2SC6011A
Description
By adapting the Sanken unique wafer-thinner technique, these
NPN power transistors achieve power-up by decreasing thermal
resistance, and provide higher voltage avalanche breakdown
rating. The high power-handling capacity of the TO-3P package
allows a smaller footprint on the circuit board design. This
series of transistors is very well suited to not only multichannel
applications for AV (audio-visual) amplifiers and receivers,
but also parallel connection applications for PA (professional
audio system) amplifiers.
Applications include the following:
▪ Single transistors for audio amplifiers
▪ Home audio amplifiers
▪ Professional audio amplifiers
▪ Automobile audio amplifiers
▪ Audio market
▪ Single transistors for general purpose
Features and Benefits
▪ Small package (TO-3P)
▪ High power handling capacity, 160 W
▪ Improved sound output by reduced on-chip impedance
▪ For professional audio (PA) applications, VCEO = 230 V
versions available
▪ Complementary to 2SA2151A
▪ Recommended output driver: 2SC4382A
Audio Amplification T ransistor
Package: 3 Lead TO-3P
38103
Audio Amplification T ransistor
2SC6011A
2
ABSOLUTE MAXIMUM RATINGS at TA = 25°C
Characteristic Symbol Rating Unit
Collector-Base Voltage VCBO 230 V
Collector-Emitter Voltage VCEO 230 V
Emitter-Base Voltage VEBO 6V
Collector Current IC15 A
Base Current IB4A
Collector Power Dissipation PC160 W
Junction Temperature TJ150 °C
Storage Temperature Tstg –55 to150 °C
SELECTION GUIDE
Part Number Type hFE Rating Packing
2SC6011A* NPN
Range O: 50 to 100
Bulk, 100 piecesRange P: 70 tp 140
Range Y: 90 to 180
*Specify hFE range when ordering. If no hFE range is specified, order will be fulfilled with either or both range O and range Y,
depending upon availability.
ELECTRICAL CHARACTERISTICS at TA = 25°C
Characteristic Symbol Test Conditions Min. Typ. Max. Unit
Collector-Cutoff Current ICBO VCB = 230 V – – 10 μA
Emitter Cutoff Current IEBO VEB = 6 V – – 10 μA
Collector-Emitter Voltage V(BR)CEO IC = 50 mA 230 – – V
DC Current Transfer Ratio* hFE VCE = 4 V, IC = 3 A 50 – 180 –
Collector-Emitter Saturation Voltage VCE(sat) IC = 5 A, IB = 0.5 A – – 0.5 V
Cutoff Frequency fTVCE = 12 V, IE = –0.5 A – 20 – MHz
Output Capacitance COB VCB = 10 V, IE = 0 A, f = 1 MHz – 270 – pF
*hFE rating: 50 to 100 (O brand on package), 70 to 140 (P), 90 to 180 (Y).
Allegro MicroSystems, Inc.
115 Northeast Cutoff, Box 15036
Worcester, Massachusetts 01615-0036 (508) 853-5000
www.allegromicro.com
Audio Amplification T ransistor
2SC6011A
3
Performance Characteristics
V
CE
(V)
I
C
(A)
I
C
vs. V
CE
V
CE(sat)
vs. I
B
h
FE
vs. I
C
I
C
vs. V
BE
V
CE
= 4 V Continuous V
CE
= 4 V Continuous
V
BE
(V)
I
C
=5A
I
C
=10A
Typ.
I
C
(A)
h
FE
I
C
(A)
V
CE(sat)
(V)
0
5
10
15
0
5
10
15
3
2
1
0
0 0.5 1.0 1.5 2.0
02134
IB= 20 mA
50 mA
100 mA
200 mA
300 mA
500 mA
1 A
I
B
(A)
0 0.5 1.0 1.5 2.0
0.01 0.1 1 10 100
10
1
100
1000
h
FE
vs. I
C
V
CE
= 4 V Continuous
I
C
(A)
h
FE
0.01 0.1 1 10 100
10
100
1000
125°C
25°C
–30°C
–30°C
25°C
125°C
0.01
0.10
1.00
10.00
1
1
10 100 1000
R
θJA
vs. t
R
θJA
(°C/W)
t(ms)
Allegro MicroSystems, Inc.
