© 2007 Microchip Technology Inc. DS21424D-page 1
TC4431/TC4432
Features
• High Peak Output Current – 1.5 A
• Wide Input Supply Operating Range:
- 4.5V to 30V
• High Capacitive Load Drive Capability:
- 1000 pF in 25 nsec
• Short Delay Times – <78 nsec Typ.
• Low Supply Current:
- With Logic ‘1’ Input – 2.5 mA
- With Logic ‘0’ Input – 300 µA
• Low Output Impedance – 7 Ω
• Latch-Up Protected: Will Withstand >300 mA
Reverse Current
• ESD Protected – 4 kV
Applications
• Small Motor Drive
• Power MOSFET Driver
• Driving Bipolar Transistors
General Description
The TC4431/TC4432 are 30V CMOS buffer/drivers
suitable for use in high-side driver applications. They
will not latch up under any conditions within their power
and voltage ratings. They can accept, without damage
or logic upset, up to 300 mA of reverse current (of
either polarity) being forced back into the ir outputs. All
terminals are fully protected against up to 4 kV of
electrostatic discharge.
Under-voltage lockout circuitry forces the output to a
‘low’ state when the input supply voltage drops below
7V. For operation at lower voltages, disable the lockout
and start-up circuit by grounding pin 3 (LOCK DIS); for
all other situations, pin 3 (LOCK DIS) should be left
floating. The under-voltage lockout and start-up circuit
gives brown out protection when driving MOSFETS.
Package Type
OUT
TC4431
1
2
3
4
VDD
5
6
7
8OUT
GND
VDD
IN
LOCK DIS
GND
TC4432
1
2
3
4
VDD
5
6
7
8OUT
GND
VDD
IN
GND
27
Inverting
Non Inverting
OUT
6
LOCK DIS
27
6
8-Pin PDIP/SOIC/CERDIP
1.5A High-Speed 30V MOSFET Drivers
TC4431/TC4432
DS21424D-page 2 © 2007 Microchip Technology Inc.
Functional Block Diagram
2mA
OUT
Input
GND Effective
Input
C = 10 pF
VDD
TC4431/TC4432
Inverting/Non Inverting
OUT
UV LOCK
Inverting
TC4431
250 mV
LOCK DIS
3
2
4, 5
Non Inverting
TC4432
6
7
8
© 2007 Microchip Technology Inc. DS21424D-page 3
TC4431/TC4432
1.0 ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings†
Supply Voltage.............. ................. ................. .......36V
Input Voltage (Note 1)................... VDD + 0.3V to GND
Package Power Dissipation (TA ≤ 70°C)
PDIP............................................................730 mW
CERDIP.......................................................800 mW
SOIC............................................................470 mW
Maximum Junction Temperature, TJ................+150°C
Storage Temperature Range..............-65°C to +150°C
† Stresses above those listed under "Absolute Maximum
Ratings" may cause permanent damage to the device. These
are stress ratings only and funct ional operation of the device
at these or any other conditions above those indicated in the
operation sections of the specifications is not implied.
Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability.
DC CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, TA = +25ºC with 4.5V ≤ VDD ≤ 30V.
Parameters Sym Min Typ Max Units Conditions
Input
Logic ‘1’, High In put Voltage VIH 2.4 — — V
Logic ‘0’, Low Input Voltage VIL ——0.8V
Input Current (Note 1)I
IN -1 — 1 µA 0V ≤ VIN ≤ 12V
Output
High Output Voltage VOH VDD – 1.0 VDD – 0.8 — V IOUT = 100 mA
Low Output Voltage VOL — — 0.025 V
Output Resistance RO—710ΩIOUT = 10 mA, VDD = 30V
Peak Output Current IPK —
—3.0
1.5 —
—ASource: V
DD = 30V
Sink: VDD = 30V
Latch-Up Protection
Withstand Reverse Current IREV — 0.3 — A Duty cycle ≤ 2%, t ≤ 300 µsec
Switching Time (Note 2)
Rise Time tR—2540nsFigure 4-1
Fall Time tF—3350nsFigure 4-1
Delay Time tD1 —6280nsFigure 4-1
Delay Time tD2 —7890nsFigure 4-1
Power Supply
Power Supply Current IS—
—2.5
0.3 4
0.4 mA VIN = 3V
VIN = 0V
Start-up Threshold VS—8.410V
Drop-out Threshold VDO 77.7—VNote 3
Note 1: For inputs >12V, add a 1 kΩ resistor in series with the input. See Section 2.0 “Typical Performance
Curves” for input current graph.
2: Switching times are ensured by design.
3: For operati o n be low 7V, pin 3 (LOCK DIS) should be tied to ground to disable the lockout and start-up
circuit, otherwise, pin 3 must be left floating.
TC4431/TC4432
DS21424D-page 4 © 2007 Microchip Technology Inc.
DC CHARACTERISTICS
TEMPERATURE CHARACTERIS TICS
Electrical Specifications: Unless otherwise noted, Over operating temperature range with 4.5V ≤ VDD ≤ 30V.
