Document Number: 28758 For technical questions, contact: filmresistors.thinfilmchip@vishay.com www.vishay.com
Revision: 30-Sep-08 1
TNPW e3
Vishay
High Stability Thin Film Flat Chip Resistor
≤ 0.05 % (1000 h rated power at 70 °C)
TNPW e3 Precision Thin Film Flat Chip Resistors are the
perfect choice for most fields of modern electronics where
highest reliability and stability is of major concern. Typical
applications include automotive, telecommunication,
industrial, medical equipment, precision test and measuring
equipment.
FEATURES
•Superior moisture resistivity ≤ 0.25 % (85 °C;
56 days; 85 % RH)
•Lead (Pb)-free solder contacts, RoHS compliant
•AEC-Q200 compliant (sizes 0402 to 1206)
•Low temperature coefficient and tight tolerances
(± 0.1 %; ± 10 ppm/K)
•Waste gas resistant
APPLICATIONS
•Test and measuring equipment
•Telecommunication
•Medical equipment
•Industrial equipment
•Instrumentation
•Automotive
Notes
(1) Size not specified in EN 140401-801
(2) Rated voltage . The power dissipation on the resistor generates a temperature rise against the local ambient, depending on the heat
flow support of the printed-circuit board (thermal resistance). Using advanced temperature level may require special considerations towards
the choice of circuit board and solder material. The rated dissipation applies only if the permitted film temperature is not exceeded.
(3) Measuring conditions in accordance with EN 140401-801
• TNPW 0402 without marking
RoHS
COMPLIANT
STANDARD ELECTRICAL SPECIFICATIONS
DESCRIPTION TNPW0402 TNPW0603 TNPW0805 TNPW1206 TNPW1210 (1) TNPW2010 TNPW2512 (1)
Metric size RR 1005M RR 1608M RR 2012M RR 3216M RR 3225M RR 5025M RR 6332M
Resistance range 10 Ω to 100 kΩ10 Ω to 332 kΩ10 Ω to 1 MΩ10 Ω to 2 MΩ10 Ω to 3.01 MΩ10 Ω to 4.99 MΩ10 Ω to 8.87 MΩ
Resistance tolerance ± 1 %; ± 0.5 %; ± 0.1 %
Temperature
coefficent ± 50 ppm/K; ± 25 ppm/K; ± 15 ppm/K; ± 10 ppm/K ± 50 ppm/K; ± 25 ppm/K
Climatic category
(LCT/UCT/days) 55/125/56 55/125/56 55/125/56 55/125/56 55/125/56 55/125/56 55/125/56
Rated dissipation,
P70 (2) 0.063 W 0.1 W 0.125 W 0.25 W 0.33 W 0.4 W 0.5 W
Operating voltage,
Umax. AC/DC 50 V 75 V 150 V 200 V 200 V 300 V 300 V
Maximum permissible
film temperature 155 °C 155 °C 155 °C 155 °C 155 °C 155 °C 155 °C
Thermal resistance (3) 870 K/W 550 K/W 440 K/W 220 K/W 170 K/W 140 K/W 110 K/W
Max. resistance
change at P70; ΔR/R10 Ω to 100 kΩ10 Ω to 332 kΩ10 Ω to 1 MΩ10 Ω to 2 MΩ10 Ω to 3.01 MΩ10 Ω to 4.99 MΩ10 Ω to 8.87 MΩ
1000 h ≤ 0.05 % ≤ 0.05 % ≤ 0.05 % ≤ 0.05 % ≤ 0.05 % ≤ 0.05 % ≤ 0.05 %
8000 h ≤ 0.10 % ≤ 0.10 % ≤ 0.10 % ≤ 0.10 % ≤ 0.10 % ≤ 0.10 % ≤ 0.10 %
225 000 h ≤ 0.30 % ≤ 0.30 % ≤ 0.30 % ≤ 0.30 % ≤ 0.30 % ≤ 0.30 % ≤ 0.30 %
Insulation voltage:
Uins 1 min 75 V 100 V 200 V 300 V 300 V 300 V 300 V