115 Northeast Cutoff, Box 15036
Worcester, Massachusetts 01615-0036 (508) 853-5000
www.allegromicro.com
Audio Amplification T ransistor
2SC6011A
4
1 10 100 1000
10 ms
DC
100 ms
I
C(A)
0.1
0.01
1.0
10.0
100.0
V
CE (V)
Safe Operating Area
T
A
= 25°C, single pulse, no heatsink, natural cooling
0.01 0.1 1 10 100
10
20
30
40
0
f
T
vs. I
E
V
CE
= 12 V Continuous
f
T
(MHz)
I
E
(A)
Typ.
PC vs. TA
0
50
100
150
200
0 25 50 75 100 125 150
T
A
(°C)
P
C
(W)
Without Heatsink
With Infinite Heatsink
3.5
Performance Characteristics, continued
Allegro MicroSystems, Inc.
115 Northeast Cutoff, Box 15036
Worcester, Massachusetts 01615-0036 (508) 853-5000
www.allegromicro.com
Audio Amplification T ransistor
2SC6011A
5
9.6 ±0.3
15.8 ±0.2
5.0 MAX
2.1 MAX
Ø3.2 ±0.1
5.0 ±0.2
Terminal dimension at lead tips
2(2×)
+0.2
–0.1
3+0.2
–0.1
1.0 (3×)
+0.2
–0.1
0.6 +0.2
–0.1
1.7 +0.2
–0.3
20.0 MIN
6.0 ±0.2
3.5 NOM
Branding
XXXXXXXX
XXXXXXXX
Terminal core material: Cu
Terminal treatment: Ni plating and solder dip
Heat sink core material: Cu
Heat sink treatment: Ni plating
Leadform number: 100
Dimensions in millimeters
Branding codes (exact appearance at manufacturer discretion):
1st line, type: C6011A
2nd line, lot: YM H
Where: Y is the last digit of the year of manufacture
M is the month (1 to 9, O, N, D)
H is the hFE rating (O, P, or Y; for values see
footnote, Electrical Characteristics table)
Pin Assignments:
1. Base
2. Collector
3. Emitter
123
2×P5.45 ±0.1
13.6 ±0.2
14.0 ±0.3
15.6 ±0.3
19.9 ±0.3
2.0 ±0.2
1.8 ±0.3
PACKAGE OUTLINE DRAWING, TO-3P
Leadframe plating Pb-free. Device composition
includes high-temperature solder (Pb >85%),
which is exempted from the RoHS directive.
Allegro MicroSystems, Inc.
115 Northeast Cutoff, Box 15036
Worcester, Massachusetts 01615-0036 (508) 853-5000
www.allegromicro.com
Audio Amplification T ransistor
2SC6011A
6
Because reliability can be affected adversely by improper storage
environments and handling methods, please observe the following
cautions.
Cautions for Storage
• Ensure that storage conditions comply with the standard
temperature (5°C to 35°C) and the standard relative humidity
(around 40 to 75%); avoid storage locations that experience
extreme changes in temperature or humidity.
• Avoid locations where dust or harmful gases are present and
avoid direct sunlight.
• Reinspect for rust on leads and solderability of products that have
been stored for a long time.
Cautions for Testing and Handling
When tests are carried out during inspection testing and other
standard test periods, protect the products from power surges
from the testing device, shorts between adjacent products, and
shorts to the heatsink.
Remarks About Using Silicone Grease with a Heatsink
• When silicone grease is used in mounting this product on a
heatsink, it shall be applied evenly and thinly. If more silicone
grease than required is applied, it may produce stress.
• Coat the back surface of the product and both surfaces of the
insulating plate to improve heat transfer between the product and
the heatsink.
• Volatile-type silicone greases may permeate the product and
produce cracks after long periods of time, resulting in reduced
heat radiation effect, and possibly shortening the lifetime of the
product.
• Our recommended silicone greases for heat radiation purposes,
which will not cause any adverse effect on the product life, are
indicated below:
Type Suppliers
G746 Shin-Etsu Chemical Co., Ltd.
YG6260 GE Toshiba Silicone Co., Ltd.
SC102 Dow Corning Toray Silicone Co., Ltd.