Parameters Sym Min Typ Max Units Conditions
Input
Logic ‘1’, High In put Voltage VIH 2.4 — — V
Logic ‘0’, Low Input Voltage VIL ——0.8V
Input Current (Note 1)I
IN -10 — 10 µA 0V ≤ VIN ≤ 12V
Output
High Output Voltage VOH VDD – 1.2 — — V IOUT = 100 mA
Low Output Voltage VOL — — 0.025 V
Output Resistance RO——12ΩIOUT = 10 mA, VDD = 30V
Switching Time (Note 2)
Rise Time tR— — 60 ns Figure 4-1
Fall Time tF— — 70 ns Figure 4-1
Delay T ime tD1 ——100nsFigure 4-1
Delay T ime tD2 ——110nsFigure 4-1
Power Supply
Power Supply Current IS—
——
—6
0.7 mA VIN = 3V
VIN = 0V
Start-up Threshold VS—8.410V
Drop-out Threshold VDO 77.7—VNote 3
Note 1: For inputs >12V, add a 1 kΩ resistor in series with the input. See Section 2.0 “Typical Performance
Curves” for input current graph.
2: Switching times are ensured by design.
3: For operati o n be l o w 7V, pin 3 (LOCK DIS) should be tied to ground to disable the lockout and start-up cir-
cuit, otherwise, pin 3 must be left floating.
Electrical Specifications: Unless otherwise noted, all parameters apply with 4.5V ≤ VDD ≤ 30V.
Parameters Sym Min Typ Max Units Conditions
Temperature Ranges
Specified Temperature Range (C) TA0—+70ºC
Specified Temperature Range (E) TA-40 — +85 ºC
Specified Temperature Range (V) TA-40 — +125 ºC
Maximum Junction Temperature TJ——+150ºC
Storage Temperature Range TA-65 — +150 ºC
Package Thermal Resistances:
Thermal Resistance, 8L-SOIC θJA —155—ºC/W
Thermal Resistance, 8L-PDIP θJA —125—ºC/W
Thermal Resistance, 8L-CERDIP θJA —150—ºC/W
© 2007 Microchip Technology Inc. DS21424D-page 5
TC4431/TC4432
2.0 TYPICAL PERFORMANCE CURVES
Note: Unless otherwise indicated, TA = +25ºC with 4.5V ≤ VDD ≤ 30V.
FIGURE 2-1: Supply Current vs.
Capacitive Load.
FIGURE 2-2: Input Current vs. Input
Voltage.
FIGURE 2-3: Rise/Fall Time vs. VDD.
FIGURE 2-4: tD1 and tD2 Delay vs. VDD.
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provide d for informational purposes only. The performance characteristics listed here in
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified pow er supply range) and therefore outside the warranted range.
100 1000 10,000
2 MHz
600 kHz
200 kHz
20 kHz
900 kHz
V = 12V
DD
60
50
40
30
20
10
0
ISUPPLY
(mA)
C
LOAD
(pF)
INPUT CURRENT (mA)
INPUT VOLTAGE (V
IN
)
50
3 6 12 15 18 21 24 27 309
40
30
20
10
0
WITHOUT 1 K RES.
45
35
25
15
5
WITH 1 K RES.
Time (nsec)
3 6 12 15 18 21 24 27 309
150
125
100
75
50
25
0
tFALL
VDD (V)
CLOAD = 1000 pF
TA = +25°C
tRISE
TIME (nsec)
3 6 12 15 18 21 24 27 309
300
250
200
150
100
50
0
tD2
tD1
C
LOAD
= 1000 pF
T
A
= +25
°
C
V
DD
(V)
TC4431/TC4432
DS21424D-page 6 © 2007 Microchip Technology Inc.
3.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1: PIN FUNCTION TABLE
3.1 Supply Input (VDD)
The VDD input is the bias supply input for the MOSFET
driver and is rated for 4.5V to 30V with respect to the
ground pins. The VDD input should be bypassed to
ground with a local ceramic capacitor . The value of this
capacitor should be chosen based on the capacitive
load that is being driven.
3.2 Control Input (IN)
The MOSFET driver input is a TTL/CMOS compatible
input with 250 mV of hysteresis between the high and
low threshold voltages. If an input signal level of greater
than 12V is applied to the device, a series current
limiting resistor is recommended.
3.3 Lockout Disable (LOCK DIS)
The lockout pin enables/disables the undervoltage
lockout feature of the device. If undervoltage lockout is
desired (output is not enabled until the bias voltage
reaches 8.4V (typical) on the rising edge and is
disabled when the bias voltage reaches 7.7V (typical)
on the falling edge), the lockout pin should be left float-
ing. If operation below 7V is desired, the lockout pin
should be tied to ground.
3.4 Ground (GND)
The ground pins are the return path for the bias current
and for the high peak currents which discharge the load
capacitor. Both ground pins sh ould be used to ensure
proper operation. The ground pins should be tied into a
ground plane or have short traces to the bias supply
source return.
3.5 Drive Output (OUT)
The TC4431/TC4432 devices have individual source
and sink output pins. This feature can be used to adjust
the rise and fall time independently by adding separate
charge and discharge resistors e xternal to the device.