Continuous 75 V 75 V 75 V 75 V 75 V 75 V 75 V
FITobserved ≤ 0.1 x 10-9/h ≤ 0.1 x 10-9/h ≤ 0.1 x 10-9/h ≤ 0.1 x 10-9/h ≤ 0.1 x 10-9/h ≤ 0.1 x 10-9/h ≤ 0.1 x 10-9/h
Weight/1000 pieces 0.65 g 2 g 5.5 g 10 g 16 g 28 g 39 g
P x R
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2Revision: 30-Sep-08
TNPW e3
Vishay High Stability Thin Film Flat Chip Resistor
≤ 0.05 % (1000 h rated power at 70 °C)
DIMENSIONS
SIZE DIMENSIONS
in millimeters
INCH METRIC L W H T1 T2
0402
1005
1.0 ± 0.05 0.5 ± 0.05 0.35 ± 0.05 0.2 ± 0.10
0603 1608 1.6 ± 0.10 0.85 ± 0.10 0.45 ± 0.10 0.3 ± 0.20
0805 2012
2.0 ± 0.15 1.25 ± 0.15 0.45 ± 0.10 0.4 ± 0.20
1206 3216
3.2 ± 0.15 1.6 ± 0.15 0.55 ± 0.10 0.5 ± 0.25
1210 3225
3.2 ± 0.15 2.45 ± 0.15 0.60 ± 0.15 0.5 ± 0.25
2010 5025
5.0 ± 0.15 2.5 ± 0.15 0.60 ± 0.15 0.6 ± 0.25
2512 6332
6.3 ± 0.20 3.1 ± 0.15 0.60 ± 0.15 0.6 ± 0.25
SOLDER PAD DIMENSIONS
in millimeters
SIZE REFLOW SOLDERING WAVE SOLDERING
INCH METRIC a b l a b l
0402
1005
0.4 0.6
0.5 - - -
0603 1608 0.5 0.9
1.0
0.9
0.9
1.0
0805 2012
0.7 1.3 1.2 0.9 1.3 1.3
1206 3216
0.9 1.7
2.0 1.1
1.7 2.3
1210 3225
0.9
2.5 2.0 1.1 2.5 2.3
2010 5025
1.0
2.5 3.9 1.2 2.5 3.9
2512 6332
1.0
3.2 5.2 1.2 3.2 5.2
TEMPERATURE COEFFICIENT AND RESISTANCE RANGE
TYPE TCR TOLERANCE RESISTANCE VALUE E-SERIES
TNPW0402
± 50 ppm/K
± 1 % 10R to 100K 24 to 96
± 0.5 % 10R to 100K 24 to 192
± 0.1 % 47R to 100K
± 25 ppm/K
± 1 % 10R to 100K 24 to 96
± 0.5 % 10R to 100K
24 to 192
± 0.1 %
47R to 100K± 15 ppm/K ± 0.1 %
± 10 ppm/K ± 0.1 %
TNPW0603
± 50 ppm/K
± 1 % 10R to 332K 24 to 96
± 0.5 % 10R to 332K 24 to 192
± 0.1 %
± 25 ppm/K
± 1 % 10R to 332K 24 to 96
± 0.5 % 10R to 332K
24 to 192
± 0.1 %
± 15 ppm/K ± 0.1 % 47R to 332K
± 10 ppm/K ± 0.1 %
TNPW0805
± 50 ppm/K
± 1 % 10R to 1M0 24 to 96
± 0.5 % 10R to 1M0 24 to 192
± 0.1 %
± 25 ppm/K
± 1 % 10R to 1M0 24 to 96
± 0.5 % 10R to 1M0
24 to 192
± 0.1 %
± 15 ppm/K ± 0.1 % 47R to 1M0
± 10 ppm/K ± 0.1 %
TNPW1206
± 50 ppm/K
± 1 % 10R to 2M0 24 to 96
± 0.5 % 10R to 2M0 24 to 192
± 0.1 %
± 25 ppm/K
± 1 % 10R to 2M0 24 to 96
± 0.5 % 10R to 2M0
24 to 192
± 0.1 %
± 15 ppm/K ± 0.1 % 47R to 2M0
± 10 ppm/K ± 0.1 %
Document Number: 28758 For technical questions, contact: filmresistors.thinfilmchip@vishay.com www.vishay.com
Revision: 30-Sep-08 3
TNPW e3
High Stability Thin Film Flat Chip Resistor
≤ 0.05 % (1000 h rated power at 70 °C) Vishay
Note
(1) Please refer to PACKAGING table
TNPW1210
± 50 ppm/K
± 1 % 10R to 3M01 24 to 96
± 0.5 % 10R to 3M01 24 to 192
± 0.1 % 47R to 2M13
± 25 ppm/K
± 1 % 10R to 3M01 24 to 96
± 0.5 % 10R to 3M01
24 to 192
± 0.1 %
47R to 2M13± 15 ppm/K ± 0.1 %
± 10 ppm/K ± 0.1 %
TNPW2010
± 50 ppm/K
± 1 % 10R to 4M99 24 to 96
± 0.5 % 10R to 4M99 24 to 192
± 0.1 % 47R to 1M0
