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Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this document or Renesas Electronics products, or if you have any other inquiries. (Note 1) "Renesas Electronics" as used in this document means Renesas Electronics Corporation and also includes its majorityowned subsidiaries. (Note 2) "Renesas Electronics product(s)" means any product developed or manufactured by or for Renesas Electronics. DATA SHEET MOS INTEGRATED CIRCUIT PD166100, 166101 N-CHANNEL LOW SIDE INTELLIGENT POWER DEVICE The PD166100, 166101 are N-channel Low-side Driver for Solenoids and Lamp Drivers. It build in protection functions. PACKAGE DRAWING (unit: mm) FEATURES z Built in current limit and thermal shutdown circuit. 8 5 Thermal shutdown will automatically restart after the channel temperature has cool down. z Low on-state resistance: RDS(ON) = 160 m (VIN = 5 V, IOUT = 0.8 A, Tch = 25C) Small and surface mount package (Power SOP 8) 4.4 0.8 +0.10 -0.05 z 6.0 0.3 4 5.37 Max. 0.15 PD166101: Dual channel Low-side switch 1.44 z 0.05 Min. Built in dynamic clamp circuit 1.8 Max. 1 z 1.27 0.40 0.5 0.2 0.10 0.78 Max. +0.10 -0.05 0.12 M <R> ORDERING INFORMATION Part Number PD166100GR-E1-AZ Note PD166100GR-E2-AZ Note PD166101GR-E1-AZ Note PD166101GR-E2-AZ Note Lead plating Packing Package Sn-Bi Tape 2500 p/reel Power SOP 8 Sn-Bi Tape 2500 p/reel Power SOP 8 Sn-Bi Tape 2500 p/reel Power SOP 8 Sn-Bi Tape 2500 p/reel Power SOP 8 Note Pb-free (This product does not contain Pb in the external electrode.) <R> QUALITY GRADE Part Number Quality Grade PD166100GR-E1-AZ Special PD166100GR-E2-AZ Special PD166101GR-E1-AZ Special PD166101GR-E2-AZ Special Please refer to "Quality Grades on NEC Semiconductor Devices" (Document No. C11531E) published by NEC Corporation to know the specification of quality grade on the devices and its recommended applications. The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. Document No. S17476EJ2V0DS00 (2nd edition) Date Published December 2008 NS Printed in Japan The mark <R> shows major revised points. The revised points can be easily searched by copying an "<R>" in the PDF file and specifying it in the "Find what:" field. 2005 PD166100, 166101 BLOCK DIAGRAM IN1 OUT1 Dynamic Clamp Over Temperature Protection Circuit Control Circuit ESD Current Limit Ch1 IN2 GND1 OUT2 Dynamic Clamp Over Temperature Protection Circuit Control Circuit ESD Current Limit Ch2 Remark PD166100: Ch1 only PIN CONFIGURATION (Top View) * Power SOP 8 PD166100GR, PD166101GR GND1 1 8 OUT1 IN1 2 7 OUT1 3 6 OUT2 Note 4 5 OUT2 Note GND2 IN2 Note Note Pin No. Symbol 1 GND1 2 IN1 3 4 5 Connected to Ground Input terminal1 (active level is high) GND2 IN2 Function Note Note OUT2 Note Note Connected to Ground Input terminal2 (active level is high) Output terminal2 6 OUT2 7 OUT1 Output terminal1 8 OUT1 Output terminal1 Output terminal2 Note PD166100: Pin No.3 to 6 are N.C. 2 Data Sheet S17476EJ2V0DS GND2 PD166100, 166101 ABSOLUTE MAXIMUM RATING (TA = 25C unless otherwise specified) Parameter Symbol Conditions Rating Output voltage VOUT 40 V Input voltage VIN 7 V Negative input current IIL -10 mA Output current IOUT(DC) SELF LIMITED A/UNIT 1.5 W PD Total power dissipation Note VIN = 0 V, DC Unit VIN = 5 V PD166100 On-State PD166101 2ch On-State 2 Channel temperature Tch 150 C Storage temperature Tstg -55 to +150 C Note Mounted on ceramic substrate of 20 cm x 20 cm x 1.1 mm ELECTRICAL CHARACTERISTICS (Tch = 25C unless otherwise specified) Parameter Symbol Conditions Min. Typ. 40 Max. Unit 60 V Output clamping voltage VOUT IOUT = 1 mA, VIN = 0 V Output Off leakage current IOL VIN = VIL, VOUT = 20 V 100 A High Level Input current IIH VIN = 5.5 V, VOUT = 0 V 300 A Low Level Input current IIL VIN = 0 V, VOUT = 20 V 10 A High Level Input voltage VIH IOUT = 0.8 A, VOUT = 0.2 V Low Level Input voltage VIL VOUT = 10 V, IOUT = 1 mA 1.5 V ON-state resistance RDS(ON) VIN = 5 V, IOUT = 0.8 A 160 m VIN = 3 V, IOUT = 0.8 A 195 m -10 3 V Turn-on time ton VCC = 18 V, RL = 22 , 120 s Rise time tr VIN = 0 to 5 V, 80 s Turn-off time toff RIN = 10 200 s Fall time tf 80 s THI VIN = 5 V 150 Current limit IS VIN = 3 V 1 Input frequency fIN Thermal shutdown detection temperature C Note A 1 kHz Note The low side switch is shutdown if the channel temperature exceeds thermal shutdown temperature. It will automatically restart after the channel temperature has cooled down than thermal shutdown temperature. TEST CIRCUIT P D 1 66 10 0, P D 1 66 1 01 V IN IN O UT V CC = 1 8 V 50% 50% IN Wave Form ton R L = 22 OUT Wave Form G ND toff tr tf 90% 90% 10% Data Sheet S17476EJ2V0DS 10% 3 PD166100, 166101 TYPICAL CHARACTERISTICS TOTAL POWER DISSIPATION vs. OUTPUT OFF LEAKAGE CURRENT vs. AMBIENT TEMPERATURE Mounted on ceramic substrate of 2 2000 mm x 2.25 mm 2.4 2 unit 2 1.6 1 unit 1.2 0.8 0.4 0 0 20 40 60 80 100 120 140 160 IOL - Output Off Leakage Current - A PT - Total Power Dissipation -W / package AMBIENT TEMPERATURE 2.8 100 VIN = VIL, VOUT = 18 V 90 80 70 60 50 40 30 20 10 0 -50 TA - Ambient Temperature - C HIGH LEVEL INPUT CURRENT vs. INPUT VOLTAGE 150 200 AMBIENT TEMPERATURE IIH - High Level Input Current - A IIH - High Level Input Current - A 100 400 VOUT = 0 V 500 400 300 200 TA = 105C 100 TA = 85C TA = 25C TA = -40C 0 VIN = 5.5 V, VOUT = 0 V 350 300 250 200 150 100 50 0 0 1 2 3 4 5 6 7 -50 8 VIN - Input Voltage - V 0 50 100 150 TA - Ambient Temperature - C 200 LOW LEVEL INPUT VOLTAGE vs. HIGH LEVEL INPUT VOLTAGE vs. AMBIENT TEMPERATURE AMBIENT TEMPERATURE 4.0 3.0 IOUT = 0.8 A 3.5 VIL - Low Level Input Voltage - V VIH - High Level Input Voltage - V 50 HIGH LEVEL INPUT CURRENT vs. 600 3.0 2.5 2.0 1.5 1.0 0.5 IOUT = 1 mA 2.5 2.0 1.5 1.0 0.5 0.0 0.0 -50 0 50 100 150 200 -50 TA - Ambient Temperature - C 4 0 TA - Ambient Temperature - C Data Sheet S17476EJ2V0DS 0 50 100 150 TA - Ambient Temperature - C 200 PD166100, 166101 ON-STATE RESISTANCE vs. ON-STATE RESISTANCE vs. OUTPUT CURRENT AMBIENT TEMPERATURE 0.25 RDS(ON) - ON-State Resistance - RDS(ON) - ON-State Resistance - 0.25 VIN = 3 V, 5 V, TA = 25C 0.2 0.15 VIN = 3 V 0.1 0.05 VIN = 5 V 0 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 VIN = 3 V, 5 V, IOUT = 0.8 A 0.2 0.15 VIN = 3 V 0.1 0.05 0 -50 VIN = 5 V 0 50 100 150 200 TA - Ambient Temperature - C IOUT - Output Current - A ON-STATE RESISTANCE vs. INPUT VOLTAGE RDS(ON) - ON-State Resistance - 0.25 IOUT = 0.8 A 0.2 0.15 TA = 105C TA = 85C 0.1 TA = 25C TA = -40C 0.05 0 0 1 2 3 4 5 6 VIN - Input Voltage - V 7 8 Data Sheet S17476EJ2V0DS 5 PD166100, 166101 TURN-ON / TURN-OFF DELAY TIME vs. RISE TIME / FALL TIME vs. OUTPUT CURRENT 100 VIN = 5 V, VOUT = 18 V, TA = 25C 175 150 tr / tf - Rise Time / Fall Time - s ton / toff - Turn-On / Turn-Off Time - s OUTPUT CURRENT 200 toff 125 100 75 50 ton 25 VIN = 5 V, VOUT = 18 V, TA = 25C 87.5 75 62.5 50 tf 37.5 25 tr 12.5 0 0 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 0 1 0.1 0.2 0.3 0.4 IOUT - Output Current - A 0.7 0.8 0.9 1 AMBIENT TEMPERATURE AMBIENT TEMPERATURE 100 200 VIN = 5 V, VOUT = 18 V, IOUT = 0.8 A 180 tr / tf - Rise Time / Fall Time - s ton / toff - Turn-On / Turn-Off Delay Time - s 0.6 RISE TIME / FALL TIME vs. TURN-ON / TURN-OFF DELAY TIME vs. 6 0.5 IOUT - Output Current - A 160 140 120 toff 100 80 60 ton 40 20 0 -50 0 50 100 150 200 VIN = 5 V, VOUT = 18 V, IOUT = 0.8 A 87.5 75 62.5 50 tr 37.5 tf 25 12.5 0 -50 TA - Ambient Temperature - C Data Sheet S17476EJ2V0DS 0 50 100 150 TA - Ambient Temperature - C 200 PD166100, 166101 APPLICATION CIRCUIT EXAMPLE (1) Inductance