Pin 7 (source output) can source 3 A peak currents into
capacitive loads and pin 6 (sink output) ca n sink 1.5 A
peak currents from a capa citive load.
Pin No. Symbol Description
1V
DD Supply Input, 4.5V to 30V
2IN TTL/CMOS Compatible Input
3LOCK DIS Input Pin, Enable/Disable for UV Lockout
4GND Ground
5GND Ground
6 OUT Drive Output, Pull Down
7 OUT Drive Output, Pull Up
8V
DD Supply Input, 4.5V to 30V
© 2007 Microchip Technology Inc. DS21424D-page 7
TC4431/TC4432
4.0 APPLICATIONS INFORMATION
FIGURE 4-1: Switching Time Test Circuit.
CL = 1000 pF
0.1 µF
4.7 µF
Inverting Driver
Non Inverting Driver
Input
VDD = 30V
Input
Output
tD1 tF
tR
tD2
Input: 100 kHz,
square wave,
tRISE = tFALL ≤ 10 nsec
Output
Input
Output
tD1 tF
tR
tD2
+5V
10%
90%
10%
90%
10%
90%
VDD
0V
90%
10%
10% 10%
90%
+5V
VDD
0V
0V
0V
90%
4, 5
2
6
1, 8
LOCK DIS 3
7
TC4431/TC4432
DS21424D-page 8 © 2007 Microchip Technology Inc.
5.0 PACKAGING INFORMATION
5.1 Package Marking Information
XXXXXXXX
XXXXXNNN
YYWW
8-Lead PDIP (300 mil) Example:
8-Lead SOIC (150 mil) Example:
XXXXXXXX
XXXXYYWW
NNN
TC4431
EPA^^256
0749
TC4431E
OA^^0749
256
8-Lead CERDIP (300 mil) Example:
XXXXXXXX
XXXXXNNN
YYWW
TC4432
EJA^^256
0749
Legend: XX...X Customer-specific information
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Al phanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
*This package is Pb-free. The Pb-free JEDEC designator ( )
can be found on the outer packaging for this package.
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
3
e
3
e
3
e
3
e
3
e
© 2007 Microchip Technology Inc. DS21424D-page 9
TC4431/TC4432
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TC4431/TC4432
DS21424D-page 12 © 2007 Microchip Technology Inc.
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© 2007 Microchip Technology Inc. DS21424D-page 13
TC4431/TC4432
APPENDIX A: REVISION HISTORY
Revision D (December 2007)
The following is the list of modificatio ns:
1. Section 1.0 “Electrical Characteristics”:
Added V temperature information to Tempera-
ture Characteristics table.
2. Added Revision History.
3. Added V temperature range to Product identifi-
cation System page.
Revision C (May 2003)
The following is the list of modificatio ns:
1. Undocumented changes
Revision B (May 2002)
The following is the list of modificatio ns:
1. Undocumented changes
Revision A (April 2002)
• Original Release of this Document.
TC4431/TC4432
DS21424D-page 14 © 2007 Microchip Technology Inc.
NOTES:
© 2007 Microchip Technology Inc. DS21424D-page 15
TC4431/TC4432
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
TC4431/TC4432
DS21424D-page 16 © 2007 Microchip Technology Inc.
NOTES:
© 2007 Microchip Technology Inc. DS21424D-page 17
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defen d, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, KEELOQ, KEELOQ logo, microID, MPLAB, PIC,
PICmicro, PICST ART, PRO MA TE, rfPIC and SmartShunt are
registered trademarks of Microchip Technology Incorporated
in the U.S.A. and other countries.
AmpLab, FilterLab, Linear Active Thermistor, Migratable
Memory, MXDEV, MXLAB, SEEVAL, SmartSensor and The
Embedded Control Solutions Company are registered
trademarks of Microchip Technology Incorporated in the
U.S.A.
Analog-for-the-Digital Age, Application Maestro, CodeGuard,
dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, FlexROM, fuzzyLAB,
In-Circuit Serial Programming, ICSP, ICEPIC, Mindi, MiWi,
MPASM, MPLAB Certified logo, MPLIB, MPLINK, PICkit,
PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal,
PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, Select
Mode, Smart Serial, SmartTel, Total Endurance, UNI/O,
WiperLock and ZENA are trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip T echnology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2007, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Note the following details of the code protection feature on Microchip devices:
• Microchip products meet the specification contained in their particular Microchip Data Sheet.
• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Dat a
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
• Microchip is willing to work with the customer who is concerned about the integrity of their code.
• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection featur es of our
products. Attempts to break Microchip’ s code protection feature may be a violation of the Digit al Millennium Copyright Act. If such acts
allow unauthorized access to you r software or other copyrighted work, you may have a right to sue for relief under that Act.
Microchip received ISO/TS-16949:200 2 certif ication for its worldwide
headquarters, design and wafer fabrication facilities in Chandle r and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperi pherals, nonvola tile memo ry and
analog product s. In addition, Microchip ’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
DS21424D-page 18 © 2007 Microchip Technology Inc.
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10/05/07