± 25 ppm/K
± 1 % 10R to 4M99 24 to 96
± 0.5 % 10R to 4M99 24 to 192
± 0.1 % 47R to 1M0
TNPW2512
± 50 ppm/K
± 1 % 10R to 8M87 24 to 96
± 0.5 % 10R to 8M87 24 to 192
± 0.1 % 47R to 1M0
± 25 ppm/K
± 1 % 10R to 8M87 24 to 96
± 0.5 % 10R to 8M87 24 to 192
± 0.1 % 47R to 1M0
TEMPERATURE COEFFICIENT AND RESISTANCE RANGE
TYPE TCR TOLERANCE RESISTANCE VALUE E-SERIES
PART NUMBER AND PRODUCT DESCRIPTION
Products can be ordered using either the Product Description or the Part Number.
For ordering TNPW with SnPb contacts please refer to latest edition of data sheet TNPW lead bearing.
PART NUMBER: (LEAD (Pb)-FREE) TNPW12061K32DEEA
MODEL VALUE TOLERANCE TCR PA CK A G I NG (1) SPECIAL
TNPW0402
TNPW0603
TNPW0805
TNPW1206
TNPW1210
TNPW2010
TNPW2512
R = Decimal
K = Thousand
M = Million
(4 digits)
B = ± 0.1 %
D = ± 0.5 %
F = ± 1.0 %
H = ± 50 ppm/K
E = ± 25 ppm/K
X = ± 15 ppm/K
Y = ± 10 ppm/K
EA
EC
ED
EF
EG
EN
EY
Up to 2 digits
Blank = Standard
PRODUCT DESCRIPTION: TNPW1206 1K32 0.5 % T-9 ET1 e3
TNPW1206 1K32 0.5 % T-9 ET1 e3
MODEL RESISTANCE
VALUE TOLERANCE TCR PACKAGING (1) LEAD (Pb)-FREE
TNPW0402
TNPW0603
TNPW0805
TNPW1206
TNPW1210
TNPW2010
TNPW2512
Examples:
54R1 = 54.1 Ω
1K32 = 1320 Ω
± 0.1 %
± 0.5 %
± 1.0 %
T- 2 = ± 50 ppm/K
T- 9 = ± 25 ppm/K
T-1 0 = ± 15 ppm/K
T-1 3 = ± 10 ppm/K
ET1
ET6
ET7
E02
E67
E52
E75
e3 = Pure Tin
Termination Finish
TW120PN 61K32DEEA
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4Revision: 30-Sep-08
TNPW e3
Vishay High Stability Thin Film Flat Chip Resistor
≤ 0.05 % (1000 h rated power at 70 °C)
Note
(1) E52/EN only for precision resistors with tolerance ± 0.1 % and temperature coefficient ≤ ± 25 ppm/K
DESCRIPTION
Production is strictly controlled and follows an extensive
set of instructions established for reproducibility. A
homogeneous film of metal alloy is deposited on a high grade
AI2O3 ceramic substrate and conditioned to achieve the
desired temperature coefficient. Specially designed inner
contacts are deposited on both sides. A special laser is used
to achieve the target value by smoothly fine trimming the
resistive layer without damaging the ceramics. A further
conditioning is applied in order to stabilize the trimming
result. The resistor elements are covered by a protective
coating designed for electrical, mechanical and climatic
protection. The terminations receive a final pure tin on nickel
plating. The result of the determined production is verified by
an extensive testing procedure on 100 % of the individual
chip resistors. This includes pulse load screening for the
elimination of products with a potential risk of early life
failures according to EN 140401-801, 2.1.2.2. Only accepted
products are laid directly into the tape in accordance with EN
60286-3.
