28.50mm [1.122"] Patent Pending Top View 1.75mm [0.069"] Ordering Information: Solder Ball Alloy 1.75mm [0.069"] Part Number Suffix Sn63Pb37 -42 Sn96.5Ag3.0Cu0.5 -42F* 1.0mm typ. 28.50mm [1.122"] *RoHS Compliant 1.33mm [0.052"] 2.36mm [0.093"] Side View 3 Detail A Detail A 1 2 2.87mm [0.113"] 0.51mm [0.020"] 4 CONTACT DATA Accepts 0.20mm - 0.33mm Diameter pins 3-finger 37 gram, Initial insertion force (with 0.254mm dia. pin) 30 gram, normal force (with 0.254mm dia. pin) 20 gram, extraction force (with 0.2545mm dia. pin) 1 Substrate: 1.59mm 0.18mm [0.0625" 0.007"] FR4/G10 or equivalent high temp material. (RoHS) 2 Pins: material- Brass Alloy 360 1/2 hard; finish0.25m [10"] Au over 1.27m [50"] Ni (min.). 3 Contacts: Beryllium Copper Alloy172, HT; Finish0.25m [10"] Au over 1.27m [50"] Ni (min.). 4 Solder Balls (See table above) Description: BGA surface mount emulator foot 416 position (1.0mm pitch) gold plated female receptacle pins to SMT solder balls (BGA type). Pin asignment 1:1. Tolerances: diameters 0.03mm [0.001"], PCB perimeters 0.18mm [0.007"], PCB thicknesses 0.18mm [0.007"], pitches (from true position) 0.08mm [0.003"], all other tolerances 0.13mm [0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. SF-BGA416E-B-42(F) Drawing (c) 2005 IRONWOOD ELECTRONICS, INC. PO BOX21151 ST. PAUL, MN 55121 Tele: (651) 452-8100 www.ironwoodelectronics.com Status: Released Scale: 2:1 Rev: B Drawing: H. Hansen Date: 11/23/05 File: SF-BGA416E-B-42 Dwg Modified: 1/9/06