MC74LCX138DR2G - ON Semiconductor

July, 2012 − Rev. 9

1Publication Order Number:

MC74LCX138/D

MC74LCX138

Low-Voltage CMOS 3-to-8

Decoder/Demultiplexer

With 5 V−Tolerant Inputs

The MC74LCX138 is a high performance, 3−to−8

decoder/demultiplexer operating from a 2.3 to 3.6 V supply. High

impedance TTL compatible inputs significantly reduce current

loading to input drivers while TTL compatible outputs offer improved

switching noise performance. A VI specification of 5.5 V allows

MC74LCX138 inputs to be safely driven from 5 V devices. The

MC74LCX138 is suitable for memory address decoding and other

TTL level bus−oriented applications.

The MC74LCX138 high−speed 3−to−8 decoder/demultiplexer

accepts three binary weighted inputs (A0, A1, A2) and, when enabled,

provides eight mutually exclusive active−LOW outputs (O0−O7). The

LCX138 features three Enable inputs, two active−LOW (E1, E2) and

one active−HIGH (E3). All outputs will be HIGH unless E1 and E2 are

LOW, and E3 is HIGH. This multiple enabled function allows easy

parallel expansion of the device to a 1−of−32 (5 lines to 32 lines)

decoder with just four LCX138 devices and one inverter (see

Figure 1). The LCX138 can be used as an 8−output demultiplexer by

using one of the active−LOW Enable inputs as the data input and the

other Enable inputs as strobes. The Enable inputs which are not used

must be permanently tied to their appropriate active−HIGH or

active−LOW state.

Current drive capability is 24 mA at the outputs.

Features

•Designed for 2.3 V to 3.6 V VCC Operation

•5 V Tolerant Inputs − Interface Capability With 5 V TTL Logic

•LVTTL Compatible

•LVCMOS Compatible

•24 mA Balanced Output Sink and Source Capability

•Near Zero Static Supply Current (10 mA) Substantially Reduces

System Power Requirements

•Latchup Performance Exceeds 500 mA

•ESD Performance: Human Body Model >2000 V

Machine Model >200 V

•NLV Prefix for Automotive and Other Applications Requiring

Unique Site and Control Change Requirements; AEC−Q100

Qualified and PPAP Capable

•These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS

Compliant

MARKING

DIAGRAMS

A = Assembly Location

WL, L = Wafer Lot

Y = Year

WW, W = Work Week

G or G= Pb−Free Package

SOIC−16

D SUFFIX

CASE 751B

LCX138G

AWLYWW

LCX

138

ALYWG

TSSOP−16

DT SUFFIX

CASE 948F

See detailed ordering and shipping information in the package

dimensions section on page 3 of this data sheet.

ORDERING INFORMATION

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(Note: Microdot may be in either location)

MC74LCX138

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Figure 1. Pinout: 16−Lead (Top View)

Figure 2. Logic Diagram

1516 14 13 12 11 10

21 34567

VCC O0 O1 O2 O3 O4 O5

A0 A1 A2 E1 E2 E3 O7

GND

O7 O6 O5 O4 O3 O2 O1 O0

A2 A1 A0 E1 E2 E3

654123

7 9 10 11 12 13 14 15

PIN NAMES

Pins Function

A0−A2 Address Inputs

E1−E2 Enable Inputs

E3 Enable Input

O0−O7 Outputs

TRUTH TABLE

Inputs Outputs

E1 E2 E3 A0 A1 A2 O0 O1 O2 O3 O4 O5 O6 O7

H X X X X X H H H H H H H H

X H X X X X H H H H H H H H

X X L X X X H H H H H H H H

L L H L L L L H H H H H H H

L L H H L L H L H H H H H H

L L H L H L H H L H H H H H

L L H H H L H H H L H H H H

L L H L L H H H H H L H H H

L L H H L H H H H H H L H H

L L H L H H H H H H H H L H

L L H H H H H H H H H H H L

H = High Voltage Level

L = Low Voltage Level

X = High or Low Voltage Level and Transitions are Acceptable

For ICC reasons, DO NOT FLOAT Inputs

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Figure 3. Expansion to 1−of−32 Decoding

O0 O1 O2 O3 O4 O5 O6 O7

A0 A1 A2 E

O0 O1 O2 O3 O4 O5 O6 O7

A0 A1 A2 E

O0 O1 O2 O3 O4 O5 O6 O7

A0 A1 A2 E

O31

O0 O1 O2 O3 O4 O5 O6 O7

A0 A1 A2 E

‘04

123 123 123 123

ORDERING INFORMATION

Device Package Shipping†

MC74LCX138DR2G SOIC−16

(Pb−Free)

2500 Tape & Reel

MC74LCX138DTG TSSOP−16

(Pb−Free)

96 Units / Rail

MC74LCX138DTR2G TSSOP−16

(Pb−Free)

2500 Tape & Reel

NLV74LCX138DR2G* SOIC−16

(Pb−Free)

2500 Tape & Reel

NLV74LCX138DTG* TSSOP−16

(Pb−Free)

96 Units / Rail

NLV74LCX138DTR2G* TSSOP−16

(Pb−Free)

2500 Tape & Reel

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.

*NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP

Capable.

MAXIMUM RATINGS

Symbol Parameter Value Condition Units

VCC DC Supply Voltage −0.5 to +7.0 V

VIDC Input Voltage −0.5 ≤ VI ≤ +7.0 V

VODC Output Voltage −0.5 ≤ VO ≤ VCC + 0.5 Output in HIGH or LOW State (Note 1) V

IIK DC Input Diode Current −50 VI < GND mA

IOK DC Output Diode Current −50 VO < GND mA

+50 VO > VCC mA

IODC Output Source/Sink Current ±50 mA

ICC DC Supply Current Per Supply Pin ±100 mA

IGND DC Ground Current Per Ground Pin ±100 mA

TSTG Storage Temperature Range −65 to +150 °C

MSL Moisture Sensitivity Level 1

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

1. IO absolute maximum rating must be observed.

MC74LCX138

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RECOMMENDED OPERATING CONDITIONS

Symbol Parameter Min Typ Max Units

VCC Supply Voltage Operating Data Retention Only 2.0

1.5

2.5, 3.3

3.6

VIInput Voltage 0 5.5 V

VOOutput Voltage (HIGH or LOW State) (3−State) 0 VCC V

IOH HIGH Level Output Current VCC = 3.0 V − 3.6 V

VCC = 2.7 V − 3.0 V

VCC = 2.3 V − 2.7 V

−24

−12

−8

IOL LOW Level Output Voltage VCC = 3.0 V − 3.6 V

VCC = 2.7 V − 3.0 V

VCC = 2.3 V − 2.7 V

+24

+12

TAOperating Free−Air Temperature −40 +85 °C

Dt/DVInput Transition Rise or Fall Rate, VIN from 0.8 V to 2.0 V, VCC = 3.0 V 0 10 ns/V

DC ELECTRICAL CHARACTERISTICS

TA = −40°C to +85°C

Symbol Characteristic Condition Min Max Units

VIH HIGH Level Input Voltage (Note 2) 2.3 V ≤ VCC ≤ 2.7 V 1.7 V

2.7 V ≤ VCC ≤ 3.6 V 2.0

VIL LOW Level Input Voltage (Note 2) 2.3 V ≤ VCC ≤ 2.7 V 0.7 V

2.7 V ≤ VCC ≤ 3.6 V 0.8

VOH HIGH Level Output Voltage 2.3 V ≤ VCC ≤ 3.6 V; IOH = −100 mAVCC −0.2 V

VCC = 2.3 V; IOH = −8 mA 1.8

VCC = 2.7 V; IOH = −12 mA 2.2

VCC = 3.0 V; IOH = −18 mA 2.4

VCC = 3.0 V; IOH = −24 mA 2.2

VOL LOW Level Output Voltage 2.3 V ≤ VCC ≤ 3.6 V; IOL = 100 mA0.2 V

VCC = 2.3 V; IOL = 8 mA 0.6

VCC = 2.7 V; IOL = 12 mA 0.4

VCC = 3.0 V; IOL = 16 mA 0.4

VCC = 3.0 V; IOL = 24 mA 0.55

IOFF Power Off Leakage Current VCC = 0, VIN = 3.6 V or VOUT = 3.6 V 10 mA

IIN Input Leakage Current VCC = 0 to 3.6 V, VIN = 3.6 V or GND ±5mA

ICC Quiescent Supply Current VCC = 3.6 V, VIN = 3.6 V or VOUT = 3.6 V 10 mA

DICC Increase in ICC per Input 2.3 ≤ VCC ≤ 3.6 V; VIH = VCC − 0.6 V 500 mA

2. These values of VI are used to test DC electrical characteristics only.

AC CHARACTERISTICS tR = tF = 2.5 ns; RL = 500 W

Limits

TA = −40°C to +85°C

VCC = 3.3 V ± 0.3 V VCC = 2.7 V VCC = 2.5 V ± 0.2 V

CL = 50 pF CL = 50 pF CL = 30 pF

Symbol Parameter Waveform Min Max Min Max Min Max Units

tPLH

tPHL

Propagation Delay

An to On

1, 2 1.5

1.5

6.0

1.5

7.0

1.5

7.2

tPLH

tPHL

Propagation Delay

E1, E2 to On

2 1.5

1.5

6.5

1.5

7.5

1.5

8.4

tPLH

tPHL

Propagation Delay

E3 to On

1 1.5

1.5

6.0

1.5

7.0

1.5

7.2

tOSHL

tOSLH

Output−to−Output Skew

(Note 3)

1.0

3. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device.

The specification applies to any outputs switching in the same direction, either HIGH−to−LOW (tOSHL) or LOW−to−HIGH (tOSLH); parameter

guaranteed by design.