ASSEMBLY
The resistors are suitable for processing on automatic SMD
assembly systems. They are suitable for automatic soldering
using wave, reflow or vapour phase as shown in
IEC 61760-1. Excellent solderability is proven, even after
extended storage in excess of 10 years. The encapsulation
is resistant to all cleaning solvents commonly used in the
electronics industry, including alcohols, esters and aqueous
solutions. The suitability of conformal coatings, if applied,
shall be qualified by appropriate means to ensure the
long-term stability of the whole system. The resistors are
RoHS compliant, the puretin plating provides compatibility
with lead (Pb)-free and lead-containing soldering processes.
The immunity of the plating against tin whisker growth has
been proven under extensive testing.
All products comply with the GADSL (2) and the
CEFIC-EECA-EICTA (3) list of legal restrictions on
hazardous substances. This includes full compliance with
the following directives:
• 2000/53/EC End of Vehicle life Directive (ELV) and
Annex II (ELV II)
• 2002/95/EC Restriction of the use of Hazardous
Substances Directive (RoHS)
• 2002/96/EC Waste Electrical and Electronic Equipment
Directive (WEEE)
Solderability is specified for 2 years after production or
re-qualification. The permitted storage time is 20 years.
Notes
(2) Global Automotive Declarable Substance List, see www.gadsl.org
(3) CEFIC (European Chemical Industry Council), EECA (European Electronic Component Manufacturers Association), EICTA (European trade
organisation representing the information and communications technology and consumer electronics), see www.eicta.org → issue →
environment policy → chemicals → chemicals for electronics
PACKAGING
MODEL TAPE WIDTH
[mm]
PITCH
[mm]
REEL DIAMETER
[mm/inch]
PIECES PER
REEL
PACKAGING
CODE FOR
PRODUCT
DESCRIPTION
PACKAGING
CODE FOR PART
NUMBER
TYPE OF
CARRIER TAPE
TNPW0402 8 2 180/7 10 000 ET7 ED Paper
TNPW0603
TNPW0805
TNPW1206
TNPW1210
8 4 180/7 1000 E52 (1) EN (1) Paper
TNPW0603
TNPW0805
TNPW1206
TNPW1210
8 4 180/7 5000 ET1 EA Paper
TNPW0603
TNPW0805
TNPW1206
TNPW1210
8 4 330/13 20 000 ET6 EC Paper
TNPW2010 12 4 180/7 1000 E75 EY Blister
4000 E02 EF Blister
TNPW2512 12 4 180/7 1000 E75 EY Blister
2000 E67 EG Blister
Document Number: 28758 For technical questions, contact: filmresistors.thinfilmchip@vishay.com www.vishay.com
Revision: 30-Sep-08 5
TNPW e3
High Stability Thin Film Flat Chip Resistor
≤ 0.05 % (1000 h rated power at 70 °C) Vishay
FUNCTIONAL PERFORMANCE
* Typical figures. HF-characteristic also depends on termination and circuit design.
