3.5x3.5 mm SMD CHIP LED LAMP Part Number: AA3535SYL1Z1S-AMT ATTENTION Super Bright Yellow OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC DISCHARGE SENSITIVE DEVICES Features Description z White SMD package, silicone resin. The source color devices are made with AlGaInP Light z Low thermal resistance. Emitting Diode. z Compatible with IR-reflow processes. Static electricity and surge damage the LEDS. z ESD protection. It is recommended to use a wrist band or anti-electrostatic z Package: 2000pcs / reel. glove when handling the LEDs. z Moisture sensitivity level : level 2a. All devices, equipment and machinery must be electrically z RoHS compliant grounded. Applications z Signal and symbol luminaire for orientation. z Marker lights (e.g. steps, exit ways, etc). z Decorative and entertainment lighting. z Commercial and residential lighting. Package Dimensions z Automotive interior lighting. Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is 0.25(0.01") unless otherwise noted. 3. The specifications, characteristics and technical data described in the datasheet are subject to change without prior notice. 4. The device has a single mounting surface. The device must be mounted according to the specifications. SPEC NO: DSAL4012 REV NO: V.5B DATE: FEB/02/2013 PAGE: 1 OF 7 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: Q.M.CHEN ERP: 1201007420 Handling Precautions Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic significantly reduces thermal stress, it is more susceptible to damage by external mechanical force. As a result, special handling precautions need to be observed during assembly using silicone encapsulated LED products. Failure to comply might lead to damage and premature failure of the LED. 1. Handle the component along the side surfaces by using forceps or appropriate tools. 2. Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry. 3. Do not stack together assembled PCBs containing exposed LEDs. Impact may scratch the silicone lens or damage the internal circuitry. 4.1. The inner diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks. 4.2. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup. 4.3. The dimensions of the component must be accurately programmed in the pick-and-place machine to insure precise pickup and avoid damage during production. 5. As silicone encapsulation is permeable to gases, some corrosive substances such as H2S might corrode silver plating of leadframe. Special care should be taken if an LED with silicone encapsulation is to be used near such substances. All design applications should refer to Kingbright application notes available at http://www.KingbrightUSA.com/ApplicationNotes SPEC NO: DSAL4012 REV NO: V.5B DATE: FEB/02/2013 PAGE: 2 OF 7 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: Q.M.CHEN ERP: 1201007420 Selection Guide Dice Part No. Super Bright Yellow (AlGaInP) AA3535SYL1Z1S-AMT Iv (cd) [2] @ 150mA Lens Type v (lm) [2] @ 150mA* Viewing Angle [1] Code. Min. Max. Code. Min. Max. Z 2.7 3.1 A17 8.6 10 ZA 3.1 3.6 B1 10 12 ZB 3.6 4.2 B2 12 14 ZC 4.2 5.0 B3 14 17 Water Clear 2 1/2 120 Notes: 1. 1/2 is the angle from optical centerline where the luminous intensity is 1/2 of the optical peak value. 2. Luminous intensity/ luminous flux: +/-15%.