06-5
06
Features
COM Express CPU Modules
Specifications
COM-45SP
Intel® Core™ 2 Duo/ Celeron® M (Socket-P Based)
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Processor
Intel® GM45 + ICH9M
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Dual-channel DDR3 SODIMM 800/1066 Memory, Max. 8 GB
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Gigabit Ethernet
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CRT, Up To 24-bit Dual-channel LVDS LCD, DisplayPort™,
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HDMI, DVI, SDVO
High Definition Audio Interface
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SATA 3.0Gb/s x 4
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USB2.0 x 8
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PCI x 4, PCI-Express [x16] x 1, PCI-Express [x1] x 5
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Wide DC Input Range, +8.5V To +19V (Optional)
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COM Express Basic Module, Pin-out Type 2, COM.0 Rev. 1.0
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COM Express Type 2 CPU Module With Intel® Core™ 2 Duo/ Celeron® M (Socket-P Based) Processor
M2.5 Screw x 5•
Product CD•
COM-45SP•
Packing List
System
Form Factor COM Express basic module, Pin-out Type 2, COM.0 Rev. 1.0
Processor Intel® Core™ 2 Duo/ Celeron® M (Socket-P based 35mm x 35mm) processor
System Memory 204-pin DDR3 SODIMM x 2, Max. 8 GB (DDR3 800/1066),
supports dual-channel function
Chipset Intel® GM45 + ICH9M
I/O Chipset ICH9M
Ethernet Intel® 82567LM, 10/100/1000Base-TX
TPM v1.2
BIOS Award BIOS v8.0
SPI type, 2 MB ROM
EEPROM Atmel® AT24C02, save BIOS and Configuration data (Optional)
Wake on LAN Yes
Watchdog Timer Fintek F75111
H/W Status Monitoring Supports CPU temperature monitoring
Expansion Interface
PCI-Express [x16] x 1 (Shared with 2 SDVOs/ 3 DisplayPorts/ 2 HDMIs/ 2 DVIs)
==> Can be configured as PCI-Express [x1]/ [x2]/ [x4]/ [x8]
PCI-Express [x1] x 5
32-bit PCI x 4
LPC bus x 1
SMBus x 1
I2C x 1
Power Requirement
Wide DC input range, +8.5V to +19V (Optional)
Nominal: +12V
2-pin wafer for RTC battery
Power Consumption
(Typical)
Intel® T9400 2.53 GHz, DDR3 1066 2 GB
3.94A@+12V, 0.38A@+5V (w/ECD-916M)
Board Size 4.92"(L) x 3.74"(W) (125mm x 95mm)
Gross Weight 0.66 lb (0.3 Kg)
Operating Temperature 32°F ~ 140°F (0°C ~ 60°C)
Storage Temperature -40°F ~ 176°F (-40°C ~ 80°C)
Operating Humidity 0% ~ 90% relative humidity, non-condensing
MTBF (Hours) 8 5 , 0 0 0
Display Supports CRT/LCD, CRT/DVI, LCD/DVI simultaneous/ dual view displays
Chipset
Intel® GM45 integrated
Integrates hardware MPEG2 decoder
Supports WMV9 (VC-1) and H.264 (AVC)
Memory Shared system memory up to 512 MB/ DVMT 5.0
Resolution Up to 2048 x 1536 (QXGA) for CRT
Up to 1920x 1200 (QXGA) for LCD
LCD Interface Up to 24-bit dual-channel LVDS
SDVO Supports SDVO x 2 (Shared with PCI-Express [x16])
HDMI Supports HDMI x 2 (Shared with PCI-Express [x16], needs to add a level shifter)
DVI Supports DVI x 2 (Shared with PCI-Express [x16], needs to add a level shifter)
DisplayPort Supports DisplayPort™ x 3 (Shared with PCI-Express [x16])
I/O
Storage SATA 3.0Gb/s x 4
USB USB2.0 x 8
Audio High definition audio
GPIO Up to 4 in or 4 out
Dual-channel DDR3 SODIMM
μFC-PGA
(Socket P)
ICH9M
2-pin Wafer for
RTC Battery
GM45Intel®
82567LM
Gigabit
Ethernet
06-6
Dimension Unit: mm
COM-45SP
TF-ECB-916M-A10-01•
COM Express Carrier Board, microATX, Dual Gigabit Ethernet, 7.1CH Audio, 4 COM, USB, PCI-Express, AT/ATX, Rev. A1.0
TF-PER-A051•
CPU Cooler, For COM-45SP, Socket-type CPU, 12V Fan
TF-PER-A082•
Passive Heatsink, For COM-45SP, Socket-type CPU
TF-PER-A072•
Heat Spreader Kit, For COM-45SP, Socket-type CPU
Ordering Information
Optional Accessories
Part Number COM Express Type CPU Memory Display LVDS Storage LAN USB UART Expansion Slot Power Temp
TF-COM-45SP-A10 2 (COM.0 Rev.1.0) Intel® Core™ 2 Duo Mobile
(Socket P)
DDR3 SODIMM x 2
Max.8GB
CRT, LVDS, SDVO, HDMI,
DP, DVI
24-bit dual
channel SATA2 x 4 GbE x 1 USB2.0 x 8 —
PCI-E [x16] x 1
PCI-E [x1] x 5
32-bit PCI x 4
12V 0°C ~ 60°C