120
110
100
90
80
70
60 10 100 1K 10K 100K
Non-Linearity
Non-Linearity A
3
in dB
Resistance Value in Ω
TNPW0603
TNPW1206
TNPW0402
TNPW0805
3
2
1
100 1K 10K 100K 1M
Current Noise
Current Noise in
µV/V
Resistance Value in Ω
TNPW0402
TNPW0805
0.5
0.3
0.1
0.01
0.03
0.05
TNPW0603
TNPW1206
60
40
20
0
- 40
- 60
-801 5 10 50 100
Frequency f in MHz
HF Performance*
Phase Angle in
ϑ°
TNPW0603
10 Ω
100 Ω
1 k Ω
4.75 k Ω
10 k Ω
500 1000
60
40
20
0
- 20
- 40
- 60
-80
TNPW0603
HF Performance*
1510 50 100 500 1000
Frequency f in MHz
[Z]-RO in %
RO
10 Ω
100 Ω
1 k Ω
4.75 k Ω
10 k Ω
60
40
20
0
- 20
- 40
- 60
-80
Phase Angle in ϑ°
1 5 10 50 100 Frequency f in MHz
HF Performance*
TNPW0805
10 Ω
100 Ω
1 k Ω
10 k Ω
500 1000
60
40
20
0
- 20
- 40
- 60
-80
[Z]-RO in %
RO
HF Performance*
1510 50 100 500 1000
Frequency f in MHz
TNPW0805
10 Ω
100 Ω
1 k Ω
10 k Ω
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6Revision: 30-Sep-08
TNPW e3
Vishay High Stability Thin Film Flat Chip Resistor
≤ 0.05 % (1000 h rated power at 70 °C)
90
80
70
60
50
40
30
20
10
0
Temperature Rise
0 0.1 0.2 0.3 0.4 0.5
Power in W
Temperature Rise in K
0.6 0.7
0402 0603 0805 1206 1210 2010 2512
Derating
120
100
80
60
40
20
0
- 55 - 25 0 25 50 75 100 125 150 175
Ambient Temperature in °C
Rated Power in %
70
EN
3K
1K
100
10 10R 100R 1K 10K 100K
Test Voltage in V
TNPW0805
TNPW0603
Single-Pulse High Voltage Overload
Test 1.2/50 µs EN140000 4.27
Resistance Value
in Ω
3K
1K
100
10
10R 100R 1K 10K 100K
Single-Pulse High Voltage Overload
Test 10/700 µs EN140000 4.27
Resistance Value
in Ω
Test Voltage in V
TNPW0805
TNPW0603
100 W
10 W
1W
0.1 W
10 µs
Pulse Duration
t
i
Permissible pulse power
P
i, max.
100 µs 1 ms 10 ms 100 ms 1 s 10 s
Maximum pulse load
P
i, max.
for single pulses
TNPW1206
TNPW0805
TNPW0603
Conditions:
P
0, n ≤ 1000 and
U
i≤
U
i, max.
100 W
10 W
1W
0.1 W
10 µs
Permissible pulse power
P
i, max.
100 µs 1 ms 10 ms 100 ms 1 s 10 s
Pulse Duration
t
i
TNPW1206
TNPW0805
TNPW0603
Conditions:
P
max.≤
P
max. (including derating)
and
U
i≤
U
i, max.
Maximum pulse load
P
i, max.
for continuous pulses
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Revision: 30-Sep-08 7
TNPW e3
High Stability Thin Film Flat Chip Resistor
≤ 0.05 % (1000 h rated power at 70 °C) Vishay
TEST AND REQUIREMENTS
All tests are carried out in accordance with the following
specifications:
EN 60115-1, Generic specification (includes tests)
EN 140400, Sectional specification (includes schedule for
qualification approval)
EN 140401-801, Detail specification (includes schedule for
conformance inspection)
The following table contains only the most important tests.
