ratio: 53%)
(Metal por tion opening area ratio: 100%)
Recommended metal mask pattern
Metal mask thickness: 120
µ
m
(Terminal portion opening area ratio: 66%)
(Metal por tion opening area ratio: 100%)
• Header
Recommended PC board pattern
(Mount pad arrangement pattern)
Relation between connector and mounting pad
Recommended metal mask pattern
Metal mask thickness: 150
µ
m
(Terminal portion opening area ratio: 52%)
(Metal por tion opening area ratio: 40%)
Recommended metal mask pattern
Metal mask thickness: 120
µ
m
(Terminal portion opening area ratio: 66%)
(Metal por tion opening area ratio: 51%)
In particular , if a lot of solder is used in
the header retaining retention fittings,
it might interfere with and cause
incomplete socket mating. Therefore,
please follow the recommended
conditions given on the left.
Pull
Pull
NG
D±0.05
3.60±0.03
B±0.05
4.00±0.03
0.23±0.03
5.60±0.03
1.00±0.03
0.40±0.03
C 0.40
0.40±0.01
0.20±0.01
5.40±0.01
4.42±0.01 (0.49)
(1.00)
C 0.40
1.00±0.01
3.60±0.01
1.40±0.01
5.60±0.01
5.40±0.01
0.20±0.01
0.40±0.01
4.18±0.01 (0.61)
1.00±0.01
3.60±0.01
(1.00)
1.40±0.01
5.60±0.01
C 0.40
0.23±0.03
0.40±0.03
4.70±0.03
3.20±0.03
D±0.05
C±0.05
Max. 2.20
0.57±0.03
1.40±0.03
: Through hole without
insulation is prohibited.
(4.70±0.03)
(3.20±0.03)
(Max. 2.20) Mounting pad
: Through hole without
insulation is prohibited.
0.20±0.01
0.40±0.01
3.60±0.01
(0.45)
4.50±0.01
1.30±0.01
0.25±0.01
1.30±0.01
0.40±0.01
0.20±0.01
3.36±0.01
(0.57)
4.50±0.01
1.30±0.01
1.30±0.01
0.31±0.01