*LEDs are binned according to their luminous flux. 3. Luminous intensity/ luminous Flux value is traceable to the CIE127-2007 compliant national standards. Absolute Maximum Ratings at TA=25C Parameter Power Dissipation Junction Temperature [1] Symbol Value Unit PD 525 mW TJ 110 C Operating Temperature Top -40 To +85 C Storage Temperature Tstg -40 To +85 C DC Forward Current [1] IF 150 mA Reverse Voltage VR 5 V Peak Forward Current [2] IFM 270 mA Thermal Resistance [1] (Junction/ambient) Rth j-a 178 C/W Thermal Resistance [1] (Junction/solder point) Rth j-S 78 C/W 8000 V Electrostatic Discharge Threshold (HBM) Notes: 1.Results from mounting on PC board FR4(pad size 70mm 2 ), mounted on pc board-metal core PCB is recommend for lowest thermal Resistance. 2.1/10 Duty Cycle, 0.1ms Pulse Width. Electrical / Optical Characteristics at TA=25C Parameter Symbol Wavelength at peak emission Dominant Wavelength IF=150mA IF=150mA Value Code. Min. peak dom [1] Typ. Max. 590 Unit nm 5 590 592 6 592 594 7 594 597 8 597 600 nm Spectral Line Half-width IF=150mA Forward Voltage IF=150mA VF [2] Allowable Reverse Current IR Temperature coefficient of peak IF=150mA, -10 C T100 C TC peak 0.13 nm/ C Temperature coefficient of dom IF=150mA, -10 C T100 C TC dom 0.10 nm/ C Temperature coefficient of VF IF=150mA, -10 C T100 C TCV -3.3 mV/ C 20 2.5 3.0 nm 3.5 V 85 mA Notes: 1.Wavelength: +/-1nm. 2. Forward Voltage: +/-0.1V. 3.Wavelength value is traceable to the CIE127-2007 compliant national standards. SPEC NO: DSAL4012 REV NO: V.5B DATE: FEB/02/2013 PAGE: 3 OF 7 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: Q.M.CHEN ERP: 1201007420 Super Bright Yellow AA3535SYL1Z1S-AMT SPEC NO: DSAL4012 REV NO: V.5B DATE: FEB/02/2013 PAGE: 4 OF 7 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: Q.M.CHEN ERP: 1201007420 AA3535SYL1Z1S-AMT Reflow soldering is recommended and the soldering profile is shown below. Other soldering methods are not recommended as they might cause damage to the product. Reel Dimension Recommended Soldering Pattern (Units : mm; Tolerance: 0.1) Tape Specifications (Units : mm) SPEC NO: DSAL4012 REV NO: V.5B DATE: FEB/02/2013 PAGE: 5 OF 7 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: Q.M.CHEN ERP: 1201007420 PACKING & LABEL SPECIFICATIONS AA3535SYL1Z1S-AMT SPEC NO: DSAL4012 REV NO: V.5B DATE: FEB/02/2013 PAGE: 6 OF 7 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: Q.M.CHEN ERP: 1201007420 Reliability Test Items And Conditions The reliability of products shall be satisfied with items listed below Lot Tolerance Percent Defective (LTPD) : 10% No. Test Item Standards Test Times / Number of Cycles Damaged Test Condition 1 Continuous operating test - Ta =25C ,IF = maximum rated current* 1,000 h 0 / 22 2 High Temp. operating test EIAJED4701/100(101) Ta = 100C IF = maximum rated current* 1,000 h 0 / 22 3 Low Temp. operating test - Ta = -40C, IF = maximum rated current* 1,000 h 0 / 22 4 High temp. storage test EIAJEDTa = maximum rated storage temperature 4701/100(201) 1,000 h 0 / 22 5 Low temp. storage test EIAJED4701/100(202) Ta = -40C 1,000 h 0 / 22 6 High temp. & humidity storage test - Ta = 60C, RH = 90% 1000 h 0 / 22 7 High temp. & humidity operating test - Ta = 60C, RH = 90% IF = maximum rated current* 1000 h 0 / 22 8 Soldering reliability test EIAJED4701/100(301) Moisture soak : 30C,70% RH, 72h Preheat : 150~180C(120s max.) Soldering temp : 260C(10s) 2 times 0 / 18 9 Thermal shock operating test - Ta = -40C(15min) ~ 100C(15min) IF = derated current at 100C 1,000 cycles 0 / 22 10 Thermal shock test - Ta = -40C(15min) ~ maximum rated storage temperature(15min) 1,000 cycles 0 / 22 11 Electric Static Discharge (ESD) EIAJED4701/100(304) C = 100pF , R2 = 1.5K V = 8000V Once each Polarity 0 / 22 12 Vibration test - a = 196m/s , f = 100~2KHz , t = 48min for all xyz axes 4 times 0 / 22 * : Refer to forward current vs. derating curve diagram Failure Criteria Items Symbols Conditions Failure Criteria luminous Intensity lv IF = 150mA Testing Min. Value