For the full test schedule refer to the documents listed above.
The testing also covers most of the requirements specified
by EIA/IS-703 and JIS-C-5202. The tests are carried out in
accordance with IEC 60068 and under standard atmospheric
conditions in accordance with IEC 60068-1, 5.3. Climatic
category LCT/UCT/56 (rated temperature range: Lower
Category Temperature, Upper Category Temperature; damp
heat, long term, 56 days) is valid. Unless otherwise specified
the following values apply:
Temperature: 15 °C to 35 °C
Relative humidity: 45 % to 75 %
Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar).
The components are mounted for testing on boards in
accordance with EN 60115-1, 4.31 unless otherwise
specified. The parameters stated in the Test Procedures and
Requirements table are based on the required tests and
permitted limits of EN 140401-801. However, some
additional tests and a number of improvements against those
minimum requirements have been included.
10 000 V
1000 V
100 V
10 V
10 µs
Pulse Duration
t
i
Permissible pulse voltage
U
i, max.
100 µs 1 ms 10 ms 100 ms 1 s 10 s
TNPW1206
TNPW0805
TNPW0603
Conditions:
P
i≤
P
i, max.
Maximum pulse voltage
U
i, max.
TEST PROCEDURES AND REQUIREMENTS
EN 60115-1
CLAUSE
IEC 60068-2
TEST METHOD TEST PROCEDURE REQUIREMENTS
PERMISSIBLE CHANGE
Stability for product types:
TNPW0402
TNPW0603
TNPW0805
TNPW1206
TNPW1210
TNPW2010
TNPW2512
4.5 - Resistance ± 1 %; ± 0.5 %; ± 0.1 %
4.8.4.2 - Temperature
coefficient
At 20/- 55/20 °C ± and
20/125/20 °C ± 50 ppm/K; ± 25 ppm/K; ± 15 ppm/K; ± 10 ppm/K
4.25.1 - Endurance at
70 °C
U= or
U = Umax.;
whichever is the less severe;
1.5 h on; 0.5 h off;
70 °C; 1000 h ± (0.05 % R+0.01Ω)
70 °C; 8000 h ± (0.1 % R+0.02Ω)
P70 x R
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8Revision: 30-Sep-08
TNPW e3
Vishay High Stability Thin Film Flat Chip Resistor
≤ 0.05 % (1000 h rated power at 70 °C)
4.25.3 -
Endurance at
upper category
temperature
125 °C; 1000 h
155 °C; 1000 h
± (0.05 % R+ 0.01 Ω)
± (0.1 % R+ 0.02 Ω)
4.24 78 (Cab) Damp heat,
steady state
(40 ± 2) °C; 56 days;
(93 ± 3) % RH ± (0.1 % R+ 0.01 Ω)
4.23 Climatic
sequence:
± (0.1 % R+ 0.02 Ω)
4.23.2 2 (Ba) Dry heat UCT; 16 h
4.23.3 30 (Db) Damp 55 °C; 24 h; > 90 % RH;
1 cycle
4.23.4 1 (Aa) Cold LCT; 2 h
4.23.5 13 (M) Low air 8.5 kPa; 2 h; 25 ± 10 °C
4.23.6 30 (Db) Damp heat,
cyclic
55 °C; 5 days;
> 95 to 100 % RH; 5 cycles
4.23.7 - D.C. load
U= ≤ Umax.; 1 min
LCT = - 55 °C
UCT = 125 °C
- 1 (Aa) Cold - 55 °C; 2 h ± (0.05 % R+ 0.01 Ω)
4.19 14 (Na) Rapid change
of temperature
30 min at LCT and
30 min at UCT;
LCT = - 55 °C; UCT = 125 °C;
1000 cycles
± (0.1 % R+ 0.01 Ω)
4.13 - Short time
overload
U= 2.5 x or
U=2 x Umax.; whichever is the
less severe; 5 s
± (0.05 % R+ 0.01 Ω)
4.27 -
Single pulse
high voltage
overload
Severity no. 4:
U= 10 x or
U=2 x Umax.;
whichever is the less severe;
10 pulses 10 µs/700 µs
± (0.5 % R+ 0.05 Ω)
no visible damage
4.37 -
Periodic
electric
overload
U= or
