B3FS-4 3
Precautions
Be sure to read the precautions common to all Tactile Switches, contained in the Technical User’s Guide, “Tactile Switches, Technical Information”
for correct use.
■Precautions for Correct Use
Soldering
General Precautions
Before soldering the Switch on a multilayer PCB, test to confirm that
soldering can be performed properly. Otherwise the Switch may be
deformed by the soldering heat on the pattern or lands of the multilayer
PCB.
Do not solder the Switch more than twice, including rectification
soldering. An interval of five minutes is required between the first and the
second soldering, or it may result in melting housing and deterioration of
operating characteristics.
Reflow Soldering (Surface Mounting)
Solder the terminals within the heating curve shown in the following diagram.
Note: The above heating curve applies if the PCB thickness is 1.6 mm.
The peak temperature may vary depending on the reflow bath used.
Confirm the conditions beforehand.
Do not use an automatic soldering bath for surface-mounted Switches.
The soldering gas or flux may enter the Switch and damage the Switch's
plunger operation.
Manual Soldering
Soldering temperature: 350 degC max. at the tip of the soldering iron
Soldering time: 3 s max. for a 1.6-mm thick, single-side PCB
Before soldering the Switch on a PCB, make sure that there is no
unnecessary space between the Switch and the PCB.
Washing
This switch cannot be washed.
Doing so will cause the washing agent, together with flux or dust
particles on the PCB, to enter the Switch, resulting in malfunction.
PCBs
If the PCBs are separated after mounting the Switch, particles from the
PCBs may enter the Switch. If PCB particles or foreign particles from the
surrounding environment, workbench, containers, or stacked PCBs
become attached to the Switch, contact failure may result.
RoHS Compliant
The "RoHS Compliant" designation indicates that the listed models
do not contain the six hazardous substances covered by the RoHS
Directive.
Reference:
The following standards are used to determine compliance for the six substances.
Lead: 1,000 ppm max.
Mercury: 1,000 ppm max.
Cadmium: 100 ppm max.
Hexavalent chromium: 1,000 ppm max.
PBB: 1,000 ppm max.
PBDE: 1,000 ppm max.
Packaging Specifications for Embossed Taping
Temperture (°C)
180
220
250 max.
Room
temperture
150 Preheating Heating
Time (s)
60 to 120 Max.60
ø13.2
ø380±2
16±0.1
Reel (Material: PS) Label
Tape drawing direction
Tape drawing direction
Tape drawing direction
(29)
4±0.1 (5.6)
2A
24
11.5
1.75
1.5+0.1
0
dia.
A
16±0.1
4±0.1 (8.5)
2A
24
11.5
1.75
1.5+0.1
0
dia.
A
B3FS-4002P
B3FS-4005P
B3FS-4052P
B3FS-4055P