Heatsink Mounting Method
• Torque When Tightening Mounting Screws. Thermal resistance
increases when tightening torque is low, and radiation effects are
decreased. When the torque is too high, the screw can strip, the
heatsink can be deformed, and distortion can arise in the product frame.
To avoid these problems, observe the recommended tightening torques
for this product package type, TO-3P (MT-100): 0.686 to 0.882 N•m (7
to 9 kgf•cm).
• Diameter of Heatsink Hole: < 4 mm. The defl ection of the press mold
when making the hole may cause the case material to crack at the joint
with the heatsink. Please pay special attention for this effect.
Soldering
• When soldering the products, please be sure to minimize the
working time, within the following limits:
260±5°C 10 s
350±5°C 3 s
• Soldering iron should be at a distance of at least 1.5 mm from the
body of the products
Electrostatic Discharge
• When handling the products, operator must be grounded.
Grounded wrist straps worn should have at least 1 MΩ of
resistance to ground to prevent shock hazard.
• Workbenches where the products are handled should be
grounded and be provided with conductive table and floor mats.
• When using measuring equipment such as a curve tracer, the
equipment should be grounded.
• When soldering the products, the head of soldering irons or the
solder bath must be grounded in other to prevent leak voltages
generated by them from being applied to the products.
• The products should always be stored and transported in our
shipping containers or conductive containers, or be wrapped in
aluminum foil.
WARNING — These devices are designed to be operated at lethal voltages and energy levels. Circuit designs
that embody these components must conform with applicable safety requirements. Pre cau tions must be
taken to prevent accidental contact with power-line potentials. Do not connect ground ed test equipment.
The use of an isolation transformer is recommended during circuit development and breadboarding.
Allegro MicroSystems, Inc.
115 Northeast Cutoff, Box 15036
Worcester, Massachusetts 01615-0036 (508) 853-5000
www.allegromicro.com
Audio Amplification T ransistor
2SC6011A
7
The products described herein are manufactured in Ja pan by Sanken Electric Co., Ltd. for sale by Allegro MicroSystems, Inc.
Sanken and Allegro reserve the right to make, from time to time, such de par tures from the detail spec i fi ca tions as may be re quired to per mit im-
prove ments in the per for mance, reliability, or manufacturability of its prod ucts. Therefore, the user is cau tioned to verify that the in for ma tion in this
publication is current before placing any order.
When using the products described herein, the ap pli ca bil i ty and suit abil i ty of such products for the intended purpose shall be reviewed at the users
responsibility.
Although Sanken undertakes to enhance the quality and reliability of its prod ucts, the occurrence of failure and defect of semi con duc tor products
at a certain rate is in ev i ta ble.
Users of Sanken products are requested to take, at their own risk, preventative measures including safety design of the equipment or systems
against any possible injury, death, fires or damages to society due to device failure or malfunction.
Sanken products listed in this publication are designed and intended for use as components in general-purpose electronic equip ment or apparatus
(home ap pli anc es, office equipment, tele com mu ni ca tion equipment, measuring equipment, etc.). Their use in any application requiring radiation
hardness assurance (e.g., aero space equipment) is not supported.
When considering the use of Sanken products in ap pli ca tions where higher reliability is re quired (transportation equipment and its control systems
or equip ment, fire- or burglar-alarm systems, various safety devices, etc.), contact a company sales representative to discuss and obtain written
confirmation of your spec i fi ca tions.
The use of Sanken products without the written consent of Sanken in applications where ex treme ly high reliability is required (aerospace equip-
ment, nuclear power-control stations, life-support systems, etc.) is strictly prohibited.
The information in clud ed herein is believed to be accurate and reliable. Ap pli ca tion and operation examples described in this pub li ca tion are
given for reference only and Sanken and Allegro assume no re spon si bil i ty for any in fringe ment of in dus tri al property rights, intellectual property
rights, or any other rights of Sanken or Allegro or any third party that may result from its use.
Anti radioactive ray design is not considered for the products listed herein.
Copyright © 2006 Allegro MicroSystems, Inc.
This datasheet is based on Sanken datasheet SSE-23015
Allegro MicroSystems, Inc.
115 Northeast Cutoff, Box 15036
Worcester, Massachusetts 01615-0036 (508) 853-5000
www.allegromicro.com