load VCC PD166100, PD166101 Microcontroller etc IN Inductance load OUT GND GND GND (2) Lamp load VCC PD166100, PD166101 Microcontroller Etc. GND IN Lamp load OUT GND GND Caution This circuit diagram is a connection example, and it is not the one to mass-produce it. Data Sheet S17476EJ2V0DS 7 PD166100, 166101 <R> TAPING INFORMATION There are two types (E1, E2) of directions of the device in the career tape. Reel side Draw-out side -E1 TYPE -E2 TYPE <R> MARKING INFORMATION This figure indicates the marking items and arrangement. However, details of the letterform, the size and the position aren't indicated. * PD166100GR, PD166101GR Example) PD166100GR 66100 Lot code Note Pb-free plating marking 1 pin mark Note Composition of the lot code Internal administrative code Week code (2 digit number) Year code (last 1 digit number) 8 Data Sheet S17476EJ2V0DS PD166100, 166101 <R> RECOMMENDED SOLDERING CONDITIONS The PD166100, 166101 should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales representative. For technical information, see the following website. Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html) PD166100GR-E1-AZ Note Note PD166101GR-E1-AZ Note Note , PD166100GR-E2-AZ , PD166101GR-E2-AZ : Power SOP 8 : Power SOP 8 Process Infrared Ray Reflow Conditions Peak temperature: 235C or below (Package surface temperature), Symbol IR35-00-3 Reflow time: 30 seconds or less (at 210C or higher), Maximum number of reflow processes: 3 times or less. Partial Heating Method Pin temperature: 350C or below, P350 Heat time: 3 seconds or less (Per each side of the device). Note Pb-free (This product does not contain Pb in the external electrode.) Caution Apply only one kind of soldering condition to a device, except for "partial heating method", or the device will be damaged by heat stress. Remark Flux: Rosin-based flux with low chlorine content (chlorine 0.2 Wt% or below) is recommended. Data Sheet S17476EJ2V0DS 9 PD166100, 166101 <R> REVISION HISTORY Revision st 1 edition Major changes since last version Page st Released 1 edition March 2005 nd Released 2 edition December 2008 nd 2 edition 10 Revised Ordering information 1 Add Taping information, Marking information 8 Revised Recommended soldering conditions 9 Add Revision history 10 Data Sheet S17476EJ2V0DS PD166100, 166101 NOTES FOR CMOS DEVICES 1 VOLTAGE APPLICATION WAVEFORM AT INPUT PIN Waveform distortion due to input noise or a reflected wave may cause malfunction. If the input of the CMOS device stays in the area between VIL (MAX) and VIH (MIN) due to noise, etc., the device may malfunction. Take care to prevent chattering noise from entering the device when the input level is fixed, and also in the transition period when the input level passes through the area between VIL (MAX) and VIH (MIN). 2 HANDLING OF UNUSED INPUT PINS Unconnected CMOS device inputs can be cause of malfunction. If an input pin is unconnected, it is possible that an internal input level may be generated due to noise, etc., causing malfunction. CMOS devices behave differently than Bipolar or NMOS devices. Input levels of CMOS devices must be fixed high or low by using pull-up or pull-down circuitry. Each unused pin should be connected to VDD or GND via a resistor if there is a possibility that it will be an output pin. All handling related to unused pins must be judged separately for each device and according to related specifications governing the device. 