MC74LCX138

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CAPACITIVE CHARACTERISTICS

Symbol Parameter Condition Typical Units

CIN Input Capacitance VCC = 3.3 V, VI = 0 V or VCC 7 pF

COUT Output Capacitance VCC = 3.3 V, VI = 0 V or VCC 8 pF

CPD Power Dissipation Capacitance 10 MHz, VCC = 3.3 V, VI = 0 V or VCC 25 pF

VCC

0 V

VOH

VOL

An, E3

tPLH

tPHL

Vmi

Vmo

Vmi

WAVEFORM 2: PROPAGATION DELAYS FOR NON−INVERTING OUTPUTS

2.7 V

0 V

VOH

VOL

An, E1, E2

tPLH

tPHL

WAVEFORM 1: PROPAGATION DELAYS FOR INVERTING OUTPUTS

Vmi

Vmo Vmo

Vmi

Vcc

Symbol 3.3 V + 0.3 V 2.7 V 2.5 V + 0.2 V

Vmi 1.5 V 1.5 V Vcc/2

Vmo 1.5 V 1.5 V Vcc/2

Figure 4. AC Waveforms

PULSE

GENERATOR

DUT

VCC

Figure 5. Test Circuit

CL= 50 pF at VCC = 3.3 ± 0.3 V or equivalent (includes jig and probe capacitance)

CL= 30 pF at VCC = 2.5 ± 0.2 V or equivalent (includes jig and probe capacitance)

RL= R1 = 500 W or equivalent

RT= ZOUT of pulse generator (typically 50 W)

MC74LCX138

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PACKAGE DIMENSIONS

SOIC−16

D SUFFIX

CASE 751B−05

ISSUE K

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSIONS A AND B DO NOT INCLUDE

MOLD PROTRUSION.

4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)

PER SIDE.

5. DIMENSION D DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBAR

PROTRUSION SHALL BE 0.127 (0.005) TOTAL

IN EXCESS OF THE D DIMENSION AT

MAXIMUM MATERIAL CONDITION.

16 9

SEATING

PLANE

RX 45_

8 PLP

−B−

−A−

0.25 (0.010) B S

−T−

16 PL

0.25 (0.010) A S

DIM MIN MAX MIN MAX

INCHESMILLIMETERS

A9.80 10.00 0.386 0.393

B3.80 4.00 0.150 0.157

C1.35 1.75 0.054 0.068

D0.35 0.49 0.014 0.019

F0.40 1.25 0.016 0.049

G1.27 BSC 0.050 BSC

J0.19 0.25 0.008 0.009

K0.10 0.25 0.004 0.009

M0 7 0 7

P5.80 6.20 0.229 0.244

R0.25 0.50 0.010 0.019

____

6.40

16X

0.58

16X 1.12

1.27

DIMENSIONS: MILLIMETERS

PITCH

SOLDERING FOOTPRINT

MC74LCX138

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PACKAGE DIMENSIONS

TSSOP−16

DT SUFFIX

CASE 948F−01

ISSUE B

ÇÇÇ

DIM MIN MAX MIN MAX

INCHESMILLIMETERS

A4.90 5.10 0.193 0.200

B4.30 4.50 0.169 0.177

C−−− 1.20 −−− 0.047

D0.05 0.15 0.002 0.006

F0.50 0.75 0.020 0.030

G0.65 BSC 0.026 BSC

H0.18 0.28 0.007 0.011

J0.09 0.20 0.004 0.008

J1 0.09 0.16 0.004 0.006

K0.19 0.30 0.007 0.012

K1 0.19 0.25 0.007 0.010

L6.40 BSC 0.252 BSC

M0 8 0 8

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSION A DOES NOT INCLUDE MOLD

FLASH. PROTRUSIONS OR GATE BURRS.

MOLD FLASH OR GATE BURRS SHALL NOT

EXCEED 0.15 (0.006) PER SIDE.

4. DIMENSION B DOES NOT INCLUDE

INTERLEAD FLASH OR PROTRUSION.

INTERLEAD FLASH OR PROTRUSION SHALL

NOT EXCEED 0.25 (0.010) PER SIDE.

5. DIMENSION K DOES NOT INCLUDE

DAMBAR PROTRUSION. ALLOWABLE

DAMBAR PROTRUSION SHALL BE 0.08

(0.003) TOTAL IN EXCESS OF THE K

DIMENSION AT MAXIMUM MATERIAL

CONDITION.

6. TERMINAL NUMBERS ARE SHOWN FOR

REFERENCE ONLY.

7. DIMENSION A AND B ARE TO BE

DETERMINED AT DATUM PLANE −W−.

____

SECTION N−N

SEATING

PLANE

IDENT.

PIN 1

16 9

DETAIL E

ÉÉÉ

DETAIL E

2X L/2

−U−

U0.15 (0.006) T

0.10 (0.004) V S

0.10 (0.004)

−T−

−V−

−W−

0.25 (0.010)

16X REFK

7.06

16X

0.36 16X

1.26

0.65

DIMENSIONS: MILLIMETERS

PITCH

SOLDERING FOOTPRINT

MC74LCX138

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