DS-RN21-V2 3/25/2010
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5. Using SPI bus for flash upgrade. While not required, this bus is very useful for configuring advanced
parameters of the Bluetooth modules, and is required for upgrading the firmware on modules. The
suggested ref-design shows a 6pin header which can be implemented to gain access to this bus. A
minimum-mode version could just use the SPI signals (4pins) and pickup ground and VCC from elsewhere
on the design.
6. Antenna Design. The pattern from the rf_out terminal pad should be
designed with 50ohms impedance and traced with straight lines. (see
diagram to the right) The rf_out signal line should not run under of near the
RN21 module. The GND plane should be on the side of the PCB which the
module is mounted. The GND should be reinforced with through-hole
connections and other means to stabilize the electric potential.
Recommended on-chip antenna is Yageo SMT high performance chip for
Bluetooth/802.11b/g 2.45GHz (3.6mm x 7.2mm)
7. Soldering Reflow Profile.
• Lead-Free Solder Reflow
• Temp: 230 degree C, 30-40 seconds, Peak 250 degree C maximum.
• Preheat temp: 165 +- 15 degree C, 90 to 120 seconds.
• Time: Single Pass, One Time
Ordering Information
Part Number Description
RN-21 Standard firmware (SPP/DUN Master and Slave)
RN-21-H HCI firmware (HCI over H4 UART)
RN-21-U USB firmware (HCI over USB port, slave device at 12Mbps rate)
For other configurations, contact Roving Networks directly.
Visit http://www.rovingnetworks.com for current pricing and a list of locations selling Roving
Networks Products.
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Roving Networks assumes no liability for applications assistance or customer’s product design. Customers are
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customer product risks, customers should provide adequate design and operating safeguards.
Roving Networks products are not authorized for use in safety-critical applications (such as life support) where
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RN21 Module
GND
RF_OUT
GND
RN21 Module
GND
RF_OUT
GND