3 PRECAUTION AGAINST ESD A strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and ultimately degrade the device operation. Steps must be taken to stop generation of static electricity as much as possible, and quickly dissipate it when it has occurred. Environmental control must be adequate. When it is dry, a humidifier should be used. It is recommended to avoid using insulators that easily build up static electricity. Semiconductor devices must be stored and transported in an anti-static container, static shielding bag or conductive material. All test and measurement tools including work benches and floors should be grounded. The operator should be grounded using a wrist strap. Semiconductor devices must not be touched with bare hands. Similar precautions need to be taken for PW boards with mounted semiconductor devices. 4 STATUS BEFORE INITIALIZATION Power-on does not necessarily define the initial status of a MOS device. Immediately after the power source is turned ON, devices with reset functions have not yet been initialized. Hence, power-on does not guarantee output pin levels, I/O settings or contents of registers. A device is not initialized until the reset signal is received. A reset operation must be executed immediately after power-on for devices with reset functions. 5 POWER ON/OFF SEQUENCE In the case of a device that uses different power supplies for the internal operation and external interface, as a rule, switch on the external power supply after switching on the internal power supply. When switching the power supply off, as a rule, switch off the external power supply and then the internal power supply. Use of the reverse power on/off sequences may result in the application of an overvoltage to the internal elements of the device, causing malfunction and degradation of internal elements due to the passage of an abnormal current. The correct power on/off sequence must be judged separately for each device and according to related specifications governing the device. 6 INPUT OF SIGNAL DURING POWER OFF STATE Do not input signals or an I/O pull-up power supply while the device is not powered. The current injection that results from input of such a signal or I/O pull-up power supply may cause malfunction and the abnormal current that passes in the device at this time may cause degradation of internal elements. Input of signals during the power off state must be judged separately for each device and according to related specifications governing the device. Data Sheet S17476EJ2V0DS 11 PD166100, 166101 * The information in this document is current as of December, 2008. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. * No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may appear in this document. * NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC Electronics products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others. * Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of a customer's equipment shall be done under the full responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. * While NEC Electronics endeavors to enhance the quality, reliability and safety of NEC Electronics products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC Electronics products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment and anti-failure features. * NEC Electronics products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to NEC Electronics products developed based on a customerdesignated "quality assurance program" for a specific application. The recommended applications of an NEC Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of each NEC Electronics product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots. "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support). "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to determine NEC Electronics' willingness to support a given application. (Note) (1) "NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its majority-owned subsidiaries. (2) "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as defined above). M8E 02. 11-1