U=2 x Umax.;
whichever is the less severe;
0.1 s on; 2.5 s off;
1000 cycles
± (0.5 % R+ 0.05 Ω)
no visible damage
4.22 6 (Fc) Vibration
Endurance by sweeping;
10 to 2000 Hz;
no resonance;
amplitude ≤ 1.5 mm or
≤ 200 m/s2; 6 h
± (0.05 % R+ 0.01 Ω)
no visible damage
TEST PROCEDURES AND REQUIREMENTS
EN 60115-1
CLAUSE
IEC 60068-2
TEST METHOD TEST PROCEDURE REQUIREMENTS
PERMISSIBLE CHANGE
Stability for product types:
TNPW0402
TNPW0603
TNPW0805
TNPW1206
TNPW1210
TNPW2010
TNPW2512
P70 x R
P70 x R
P70 x R
15 x P70 x R
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Revision: 30-Sep-08 9
TNPW e3
High Stability Thin Film Flat Chip Resistor
≤ 0.05 % (1000 h rated power at 70 °C) Vishay
4.17.2 58 (Td) Solderability
Solder bath method;
SnPb40; non-activated flux
(215 ± 3) °C; (3 ± 0.3) s Good tinning (≥ 95 % covered);
no visible damage
Solder bath method;
SnAg3Cu0.5 or SnAg3.5;
non-activated flux
(235 ± 3) °C; (2 ± 0.2) s
4.18.2 58 (Td) Resistance to
soldering heat
Solder bath method;
(260 ± 5) °C; (10 ± 1) s ± (0.02 % R+0.01 Ω)
4.29 45 (XA)
Component
solvent
resistance
Isopropyl alcohol + 50 °C;
method 2 No visible damage
4.32 21 (Ue3)Shear
(adhesion)
RR 1005M and RR 1608M;
9 N No visible damage
RR 2012M and RR 3216M:
45 N
4.33 21 (Ue1)Substrate
bending Depth 2 mm, 3 times ± (0.05 % R+0.01 Ω)
no visible damage, no open circuit in bent position
4.7 - Voltage proof Urms =Uins; 60 ± 5 s No flashover or breakdown
4.35 - Flammability IEC 60695-11-5,
needle flame test; 10 s No burning after 30 s
- - Damp heat (85 ± 5) °C; 56 days
(85 ± 5) % RH ± (0.25 R + 0.05 Ω)
TEST PROCEDURES AND REQUIREMENTS
EN 60115-1
CLAUSE
IEC 60068-2
TEST METHOD TEST PROCEDURE REQUIREMENTS
PERMISSIBLE CHANGE
Stability for product types:
TNPW0402
TNPW0603
TNPW0805
TNPW1206
TNPW1210
TNPW2010
TNPW2512
APPLICABLE SPECIFICATIONS
• CECC40000/40400
• EN140400
• EN 140401-801
• EN 60115-1
• IEC 60286-3
Document Number: 91000 www.vishay.com
Revision: 18-Jul-08 1
Disclaimer
Legal Disclaimer Notice
Vishay
All product specifications and data are subject to change without notice.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf
(collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein
or in any other disclosure relating to any product.
Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any
information provided herein to the maximum extent permitted by law. The product specifications do not expand or
otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed
therein, which apply to these products.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this
document or by any conduct of Vishay.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless
otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such
applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting
from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding
products designed for such applications.
Product names and markings noted herein may be trademarks of their respective owners.
