AXK7L, 8L
4
AKCT1B57E 200309-3YT
Please contact ..........
Specifications are subject to change without notice. Printed in Japan.
Automation Controls Company
KHead Office: 1048, Kadoma, Kadoma-shi, Osaka 571-8686, Japan
KTelephone: Japan (81) Osaka (06) 6908-1050
KFacsimile: Japan (81) Osaka (06) 6908-5781
http://www.nais-e.com/
COPYRIGHT © 2003 All Rights Reserved
Matsushita Electric W orks, Ltd.
These materials are printed on ECF pulp.
These materials are printed with earth-friendly vegetable-based (soybean oil) ink.
NOTES
1. Removal by pulling up from an end
causes the entire connector removal
force to concentrate on the retention
fittings and end terminals. Therefore,
please lift and remove from the side.
Doing so will also prevent cracking of
the soldered parts.
2. PC Boards and Recommended Metal
Mask Patterns
Connectors are mounted with high
density, with a pitch interval of 0.4 to 0.5
mm. It is therefore necessary to make
sure that the right levels of solder are
used, in order to reduce solder bridge and
other issues. The figures to the right are
recommended metal mask patterns.
Please use them as a reference.
• Socket
Recommended PC board pattern
(Mount pad arrangement pattern)
Recommended metal mask pattern
Metal mask thickness: 150
µ
m
(Terminal portion opening area ratio: 53%)
(Metal por tion opening area ratio: 100%)
Recommended metal mask pattern
Metal mask thickness: 120
µ
m
(Terminal portion opening area ratio: 66%)
(Metal por tion opening area ratio: 100%)
• Header
Recommended PC board pattern
(Mount pad arrangement pattern)
Relation between connector and mounting pad
Recommended metal mask pattern
Metal mask thickness: 150
µ
m
(Terminal portion opening area ratio: 52%)
(Metal por tion opening area ratio: 40%)
Recommended metal mask pattern
Metal mask thickness: 120
µ
m
(Terminal portion opening area ratio: 66%)
(Metal por tion opening area ratio: 51%)
In particular , if a lot of solder is used in
the header retaining retention fittings,
it might interfere with and cause
incomplete socket mating. Therefore,
please follow the recommended
conditions given on the left.
Pull
Pull
NG
D±0.05
3.60±0.03
B±0.05
4.00±0.03
0.23±0.03
5.60±0.03
1.00±0.03
0.40±0.03
C 0.40
0.40±0.01
0.20±0.01
5.40±0.01
4.42±0.01 (0.49)
(1.00)
C 0.40
1.00±0.01
3.60±0.01
1.40±0.01
5.60±0.01
5.40±0.01
0.20±0.01
0.40±0.01
4.18±0.01 (0.61)
1.00±0.01
3.60±0.01
(1.00)
1.40±0.01
5.60±0.01
C 0.40
0.23±0.03
0.40±0.03
4.70±0.03
3.20±0.03
D±0.05
C±0.05
Max. 2.20
0.57±0.03
1.40±0.03
: Through hole without
insulation is prohibited.