ECH8306
No. A0302-1/4
80906 / 12506PE MS IM TB-00001929
ECH8306 P-Channel Silicon MOSFET
General-Purpose Switching Device
Applications
Features
•Low ON-resistance.
•4V dri ve.
Specifications
Absolute Maximum Ratings at Ta=25°C
Parameter Symbol Conditions Ratings Unit
Drain-to-Source Voltage VDSS --100 V
Gate-to-Source Voltage VGSS ±20 V
Drain Current (DC) ID-- 2 A
Drain Current (Pulse) IDP PW≤10µs, duty cycle≤1% --12 A
Allowable Power Dissipation PDMounted on a ceramic board (900mm2✕0.8mm) 1.6 W
Channel Temperature Tch 150 °C
Storage Temperature Tstg --55 to +150 °C
Electrical Characteristics at Ta=25°C
Ratings
Parameter Symbol Conditions min typ max Unit
Drain-to-Source Breakdown Voltage V(BR)DSS ID=--1mA, VGS=0V --100 V
Zero-Gate Voltage Drain Current IDSS VDS=--100V, VGS=0V --1 µA
Gate-to-Source Leakage Current IGSS VGS=±16V, VDS=0V ±10 µA
Cutoff Voltage VGS(off) VDS=--10V, ID=--1mA --1.2 --2.6 V
Forward T ransfer Admittance yfsVDS=--10V, ID=--1A 2.9 4.9 S
Static Drain-to-Source On-State Resistance
RDS(on)1 ID=--1A, VGS=--10V 170 225 mΩ
RDS(on)2 ID=--0.5A, VGS=--4V 195 275 mΩ
Input Capacitance Ciss VDS=--20V, f=1MHz 1600 pF
Output Capacitance Coss VDS=--20V, f=1MHz 85 pF
Reverse T ransfer Capacitance Crss VDS=--20V, f=1MHz 72 pF
Turn-ON Delay Time td(on) See specified Test Circuit. 13.5 ns
Rise Time trSee specified Test Circuit. 10 ns
Turn-OFF Delay Time td(off) See specified Test Circuit. 190 ns
Fall T ime tfSee specified Test Circuit. 54 ns
Total Gate Charge Qg VDS=--50V, VGS=--10V, ID=--2A 33 nC
Gate-to-Source Charge Qgs VDS=--50V, VGS=--10V, ID=--2A 3.6 nC
Gate-to-Drain “Miller” Charge Qgd VDS=--50V, VGS=--10V, ID=--2A 6.0 nC
Diode Forward Voltage VSD IS=--2A, VGS=0V --0.8 --1.2 V
Marking : JH
Ordering number : ENA0302
SANYO Semiconductors
DATA SHEET
Any and all SANYO Semiconductor products described or contained herein do not have specifications
that can handle applications that require extremely high levels of reliability, such as life-support systems,
aircraft's control systems, or other applications whose failure can be reasonably expected to result in
serious physical and/or material damage. Consult with your SANYO Semiconductor representative
nearest you before usingany SANYO Semiconductor products described or contained herein in such
applications.
SANYO Semiconductor assumes no responsibility for equipment failures that result from using products
at values that exceed, even momentarily, rated values (such as maximum ratings, operating condition
ranges, or other parameters) listed in products specifications of any and all SANYO Semiconductor
products described or contained herein.
TOKYO OFFICE Tokyo Bldg., 1-10, 1 Chome, Ueno, Taito-ku, TOKYO, 110-8534 JAPAN